CN101696512A - Gold-plating process of high-voltage contact head and contact finger - Google Patents
Gold-plating process of high-voltage contact head and contact finger Download PDFInfo
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- CN101696512A CN101696512A CN200910178366A CN200910178366A CN101696512A CN 101696512 A CN101696512 A CN 101696512A CN 200910178366 A CN200910178366 A CN 200910178366A CN 200910178366 A CN200910178366 A CN 200910178366A CN 101696512 A CN101696512 A CN 101696512A
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Abstract
The invention provides a gold-plating process of a high-voltage contact head and a high-voltage contact finger, which changes the traditional coppering process and carries out surface gold-plating treatment by adopting the steps of coppering, then nickeling and finally gold-plating. In the treatment process, the product is suitable for using outdoors for a long time and can not be vulcanized or halogenated by utilizing the inertness of gold, thereby effectively protecting the product and prolonging the service life; and in addition, during the use, as the product is not easy to vulcanize, the invention is attractive in appearance, favorable in contact and safe in use.
Description
Technical field
The present invention relates to the craft of gilding of a kind of high-voltage contact, fingertip, be specifically related to a kind ofly by two kinds of metals of preplating, and then carry out gold-plated technology, this technology has effectively prevented the product sulfuration.
Background technology
High-voltage contact in the market, the surface of fingertip are silver-plated.The shortcoming of this silver plated high-voltage contact, fingertip is: silver-plated: character is active, and anti-sulphur, halogen are bad.Easily sulfuration in the air, blackout influences outward appearance, electroconductibility, influences work-ing life; The local temperature height influences safety.
Summary of the invention
Main task of the present invention is to provide the craft of gilding of a kind of high-voltage contact, fingertip, is specifically related to a kind ofly can effectively prevent the product sulfuration, prolongs the product high-voltage contact in work-ing life, the craft of gilding of fingertip.
In order to solve above technical problem, the craft of gilding of a kind of high-voltage contact of the present invention, fingertip, mainly be made of pre-treatment, plating and aftertreatment three steps, its innovative point is: the gold-plated step of described electroplating technology was three steps, was first copper facing, nickel plating again, gold-plated at last; Described strike copper plating technique is: after all kinds of raw materials of copper facing are mixed formation solution with water dissolution in proportion, with 0.5-2A/dm
2Current density is 40-45 ℃ in temperature plated 1-2 minute down, and water at normal temperature is washed and finished pre-copper facing for twice then; Described nickel preplating technology is: after all kinds of raw materials of above-mentioned nickel plating are mixed formation solution with water dissolution in proportion, be 0.5-2A/dm with the current density
2, be 45-55 ℃ in temperature and plated 5 minutes down that nickel plating technology is finished in washing twice; Described craft of gilding is: after gold-plated all kinds of raw materials are mixed formation solution with water dissolution in proportion, be 0.5-1A/dm with the current density
2, be gold-plated under 45-50 ℃ in temperature with 1 μ m/5 minute, after gold had plated, craft of gilding was finished on normal temperature washing both sides.
Further, described copper facing raw material is: the cuprous concentration of hydrogenation is that the concentration of 80-90g/L, potassium hydride KH is 45-55g/L, and the concentration of potassium hydroxide is 5-150g/L, and the concentration of brightening agent is 15-25mL/L.
Further, described nickel plating raw material is: the concentration of single nickel salt is 250-350g/L, and the concentration of nickelous chloride is 45-55g/L, and the concentration of boric acid is 35-45g/L, and the concentration of brightening agent is 200-300mL/L.
Further, described gold-plated raw material is: the concentration of hydrogenation gold potassium is 8-12g/L, and the concentration of supplement is 20-30g/L.
Further, described supplement are bright dose of golden nickel.
The invention has the advantages that: the present invention adopts above-mentioned craft of gilding, makes contact, fingertip surface gold-plating, utilizes the inertness of gold; make product adaptation use out of doors for a long time; can not cure or halogenation, effectively protect product, increase the service life; and in use; owing to be difficult for curing, therefore, appearance looks elegant; and contact is good, and is safe in utilization.
Embodiment
Concrete processing step of the present invention is as follows:
This technology comprises pre-treatment, plating and aftertreatment three big steps.
