JPH0655232U - Electrolytic capacitor - Google Patents

Electrolytic capacitor

Info

Publication number
JPH0655232U
JPH0655232U JP9347292U JP9347292U JPH0655232U JP H0655232 U JPH0655232 U JP H0655232U JP 9347292 U JP9347292 U JP 9347292U JP 9347292 U JP9347292 U JP 9347292U JP H0655232 U JPH0655232 U JP H0655232U
Authority
JP
Japan
Prior art keywords
electrolytic capacitor
outer case
sleeve
air
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9347292U
Other languages
Japanese (ja)
Inventor
▲きよし▼ 石原
Original Assignee
日本ケミコン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本ケミコン株式会社 filed Critical 日本ケミコン株式会社
Priority to JP9347292U priority Critical patent/JPH0655232U/en
Publication of JPH0655232U publication Critical patent/JPH0655232U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】 【目的】 電解コンデンサの封止強度を低下させること
なく、電解コンデンサの封口部側と基板との間に生じる
空間部内に空気が閉じ込められないようにした電解コン
デンサを提供する。 【構成】 外装ケース(2)の表面にスリーブ(絶縁ス
リーブ4)を被せた電解コンデンサであって、前記スリ
ーブに前記外装ケースの封口部側と基板(12)面との
間に形成される空間部(10)に閉じ込められる空気を
放出する切欠き部(22)を形成したものである。
(57) [Abstract] [Purpose] To provide an electrolytic capacitor in which air is not trapped in the space formed between the sealing portion side of the electrolytic capacitor and the substrate without lowering the sealing strength of the electrolytic capacitor. . An electrolytic capacitor in which a sleeve (insulating sleeve 4) is covered on the surface of an outer case (2), the space formed between the sealing portion side of the outer case and the substrate (12) surface in the sleeve. A cutout portion (22) for discharging air trapped in the portion (10) is formed.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、外装ケースの外周面を絶縁スリーブで被覆した電解コンデンサに関 する。 The present invention relates to an electrolytic capacitor in which the outer peripheral surface of an outer case is covered with an insulating sleeve.

【0002】[0002]

【従来の技術】[Prior art]

一般に、電解コンデンサでは、外装ケースの周面に絶縁スリーブが被せられ、 この絶縁スリーブは、外装ケースの絶縁とともに、定格等の表示手段として用い られている。通常、この絶縁スリーブには、加工性等の点で優れた熱収縮性を持 つ合成樹脂からなるシュリンクスリーブが用いられている。 Generally, in an electrolytic capacitor, an outer sleeve is covered with an insulating sleeve, and this insulating sleeve is used as an indicator of the rating and the like together with the insulation of the outer case. Usually, a shrink sleeve made of synthetic resin having excellent heat shrinkability in terms of workability is used for this insulating sleeve.

【0003】 例えば、図3に示すように、外装ケース2に熱収縮性の絶縁スリーブ4を被せ て収縮させた場合、絶縁スリーブ4の開口縁部は、外装ケース2を封口する封口 体6の上面に外装ケース2の開口縁部に沿って収縮して湾曲し、外装ケース2の 縁部8とともに封口部側に空間部10を形成する。この空間部10は、外装ケー ス2の縁部8がカーリング処理される場合にはより顕著であり、大きな容積とな る。For example, as shown in FIG. 3, when the outer case 2 is covered with a heat-shrinkable insulating sleeve 4 to be shrunk, the opening edge portion of the insulating sleeve 4 has a sealing body 6 for sealing the outer case 2. The upper surface is contracted and curved along the opening edge of the outer case 2 to form a space 10 on the sealing portion side together with the edge 8 of the outer case 2. This space portion 10 is more prominent and has a large volume when the edge portion 8 of the exterior case 2 is curled.

