CN110528034B - Local plating method for surface of plastic product - Google Patents
Local plating method for surface of plastic product Download PDFInfo
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- CN110528034B CN110528034B CN201910852667.7A CN201910852667A CN110528034B CN 110528034 B CN110528034 B CN 110528034B CN 201910852667 A CN201910852667 A CN 201910852667A CN 110528034 B CN110528034 B CN 110528034B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
Abstract
The invention discloses a local plating method for the surface of a plastic product, which comprises the following steps: s1, plastic surface metallization: metallizing the surface of the pretreated plastic product to plate a first metal conductive layer on the whole surface; s2, laser engraving partition: carving the outline of the to-be-plated area on the surface of the plastic product by using laser, and exposing the substrate of the plastic product at the outline to divide the to-be-plated area and the non-plated area and electrically isolate the to-be-plated area from the non-plated area; s3, plating a conductive layer in the to-be-plated area and dissolving the conductive layer in the non-plated area: connecting the area to be plated on the surface of the plastic product with an electrode and electrifying, plating a second metal conductive layer on the area to be plated, and dissolving the first metal conductive layer in the non-plating area in the plating solution. The invention divides and electrically isolates the plastic product with metalized surface by laser engraving, and the metal layer of the non-plating area is dissolved while the metal layer is plated on the area to be plated, thereby realizing the local plating on the surface of the plastic product, not only meeting the requirements of precise and complex circuits, but also improving the local plating quality and efficiency and reducing the local plating cost.
Description
Technical Field
The invention belongs to the technical field of surface treatment of plastic products, and particularly relates to a local plating method for the surface of a plastic product.
Background
In the field of communication electronics, some important parts need to be formed by using high dielectric constant materials, and in order to enable products to have special radio frequency performance, functional circuits need to be plated on the surfaces of the products, such as: plastic parts molded from LCP material, generally, the surface of the plastic part is plated locally by the following methods:
(1) for example, the invention discloses a method for laser engraving and electroplating on a plastic surface, which is a Chinese invention patent and has an application number of 02127135.6, and the method comprises the following steps: coating the back of the plastic material with light-transmitting plating-resistant ink print; the method comprises the steps of applying a metal film coating pretreatment to the front surface of a plastic material, applying laser engraving to the metal film coating pretreatment plastic material to determine a required pattern, and applying electroplating treatment to the plastic material, wherein the method is difficult to apply to complex pattern requirements, has very low dimensional precision and cannot meet the requirements of precise circuits;
(2) the double-color injection molding process is adopted, only one material is treated before electroplating, and the other material is not plated, as in the Chinese invention patent: the invention discloses a plastic product electroplating process method, which has the application number of 200610123178.0 and utilizes a two-color injection molding process to form an electroplating area and a waste electroplating area so as to achieve the effect of local electroplating. In this way, for complex circuits, the mold structure cannot meet the requirement, and the dielectric constants of the two materials are different, so that the radio frequency performance is also influenced;
(3) the invention discloses a local electroplating method for a plastic surface, which adopts electroplating pretreatment, copper plating or nickel plating and then removes unnecessary plating layers by laser, and belongs to the Chinese invention patent with the application number of 201210515285.3.
Therefore, the inventors have endeavored to design a method for local plating on the surface of a plastic product to solve the above problems.
Disclosure of Invention
The invention aims to: the method for locally plating the surface of the plastic product is characterized in that the plastic product with the metalized surface is partitioned and electrically isolated through laser engraving, the metal layer in the non-plating area is dissolved while the metal layer is plated in the area to be plated, so that the local plating on the surface of the plastic product is realized, the requirements of precise and complex circuits are met, the radio frequency performance is not influenced, the local plating quality and efficiency can be improved, and the local plating cost is reduced.
