JP2003342787A - Method of producing flexible printed circuit board - Google Patents
Method of producing flexible printed circuit boardInfo
- Publication number
- JP2003342787A JP2003342787A JP2002150892A JP2002150892A JP2003342787A JP 2003342787 A JP2003342787 A JP 2003342787A JP 2002150892 A JP2002150892 A JP 2002150892A JP 2002150892 A JP2002150892 A JP 2002150892A JP 2003342787 A JP2003342787 A JP 2003342787A
- Authority
- JP
- Japan
- Prior art keywords
- copper plating
- layer
- flexible printed
- copper
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フレキシブルプリ
ント配線用基板の製造方法、好適には、２層フレキシブ
ルプリント配線用基板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a flexible printed wiring board, preferably a two-layer flexible printed wiring board.
【０００２】[0002]
【従来の技術】従来、プラスチックフィルム上に、接着
剤層を介して導体層としての銅箔を貼り合せた３層構造
のフレキシブルプリント配線用基板が知られている。こ
の３層構造タイプのフレキシブルプリント配線用基板
は、用いられる接着剤の耐熱性がプラスチックフィルム
より劣るため、加工後の寸法精度が低下するという問題
があり、また用いられる銅箔の厚さが通常１０μｍ以上
であるため、ピッチの狭い高密度配線用のパターニング
が難しいという欠点もあった。2. Description of the Related Art Conventionally, there has been known a flexible printed wiring board having a three-layer structure in which a copper foil as a conductor layer is laminated on a plastic film via an adhesive layer. This three-layer structure type flexible printed wiring board has a problem that the dimensional accuracy after processing is reduced because the heat resistance of the adhesive used is lower than that of the plastic film, and the thickness of the copper foil used is usually Since it is 10 μm or more, there is a drawback that patterning for high-density wiring with a narrow pitch is difficult.
【０００３】一方、プラスチックフィルム上に接着剤を
用いることなく、湿式めっき法や乾式めっき法（例え
ば、真空蒸着法、スパッタリング法、イオンプレーティ
ング法など）により導体層としての金属層を形成させた
２層構造タイプのフレキシブルプリント配線用基板も知
られている。この２層構造タイプのフレキシブルプリン
ト配線用基板は、導体層を１０μｍよりも薄くすること
ができるため高密度配線が可能であるが、電気めっき法
で導体層を積層する工程において、めっき液中の添加剤
成分（析出促進成分や析出抑制成分）の銅層表面への吸
着ムラ、活性化ムラの発生や基材に対向して配置される
溶解アノード表面に形成されたブラックフィルム起因す
る成分の特異的吸着等により、基材処理面で金属銅の異
常析出が生じたり、シミ状の外観を呈したりすることが
ある。これが微細な高密度配線を行った場合、リード間
でショートや絶縁不良の要因になり、信頼性を低下させ
る原因となっていた。On the other hand, a metal layer as a conductor layer was formed on a plastic film by a wet plating method or a dry plating method (for example, a vacuum deposition method, a sputtering method, an ion plating method) without using an adhesive. A two-layer structure type flexible printed wiring board is also known. In this two-layer structure type flexible printed wiring board, since the conductor layer can be made thinner than 10 μm, high-density wiring is possible. However, in the process of laminating the conductor layers by electroplating, Unique adsorption of additive components (precipitation accelerating component or precipitation suppressing component) on the copper layer surface, generation of activation irregularity, and specificity of components due to the black film formed on the surface of the dissolving anode that is placed facing the substrate Due to static adsorption or the like, abnormal deposition of metallic copper may occur on the treated surface of the substrate, or a stain-like appearance may appear. When fine high-density wiring is performed, this may cause a short circuit or insulation failure between the leads, which causes a decrease in reliability.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、前記の実情
に鑑みて発明されたもので、その目的は、前記従来技術
の問題点を解決して、高品位な銅めっき面を形成するこ
とにより高密度配線でも信頼性の高いフレキシブルプリ
ント配線用基板を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to solve the problems of the prior art and form a high-quality copper-plated surface. Is to provide a flexible printed wiring board having high reliability even with high-density wiring.