【0004】[0004]

【考案が解決しようとする課題】[Problems to be solved by the device]

ところで、このような電解コンデンサの封口部側を基板12の実装面に当て、 リード14を基板12に形成されている貫通孔16に挿入して仮固定し、その背 面側の導電パターン18とリード14とを半田20で固定及び電気的に接続する ものとする。この場合、基板12の実装面には外装ケース2の封口部側を一様に 覆う絶縁スリーブ4が当てられ、しかも、絶縁スリーブ4は適当な弾力性を持っ ているため、空間部10は密閉状態となるのである。この状態で、半田20の処 理を半田リフローにより行なうと、基板12を通して空間部10の空気が温めら れて膨張し、空間部10から排出することになる。しかも、空間部10内の空気 の加熱は瞬間的に行なわれるため、空気の膨張率は高く、電解コンデンサを押し 上げる程度の大きさである。このため、半田20の接続及び固定時に電解コンデ ンサの傾きや半田20に空気が通過したいわゆるブローホールが生じ、これが回 路装置の信頼性を低下させる原因となっている。 By the way, the sealing portion side of such an electrolytic capacitor is applied to the mounting surface of the substrate 12, the lead 14 is inserted into the through hole 16 formed in the substrate 12 and temporarily fixed, and the conductive pattern 18 on the back surface side thereof is formed. The lead 14 is fixed and electrically connected with the solder 20. In this case, the mounting surface of the substrate 12 is covered with the insulating sleeve 4 that uniformly covers the sealing portion side of the outer case 2, and since the insulating sleeve 4 has an appropriate elasticity, the space 10 is hermetically sealed. It becomes a state. If the solder 20 is processed by solder reflow in this state, the air in the space 10 is warmed and expanded through the substrate 12, and is discharged from the space 10. Moreover, since the air in the space 10 is heated instantaneously, the expansion coefficient of the air is high, and the size is such that the electrolytic capacitor is pushed up. Therefore, when the solder 20 is connected and fixed, a tilt of the electrolytic capacitor and a so-called blow hole in which air passes through the solder 20 occur, which causes the reliability of the circuit device to deteriorate.

【0005】 従来、外装ケースのカーリング部に切欠き部を設けて、封口側の空間部に残留 する空気を排出するものが提案されているが、電解コンデンサは、気密性が特性 を決定する上で重要な要素となるため、外装ケースのカーリング部の一部を切除 することは、その分だけ封止強度を低下させ、特性悪化の原因になる。Conventionally, it has been proposed that a curling portion of an outer case is provided with a cutout portion to discharge air remaining in a space portion on a sealing side. However, in an electrolytic capacitor, airtightness determines a characteristic. Therefore, cutting off a part of the curling part of the outer case reduces the sealing strength by that amount and causes deterioration of the characteristics.

【0006】 そこで、本考案は、電解コンデンサの封止強度を低下させることなく、電解コ ンデンサの封口部側と基板との間に生じる空間部内に空気が閉じ込められないよ うにした電解コンデンサを提供することを目的とする。Therefore, the present invention provides an electrolytic capacitor in which air is not trapped in the space formed between the substrate side and the sealing side of the electrolytic capacitor without lowering the sealing strength of the electrolytic capacitor. The purpose is to do.

【0007】[0007]

【課題を解決するための手段】[Means for Solving the Problems]

本考案の電解コンデンサは、図1に例示するように、外装ケース(2)の表面 にスリーブ(絶縁スリーブ4)を被せた電解コンデンサであって、前記スリーブ に前記外装ケースの封口部側と基板(12)面との間に形成される空間部(10 )に閉じ込められる空気を放出する切欠き部(22)を形成したことを特徴とす る。 As shown in FIG. 1, the electrolytic capacitor of the present invention is an electrolytic capacitor in which a sleeve (insulating sleeve 4) is covered on the surface of an outer case (2), and the sleeve has a sealing portion side and a substrate. It is characterized in that a notch (22) for discharging air trapped in a space (10) formed between the (12) plane and the (12) plane is formed.

【0008】[0008]

【作用】[Action]

電解コンデンサが実装される基板と封口部との間に形成される空間部は、スリ ーブに形成された切欠き部を以て外気に通じており、半田付け時に膨張した空気 は、切欠き部を以て外気に放出される。したがって、空気の膨張による電解コン デンサの押し上げや半田へのブローホールの発生を防止することができる。 The space formed between the board on which the electrolytic capacitor is mounted and the sealing part communicates with the outside air through the notch formed in the sleeve, and the air expanded during soldering has the notch. It is released to the outside air. Therefore, it is possible to prevent the electrolytic capacitor from being pushed up due to the expansion of air and the generation of blow holes in the solder.

