CN103643271B - A kind of J type isolator fingertip electroplating technology - Google Patents
A kind of J type isolator fingertip electroplating technology Download PDFInfo
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- CN103643271B CN103643271B CN201310615629.2A CN201310615629A CN103643271B CN 103643271 B CN103643271 B CN 103643271B CN 201310615629 A CN201310615629 A CN 201310615629A CN 103643271 B CN103643271 B CN 103643271B
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Abstract
The present invention relates to a kind of J type isolator fingertip electroplating technology, it is characterized in that: described plating stage comprises copper pre-plating, washing, silver-plated and silver-plated in advance successively, before silver-plated, the peg of Electropolating hangers hangs fingertip, and on each fingertip outer cover tubular dielectric shielding case, the fingertip that this insulation shielding covers on fingertip moves contact area front and has one and move window corresponding to contact area with fingertip; Electroplating.In silver-plated operation, utilize insulation shielding cover to the surface protection of the non-dynamic contact area of fingertip, reduce the adhesion amount of metal ion during plating, and then realize moving contact area at fingertip and plating the silvering that a layer thickness reaches more than 20 microns, the non-perpendicular contact segment of fingertip then can only plate the silvering of layer; Isolator fingertip is once electroplated reach the requirement of same workpiece different zones different thickness, greatly cost-saving, and shorten the process-cycle.
Description
Technical field
The present invention relates to a kind of electroplating technology, particularly a kind of J type isolator fingertip electroplating technology.
Background technology
Isolator is mainly used for needing the part had a power failure reliably to isolate with alive part, to ensure the safety of service work in high voltage distribution installation.Traditional isolator galvanic circle comprises pair of conductive arm, and be arranged on contact or the fingertip of conductive arm one end, the conductive arm the other end is electrically connected wiring board by soft strength, and on soft strength, cover has rain cover.It to be coordinated with fingertip by contact and realizes divide-shut brake.
As shown in Figure 1, it connects and composes " J " shape by right angle setting section 11, perpendicular contact section 12 and arcuate guide section 13 to the J type fingertip of isolator successively, and installation end 11 is drilled with connecting hole 14, and the outer surface of vertical section 12 and segmental arc 13 is formed with groove.In process of production, need at fingertip electroplating surface one deck silvering, it requires that the silvering thickness that fingertip moves contact area (i.e. the most of region of vertical section 12) is 20 microns, and quiet contact area or non-contact area (i.e. construction section 11 and segmental arc 13) only need 6 microns.Method traditional is at present the silvering that direct plating last layer thickness is not less than 20 microns, and then meets design requirement.The shortcoming of this kind of structure is: although meet design requirements, and quiet contact area or non-contact area only need 6 microns, virtually causes the waste of resource and the raising of cost.
Also there is part to adopt the mode of twice plating to reduce costs, when first time electroplates, superscribe insulating protective layer at each quiet contact area or non-contact area, and then move the thinner silvering of contact area plating last layer at fingertip; Remove insulating protective layer again, then entirety plates one deck silvering, and then make fingertip move the thicker silvering of contact area twice silver-plated formation.Its shortcoming is: need twice plating, therefore workload significantly promotes, and reduces production efficiency.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of J type isolator fingertip electroplating technology, once can electroplate the requirement meeting the different thickness of coating of workpiece different zones, reduce electroplating cost.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of J type isolator fingertip electroplating technology, and mainly comprise Pre-treatment before plating stage, plating stage and plating posttreatment stage, its innovative point is: described plating stage is specially:
Step S1: copper pre-plating, is suspended on some fingertips on the peg of Electropolating hangers, and by the copper electroplating liquid in peg immersion plating pond, electrical current: 190-200A, time: 2-4min, at the plated surface last layer of fingertip as the copper coating of interior intermediate layer, copper coating thickness 1.8-2.2 micron; Step S2: wash the fingertip after copper pre-plating, removes the copper electroplating liquid on fingertip surface; Step S3: silver-plated in advance, the fingertip after washing is placed in the silver plating solution of electrolytic plating pool, electric current: 110-120A, the time: 0.9-1.2min, thickness of coating is about 0.4-0.6 micron, as outer intermediate layer; Step S4: silver-plated, the peg of Electropolating hangers hangs fingertip, and on each fingertip outer cover a upper and lower unsealed tubular dielectric shielding case, the fingertip that this insulation shielding covers on fingertip moves contact area front and has one and move window corresponding to contact area with fingertip; The distance of fingertip distance insulation shielding cover inwall is at 3-7mm; Fingertip on Electropolating hangers and insulation shielding cover are immersed in silver plating solution, conduction time 60min, electric current 80-82A; Make the fingertip of fingertip move contact area and plate the thick silvering of a layer thickness at 20-25 micron, move contact area at the non-fingertip of fingertip and plate the thin silvering of a layer thickness at 6-9 micron.