In order to achieve the purpose of the invention, the invention adopts a technical scheme that:
a method for locally plating the surface of a plastic product comprises the following steps:
s1, plastic surface metallization: metallizing the surface of the pretreated plastic product to plate a first metal conductive layer on the surface of the whole plastic product, wherein the first metal conductive layer not only has conductivity, but also has enough binding force and sufficient coverage with a substrate of the plastic product, so that the post process is convenient to carry out;
s2, laser engraving partition: carving the outline of the to-be-plated area on the surface of the plastic product by using laser, and exposing the substrate of the plastic product at the outline to electrically isolate the to-be-plated area and the non-plated area on the surface of the plastic product;
s3, plating a conductive layer in the to-be-plated area and dissolving the conductive layer in the non-plated area: connecting an electrode to a to-be-plated area on the surface of the plastic product and electrifying, plating a second metal conducting layer on the to-be-plated area, and dissolving the first metal conducting layer in a non-plated area in a plating solution so as to expose a substrate in the non-plated area for insulation;
preferably, in step S1, the preprocessing method includes: and sequentially carrying out oil removal cleaning and sand blasting treatment on the surface of the molded plastic part to obtain a plastic product with the surface roughness of 0.5-0.8 um.
The purpose of degreasing and cleaning in the pretreatment is to remove grease and oxides thereof on the surface of the molded plastic part, and a reagent used for degreasing is a common oil stain cleaning agent capable of removing an injection molding release agent, such as a plastic oil stain cleaning agent produced by Shenzhen Guanjie optimization Limited.
The purpose of the sand blasting in the pretreatment is to coarsen the surface of the plastic product to form spongy dents, so that the metal coating can be conveniently anchored in the dents, and the coating can form mechanical adhesion with the plastic.
Preferably, the specific method for metallizing the surface of the plastic product comprises the following steps: the plastic product is immersed in an activation solution containing palladium ions for sensitization, a continuous metal palladium layer is attached to the surface of the plastic product, the plastic product is taken out, washed and immersed in a sulfuric acid water solution to activate metal palladium, metal ions in a plating solution are reduced into metal in a chemical deposition mode, the metal ions are separated out from the surface of the plastic product, the first metal conductive layer with the thickness of 1-2 um is formed, and the first metal conductive layer is a metal nickel layer.
In the concrete method for the surface metallization of the plastic product, the activating solution can be a mixed solution of palladium chloride, stannous chloride and hydrochloric acid, wherein the palladium chloride is a palladium catalyst, the stannous chloride is a cocatalyst, the activating solution can enable a continuous metal palladium layer to be attached to the surface of the plastic product, the sensitization treatment time of the plastic product in the activating solution is 1.5-2 min, and the temperature is 30-35 ℃. Activating the plastic product in sulfuric acid water solution for 1.5-2 min at 30-35 deg.c and chemical deposition for 8-10 min at 38-40 deg.c to initiate the adsorption of metal deposited on the particle core of the plastic surface, promote the homogeneity and forming speed of the coating and increase the adsorption capacity of the coating.
The chemical nickel-depositing plating liquid is neutral or alkaline, and is prepared with nickel sulfate, nickel acetate, etc. as main salt, hypophosphite, sodium borohydride, borane, hydrazine, etc. as reductant, and through adding various assistants and reduction reaction to plate metal nickel layer on the surface of plastic product.
Preferably, the step S3 is further: and after the partitioned plastic product to-be-plated area is electrified, a second metal conducting layer is formed on the first metal conducting layer of the to-be-plated area in an electroplating way in an electroplating solution of an electroplating bath in an electroplating way, so that the binding force of the plating layer is improved, meanwhile, the first metal conducting layer of the to-be-plated area is prevented from being dissolved in the electroplating solution, and the first metal conducting layer of the non-plated area is dissolved in the electroplating solution, so that the plastic substrate is exposed out of the non-plated area, the non-plated area is not conductive, and the metal conducting layer cannot be plated again.
Further, the main components of the electroplating solution are sulfuric acid and copper sulfate, the mass concentration of the sulfuric acid is 180 g/L-220 g/L, the mass concentration of the copper sulfate is 50-80 g/L, the coating can be more uniform due to the strong dispersing capacity (TP) of the sulfuric acid and the copper sulfate, the thickness of the second metal conducting layer is 2 um-3 um, and the second metal conducting layer is made of metal copper.
