EP3252187B1 - Slipring with reduced contact noise - Google Patents
Slipring with reduced contact noise Download PDFInfo
- Publication number
- EP3252187B1 EP3252187B1 EP16197807.7A EP16197807A EP3252187B1 EP 3252187 B1 EP3252187 B1 EP 3252187B1 EP 16197807 A EP16197807 A EP 16197807A EP 3252187 B1 EP3252187 B1 EP 3252187B1
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- Prior art keywords
- layer
- nickel
- copper
- substrate
- gold
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 45
- 229910052802 copper Inorganic materials 0.000 claims description 45
- 239000010949 copper Substances 0.000 claims description 45
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 28
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims description 22
- 229910052759 nickel Inorganic materials 0.000 claims description 19
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 17
- 229910052737 gold Inorganic materials 0.000 claims description 17
- 239000010931 gold Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 15
- 229910001369 Brass Inorganic materials 0.000 claims description 6
- 239000010951 brass Substances 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 6
- GOBZQAFUBBVPEO-UHFFFAOYSA-N [Cu](C#N)C#N.[K] Chemical compound [Cu](C#N)C#N.[K] GOBZQAFUBBVPEO-UHFFFAOYSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000004913 activation Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
- C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Definitions
- the invention relates to a method for producing a gold-plated slip ring contact, a sliding contact and a galvanic bath.
- US 4,398,113 discloses a slip ring assembly which has a conventional slip ring contact.
- a copper layer (from 0.1 ⁇ m to 4 ⁇ m layer thickness) is successively applied to a mechanically processed copper-containing substrate material as an activation layer, if necessary a nickel and / or nickel-phosphor layer (each from 1 ⁇ m to 10 ⁇ m layer thickness) as a diffusion barrier. , Support and corrosion protection layer and a hard gold layer (from 1 ⁇ m to 15 ⁇ m) as contact material.
- Galvanic application of several layers to a substrate material is described, for example, in EP 2 581473 A1 , JP H03 223486 A , US 2003/135981 A1 and CN 101 696 512 A. disclosed.
- the object of the invention is to improve the electrical behavior, in particular the noise behavior, of the sliding contact.
- the process for producing a gold-plated slip ring contact has the following process steps: provision of an electrically conductive substrate, galvanic application of a copper layer on the substrate, galvanic application of a nickel and / or nickel-phosphorus layer on the copper layer, and galvanic application of a gold layer on the nickel and / or nickel-phosphor layer.
- provision of an electrically conductive substrate galvanic application of a copper layer on the substrate
- galvanic application of a nickel and / or nickel-phosphorus layer on the copper layer
- galvanic application of a gold layer on the nickel and / or nickel-phosphor layer is used.
- Such sliding contacts establish an electrical connection between moving parts.
- Such a sliding contact can be used either as a fixed part or as a moving part.
- Such a sliding contact can of course also be used both as a fixed part and as a moving part of a grinding module.
- E.g. such a sliding contact can also be used as a brush or as a sliding track.
- the absence of the brightener means that the copper layer deposited on the brass-containing substrate has a higher roughness than in the prior art.
- Sa or Sq values according to EN ISO 25178 can be used to characterize the layer roughness.
- the Sq value is the effective value or the square mean of the profile height of the surface.
- the Sa value is an average of the absolute values of the profile height of the surface.
- Typical Sa or Sq values for copper baths of the prior art are in the order of magnitude of 10 to 50 nm.
- the layer roughness of the deposited copper layer becomes Sa or Sq values of 200 nm to 1 ⁇ m increased.
- a certain leveling can take place depending on the intermediate layer and final layer used.
- the Sa and Sq values of the final layer according to the invention are typically a factor of 5 to 20 higher and thus rougher compared to conventional final layers.
- a gold layer produced in this way has improved electrical properties, in particular reduced contact noise.
- a sliding contact thus also has these improved electrical properties, in particular a reduced contact noise.
- such a layer structure with a rough uppermost gold layer can be used either on the brush or on the brush wires or on the sliding track or both on the brush or on the brush wires and on the sliding track.