The invention has the advantages that: fingertip electroplating technology of the present invention, by copper pre-plating, in advance silver-plated and finally silver-plated come, silvering and fingertip substrate contact good, not easy to foaming, surface smoothness is high; In silver-plated operation, fingertip moves contact area due to just to the window of insulation shielding cover, when electroplating, impact is less, and utilize insulation shielding cover to the surface protection of the non-dynamic contact area of fingertip, reduce the adhesion amount of metal ion during plating, and then realize moving contact area at fingertip and plating the silvering that a layer thickness reaches more than 20 microns, the non-perpendicular contact segment of fingertip then can only plate the silvering of layer; Isolator fingertip is once electroplated reach the requirement of same workpiece different zones different thickness, greatly cost-saving, and shorten the process-cycle.
Accompanying drawing explanation
Fig. 1 is isolator fingertip structural representation.
Fig. 2 uses insulation shielding cover to carry out silvering electroplating conditions figure in the present invention.
Embodiment
Present invention is disclosed a kind of J type isolator fingertip electroplating technology, once can electroplate the requirement meeting the different thickness of coating of workpiece different zones.
The isolator fingertip 1 of current routine connects and composes " J " shape successively by right angle setting section 11, perpendicular contact section 12 and arcuate guide section 13, and the at right angle setting section of fingertip has open holes 14.
J type isolator fingertip electroplating technology in the present invention, mainly comprise Pre-treatment before plating stage, plating stage and plating posttreatment stage, plating stage is specially:
Step S1: copper pre-plating, is suspended on some fingertips on the peg of Electropolating hangers, and by the copper electroplating liquid in peg immersion plating pond, electrical current: 190-200A, time: 2-4min, at the plated surface last layer of fingertip as the copper coating of interior intermediate layer, copper coating thickness 1.8-2.2 micron;
Step S2: wash the fingertip after copper pre-plating, removes the copper electroplating liquid on fingertip surface;
Step S3: silver-plated in advance, the fingertip after washing is placed in the silver plating solution of electrolytic plating pool, electric current: 110-120A, the time: 0.9-1.2min, thickness of coating is about 0.4-0.6 micron, as outer intermediate layer;
Step S4: silver-plated, as shown in Figure 2, the peg 4 of Electropolating hangers hangs fingertip 1, and on each fingertip 1 outer cover a upper and lower unsealed tubular dielectric shielding case 2, this insulation shielding cover 2 moves contact area front at the fingertip of fingertip and has one and move window corresponding to contact area 21 with fingertip; The distance of fingertip distance insulation shielding cover inwall is in certain distance; Fingertip on Electropolating hangers and insulation shielding cover are immersed in silver plating solution; Make the fingertip of fingertip move contact area and plate the thick silvering of a layer thickness at 20-25 micron, move contact area at the non-fingertip of fingertip and plate the thin silvering of a layer thickness at 6-9 micron.
In this step, isolator 479.1 fingertip for Rugao High-Voltage Electrical Appliance Co., Ltd., Jiangsu Province:
Embodiment one
Fingertip distance shielding case inwall 8mm, electroplate according to normal flow, silver-plating bath electric current 70A, electroplating time 60min, test silver-plated workspace mean thickness 12 microns, average 10 microns of nonclient area thickness, does not meet isolator fingertip manufacturer's standard;
Embodiment two
Fingertip distance shielding case inwall 8mm, electroplate according to normal flow, silver-plating bath electric current 80A, electroplating time 60min, test silver-plated workspace mean thickness 18 microns, average 14 microns of nonclient area thickness, does not meet isolator fingertip manufacturer's standard;
Embodiment three
Fingertip distance shielding case inwall 7mm, electroplate according to normal flow, silver-plating bath electric current 80A, electroplating time 60min, test silver-plated workspace mean thickness 19 ~ 20 microns, average 11 microns of nonclient area thickness, meets isolator fingertip manufacturer's standard;
Embodiment four
Fingertip distance shielding case inwall 6mm, electroplate according to normal flow, silver-plating bath electric current 82A, electroplating time 60min, test silver-plated workspace mean thickness 20 ~ 21 microns, average 10 microns of nonclient area thickness, meets isolator fingertip manufacturer's standard;
Embodiment five
Fingertip distance shielding case inwall controls at 5mm, and electroplate according to normal flow, silver-plating bath electric current 82A, electroplating time 60min, test silver-plated workspace mean thickness 24 microns, average 7 microns of nonclient area thickness, meets manufacturer's standard;
Embodiment six
Fingertip distance shielding case inwall 3mm, electroplates according to normal flow, silver-plating bath electric current 82A, electroplating time 60min, tests silver-plated workspace mean thickness 25 microns, average 6 microns of nonclient area thickness;
Embodiment seven
Fingertip distance shielding case inwall 2mm, electroplate according to normal flow, silver-plating bath electric current 82A, electroplating time 60min, test silver-plated workspace mean thickness 30 microns, average 5 microns of nonclient area thickness, local has plating not go up phenomenon.