After partitioning, after the area to be plated of the plastic product is electrified in the electroplating bath, the following electrochemical reactions occur:
and (3) cathode reaction: cu2++2e＝Cu
2H++2e＝H2
And (3) anode reaction: cu-2e ═ Cu2+
4OH--4e＝2H2O+O2
The nickel is insoluble in water and can be slowly dissolved in dilute acid to release hydrogen to generate green positive divalent nickel ions Ni2+In the electroplating process, a layer of metal copper is plated on the to-be-plated area of the plastic product due to electrification, the metal copper is insoluble in dilute sulfuric acid, and the electroplating speed of the metal copper is greater than the speed of nickel dissolved in the dilute sulfuric acid, so that in the electroplating process, a layer of metal copper protective metal nickel layer is directly plated on the surface of the metal nickel layer of the to-be-plated area, and the metal nickel layer of the non-plated area is dissolved in the acid electroplating solution.
Furthermore, the hanger is provided with a plurality of hooks made of metal conductive materials, the surfaces of the hooks are coated with insulating paint, the tail ends of the hooks are exposed out of contact parts, the contact parts are in contact conductive connection with the to-be-plated area of the plastic product, and the electrodes are connected with the to-be-plated area of the plastic product through the hanger by 0.5-0.8A of current so as to electrify the to-be-plated area of the plastic product.
Preferably, plastic product treats that the plating zone is located different planes or curved surfaces, laser is transmitted by 3D laser engraving machine, 3D laser engraving machine transmitting power is 10W ~ 20W, laser is infrared laser or ultraviolet laser, laser sculpture's profile width is 0.2mm ~ 0.5mm, laser sculpture's profile depth is 2um ~ 5um to remove the first metal conducting layer on the profile completely, will treat plating zone and non-plating zone electrical isolation.
Preferably, the method for locally plating the surface of the plastic product further comprises the following steps:
s4, thickening and plating: and plating a third metal conductive layer on the second metal conductive layer of the plastic product, and thickening the plating layer.
Further, the third metal conducting layer is metal copper, the metal copper is deposited on the second metal conducting layer through chemical plating, and the plating thickness of the third metal conducting layer is 10 um-20 um.
The electroless copper plating solution is neutral or alkaline, generally nickel sulfate, nickel acetate and the like are used as main salts, hypophosphite, sodium borohydride, borane, hydrazine and the like are used as reducing agents, various auxiliaries are added, a metal copper layer is plated on the surface of the plastic product through a reduction reaction, and the main function of the third metal conductive layer is a bearing material.
Preferably, the method for locally plating the surface of the plastic product further comprises the following steps:
s5, tin plating layer: the third metal conducting layer surface is plated with a tin layer, and the weldability and the decorativeness of the third metal conducting layer can be increased, so that electronic parts can be conveniently welded on the surface of a plastic product, and the plating thickness of the tin layer is 3 um-8 um.
The tin plating process comprises the following steps: adding 1.0% of a tin plating additive into tin plating water for use, wherein the tin deposition temperature is 20-30 ℃, the tin deposition time is 15-30 min, and the plating solution is stirred lightly in the tin plating process.
Since a reducing agent such as hypophosphite, sodium borohydride, dialkylborane, hydrazine, formaldehyde, etc. used for electroless plating of Ni or Cu cannot be used to reduce Sn. The reason is that Sn is a high hydrogen evolution overpotential metal, and the reducing agent has hydrogen evolution reaction in the deposition of electroless plating, so the reducing agent can not react Sn2+Is reduced to Sn. The electroless tin plating must be performed with a strong reducing agent that does not evolve hydrogen, such as Ti3+And plating the surface of the third metal conductive layer with a metallic tin layer through a reduction reaction.
Compared with the prior art, the invention has the following technical effects: according to the invention, the plastic product with the metalized surface is partitioned and electrically isolated through laser engraving, the metal layer in the non-plating area is dissolved while the metal layer is plated on the area to be plated, so that the local plating on the surface of the plastic product is realized, and the local uniform plating layer with the tolerance within 0.05mm and complex patterns is prepared, so that the requirements of a precise circuit are met, the radio frequency performance is not influenced, the local plating quality and efficiency can be improved, and the local plating cost is reduced.