【0009】[0009]

【実施例】【Example】

以下、本考案を図面に示した実施例を参照して詳細に説明する。 Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the drawings.

【0010】 図1は、本考案の電解コンデンサの一実施例を示している。この電解コンデン サは、外装ケース2及び封口体6によって封止されており、外装ケース2の外面 部には絶縁スリーブ4が被せられている。この絶縁スリーブ4には、熱収縮性を 持つ合成樹脂からなるシュリンクスリーブが用いられている。FIG. 1 shows an embodiment of the electrolytic capacitor of the present invention. The electrolytic capacitor is sealed by an outer case 2 and a sealing body 6, and an outer surface of the outer case 2 is covered with an insulating sleeve 4. As the insulating sleeve 4, a shrink sleeve made of synthetic resin having heat shrinkability is used.

【0011】 そして、この絶縁スリーブ4の封口体6の上面、即ち、封口部側に臨む縁部に は、直径方向に一対の矩形の切欠き部22が形成され、各切欠き部22は、内部 の外装ケース2のカーリング処理部を充分に露出させ、即ち、封口部側の空間部 10が外気に通じる程度の大きさとされている。A pair of rectangular notches 22 are formed in the diametrical direction on the upper surface of the sealing body 6 of the insulating sleeve 4, that is, at the edge portion facing the sealing portion side, and each notch portion 22 is The curling treatment portion of the outer case 2 inside is sufficiently exposed, that is, the space portion 10 on the sealing portion side is of a size that communicates with the outside air.

【0012】 そこで、図2に示すように、基板12に電解コンデンサを実装した場合、即ち 、封口部側を基板12の実装面に当てた場合、その封口部に形成される空間部1 0は、絶縁スリーブ4に形成された各切欠き部22を以て外気に通じている。し たがって、半田20による接続のため加熱された場合、膨張した空気は切欠き部 22を通して外気に放出されることになる。このため、空気の膨張によって電解 コンデンサが押し上げられて傾斜、あるいは半田20へのブローホールの発生を 未然に防止でき、回路装置の信頼性を高めることができる。Therefore, as shown in FIG. 2, when the electrolytic capacitor is mounted on the substrate 12, that is, when the sealing portion side is applied to the mounting surface of the substrate 12, the space 10 formed in the sealing portion is The cutouts 22 formed in the insulating sleeve 4 communicate with the outside air. Therefore, when heated due to the connection by the solder 20, the expanded air is released to the outside air through the cutout portion 22. For this reason, it is possible to prevent the electrolytic capacitor from being pushed up by the expansion of air to cause an inclination or the formation of blowholes in the solder 20, and to enhance the reliability of the circuit device.

【0013】 なお、実施例では、絶縁スリーブ4の2箇所に切欠き部22を形成して空気の 排出を可能にしたが、切欠き部22は電解コンデンサの大きさや開口部側に形成 される空間部10の大きさに対応した大きさ又は形状とすれば、目的を達成でき 、切欠き部22は一か所としてもよい。In the embodiment, the notches 22 are formed at two positions of the insulating sleeve 4 to allow air to be discharged. However, the notches 22 are formed on the size of the electrolytic capacitor and on the opening side. If the size or shape corresponds to the size of the space portion 10, the purpose can be achieved, and the notch portion 22 may be provided in one place.

【0014】[0014]

【考案の効果】[Effect of device]

以上説明したように、本考案によれば、外装ケースの封止強度を低下させるこ となく、実装した場合に基板面と封口部との間に形成される空間部に閉じ込めら れる空気をスリーブに形成した切欠き部で外気に放出させることができ、半田付 け時の電解コンデンサの傾きや半田に生じるブローホールを確実に防止でき、電 解コンデンサを実装する回路装置の品位や信頼性を高めることができる。 As described above, according to the present invention, the air that is trapped in the space formed between the board surface and the sealing portion when mounted is prevented from deteriorating without reducing the sealing strength of the outer case. The notch formed on the bottom allows air to be released to the outside air, and the inclination of the electrolytic capacitor during soldering and the blowholes that occur in the solder can be reliably prevented, thus improving the quality and reliability of the circuit device that mounts the electrolytic capacitor. Can be increased.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の電解コンデンサの一実施例を示す斜視
図である。
FIG. 1 is a perspective view showing an embodiment of an electrolytic capacitor of the present invention.

