JPS60221920A - Method of producing chip type ceramic fuse - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a packaging fuse, and specifically to a method for manufacturing a chip-type ceramic fuse using a ceramic chip as a packaging material.

(Prior art) In general, packaging fuses are made by fixing cap-shaped metal terminals for external connection to both ends of a small-diameter glass tube.
A structure in which a filamentous fusing material is passed through a glass tube and welded to metal terminals at both ends is commonly used. Also,
In recent years, Japanese Unexamined Patent Publication No. 54-13950 and Utility Model Application No. 54-7
A slit-type fuse is proposed in Japanese Patent No. 3939.

(Problem to be solved by the invention) However, when incorporating the former into the circuit of an IC or LSI device,
Compared to I-type elements, they occupy a larger area on a circuit board, which poses an obstacle in designing a mounting circuit.Furthermore, since the packaging material is a glass tube, they are easily damaged.

In addition, the latter type has good current limiting characteristics, but due to its structure in which the sparks generated in the slit are discharged to the outside by its own internal pressure, the fusing material is easily affected by the outside air, and furthermore, the sparks generated in the slit are discharged to the outside. In addition to the risk of fire caused by the sparks generated, there is also the problem that miniaturization is difficult because the insulating plates facing each other are assembled with bolts with a gap between them.

(Object of the Invention) The object of the present invention is to solve these problems, to reduce the size of a packaging fuse, and at the same time to obtain a fuse that is strong and operates reliably.

(Structure of the Invention) Therefore, the gist of the present invention is to provide a pair of ceramic green sheets extending from opposite ends toward the center on the same surface of the ceramic green sheet and terminating at a predetermined interval at approximately the center. A conductor layer for internal connection and a fusing material for connecting between the conductor layers are formed.Other ceramic green sheets are laminated and integrated on the IC ceramic green sheet, and this is fired to form the inside of the ceramic chip. This is a method of manufacturing a chip-type ceramic fuse characterized by integrally encapsulating a conductor layer for internal connection and a fusing material.

(Embodiment) Hereinafter, an embodiment of the present invention will be explained with reference to the drawings. In the figure, 1 is a ceramic chip, inside which a pair of internal connection conductor layers 2 and 3 are formed on the same plane. The conductor layers 2.3 are formed and terminate at a predetermined interval in the center of the ceramic chip 1, and are electrically connected by a fusing material (Hikozu) 4 disposed between the two. Each conductive layer 2.3 is formed at the opposite end side of the ceramic deep 1 so as to surround the external connection terminal 5, 6.
are connected to each. The conductor layer 2.3 may be the same as the fusing material, and the conductor layers 2, 3 and the fusing material 4 may be formed of a known conductive paste or metal by printing, vapor deposition, or other means.

This chip type ceramic fuse can be manufactured, for example, as follows. That is, first, a ceramic green sheet 1a11b is created by a known method,
As shown in Fig. 2, one of the green sheets 1-18 is printed with a conductor layer 2.3 for internal connection using conductive paste, and the conductor layers 2 and 3 on the sheet 1a are cut into thread-like or plate-like shapes. By stacking the chips 1-1a and 1b connected with material 4, baking them and integrating them, and forming external connection terminals 5 and 6 at both ends of the formed chip 1, the structure shown in FIG.
Obtain a chip-type ceramic fuse.

(Effect of the invention) Since the chip-type ceramic fuse obtained by the above process is completely insulated from the outside by ceramic, even if sparks are generated when melting due to overcurrent, it is limited to the inside of the chip, and there is a risk of fire. Furthermore, the characteristics of the fusing material do not deteriorate as it is not affected by the outside air, so if an overcurrent flows, it will always melt and operate reliably. Furthermore, since ceramic is used as the packaging material, it is strong and can be made in the same shape as chip capacitors, etc., and can be automatically attached to printed circuit boards. It has the advantage of being able to be mass-produced.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional perspective view of a chip-type ceramic fuse obtained according to the present invention, and FIG. 2 is a partially exploded perspective view thereof. 100. Ceramic chip, 2.3... Conductor layer, 4
... Fusing material, 5, 6... External connection terminal. Figure 1

Claims (1)

[Claims] (1) A pair of conductor layers for internal connection extending from opposite ends toward the center on the same surface of a ceramic green sheet and terminating at a predetermined interval at approximately the center; A ceramic green sheet with a fusing material to be connected is formed, and other ceramic green sheets 1 to 1 are laminated and integrated, and this is fired to form a conductor layer for internal connection and a fusing material inside the ceramic chip. A method for manufacturing a chip-type ceramic fuse characterized by being integrally sealed.