Drawings
FIG. 1 is a sectional perspective view of a plastic part according to an embodiment of the present invention;
FIG. 2 is a perspective view of another embodiment of the plastic part of the present invention;
FIG. 3 is a perspective view of a plastic part after partial plating according to an embodiment of the present invention;
FIG. 4 is a perspective view of another perspective of the plastic part after being partially plated according to the embodiment of the present invention;
fig. 5 is a partial perspective view of the hanger of the present invention.
Illustration of the drawings:
1. plastic products, 11, a hanging hole, 12, a transition hole, 13, a first transfer hole, 14, a second transfer hole, 2, a contour, 3, a to-be-plated area, 4, a non-plated area, 5, a conductive area, 100, a hanger, 101, a hanging rod, 102, a hook, 103 and a contact part.
Detailed Description
The embodiments of the present invention will be described in detail with reference to the accompanying drawings, which are for reference and illustration only and are not to be construed as limiting the scope of the invention.
A method for locally plating the surface of a plastic product comprises the following steps:
s1, plastic surface metallization: metallizing the surface of the pretreated plastic product, and plating a first metal conductive layer with the thickness of 1-2 um on the surface of the whole plastic product, wherein the first metal conductive layer is a metal nickel layer;
s2, laser engraving partition: carving the outline of the to-be-plated area on the surface of the plastic product by using laser, and exposing the substrate of the plastic product at the outline to electrically isolate the to-be-plated area and the non-plated area on the surface of the plastic product;
s3, plating a conductive layer in the to-be-plated area and dissolving the conductive layer in the non-plated area: electrically connecting the partitioned plastic product to-be-plated area with an electrode through a hanger, immersing the plastic product to-be-plated area in electroplating solution of an electroplating bath, and electroplating a first metal conducting layer of the to-be-plated area to form a second metal conducting layer with the thickness of 2-3 um after the to-be-plated area is electrified, wherein the second metal conducting layer is made of metal copper, and the first metal conducting layer of the non-plated area is dissolved in the electroplating solution;
s4, thickening and plating: plating a third metal conductive layer with the thickness of 10-20 um on the second metal conductive layer of the plastic product through chemical plating deposition, wherein the third metal conductive layer is metal copper and is a thickened plating layer;
s5, tin plating layer: and plating a tin layer on the surface of the third metal conducting layer to form a conducting area, wherein the plating thickness of the tin layer is 3-8 um.
In step S1, the preprocessing method includes: and sequentially carrying out oil removal cleaning and sand blasting treatment on the surface of the molded plastic part to obtain a plastic product with the surface roughness of 0.5-0.8 um.
In step S1, the specific method for metallizing the surface of the plastic product includes: the plastic product is immersed in an activation solution containing palladium ions for sensitization, a continuous metal palladium layer is attached to the surface of the plastic product, the plastic product is taken out, washed by water and immersed in a sulfuric acid aqueous solution, the metal palladium is activated for 1.5 min-2 min at the temperature of 30-35 ℃, the metal ions in the plating solution are reduced into metal in a chemical deposition mode, the metal ions are separated out on the surface of the plastic product, and the first metal conductive layer is formed, wherein the chemical deposition time is 8 min-10 min, and the temperature is 38-40 ℃.
The specific method for metalizing the surface of the plastic product comprises the following steps: the activating solution can be a mixed solution of palladium chloride, stannous chloride and hydrochloric acid, wherein the palladium chloride is a palladium catalyst, the stannous chloride is a cocatalyst, the activating solution can enable a continuous metal palladium layer to be attached to the surface of the plastic product, the plastic product is sensitized in the activating solution for 1.5-2 min, and the temperature is 30-35 ℃; the chemical nickel-depositing liquid is neutral or alkaline, and is prepared through reduction reaction of nickel sulfate, nickel acetate, etc. as main salt and hypophosphite, sodium borohydride, borane, hydrazine, etc. as reductant to plate metal nickel layer on the surface of plastic product.