- electrical noise values differ, e.g. measured as the 90% percentile of the peak-to-peak noise value over 5 revolutions over the lifetime, typically at least by a factor of 2.
- a pure potassium copper cyanide solution is used as the electroplating bath in the galvanic application of the copper layer.
- the copper layer is preferably applied to the substrate with a layer thickness of up to 4 ⁇ m. In a particularly advantageous embodiment, it is a copper layer with a layer thickness of up to 10 ⁇ m.
- the nickel and / or nickel-phosphorus layer is preferably applied with a layer thickness between 5 and 10 ⁇ m.
- the gold layer is electroplated onto the nickel and / or nickel phosphor layer
- the gold layer is preferably applied with a layer thickness between 3 and 9 ⁇ m, particularly preferably 6 ⁇ m.
- the process for producing a gold-plated slip ring contact produces a slip ring contact which has the following layer sequence: an electrically conductive substrate, a copper layer on the substrate, a nickel and / or nickel-phosphor layer on the copper layer, and a gold layer on the nickel and / or nickel-phosphor layer.
- the substrate has brass. It is further preferred that the substrate is made of brass.
- This slip ring contact which e.g. can be attached to a brush or on a sliding track, as already described above, is characterized by improved electrical properties.
- a galvanic bath is used for the deposition of copper, in which no brightener is used in the galvanic bath.
- an electrolyte based on potassium copper cyanide is preferably used as the electroplating bath in the galvanic application of the copper layer 12 to the substrate 10.
- the copper layer 12 is preferably applied to the substrate with a layer thickness of up to 4 ⁇ m.
- the copper layer 12 is a copper layer with a layer thickness of up to 10 ⁇ m.
- Figure 3 shows the third step of the method according to the invention for producing a gold-plated slip ring contact.
- a nickel and / or nickel-phosphor layer 14 is applied galvanically to the copper layer 12.
- the nickel and / or nickel-phosphor layer 14 is preferably applied with a layer thickness between 5 and 10 ⁇ m.
- Figure 4 shows the fourth and last step of the method according to the invention for producing a gold-plated slip ring contact.
- a gold layer 16 is galvanically applied to the nickel and / or nickel-phosphor layer 14.
- the gold layer 16 is preferably applied with a layer thickness between 3 and 9 ⁇ m, particularly preferably 6 ⁇ m.
- Figure 4 thus likewise shows a sliding contact according to the invention with the layer sequence described above on the substrate 10.
- the sliding contact has a rougher surface than sliding contacts from the prior art.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electroplating Methods And Accessories (AREA)
Description
Die Erfindung betrifft ein Verfahren zur Herstellung eines vergoldeten Schleifringkontaktes, einen Schleifkontakt sowie ein galvanisches Bad.The invention relates to a method for producing a gold-plated slip ring contact, a sliding contact and a galvanic bath.
Im Stand der Technik ist es bekannt, Schleifringkontakte wie folgt herzustellen. Auf ein mechanisch bearbeitetes kupferhaltiges Substratmaterial wird nacheinander eine Kupferschicht (von 0,1 µm bis zu 4 µm Schichtstärke) als Aktivierungsschicht, bei Bedarf eine Nickel- und/oder Nickel-Phosphorschicht (jeweils von 1 µm bis zu 10 µm Schichtdicke) als Diffusionssperr-, Stütz- und Korrosionsschutzschicht und eine Hartgoldschicht (von 1 µm bis zu 15 µm) als Kontaktmaterial aufgetragen. Galvanisches Auftragen mehrerer Schichten auf ein Substratmaterial wird beispielsweise in
Der Erfindung liegt die Aufgabe zugrunde, das elektrische Verhalten, insbesondere das Rauschverhalten, des Schleifkontaktes zu verbessern.The object of the invention is to improve the electrical behavior, in particular the noise behavior, of the sliding contact.