【０００５】[0005]
【課題を解決するための手段】本発明は上記課題を解決
するためになされたもので、フィルム基材に銅めっきす
る方法において、銅めっき終了後に形成された銅めっき
層の銅表面をエッチング工程により処理することを特徴
とする基材の製造方法である。具体的に、本発明のフレ
キシブルプリント配線用基板の製造方法は、陽極及び電
解銅めっき液を有する銅めっき槽を１槽もしくは複数配
置し、絶縁体フィルム上に金属被膜からなる導電層を有
するフィルム基材をこれらの銅めっき槽へ供給し各銅め
っき槽毎に電気銅めっきを行って該導電層表面に連続的
に電気銅めっき層を形成させる方法において、銅めっき
層形成終了直後に該銅めっき層をエッチングすることを
特徴とするフレキシブルプリント配線用基板の製造方法
である。The present invention has been made to solve the above problems, and in a method of copper-plating a film substrate, a step of etching a copper surface of a copper-plated layer formed after completion of copper plating. The method for producing a base material is characterized in that: Specifically, the method for producing a flexible printed wiring board of the present invention is a film having a conductive layer made of a metal coating on an insulator film, in which one or a plurality of copper plating tanks containing an anode and an electrolytic copper plating solution are arranged. In the method of supplying a base material to these copper plating tanks and performing electrolytic copper plating in each copper plating tank to continuously form an electrolytic copper plating layer on the surface of the conductive layer, the copper is immediately after the formation of the copper plating layer. A method for manufacturing a flexible printed wiring board, characterized by etching a plating layer.
【０００６】[0006]
【発明の実施の形態】以下、本発明になるフレキシブル
プリント配線用基板の製造方法について詳述する。BEST MODE FOR CARRYING OUT THE INVENTION A method for manufacturing a flexible printed wiring board according to the present invention will be described in detail below.
【０００７】本発明で用いられる基材のフィルムを例示
すると、ポリエチレンテレフタレート、ポリエチレン−
２，６−ナフタレート、ポリエチレン−α，β−ビス
（２−クロルフェノキシエタン−４，４′−ジカルボキ
シレート）などのポリエステル、ポリフェニレンサルフ
ァイド、ポリエーテルスルホン、ポリエーテルエーテル
ケトン、芳香族ポリアミド、ポリアリレート、ポリイミ
ド、ポリアミドイミド、ポリエーテルイミド、ポリパラ
ジン酸、ポリオキサジアゾールおよびこれらのハロゲン
基あるいはメチル基置換体等からなるプラスチックフィ
ルムが挙げられる。また、これらの共重合体や、他の有
機重合体を含有するプラスチックフィルムであっても良
い。これらのプラスチックフィルムに公知の添加剤、例
えば、滑剤、可塑剤などが添加されていても良い。Examples of the base film used in the present invention include polyethylene terephthalate and polyethylene-
Polyesters such as 2,6-naphthalate and polyethylene-α, β-bis (2-chlorophenoxyethane-4,4′-dicarboxylate), polyphenylene sulfide, polyether sulfone, polyether ether ketone, aromatic polyamide, poly Examples of the plastic film include arylate, polyimide, polyamide imide, polyether imide, polyparazic acid, polyoxadiazole, and their halogen group- or methyl group-substituted compounds. Further, a plastic film containing these copolymers or other organic polymers may be used. Known additives such as lubricants and plasticizers may be added to these plastic films.
【０００８】本発明では、上記のプラスチックフィルム
中、下記式の繰返し単位を８５モル％以上含むポリマー
を溶融押出しして得られる未延伸フィルムを、二軸方向
に延伸配向して機械特性を向上せしめたフィルムが特に
好ましく使用される。In the present invention, an unstretched film obtained by melt-extruding a polymer containing 85 mol% or more of repeating units of the following formula in the above plastic film is stretched and oriented biaxially to improve mechanical properties. Films are particularly preferably used.