In the step S3, the main components of the electroplating solution are sulfuric acid and copper sulfate, the mass concentration of the sulfuric acid is 180g/L to 220g/L, the mass concentration of the copper sulfate is 50g/L to 80g/L, the surface of the metal nickel layer of the region to be plated is directly plated with a metal copper protective metal nickel layer, the metal nickel layer of the non-plating region is dissolved in the acid electroplating solution, and after the electroplating bath is electrified, the following electrochemical reactions occur:
and (3) cathode reaction: cu2++2e＝Cu
2H++2e＝H2
And (3) anode reaction: cu-2e ═ Cu2+
4OH--4e＝2H2O+O2。
In the step S3, the hanger is provided with a plurality of hooks made of a metal conductive material, the surface of each hook is coated with insulating paint, and a contact portion at the tail end is exposed, the contact portion is in contact conductive connection with the to-be-plated area of the plastic product, and the electrode conducts current of 0.5A to 0.8A to the to-be-plated area of the plastic product through the hanger.
In step S4, the electroless copper plating solution is neutral or alkaline, and generally includes nickel sulfate, nickel acetate, etc. as main salts, hypophosphite, sodium borohydride, borane, hydrazine, etc. as reducing agents, and various additives are added to plate a metal copper layer on the surface of the plastic product through a reduction reaction.
In step S5, the chemical tin plating process includes: selects strong reducing agent Ti without hydrogen evolution3+Adding 1.0% of a tin plating additive into tin plating water for use, wherein the tin deposition temperature is 20-30 ℃, the tin deposition time is 15-30 min, and the surface of the third metal conductive layer is plated with a metal tin layer through a reduction reaction.
The plastic product to-be-plated areas are located on different planes or curved surfaces, the laser is emitted by a 3D laser engraving machine, the emission power of the 3D laser engraving machine is 10W-20W, the laser is infrared laser or ultraviolet laser, the width of the laser engraved outline is 0.2 mm-0.5 mm, and the depth of the laser engraved outline is 2 um-5 um.
The following describes a method for local plating on the surface of a plastic product according to the present invention with a specific embodiment.
The plastic product 1 of this embodiment uses a plastic material with a high dielectric constant as a substrate, as shown in fig. 1 to 2, the plastic product 1 is provided with two hanging holes 11 for hanging a product, a transition hole 12, a first transfer hole 13 and a second transfer hole 14, as shown in fig. 1, the front side of the plastic product 1 is provided with a circular protrusion, the second transfer hole 14 is located at the center of the protrusion, a step is provided beside the protrusion, the transition hole 12 is located on the step and penetrates through the step, the front side of the plastic product is provided with a region to be plated 3, the region to be plated 3 on the front side starts from one end of the plastic product 1, after branching, one of the regions to be plated 3 ends at the first transfer hole 13, the other region to be plated 3 ends at the transition hole 12, as shown in fig. 2, the back side of the plastic product 1 is provided with a groove corresponding to the boss, the second transfer hole 14 is located in the groove, the region to be plated 3 on the back side starts at the transition hole 12, and the plastic product 1 connects the front-side region to be plated 3 with the back-side region to be plated 3 through the transition hole 12, and the first and second transfer holes 13 and 14 are used for electrically connecting with other devices.
The hanger 100 used in this embodiment is a hardware processing part for city endowing from the Yangmen river region, a plurality of hanging rods 101 are fixed on the side surface of the main rod of the hanger 100, a plurality of hooks 102 (as shown in fig. 5) for hanging the plastic product 1 are fixed on each hanging rod 101, the main rod, the hanging rods 101 and the hooks 102 of the hanger 100 are all made of metal conductive materials, the hooks 102 can be freely bent or straightened, insulating paint is coated on the main rod and the hanging rods 101, insulating paint is coated on the surface of each hook 102, and the contact part 103 at the tail end of each hook is exposed and is used for contacting the to-be-plated region 3 of the plastic product 1.