Pre-treatment is divided into oil removing, pickling, localised protection, preceding cleaning, oil removing.
Pickling: A: oil removing is used by sodium hydroxide 6-10g/L, Na the contact fingertip
2CO
3Carry out oil removing in the alkali lye of 30-50g/L, tertiary sodium phosphate 50-70g/L configuration, temperature is 80-90 ℃, soaks 45 minutes, removes surperficial oil stain.
B: the washing clear water soaks 2 times, and first pass is to soak 1 minute in 80-90 ℃ hot water, and second time is to soak 1 minute in normal-temperature water.
C: pickling will have been carried out in the hydrochloric acid after the contact of above-mentioned two steps and fingertip are immersed in dilution at normal temperatures, and hydrochloric acid is 1: 1 with the ratio of water, and soak time is 1 minute, removes the oxide skin on contact and fingertip surface.
D: wash contact that pickling is good and fingertip and soaked at normal temperatures 1 minute.
E: soak 3-5 second in the mixing acid that bright dipping is configured to by 1: 3 volume ratio by 98% concentrated nitric acid and 98% vitriol oil.
F: contact and the fingertip of passivation after with bright dipping is soaked in the water after 3-5 takes out second, be soaked in 3-5 second in the sulfuric acid mixture liquid of chromic anhydride that 80-100g/ rises and 5-8g/L again, take out the back and in normal-temperature water, soaked 1 minute, in 60-80 ℃ hot water, soaked 30 seconds-1 minute drying again.
Localised protection: whole prod is immersed in the strippable coatings, and coating is natural rubber and thinner, viscosity be under 25 ℃ of conditions 80-120 second, gold-plated part part is peeled off.
Preceding cleaning: extremely light is cleared up with the husky skin polishing of 320 purposes in the part of peeling off, use the scouring pad wiping.
Oil removing: degreaser is ROHM AND HAAS degreaser 4%-6%, and it is 40-60g/L that DCF removes the oil-bound distemper consumption, washes at normal temperatures 1 minute, washes 2 times.
Plating is divided into activation, copper facing, nickel plating and gold-plated.
Activation: activator is the sulphuric acid soln that contains 5% weight percent sulfuric acid, and this product carries out activation treatment with ordinary method in this solution.
Copper facing: the copper facing raw material is: the cuprous concentration of hydrogenation is that the concentration of 80-90g/L, potassium hydride KH is 45-55g/L, and the concentration of potassium hydroxide is 5-150g/L, and the concentration of brightening agent is 15-25mL/L; Brightening agent of the present invention is the brightening agent that ROHM AND HAAS is produced energy.After the mixing of copper facing raw material, with 0.5-2A/dm
2Current density is 40-45 ℃ in temperature plated 1-2 minute down, and water at normal temperature is washed and finished pre-copper facing for twice then.
Nickel plating: at first pre-copper facing: hydrogenation is cuprous, and concentration is 80-90g/L, potassium cyanide, and concentration is 45-55g/L; Potassium hydroxide, concentration are 5-150g/L, plate 1-2 minute, and temperature is 40-45 ℃, and brightening agent is the EB brightening agent of Rhom and Hass, and current density is 0.5-2A/dm
2Washing is twice, normal temperature each 1 minute down.Nickel plating then: concentration of nickel sulfate is 250-350g/L, and nickelous chloride concentration is 45-55g/L, and boric acid concentration is 35-45g/L, brightening agent 200-300mL/L; Plating 5 minutes, is 0.5-2A/dm with the current density
2, be 45-55 ℃ in temperature and plated 5 minutes down.Washing, washing is twice, normal temperature each 1 minute down.
Gold-plated: hydrogenation gold potassium, concentration is 8-12g/L, supplement are 20-30g/L, are 0.5-1A/dm with the current density
2, be 45-50 in temperature.Gold-plated under ℃ with 1 μ m/5 minute.Washing, washing is twice, normal temperature each 1 minute down.
Aftertreatment is divided into back cleaning, coating protectant and packing.
The back cleaning: the stripping lacquer that partially plating gold is later is peeled off, and cleans up.
Coating protectant: ROHM AND HAAS, technology
Packing: qualified product are packed according to packing instructions.