【０００９】[0009]
【化１】
（但し、ＸはＨ、ＣＨ3、Ｆ、ＣＩ基を示す）。また、
下記式の繰返し単位を５０モル％以上含むポリマーから
なり、湿式あるいは乾湿式製膜したフィルム、あるいは
該フィルムを二軸延伸および／または熱処理せしめたフ
ィルムも好ましく使用される。[Chemical 1] (Wherein, X is shown H, CH 3, F, and CI group). Also,
A film made of a polymer containing 50 mol% or more of the repeating unit represented by the following formula and formed by a wet or dry wet method, or a film obtained by biaxially stretching and / or heat treating the film is also preferably used.
【００１０】[0010]
【化２】
（ここで、ＸはＨ，ＣＨ3、Ｆ、ＣＩ基、ｍ，ｎは０〜３
の整数を示す）。[Chemical 2] (Here, X is H, CH 3 , F, CI group, m and n are 0 to 3
Indicates an integer).
【００１１】上記のような繰返し単位を含むポリマーか
らなるプラスチックフィルムは、特に耐熱安定性と耐湿
安定性に優れウエットエッチング工程における寸法変化
が小さい。A plastic film made of a polymer containing a repeating unit as described above is particularly excellent in heat resistance and humidity resistance and has a small dimensional change in a wet etching process.
【００１２】基材であるフィルムの厚さは、好ましくは
６〜１２５μｍ程度のものが多用され、１２〜５０μｍ
の厚さが好適である。The thickness of the base film is preferably 6 to 125 μm, and is often 12 to 50 μm.
Is preferred.
【００１３】本発明では、電気銅メッキ法で、より厚膜
の金属層（銅めっき層）を形成するに先立って、真空蒸
着またはスパッタ法等により金属被膜層（導電層）を形
成する。金属被膜層を構成する金属としては、銅、ニッ
ケル、スズ、クロムおよびこれらの合金から選ばれた金
属が好適であり、これによって低抵抗でしかも屈曲性に
富む金属被膜層を形成することができる。In the present invention, prior to forming a thicker metal layer (copper plating layer) by the electrolytic copper plating method, the metal coating layer (conductive layer) is formed by vacuum vapor deposition or sputtering. As a metal constituting the metal coating layer, a metal selected from copper, nickel, tin, chromium and alloys thereof is suitable, and thereby a metal coating layer having low resistance and high flexibility can be formed. .
【００１４】該金属被膜層は、一層でも二層以上でも良
いが、導電層とフィルムの密着力を高めるため、また電
気銅めっきの際の抵抗値を低くすることができることか
ら、ニッケル、スズ、クロムおよびこれらの合金から選
ばれた金属で第一層を形成し、銅で第二層を形成するこ
とが好ましい。The metal coating layer may be one layer or two or more layers, but nickel, tin, and tin are used because the adhesion between the conductive layer and the film is enhanced and the resistance value during electrolytic copper plating can be lowered. It is preferable to form the first layer with a metal selected from chromium and alloys thereof and the second layer with copper.
【００１５】フィルムに蒸着またはスパッタ法等によっ
て設けられる該金属被膜層の厚さは、好ましくは１０〜
３００ｎｍ、より好ましくは３０〜１２０ｎｍ、さらに
好ましくは４０〜１００ｎｍである。金属被膜層の膜厚
が１０ｎｍよりも薄い場合は、金属メッキ工程で膜が溶
出しやすく、また３００ｎｍよりも厚い場合は、金属メ
ッキ工程後に膜がはがれやすい。なお、前記金属被膜層
の表面の抵抗値は電気銅めっきがしやすいことから、
１．０Ω／ｃｍ以下（端子間距離１ｃｍで測定した抵抗
値が１．０Ω以下）であることが好ましい。The thickness of the metal coating layer provided on the film by vapor deposition or sputtering is preferably 10 to
The thickness is 300 nm, more preferably 30 to 120 nm, further preferably 40 to 100 nm. When the film thickness of the metal coating layer is thinner than 10 nm, the film is likely to be eluted in the metal plating step, and when it is thicker than 300 nm, the film is likely to peel off after the metal plating step. Incidentally, the resistance value of the surface of the metal coating layer is easy to electrolytic copper plating,
It is preferably 1.0 Ω / cm or less (the resistance value measured at a terminal distance of 1 cm is 1.0 Ω or less).