Diese Aufgabe wird durch das Verfahren nach Anspruch 1 und einen Schleifkontakt nach Anspruch 6 gelöst. Vorteilhafte Ausgestaltungen der Erfindung sind in den Unteransprüchen angegeben.This object is achieved by the method according to claim 1 and a sliding contact according to claim 6. Advantageous embodiments of the invention are specified in the subclaims.
Das Verfahren zur Herstellung eines vergoldeten Schleifringkontaktes weist folgende Verfahrensschritte auf: Bereitstellen eines elektrisch leitfähigen Substrats, galvanisches Auftragen einer Kupferschicht auf das Substrat, galvanisches Auftragen einer Nickel- und / oder Nickel-Phosphorschicht auf die Kupferschicht, und galvanisches Auftragen einer Goldschicht auf die Nickel- und / oder Nickel-Phosphorschicht. Hierbei wird beim galvanischen Auftragen der Kupferschicht auf das Substrat in dem verwendeten Galvanikbad kein Glanzbildner verwendet.The process for producing a gold-plated slip ring contact has the following process steps: provision of an electrically conductive substrate, galvanic application of a copper layer on the substrate, galvanic application of a nickel and / or nickel-phosphorus layer on the copper layer, and galvanic application of a gold layer on the nickel and / or nickel-phosphor layer. Here will When the copper layer is galvanically applied to the substrate in the electroplating bath used, no brightener is used.
Solche Schleifkontakte stellen eine elektrische Verbindung zwischen bewegten Teilen her.Such sliding contacts establish an electrical connection between moving parts.
Hierbei kann ein solcher Schleifkontakt entweder als feststehendes Teil oder als bewegtes Teil verwendet werden. Ein solcher Schleifkontakt kann natürlich auch sowohl als feststehendes Teil als auch als bewegtes Teil eines Schleifmoduls verwendet werden. Z.B. kann ein solcher Schleifkontakt auch als Bürste oder als Schleifbahn verwendet werden.Such a sliding contact can be used either as a fixed part or as a moving part. Such a sliding contact can of course also be used both as a fixed part and as a moving part of a grinding module. E.g. such a sliding contact can also be used as a brush or as a sliding track.
Durch die Abwesenheit der Glanzbildner wird erreicht, dass die auf das Messing aufweisende Substrat abgeschiedene Kupferschicht eine höhere Rauheit als beim Stand der Technik aufweist. Zur Charakterisierung der Schichtrauheit können Sa- oder Sq-Werte nach EN ISO 25178 herangezogen werden. Hierbei ist der Sq-Wert der Effektivwert oder das Quadratmittel der Profilhöhe der Oberfläche. Der Sa-Wert ist ein Mittelwert der Absolutwerte der der Profilhöhe der Oberfläche. Typische Sa- oder Sq-Werte liegen für Kupferbäder des Stands der Technik in der Größenordnung von 10 bis 50 nm. Bei der Anwendung der in der Erfindung beschriebenen Bäder wird die Schichtrauheit der abgeschiedenen Kupferschicht auf Sa- oder Sq-Werte von 200 nm bis 1 µm gesteigert. Bei der weiteren Ablagerung kann je nach verwendeter Zwischenschicht und Endschicht eine gewisse Einebnung erfolgen. Allerdings sind die Sa- und Sq-Werte der erfindungsgemäßen Endschicht im Vergleich zu herkömmlichen Endschichten um einen Faktor von typischerweise 5 bis 20 höher und somit rauer.The absence of the brightener means that the copper layer deposited on the brass-containing substrate has a higher roughness than in the prior art. Sa or Sq values according to EN ISO 25178 can be used to characterize the layer roughness. The Sq value is the effective value or the square mean of the profile height of the surface. The Sa value is an average of the absolute values of the profile height of the surface. Typical Sa or Sq values for copper baths of the prior art are in the order of magnitude of 10 to 50 nm. When using the baths described in the invention, the layer roughness of the deposited copper layer becomes Sa or Sq values of 200 nm to 1 µm increased. During the further deposition, a certain leveling can take place depending on the intermediate layer and final layer used. However, the Sa and Sq values of the final layer according to the invention are typically a factor of 5 to 20 higher and thus rougher compared to conventional final layers.