【図2】図1に示した電解コンデンサの実装例を示す部
分断面図である。
FIG. 2 is a partial cross-sectional view showing a mounting example of the electrolytic capacitor shown in FIG.

【図3】従来の電解コンデンサの実装例における実装面
部を示す縦断面図である。
FIG. 3 is a vertical cross-sectional view showing a mounting surface portion in a mounting example of a conventional electrolytic capacitor.

【符号の説明】[Explanation of symbols]

2 外装ケース 4 絶縁スリーブ 10 空間部 12 基板 22 切欠き部 2 Outer case 4 Insulation sleeve 10 Space 12 Board 22 Notch

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 外装ケースの表面にスリーブを被せた電
解コンデンサであって、 前記スリーブに前記外装ケースの封口部側と基板面との
間に形成される空間部に閉じ込められる空気を放出する
切欠き部を形成したことを特徴とする電解コンデンサ。
1. An electrolytic capacitor in which a surface of an outer case is covered with a sleeve, wherein the sleeve discharges air trapped in a space formed between a sealing portion side of the outer case and a substrate surface. An electrolytic capacitor having a notched portion.
JP9347292U 1992-12-29 1992-12-29 Electrolytic capacitor Pending JPH0655232U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9347292U JPH0655232U (en) 1992-12-29 1992-12-29 Electrolytic capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9347292U JPH0655232U (en) 1992-12-29 1992-12-29 Electrolytic capacitor

Publications (1)

Publication Number Publication Date
JPH0655232U true JPH0655232U (en) 1994-07-26

Family

ID=14083288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9347292U Pending JPH0655232U (en) 1992-12-29 1992-12-29 Electrolytic capacitor

Country Status (1)

Country Link
JP (1) JPH0655232U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012074561A (en) * 2010-09-29 2012-04-12 Omron Corp Socket for electrolytic capacitor
JP2012079756A (en) * 2010-09-30 2012-04-19 Omron Corp Surface mounting socket for electrolytic capacitor, and method for surface mounting of electrolytic capacitor
JP2012151223A (en) * 2011-01-18 2012-08-09 Shindengen Electric Mfg Co Ltd Housing case, electronic component module, and electronic apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012074561A (en) * 2010-09-29 2012-04-12 Omron Corp Socket for electrolytic capacitor
JP2012079756A (en) * 2010-09-30 2012-04-19 Omron Corp Surface mounting socket for electrolytic capacitor, and method for surface mounting of electrolytic capacitor
JP2012151223A (en) * 2011-01-18 2012-08-09 Shindengen Electric Mfg Co Ltd Housing case, electronic component module, and electronic apparatus

Similar Documents

Publication Publication Date Title
US5994763A (en) Wiring structure for semiconductor element and method for forming the same
JPH0774053A (en) Surface mounting type chip capacitor
JPH0655232U (en) Electrolytic capacitor
JP3247050B2 (en) Solid electrolytic capacitors
JPH06204098A (en) Casing for electrolytic capacitor
JPH0716370U (en) Airtight terminal
JPH074763Y2 (en) Chip fuse
JPH09162078A (en) Electronic parts
JP3647971B2 (en) Connection structure between board and terminal block
JPS6317231Y2 (en)
JP3487355B2 (en) Piezoelectric oscillator
JPS61181120A (en) Solid electrolytic capacitor with fuse
JPH09162077A (en) Electronic components
JPH0438514Y2 (en)
JPH0429521Y2 (en)
JP2842067B2 (en) Chip solid electrolytic capacitor with fuse
JP3660117B2 (en) Electronics
JPH0519945Y2 (en)
JPH0349392Y2 (en)
JPH0416419Y2 (en)
JP2748531B2 (en) Aluminum electrolytic capacitor
JPS6134217B2 (en)
JPS60221920A (en) Method of producing chip type ceramic fuse
JP2937176B2 (en) High-voltage variable resistor
JP2001102714A (en) Resin encapsulated printed wiring board