【００１６】前記金属被膜層上に、電解銅めっきによっ
て、より厚膜の電気銅めっき層（金属層）を形成する。
電解銅めっき工程は、密着性を向上させるための脱脂お
よび酸活性処理、金属ストライク、銅メッキの各工程か
らなる。金属被膜層を蒸着した直後に電気銅めっき工程
に入る場合には、脱脂および酸活性処理、金属ストライ
クを省略してもよい。金属被膜層に給電する電流密度は
０．２〜１０Ａ／ｄｍ 2が好適で、０．５〜５Ａ／ｄｍ2
がより好適である。By electrolytic copper plating on the metal coating layer,
To form a thicker electrolytic copper plating layer (metal layer).
The electrolytic copper plating process is a degreasing process to improve adhesion.
And acid activation treatment, metal strike, copper plating process
Consists of Immediately after depositing the metal coating layer, electrolytic copper plating process
If entering, degreasing and acid activation treatment, metal strike
It may be omitted. The current density to feed the metal coating layer is
0.2-10 A / dm 2Is preferred, 0.5 to 5 A / dm2
Is more preferable.
【００１７】形成される銅めっき層の厚さは、好ましく
は０．５〜３５μｍであり、１．０〜２０μｍがより好
適である。銅めっき層の厚さが０．５μｍより小さい場
合はめっき層の信頼性が十分とはいえない。また、銅め
っき層の厚さが３５μｍを超える場合は膜形成に時間が
かかり経済性が劣るほか、エッチング加工時に回路パタ
ーンの端部エッチングが進行しやすく、また、折り曲げ
による断線のおそれがあるなど品質面でも好ましくな
い。目的とする回路の電流密度によっても異なるが、加
工作業性、品質の面から銅めっき層の厚さは１．０〜２
０μｍ程度がより好適である。The thickness of the copper plating layer formed is preferably 0.5 to 35 μm, more preferably 1.0 to 20 μm. When the thickness of the copper plating layer is smaller than 0.5 μm, the reliability of the plating layer is not sufficient. In addition, when the thickness of the copper plating layer exceeds 35 μm, it takes time to form the film, which is inferior in economic efficiency, and the end portion of the circuit pattern is easily etched during the etching process, and the wire may be broken due to bending. It is not good in terms of quality. Although it depends on the current density of the target circuit, the thickness of the copper plating layer is 1.0 to 2 in terms of workability and quality.
About 0 μm is more preferable.
【００１８】本発明において、銅めっきの条件は、めっ
き浴の組成、電流密度、浴温、撹拌条件などにより異な
るが、とくに制限はない。銅めっき浴は、硫酸銅浴、ピ
ロりん酸銅浴、シアン化銅浴などが好ましいがこれらに
限られるものではない。In the present invention, the conditions for copper plating differ depending on the composition of the plating bath, the current density, the bath temperature, the stirring conditions, etc., but there is no particular limitation. The copper plating bath is preferably, but not limited to, a copper sulfate bath, a copper pyrophosphate bath, a copper cyanide bath and the like.
【００１９】本発明では、銅めっき層形成終了直後に、
該銅めっき層をエッチングすることが重要である。ここ
で記載した銅めっき層形成終了直後としては、９０秒以
内が好ましく、より好ましくは３０秒以内であり、さら
に好ましくは１〜１０秒である。In the present invention, immediately after the completion of the copper plating layer formation,
It is important to etch the copper plating layer. Immediately after the formation of the copper plating layer described here, the time is preferably 90 seconds or less, more preferably 30 seconds or less, and further preferably 1 to 10 seconds.
【００２０】本発明におけるエッチング方法において
は、硫酸−過酸化水素系及び硫酸−過硫酸ナトリウム系
などに代表される強い酸化力をもった溶液に銅めっき層
を接触させることにより、銅めっき層を溶解させる化学
エッチング方法が好適に適用される。もちろん、エッチ
ング液はこれらに限定されるものではない。In the etching method of the present invention, the copper plating layer is contacted with a solution having a strong oxidizing power represented by sulfuric acid-hydrogen peroxide system and sulfuric acid-sodium persulfate system. A chemical etching method of dissolving is preferably applied. Of course, the etching solution is not limited to these.