Embodiment
Embodiment 1
The contact fingertip is used by sodium hydroxide 7g/L, Na
2CO
3Carry out oil removing in the alkali lye of 40g/L, tertiary sodium phosphate 53g/L configuration, temperature is 87 ℃, soaks 45 minutes, removes surperficial oil stain.Soak 2 times with clear water, first pass is to soak 1 minute in 87 ℃ hot water again, and second time is to soak 1 minute in normal-temperature water.And then being immersed in the hydrochloric acid after the dilution 1 minute at normal temperatures, hydrochloric acid is 1: 1 with the ratio of water, removes the oxide skin on contact and fingertip surface, and then soaks at normal temperatures 1 minute.Soak 3-5 second in the mixing acid that the concentrated nitric acid by 98% and 98% vitriol oil are configured to by 1: 3 volume ratio.Contact after the bright dipping and fingertip are soaked in the water after 3-5 takes out second, are soaked in 3-5 second in the sulfuric acid mixture liquid of chromic anhydride that 94g/ rises and 6g/L again, take out the back and in normal-temperature water, soaked 1 minute, immersion 30 seconds-1 minute in 75 ℃ hot water again, drying.Whole prod is immersed in the strippable coatings, and coating is natural rubber and thinner, viscosity be under 25 ℃ of conditions 80-120 second, gold-plated part part is peeled off.Extremely bright to the part of peeling off with the husky skin polishing of 320 purposes cleaning, use the scouring pad wiping.
Activation: activator is the sulphuric acid soln that contains 5% weight percent sulfuric acid, and this product carries out activation treatment with ordinary method in this solution.
Copper facing: the copper facing raw material is: the cuprous concentration of hydrogenation is that the concentration of 80-90g/L, potassium hydride KH is 45-55g/L, and the concentration of potassium hydroxide is 5-150g/L, and the concentration of brightening agent is 15-25mL/L; Brightening agent of the present invention is the brightening agent that ROHM AND HAAS is produced energy.After the mixing of copper facing raw material, with 0.5-2A/dm
2Current density is 40-45 ℃ in temperature plated 1-2 minute down, and water at normal temperature is washed and finished pre-copper facing for twice then.
Carry out nickel plating again: at first pre-copper facing: hydrogenation is cuprous, and concentration is 76g/L, potassium cyanide, and concentration is 50g/L; Potassium hydroxide, concentration are 90g/L, plate 1-2 minute, and temperature is 42 ℃, and brightening agent is 38 bronze medal brightening agents of Rhom and Hass, and current density is 0.5-2A/dm
2Washing is twice, normal temperature each 1 minute down.Nickel plating then: concentration of nickel sulfate is 342g/L, and nickelous chloride concentration is 49g/L, and boric acid concentration is 40g/L, brightening agent 250mL/L; Plating 5 minutes, is 0.5-2A/dm with the current density
2, be 50 ℃ of plating washings twice in 5 minutes down in temperature, normal temperature each 1 minute down.
Carry out gold-plated at last: hydrogenation gold potassium, concentration is 10g/L, supplement are 30g/L, are 0.5-1A/dm with the current density
2, be gold-plated under 50 ℃ with 1 μ m/5 minute in temperature.Washing, twice, normal temperature each 1 minute down.The stripping lacquer that partially plating gold is later is peeled off, and cleans up.Qualified product are packed according to packing instructions.
Embodiment 2
The contact fingertip is used by sodium hydroxide 10g/L, Na
2CO
3Carry out oil removing in the alkali lye of 50g/L, tertiary sodium phosphate 70g/L configuration, temperature is 90 ℃, soaks 45 minutes, removes surperficial oil stain.Soak 2 times with clear water, first pass is to soak 1 minute in 87 ℃ hot water again, and second time is to soak 1 minute in normal-temperature water.And then being immersed in the hydrochloric acid after the dilution 1 minute at normal temperatures, hydrochloric acid is 1: 1 with the ratio of water, removes the oxide skin on contact and fingertip surface, and then soaks at normal temperatures 1 minute.Soak 3-5 second in the mixing acid that the concentrated nitric acid by 98% and 98% vitriol oil are configured to by 1: 3 volume ratio.Contact after the bright dipping and fingertip are soaked in the water after 3-5 takes out second, are soaked in 3-5 second in the sulfuric acid mixture liquid of chromic anhydride that 100g/ rises and 8g/L again, take out the back and in normal-temperature water, soaked 1 minute, immersion 30 seconds-1 minute in 80 ℃ hot water again, drying.Whole prod is immersed in the strippable coatings, and coating is natural rubber and thinner, viscosity be under 25 ℃ of conditions 80-120 second, gold-plated part part is peeled off.Extremely bright to the part of peeling off with the husky skin polishing of 320 purposes cleaning, use the scouring pad wiping.