Therefore, in step s 4 which, the distance of fingertip distance insulation shielding cover inwall is at 2.5-7mm; Conduction time 60min, electric current 80-82A is advisable, and the fingertip of fingertip can be made to move contact area and plate the thick silvering of a layer thickness at 20-25 micron, move contact area plate the thin silvering of a layer thickness at 6-9 micron at the non-fingertip of fingertip.
Claims (1)
1. a J type isolator fingertip electroplating technology, mainly comprises Pre-treatment before plating stage, plating stage and plating posttreatment stage, it is characterized in that: described plating stage is specially:
Step S1: copper pre-plating, is suspended on some fingertips on the peg of Electropolating hangers, and by the copper electroplating liquid in peg immersion plating pond, electrical current: 190-200A, time: 2-4min, at the plated surface last layer of fingertip as the copper coating of interior intermediate layer, copper coating thickness 1.8-2.2 micron;
Step S2: wash the fingertip after copper pre-plating, removes the copper electroplating liquid on fingertip surface;
Step S3: silver-plated in advance, the fingertip after washing is placed in the silver plating solution of electrolytic plating pool, electric current: 110-120A, the time: 0.9-1.2min, thickness of coating 0.4-0.6 micron, as outer intermediate layer;
Step S4: silver-plated, the peg of Electropolating hangers hangs fingertip, and on each fingertip outer cover a upper and lower unsealed tubular dielectric shielding case, the fingertip that this insulation shielding covers on fingertip moves contact area front and has one and move window corresponding to contact area with fingertip; The distance of fingertip distance insulation shielding cover inwall is at 3-7mm;
Fingertip on Electropolating hangers and insulation shielding cover are immersed in silver plating solution, conduction time 60min, electric current 80-82A; Make the fingertip of fingertip move contact area and plate the thick silvering of a layer thickness at 20-25 micron, move contact area at the non-fingertip of fingertip and plate the thin silvering of a layer thickness at 6-9 micron.
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| CN201310615629.2A CN103643271B (en) | 2013-11-28 | 2013-11-28 | A kind of J type isolator fingertip electroplating technology |
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| CN201310615629.2A CN103643271B (en) | 2013-11-28 | 2013-11-28 | A kind of J type isolator fingertip electroplating technology |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105018995A (en) * | 2015-07-10 | 2015-11-04 | 陈圳浩 | Silver ornament surface brightness five-layer electroplating technology |
| CN105751427A (en) * | 2016-03-10 | 2016-07-13 | 高铭电子（惠州）有限公司 | Hardware injection molded switch preparation method |
| CN106591898A (en) * | 2016-12-21 | 2017-04-26 | 贵州振华群英电器有限公司（国营第八九厂） | Silver plating process for contactor plastic compression part |
| CN106757199A (en) * | 2016-12-22 | 2017-05-31 | 唐恩(厦门)电气有限公司 | One kind prepares high pressure and separates the silver-colored graphite coating process of switch |
| CN110952128A (en) * | 2019-11-01 | 2020-04-03 | 江苏中科瑞尔汽车科技有限公司 | Shielding electroplating method and hanger structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1594669A (en) * | 2004-06-21 | 2005-03-16 | 乐清市帕特尼触头有限公司 | Production method for electrical contact material |
| CN101696512A (en) * | 2009-11-13 | 2010-04-21 | 江苏省如高高压电器有限公司 | Gold-plating process of high-voltage contact head and contact finger |
-
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1594669A (en) * | 2004-06-21 | 2005-03-16 | 乐清市帕特尼触头有限公司 | Production method for electrical contact material |
| CN101696512A (en) * | 2009-11-13 | 2010-04-21 | 江苏省如高高压电器有限公司 | Gold-plating process of high-voltage contact head and contact finger |
Non-Patent Citations (2)
| Title |
|---|
| 电工产品镀银技术现状及发展建议;蒋国钊等;《电机电器技术》;19910430(第4期);第37-41页 * |
| 适用于输配电行业的铜件镀银工艺;茅红裕;《电镀与涂饰》;20110630;第30卷(第6期);第8-11页 * |
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