【００２１】また、エッチング速度は、エッチング液組
成、エッチング液温度、エッチング時間により任意にコ
ントロールすることができるが、生産性、安全性、環境
への影響を加味し決定する必要がある。通常、硫酸濃度
は０．５〜３０％程度が望ましく、エッチング時間は、
１０〜６０秒程度が適切である。硫酸は、元来、めっき
液中にも多く添加される薬品であり、めっき液の組成管
理の点からも取り扱い易いという利点をもっている。エ
ッチング厚みは、通常、１ｎｍ以上で効果が認められる
が、０．１〜０．５μｍ程度が好適である。The etching rate can be arbitrarily controlled by the composition of the etching solution, the temperature of the etching solution, and the etching time, but it must be determined in consideration of productivity, safety, and the influence on the environment. Usually, the sulfuric acid concentration is preferably about 0.5 to 30%, and the etching time is
About 10 to 60 seconds is suitable. Sulfuric acid is originally a chemical that is often added to the plating solution and has the advantage of being easy to handle from the viewpoint of controlling the composition of the plating solution. The etching thickness is usually 1 nm or more, and the effect is recognized, but about 0.1 to 0.5 μm is preferable.
【００２２】次に、本発明のフレキシブルプリント配線
用基板の製造方法を図面に基づいて説明する。図１は、
本発明に係るリール・ツー・リール方式で連続的に基材
フィルムに電気銅めっきを施すための装置の全体概略図
である。Next, a method for manufacturing a flexible printed wiring board according to the present invention will be described with reference to the drawings. Figure 1
1 is an overall schematic view of an apparatus for continuously performing electrolytic copper plating on a base film by a reel-to-reel method according to the present invention.
【００２３】図１において、繰り出しローラー１から送
り出された金属被膜層を有する基材フィルム２は、陽極
５を備えためっき液槽３に導かれて、銅めっきにより銅
めっき層が形成され、次いで、側壁６で隔てられたエツ
チング液槽に導かれて、エッチング処理される。銅めっ
き層形成後、エツチング液槽に導かれる時間は前述のと
おりである。エッチング処理されたフレキシブルプリン
ト配線用基板は、巻き取りローラー７にて巻き取られ
る。In FIG. 1, the substrate film 2 having a metal coating layer fed from the feeding roller 1 is guided to a plating solution tank 3 equipped with an anode 5 to form a copper plating layer by copper plating, Then, it is introduced into an etching liquid bath separated by the side wall 6 and subjected to etching treatment. The time for which the copper plating layer is formed and then introduced into the etching liquid bath is as described above. The flexible printed wiring board that has been subjected to the etching treatment is wound up by the winding roller 7.
【００２４】めっき液槽３は１槽でもよいが、本発明で
は、めっき液槽３を図１のように複数槽、例えば、好ま
しくは２〜１０槽、より好ましくは２〜５槽配置させて
連続的にめっきすることができる。めっき液槽３を複数
槽にすることで、めっき長さ＝時間を長くすることがで
き、１パスでめっきの厚みを厚くすることができる。The plating solution tank 3 may be one tank, but in the present invention, a plurality of plating solution tanks 3 are arranged as shown in FIG. 1, for example, preferably 2 to 10 tanks, more preferably 2 to 5 tanks. It can be plated continuously. By using a plurality of plating solution tanks 3, the plating length = time can be increased, and the thickness of plating can be increased with one pass.
【００２５】本発明になるフレキシブルプリント配線用
基板は、電子計算機、端末機器、電話機、通信機器、計
測制御機器、カメラ、時計、自動車、事給機器、家電製
品、航空機計器、医療機器などのあらゆるエレクトロニ
クスの分野に活用できる。またコネクター、フラット電
極などへの適用も可能である。The flexible printed wiring board according to the present invention is applicable to all kinds of electronic computers, terminal equipment, telephones, communication equipment, measurement control equipment, cameras, watches, automobiles, household appliances, home appliances, aircraft instruments, medical equipment and the like. It can be used in the field of electronics. It can also be applied to connectors and flat electrodes.