Activation: activator is the sulphuric acid soln that contains 5% weight percent sulfuric acid, and this product carries out activation treatment with ordinary method in this solution.
Copper facing: the copper facing raw material is: the cuprous concentration of hydrogenation is that the concentration of 80-90g/L, potassium hydride KH is 45-55g/L, and the concentration of potassium hydroxide is 5-150g/L, and the concentration of brightening agent is 15-25mL/L; Brightening agent of the present invention is the brightening agent that ROHM AND HAAS is produced energy.After the mixing of copper facing raw material, with 0.5-2A/dm
2Current density is 40-45 ℃ in temperature plated 1-2 minute down, and water at normal temperature is washed and finished pre-copper facing for twice then.
Carry out nickel plating again: at first pre-copper facing: hydrogenation is cuprous, and concentration is 90g/L, potassium cyanide, and concentration is 55g/L; Potassium hydroxide, concentration are 150g/L, plate 1-2 minute, and temperature is 45 ℃, and brightening agent is a ROHM AND HAAS, and current density is 0.5-2A/dm
2Washing is twice, normal temperature each 1 minute down.Nickel plating then: concentration of nickel sulfate is 350g/L, and nickelous chloride concentration is 55g/L, and boric acid concentration is 45g/L, brightening agent 300mL/L; Plating 5 minutes, is 0.5-2A/dm with the current density
2, be 50 ℃ of plating washings twice in 5 minutes down in temperature, normal temperature each 1 minute down.
Carry out gold-plated at last: hydrogenation gold potassium, concentration is 12g/L, supplement are 30g/L, are 0.5-1A/dm with the current density
2, be gold-plated under 50 ℃ with 1 μ m/5 minute in temperature.Washing, twice, normal temperature each 1 minute down.The stripping lacquer that partially plating gold is later is peeled off, and cleans up.Qualified product are packed according to packing instructions.
Claims (5)
1. the craft of gilding of a high-voltage contact, fingertip mainly is made of pre-treatment, plating and three steps of aftertreatment, and it is characterized in that: the gold-plated step of described electroplating technology was three steps, was first copper facing, nickel plating again, gold-plated at last; Described strike copper plating technique is: after the copper facing raw material is mixed, with 0.5-2A/dm
2Current density is 40-45 ℃ in temperature plated 1-2 minute down, and water at normal temperature is washed and finished pre-copper facing for twice then; Described nickel preplating technology is: after above-mentioned nickel plating raw material is mixed, be 0.5-2A/dm with the current density
2, be 45-55 ℃ in temperature and plated 5 minutes down that nickel plating technology is finished in washing twice; Described craft of gilding is: after gold-plated raw material is mixed, be 0.5-1A/dm with the current density
2, be gold-plated under 45-50 ℃ in temperature with 1 μ m/5 minute, after gold had plated, craft of gilding was finished in normal temperature washing twice.
2. the craft of gilding of a kind of high-voltage contact according to claim 1, fingertip is characterized in that: described copper facing raw material is: concentration is that the hydrogenation of 80-90g/L is cuprous, the potassium hydride KH of 45-55g/L, the potassium hydroxide of 5-150g/L, the brightening agent of 15-25mL/L.
3. the craft of gilding of a kind of high-voltage contact according to claim 1, fingertip is characterized in that: described nickel plating raw material is: concentration is the single nickel salt of 250-350g/L, the nickelous chloride of 45-55g/L, the boric acid of 35-45g/L, the brightening agent of 200-300mL/L.
4. the craft of gilding of a kind of high-voltage contact according to claim 1, fingertip is characterized in that: described gold-plated raw material is: concentration is the hydrogenation gold potassium of 8-12g/L, the supplement of 20-30g/L.