Die nachfolgenden Tabellenwerte wurden als Mittelwerte einer Probenserie (10 Wiederholversuche) bestimmt.The following table values were determined as mean values of a sample series (10 repeat tests).
Typische Sa- und Sq-Werte für Standard-Kupferschichten und erfindungsgemäße Kupferschichten sowie Standard-Endschichten und erfindungsgemäße Endschichten (Beispiel Kupfer; Nickel- und / oder Nickel-Phosphor; Gold-Systeme):
Diese erhöhte Rauheit der Kupferschicht führt nach dem nachfolgenden galvanischen Abscheiden einer Nickel- und / oder Nickel-Phosphorschicht auf der Kupferschicht und einer Goldschicht auf der Nickel- und / oder Nickel-Phosphorschicht zu einer erhöhten Rauheit der Goldschicht, welche für das elektrische Verhalten entscheidend ist. Die Rauheit der auf dem Substrat aufgetragenen Schicht, hier also der Kupferschicht, ist entscheidend für die Rauheit der obersten Schicht. Man kann auch sagen, dass sich die Rauheit der Kupferschicht bei mehreren galvanisch aufgetragenen Schichten bis in die letzte Galvanikschicht fortsetzt.After the subsequent electrodeposition of a nickel and / or nickel-phosphorus layer on the copper layer and a gold layer on the nickel and / or nickel-phosphorus layer, this increased roughness of the copper layer leads to an increased roughness of the gold layer, which is crucial for the electrical behavior . The roughness of the layer applied to the substrate, here the copper layer, is decisive for the roughness of the top layer. One can also say that the roughness of the copper layer continues with several galvanically applied layers down to the last electroplating layer.
Eine so hergestellte Goldschicht weist im Gegensatz zu herkömmlichen Schleifkontakten verbesserte elektrische Eigenschaften, insbesondere ein reduziertes Kontaktrauschen, auf. Somit weist auch ein Schleifkontakt diese verbesserten elektrischen Eigenschaften, insbesondere ein reduziertes Kontaktrauschen, auf. Dies haben von der Anmelderin durchgeführte Federdrahttests gezeigt. Hierbei kann ein solcher Schichtaufbau mit einer rauen obersten Goldschicht entweder auf der Bürste bzw. auf den Bürstendrähten oder auf der Schleifbahn oder sowohl auf der Bürste bzw. auf den Bürstendrähten als auch auf der Schleifbahn verwendet werden. In einem typischen Testaufbau unterscheiden sich elektrische Rauschwerte, z.B. gemessen als das 90%-Perzentil des Spitze-Spitze-Rauschwerts über 5 Umdrehungen über die Lebensdauer, typischerweise mindestens um einen Faktor 2.In contrast to conventional sliding contacts, a gold layer produced in this way has improved electrical properties, in particular reduced contact noise. A sliding contact thus also has these improved electrical properties, in particular a reduced contact noise. This has been shown by spring wire tests carried out by the applicant. In this case, such a layer structure with a rough uppermost gold layer can be used either on the brush or on the brush wires or on the sliding track or both on the brush or on the brush wires and on the sliding track. In a typical test setup, electrical noise values differ, e.g. measured as the 90% percentile of the peak-to-peak noise value over 5 revolutions over the lifetime, typically at least by a factor of 2.
Erfindungsgemäß wird beim galvanischen Auftragen der Kupferschicht auf das Substrat als Galvanikbad eine reine Kalium-Kupfercyanidlösung verwendet.According to the invention, a pure potassium copper cyanide solution is used as the electroplating bath in the galvanic application of the copper layer.
Bevorzugt wird die Kupferschicht auf das Substrat mit einer Schichtdicke von bis zu 4 µm aufgetragen. In einer besonders vorteilhaften Ausführungsform handelt es sich um eine Kupferschicht mit einer Schichtdicke von bis zu 10 µm.The copper layer is preferably applied to the substrate with a layer thickness of up to 4 μm. In a particularly advantageous embodiment, it is a copper layer with a layer thickness of up to 10 μm.