【００２６】[0026]
【実施例】以下、実施例によって本発明を詳述するが、
本発明はこれらの実施例に限定されるものではない。The present invention will be described in detail below with reference to examples.
The invention is not limited to these examples.
【００２７】（実施例１）片面にスパッタ法により厚さ
０．１μmの銅被膜を設けた厚さ２５μmのポリイミドフ
ィルム”カプトンＥＮ”（東レデュポン社の登録商標）
３０００ｍ巻原反の該銅被膜上に、層厚が８μmとなる
ように、図１に示した電気めっき装置を用いて銅めっき
を行って銅めっき層を形成した。銅めっき液としては、
表１の組成の銅めっき液を用いた。次いで、銅めっき層
を形成後１０秒後に、表２の組成のエッチング液に浸漬
させ銅めっき層を０．５μmエッチング後、水洗、乾燥
させ巻き取り、フレキシブルプリント配線用基板を作製
した。その後、得られたフレキシブルプリント配線用基
板の銅表面に発生した３０μm以上の大きさをもつ銅突
起、並びに凹みの数を、光学顕微鏡（ライカ社製）を用
いて検査した。さらに、目視で外観検査を行ったとこ
ろ、シミやムラなどのない表面外観の良好なめっき膜が
得られた。その結果を表３に示す。Example 1 A 25 μm-thick polyimide film “Kapton EN” (registered trademark of Toray DuPont) having a 0.1 μm-thick copper coating formed on one side by a sputtering method.
A copper plating layer was formed on the copper coating film of the 3000 m roll by copper plating using the electroplating apparatus shown in FIG. 1 so that the layer thickness was 8 μm. As a copper plating solution,
The copper plating solution having the composition shown in Table 1 was used. Then, 10 seconds after the formation of the copper plating layer, the copper plating layer was immersed in an etching solution having the composition shown in Table 2 to etch the copper plating layer by 0.5 μm, washed with water, dried and wound to prepare a substrate for flexible printed wiring. After that, the number of copper projections having a size of 30 μm or more and the number of depressions generated on the copper surface of the obtained substrate for flexible printed wiring was examined using an optical microscope (manufactured by Leica). Furthermore, when a visual inspection was conducted, a plated film having a good surface appearance without spots or unevenness was obtained. The results are shown in Table 3.
【００２８】[0028]
【表１】 [Table 1]
【００２９】[0029]
【表２】 [Table 2]
【００３０】[0030]
【表３】
表３中 ○：目視による観察でめっき外観が非常に良好
×：目視による観察でめっき外観にシミやムラが発生
表面欠点の数は非常に少なく、極めて高品位な表面をも
つフレキシブルプリント配線用基板が得られた。[Table 3] In Table 3, ○: The plating appearance is very good by visual observation. ×: The appearance of the plating has stains and unevenness by visual observation. The number of surface defects is very small and the substrate for flexible printed wiring has an extremely high-quality surface. was gotten.
【００３１】（比較例１）実施例１と同様に、ポリイミ
ドフィルム上に０．１μmの銅被膜を形成後、電気銅め
っきを行い後、水洗、乾燥後巻き取り、エッチング液処
理することなく、フレキシブルプリント配線用基板を作
製した。その後、実施例１と同様に、得られたフレキシ
ブル配線用基板銅表面に発生した３０μm以上の大きさ
をもつ銅突起、並びに凹みの数を光学顕微鏡（ライカ社
製）を用いて検査を行ったところ、表１のような結果を
得た。実施例１と比較して明らかに表面品位が劣ってい
る結果となった。(Comparative Example 1) In the same manner as in Example 1, after forming a copper coating of 0.1 μm on a polyimide film, electrolytic copper plating was performed, followed by washing with water, drying, winding, and treatment with an etching solution. A flexible printed wiring board was produced. Then, in the same manner as in Example 1, the number of the copper projections having a size of 30 μm or more and the number of depressions generated on the obtained copper surface of the flexible wiring substrate was examined using an optical microscope (manufactured by Leica). However, the results shown in Table 1 were obtained. As a result, the surface quality was clearly inferior to that of Example 1.