5. the craft of gilding of a kind of high-voltage contact according to claim 4, fingertip is characterized in that: described supplement are bright dose of golden nickel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910178366A CN101696512A (en) | 2009-11-13 | 2009-11-13 | Gold-plating process of high-voltage contact head and contact finger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910178366A CN101696512A (en) | 2009-11-13 | 2009-11-13 | Gold-plating process of high-voltage contact head and contact finger |
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| Publication Number | Publication Date |
|---|---|
| CN101696512A true CN101696512A (en) | 2010-04-21 |
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|---|---|---|---|
| CN200910178366A Pending CN101696512A (en) | 2009-11-13 | 2009-11-13 | Gold-plating process of high-voltage contact head and contact finger |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102443829A (en) * | 2011-12-08 | 2012-05-09 | 天津大学 | Surface plating of Ag-Ni electric contact and preparation process thereof |
| CN103036088A (en) * | 2011-10-04 | 2013-04-10 | 日本压着端子制造株式会社 | Contact and electrical connector |
| CN103643271A (en) * | 2013-11-28 | 2014-03-19 | 江苏省如高高压电器有限公司 | Electroplating process of J-type disconnecting switch contact finger |
| CN105401180A (en) * | 2015-12-23 | 2016-03-16 | 苏州市金星工艺镀饰有限公司 | Electroplating liquid of wear-resistant gold-plated film and electroplating method thereof |
| EP3252187A1 (en) * | 2016-05-30 | 2017-12-06 | Schleifring und Apparatebau GmbH | Slipring with reduced contact noise |
| CN107447237A (en) * | 2016-05-30 | 2017-12-08 | 滑动环及设备制造有限公司 | The slip ring of contact noise with reduction |
| CN108330522A (en) * | 2018-01-30 | 2018-07-27 | 商丘金振源电子科技有限公司 | A kind of novel local electro-plating method and device |
| CN113186572A (en) * | 2021-04-30 | 2021-07-30 | 东莞市环侨金属制品有限公司 | Rhodium ruthenium alloy electroplating process |
-
2009
- 2009-11-13 CN CN200910178366A patent/CN101696512A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103036088A (en) * | 2011-10-04 | 2013-04-10 | 日本压着端子制造株式会社 | Contact and electrical connector |
| CN102443829A (en) * | 2011-12-08 | 2012-05-09 | 天津大学 | Surface plating of Ag-Ni electric contact and preparation process thereof |
| CN102443829B (en) * | 2011-12-08 | 2014-07-16 | 天津大学 | Surface plating of Ag-Ni electric contact and preparation process thereof |
| CN103643271A (en) * | 2013-11-28 | 2014-03-19 | 江苏省如高高压电器有限公司 | Electroplating process of J-type disconnecting switch contact finger |
| CN103643271B (en) * | 2013-11-28 | 2016-01-20 | 江苏省如高高压电器有限公司 | A kind of J type isolator fingertip electroplating technology |
| CN105401180A (en) * | 2015-12-23 | 2016-03-16 | 苏州市金星工艺镀饰有限公司 | Electroplating liquid of wear-resistant gold-plated film and electroplating method thereof |
| EP3252187A1 (en) * | 2016-05-30 | 2017-12-06 | Schleifring und Apparatebau GmbH | Slipring with reduced contact noise |
| CN107447237A (en) * | 2016-05-30 | 2017-12-08 | 滑动环及设备制造有限公司 | The slip ring of contact noise with reduction |
| US10666004B2 (en) | 2016-05-30 | 2020-05-26 | Schleifring Gmbh | Slipring with reduced contact noise |
| CN107447237B (en) * | 2016-05-30 | 2021-04-20 | 史莱福灵有限公司 | Slip ring with reduced contact noise |
| CN108330522A (en) * | 2018-01-30 | 2018-07-27 | 商丘金振源电子科技有限公司 | A kind of novel local electro-plating method and device |
| CN113186572A (en) * | 2021-04-30 | 2021-07-30 | 东莞市环侨金属制品有限公司 | Rhodium ruthenium alloy electroplating process |
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Open date: 20100421 |