Bevorzugt wird beim galvanischen Auftragen der Nickel- und / oder Nickel-Phosphorschicht auf die Kupferschicht die Nickel- und / oder Nickel-Phosphorschicht mit einer Schichtdicke zwischen 5 und 10 µm aufgetragen.During the galvanic application of the nickel and / or nickel-phosphorus layer onto the copper layer, the nickel and / or nickel-phosphorus layer is preferably applied with a layer thickness between 5 and 10 μm.
Bevorzugt wird beim galvanischen Auftragen der Goldschicht auf die Nickel- und / oder Nickel-Phosphorschicht die Goldschicht mit einer Schichtdicke zwischen 3 und 9 µm, besonders bevorzugt 6 µm, aufgetragen.When the gold layer is electroplated onto the nickel and / or nickel phosphor layer, the gold layer is preferably applied with a layer thickness between 3 and 9 μm, particularly preferably 6 μm.
Mit dem Verfahren zur Herstellung eines vergoldeten Schleifringkontaktes wird ein Schleifringkontakt hergestellt, welcher folgende Schichtabfolge aufweist: ein elektrisch leitfähiges Substrat, eine Kupferschicht auf dem Substrat, eine Nickel- und / oder Nickel-Phosphorschicht auf der Kupferschicht, und eine Goldschicht auf der Nickel- und / oder Nickel-Phosphorschicht. Das Substrat weist Messing auf. Es ist ferner bevorzugt, dass das Substrat aus Messing besteht.The process for producing a gold-plated slip ring contact produces a slip ring contact which has the following layer sequence: an electrically conductive substrate, a copper layer on the substrate, a nickel and / or nickel-phosphor layer on the copper layer, and a gold layer on the nickel and / or nickel-phosphor layer. The substrate has brass. It is further preferred that the substrate is made of brass.
Dieser Schleifringkontakt, welcher z.B. auf einer Bürste oder auf einer Schleifbahn angebracht sein kann, zeichnet sich wie bereits oben geschildert durch verbesserte elektrische Eigenschaften aus.This slip ring contact, which e.g. can be attached to a brush or on a sliding track, as already described above, is characterized by improved electrical properties.
Bei der galvanischen Abscheidung von Kupfer des oben genannten Verfahrens wird ein galvanisches Bad zur Abscheidung von Kupfer verwendet, bei dem in dem galvanischen Bad kein Glanzbildner verwendet wird.In the galvanic deposition of copper of the above-mentioned method, a galvanic bath is used for the deposition of copper, in which no brightener is used in the galvanic bath.
Die Erfindung wird nachstehend ohne Beschränkung des allgemeinen Erfindungsgedankens anhand von Ausführungsbeispielen unter Bezugnahme auf die Zeichnungen exemplarisch beschrieben.
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Figur 1 zeigt den ersten Schritt des erfindungsgemäßen Verfahrens zur Herstellung eines vergoldeten Schleifringkontaktes. Hierbei wird ein bevorzugt aus Messing oder einer anderen kupferbasierten Legierunghergestelltes Substrat 10 bereitgestellt. -
Figur 2 zeigt den zweiten Schritt des erfindungsgemäßen Verfahrens zur Herstellung eines vergoldeten Schleifringkontaktes. Hierbei wird eineKupferschicht 12 auf dasSubstrat 10 galvanisch aufgetragen.
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Figure 1 shows the first step of the method according to the invention for producing a gold-plated slip ring contact. In this case, asubstrate 10 preferably made of brass or another copper-based alloy is provided. -
Figure 2 shows the second step of the method according to the invention for producing a gold-plated slip ring contact. Here, acopper layer 12 is applied galvanically to thesubstrate 10.