【００３２】（比較例２）実施例１と同様に、ポリイミ
ドフィルム上に０．１μmの銅被膜を形成後、層厚が８
μmの電気銅めっきを行なった後、１２０秒後に０．５
μmのエッチング処理を実施例１と同様に行った。その
後、水洗、乾燥後巻き取り、フレキシブルプリント配線
用基板を作製した。その後、実施例１と同様に、得られ
たフレキシブル配線用基板銅表面に発生した３０μm以
上の大きさをもつ銅突起、並びに凹みの数を光学顕微鏡
（ライカ社製）を用いて検査を行ったところ、表１のよ
うな結果を得た。実施例１と比較して明らかに表面品位
が劣っている結果となった。さらに、銅めっき層に明ら
かな酸化膜層の形成とともにシミ、ムラが見られ著しく
外観を損ねる結果となった。(Comparative Example 2) As in Example 1, after forming a copper coating of 0.1 μm on a polyimide film, the layer thickness was 8
After performing copper plating of μm, 0.5 seconds after 120 seconds
The etching treatment of μm was performed in the same manner as in Example 1. Then, the substrate was washed with water, dried, and wound up to produce a flexible printed wiring board. Then, in the same manner as in Example 1, the number of copper projections having a size of 30 μm or more and the number of depressions generated on the obtained copper surface for flexible wiring substrate was inspected using an optical microscope (manufactured by Leica). However, the results shown in Table 1 were obtained. As a result, the surface quality was clearly inferior to that of Example 1. In addition, the formation of an oxide film layer on the copper plating layer was clearly observed, and spots and unevenness were observed, resulting in a marked deterioration of the appearance.
【００３３】[0033]
【発明の効果】以上、本発明のフレキシブルプリント配
線用基板の製造方法を用いることで、プラスチックフィ
ルムの上に金属層を約０．５〜３５μｍの厚みに形成す
ることができ、かつその表面に突起やへこみの全くない
フレキシブルプリント配線用基板を得ることができる。
その結果、従来よりもファインなパターン形成を行って
も、配線の切れやカケ、ショートなどが発生しない、優
れたＦＰＣ基板、ＣＯＦ用基板を提供できる。しかも、
従来は、たとえば、銅箔の厚さの限界により１２μｍ未
満のものは限定的にしか生産されていなかったが、０．
５〜１１μｍのより薄い銅層を形成できることにより、
パターン精度が向上し、より高密度、高精度の配線が可
能となる。しかも、銅箔ラミネート時に発生していた折
れきずやピンホールが少なく、経済性と高い品質を兼ね
備えたものが得られる。As described above, by using the method for manufacturing a flexible printed wiring board of the present invention, a metal layer can be formed on a plastic film to a thickness of about 0.5 to 35 μm, and the surface thereof can be formed. It is possible to obtain a flexible printed wiring board having no protrusions or dents.
As a result, it is possible to provide an excellent FPC substrate or COF substrate in which wiring breakage, chipping, short-circuiting, etc. do not occur even when finer pattern formation is performed than in the past. Moreover,
Conventionally, for example, a copper foil having a thickness of less than 12 μm has been limitedly produced due to the limit of the thickness of the copper foil.
By being able to form a thinner copper layer of 5-11 μm,
The pattern accuracy is improved, and higher density and higher accuracy wiring is possible. In addition, there are few creases and pinholes that occur during copper foil lamination, and it is possible to obtain a product that has both economic efficiency and high quality.
【図１】 図１は、本発明に係るリール・ツー・リール
方式で連続的にフィルムに電気めっきを施すための装置
の全体概略図である。FIG. 1 is an overall schematic view of an apparatus for continuously electroplating a film in a reel-to-reel system according to the present invention.