A method for locally plating the surface of a plastic product 1 comprises the following steps:
s1, plastic surface metallization: sequentially carrying out oil removal cleaning and sand blasting pretreatment on the surface of a molded plastic part to obtain a plastic product 1 with the surface roughness of 0.6um, immersing the plastic product 1 in an activation solution mixed by palladium chloride, stannous chloride and hydrochloric acid for sensitization to enable a continuous metal palladium layer to be attached to the surface of the plastic, taking out the plastic product, washing, immersing in a sulfuric acid aqueous solution, activating the metal palladium for 1.5min at the temperature of 32 ℃, reducing metal ions in a plating solution into metal in a chemical deposition mode, and plating a metal nickel layer with the thickness of 1.5um on the surface of the whole plastic product 1;
s2, laser engraving partition: referring to fig. 1 and 2, a 3D laser engraving machine emits an infrared laser with a power of 15W, first engraves an outline 2 with a width of 0.3mm along a to-be-plated area 3 on a front surface of a plastic product 1, a first transfer hole 13 and a transition hole 12 are surrounded by the outline 2 on the front surface, and a substrate of the plastic product 1 is exposed at the outline 2 on the front surface, so that the to-be-plated area 3 on the front surface of the plastic product is partitioned and electrically isolated from a non-plated area 4 (as shown in fig. 1), then the plastic product 1 is turned over, the infrared laser engraves an outline 2 with a width of 0.3mm along the to-be-plated area 3 on a back surface of the plastic product 1, the transition hole 12 on the back surface and a second transfer hole 14 on the back surface are surrounded by the outline 2 on the back surface, and the substrate of the plastic product 1 is exposed at the outline 2 on the back surface, so that the to-be-plated area 3 is partitioned and electrically isolated from the non-plated area 4 (as shown in fig. 2);
s3, plating a conductive layer in the to-be-plated area and dissolving the conductive layer in the non-plated area: the plastic product 1 after being partitioned is hung on two adjacent hooks 102 of a hanger 100 through two hanging holes 11, the part of the hooks 102 coated with insulating paint is contacted with the hanging holes 11, the non-plating area 4 of the plastic product is prevented from being electrified, the hooks 102 are bent, the contact parts 103 of the hooks 102 are contacted with the area 3 to be plated of the plastic product, the plastic product 1 hung on the hanger 100 is soaked in electroplating solution with the main components of sulfuric acid and copper sulfate, after the electrodes supply weak current of 0.5A to the main rod of the hanger 100, the main rod transmits weak current to the hook 102 through each hanging rod 101, the hook 102 simultaneously energizes the zones to be plated 3 on the front and back sides of the plastic product through the contact part 103, metal copper with the thickness of 2.5um is formed by electroplating on metal nickel layers of the zones to be plated 3 on the front side branch, the zones to be plated 3 on the back side branch, the transition holes, the first transfer holes 13 and the second transfer holes 14, and the metal nickel layers of the non-plating zones 4 are dissolved in electroplating solution and expose substrates;
s4, thickening and plating: plating metal copper with the thickness of 15um on the metal copper with the thickness of 2.5um of the plastic product through chemical plating deposition, and thickening a plating layer;
s5, tin plating layer: a tin layer with a thickness of 5um is plated on the surface of the metal copper with a thickness of 15um to form the conductive region 5, as shown in fig. 3 and 4.
The conductive region 5 branch of this embodiment is two parts, and the conductive region of one of them branch is located plastic product 1 openly, directly communicates with first switching hole 13 electricity, and the conductive region part of another branch is located plastic product openly, and through transition hole 12 and the conductive region intercommunication of reverse side, finally communicate with second switching hole 14 electricity in the recess, when the initial end of the conductive region of openly circular telegram, the electric current shunts the back through two branches, get into different devices through first switching hole 13 and second switching hole 14 respectively, realize accurate, complicated circuit transmission.
The invention divides and electrically isolates the plastic product with metalized surface by laser engraving, and the metal layer of the non-plating area is dissolved while the metal layer is plated on the area to be plated, thereby realizing the local plating of the surface of the plastic product, producing the local uniform plating layer with the tolerance within 0.05mm and complex pattern, meeting the requirements of precise and complex circuits, not influencing the radio frequency performance, improving the local plating quality and efficiency, and reducing the local plating cost.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the present invention.