Hierbei wird beim galvanischen Auftragen der Kupferschicht 12 auf das Substrat 10 als Galvanikbad bevorzugt ein Elektrolyt auf Basis von Kalium-Kupfercyanid verwendet.In this case, an electrolyte based on potassium copper cyanide is preferably used as the electroplating bath in the galvanic application of the
Die Kupferschicht 12 wird bevorzugt auf das Substrat mit einer Schichtdicke von bis zu 4 µm aufgetragen. In einer besonders vorteilhaften Ausführungsform handelt es sich bei Kupferschicht 12 um eine Kupferschicht mit Schichtdicke von bis zu 10 µm.The
- 1010th
- SubstratSubstrate
- 1212th
- KupferschichtCopper layer
- 1414
- Nickel- und / oder Nickel-PhosphorschichtNickel and / or nickel-phosphor layer
- 1616
- GoldschichtGold layer
Claims (6)
- Method for manufacturing a gold-plated slipring contact comprising the following method steps:- providing an electrically conductive substrate (10);- galvanic application of a copper layer (12) onto the substrate (10);- galvanic application of a nickel and/or nickel-phosphor layer (14) onto the copper layer (12); and- galvanic application of a gold layer (16) onto the nickel and/or nickel-phosphor layer (14);characterized in that
the substrate (10) is made of brass and during galvanic application of the copper layer (12) onto the substrate (10), a pure potassium-copper-cyanide solution is used as an electroplating bath. - Method according to the preceding claim,
characterized in that
during galvanic application of the copper layer (12) onto the substrate (10), the copper layer (12) is applied with a layer thickness of up to 4 µm. - Method according to one of the preceding claims,
characterized in that
during galvanic application of the copper layer (12) onto the substrate (10), the copper layer (12) is applied with a layer thickness of up to 10 µm. - Method according to one of the preceding claims,
characterized in that
during the galvanic application of the nickel and/or nickel-phosphor layer (14) onto the copper layer (12), the nickel and/or nickel-phosphor layer (14) is applied with a layer thickness between 5 and 10 µm. - Method according to one of the preceding claims,
characterized in that
during the galvanic application of the gold layer (16) onto the nickel-phosphor layer (14), the gold layer (16) is applied with a layer thickness between 3 and 9 µm, preferably 6 µm. - Sliding contact comprising:- an electrically conductive substrate (10);- a copper layer (12) on the substrate (10);- a nickel-phosphor layer (14) on the copper layer (12); and- a gold layer (16) on the nickel-phosphor layer (14);characterized in that
the substrate (10) is made of brass and during galvanic application of the copper layer (12) to the substrate (10), a pure potassium-copper-cyanide solution is used as an electroplating bath, and a layer roughness of the deposited copper layer (12) has Sa- or Sq-values of 200 nm to 1 µm.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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EP16172007 | 2016-05-30 |
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EP3252187A1 EP3252187A1 (en) | 2017-12-06 |
EP3252187B1 true EP3252187B1 (en) | 2020-04-29 |
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EP16197807.7A Active EP3252187B1 (en) | 2016-05-30 | 2016-11-08 | Slipring with reduced contact noise |
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CN114361592B (en) * | 2021-12-28 | 2023-08-01 | 大连中比动力电池有限公司 | Additive and application thereof in sodium ion battery electrolyte |
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US4398113A (en) | 1980-12-15 | 1983-08-09 | Litton Systems, Inc. | Fiber brush slip ring assembly |
JPH0663111B2 (en) * | 1990-01-25 | 1994-08-17 | 日本アビオニクス株式会社 | Surface treatment method for sliding member of copper clad laminate |
US6984915B2 (en) * | 2002-01-22 | 2006-01-10 | Electro-Tec Corp. | Electrical slip ring platter multilayer printed circuit board and method for making same |
CN101696512A (en) * | 2009-11-13 | 2010-04-21 | 江苏省如高高压电器有限公司 | Gold-plating process of high-voltage contact head and contact finger |
DE102011115802B4 (en) * | 2011-10-12 | 2015-03-12 | C. Hafner Gmbh + Co. Kg | Process for the corrosion protection treatment of a workpiece made of an aluminum material, in particular of an aluminum wrought alloy |
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