１ 繰り出しローラー ２ フィルム ３ めっき液槽 ４ エッチング液槽 ５ 陽極（アノード） ６ 側壁 ７ 巻き取りローラー 1 Feeding roller 2 films 3 plating bath 4 Etching liquid tank 5 Anode (anode) 6 side walls 7 Take-up roller
フロントページの続き (72)発明者 三宅 徹 福島県岩瀬郡鏡石町大字成田字諏訪町334 −３東洋メタライジング株式会社福島工場 内 (72)発明者 松村 隆一郎 福島県岩瀬郡鏡石町大字成田字諏訪町334 −３東洋メタライジング株式会社福島工場 内 Ｆターム(参考） 4K024 AA09 AB01 BA12 BB11 BC01 CA06 DA04 DA06 DA09 DB10 GA01 4K057 WA01 WE03 WE25 WG02 WN01Continued front page (72) Inventor Toru Miyake Fukushima Prefecture Iwase District Kagamiishi Town Oita Narita Suwa Town 334 -3 Toyo Metalizing Co., Ltd. Fukushima Factory Within (72) Inventor Ryuichiro Matsumura Fukushima Prefecture Iwase District Kagamiishi Town Oita Narita Suwa Town 334 -3 Toyo Metalizing Co., Ltd. Fukushima Factory Within F term (reference) 4K024 AA09 AB01 BA12 BB11 BC01 CA06 DA04 DA06 DA09 DB10 GA01 4K057 WA01 WE03 WE25 WG02 WN01
Claims (5)
き槽を１槽もしくは複数配置し、フィ ルム上に金属被
膜からなる導電層を有する基材フィルムを、これらの銅
めっき槽へ供給し各銅めっき槽毎に電気銅めっきを行っ
て該導電層表面に連続的に電気銅めっき層を形成させる
方法において、銅めっき層形成終了直後に該銅めっき層
をエッチングすることを特徴とするフレキシブルプリン
ト配線用基板の製造方法。1. A copper plating tank having an anode and an electrolytic copper plating solution is arranged in one tank or a plurality of tanks, and a base film having a conductive layer made of a metal coating on a film is supplied to each of these copper plating tanks. In a method of performing electrolytic copper plating in each copper plating tank to continuously form an electrolytic copper plating layer on the surface of the conductive layer, a flexible print characterized by etching the copper plating layer immediately after the completion of copper plating layer formation. Wiring board manufacturing method.
エッチング工程に投入することを特徴とする請求項１記
載のフレキシブルプリント配線用基板の製造方法。2. The method for manufacturing a flexible printed wiring board according to claim 1, wherein the etching step is performed within 90 seconds immediately after the formation of the copper plating layer.
ことを特徴とする請求項１または２記載のフレキシブル
プリント配線用基板の製造方法。3. The method for manufacturing a flexible printed wiring board according to claim 1, wherein the etching method is chemical etching.
ことを特徴とする請求項１〜３のいずれかに記載のフレ
キシブルプリント配線用基板の製造方法。4. The method for manufacturing a flexible printed wiring board according to claim 1, wherein the etching thickness is 2.0 μm or less.
であることを特徴とする請求項１〜４のいずれかに記載
のフレキシブルプリント配線用基板の製造方法。5. The electrolytic copper plating layer has a thickness of 1.0 to 35 μm.
The method for manufacturing a flexible printed wiring board according to any one of claims 1 to 4, wherein:
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|---|---|---|---|
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002150892A JP2003342787A (en) | 2002-05-24 | 2002-05-24 | Method of producing flexible printed circuit board |
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|---|---|
| JP2003342787A true JP2003342787A (en) | 2003-12-03 |
Family
ID=29768630
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|---|---|---|---|
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009502473A (en) * | 2005-07-26 | 2009-01-29 | ドレセル プライヴェイト リミテッド | Method for producing porous track membrane |
| JP2010205799A (en) * | 2009-02-27 | 2010-09-16 | Sumitomo Metal Mining Co Ltd | Two-layer plated substrate and method of manufacturing the same |
| US8177954B2 (en) | 2005-03-15 | 2012-05-15 | Fujifilm Corporation | Plating processing method, light-transmitting conductive film and electromagnetic wave-shielding film |
| CN105442010A (en) * | 2014-06-11 | 2016-03-30 | 深南电路有限公司 | PCB (printed circuit board) electroplating method and PCB electroplating apparatus |
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| US8177954B2 (en) | 2005-03-15 | 2012-05-15 | Fujifilm Corporation | Plating processing method, light-transmitting conductive film and electromagnetic wave-shielding film |
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