Claims (3)
1. A method for locally plating the surface of a plastic product is characterized by comprising the following steps:
s1, plastic surface metallization: metallizing the surface of the plastic product with the pretreated surface roughness of 0.5-0.8 um to plate a first metal conductive layer on the surface of the whole plastic product;
the specific method for metalizing the surface of the plastic product comprises the following steps: immersing the plastic product in an activating solution containing palladium ions for sensitization, attaching a continuous metal palladium layer on the surface of the plastic, taking out the plastic product, washing, immersing in a sulfuric acid aqueous solution, activating metal palladium, reducing metal ions in a plating solution into metal in a chemical deposition mode, and precipitating on the surface of the plastic product to form the first metal conductive layer with the thickness of 1-2 um, wherein the first metal conductive layer is a metal nickel layer;
s2, laser engraving partition: carving the outline of the to-be-plated area on the surface of the plastic product by using laser, and exposing the substrate of the plastic product at the outline to electrically isolate the to-be-plated area and the non-plated area on the surface of the plastic product;
s3, plating a conductive layer in the to-be-plated area and dissolving the conductive layer in the non-plated area: connecting an electrode to a region to be plated on the surface of the plastic product, electrifying, plating a second metal conductive layer on the region to be plated, and dissolving the first metal conductive layer in a non-plating region in plating solution;
the step S3 further includes: electrically connecting the partitioned plastic product to-be-plated area with an electrode through a hanger, immersing the partitioned plastic product to-be-plated area in electroplating solution of an electroplating bath, electroplating a first metal conducting layer of the partitioned plastic product to-be-plated area to form a second metal conducting layer after the partitioned plastic product to-be-plated area is electrified, and dissolving the first metal conducting layer of the non-plated area in the electroplating solution;
the hanger is provided with a plurality of hooks made of metal conductive materials, insulating paint is coated on the surfaces of the hooks, contact parts at the tail ends of the hooks are exposed, the contact parts are in contact conductive connection with the to-be-plated area of the plastic product, and the electrodes conduct current of 0.5-0.8A to the to-be-plated area of the plastic product through the hanger;
the main components of the electroplating solution are sulfuric acid and copper sulfate, the mass concentration of the sulfuric acid is 180 g/L-220 g/L, the mass concentration of the copper sulfate is 50 g/L-80 g/L, the thickness of the second metal conducting layer is 2 um-3 um, and the second metal conducting layer is metal copper;
s4, thickening and plating: plating a third metal conductive layer on the second metal conductive layer of the plastic product, and thickening the plating layer;
the third metal conducting layer is made of metal copper, the metal copper is deposited on the second metal conducting layer through chemical plating, and the plating thickness of the third metal conducting layer is 10-20 um;
s5, tin plating layer: plating a tin layer on the surface of the third metal conducting layer, wherein the thickness of the tin layer is 3-8 um;
the tin plating process comprises the following steps: adding 1.0% of a tin plating additive into tin plating water for use, wherein the tin deposition temperature is 20-30 ℃, the tin deposition time is 15-30 min, and the plating solution is stirred lightly in the tin plating process.
2. The method for partially plating the surface of a plastic part according to claim 1, wherein in step S1, the pre-treatment method comprises: and sequentially carrying out oil removal cleaning and sand blasting treatment on the surface of the molded plastic part to obtain a plastic product with the surface roughness of 0.5-0.8 um.
3. The method for locally plating the surface of the plastic product according to claim 1, wherein the to-be-plated area of the plastic product is located on different planes or curved surfaces, the laser is emitted by a 3D laser engraving machine, the emission power of the 3D laser engraving machine is 10W-20W, the laser is infrared laser or ultraviolet laser, the width of the laser engraved outline is 0.2 mm-0.5 mm, and the depth of the laser engraved outline is 2 um-5 um.
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| CN113637960A (en) * | 2020-04-27 | 2021-11-12 | 苏州硕贝德创新技术研究有限公司 | Selective electroplating method for surface of plastic part |
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| CN113564593B (en) * | 2021-06-30 | 2024-01-16 | 深圳市信维通信股份有限公司 | Method for improving binding force of plastic surface coating |
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