JPS6317231Y2 - - Google Patents
Info
- Publication number
- JPS6317231Y2 JPS6317231Y2 JP1981071178U JP7117881U JPS6317231Y2 JP S6317231 Y2 JPS6317231 Y2 JP S6317231Y2 JP 1981071178 U JP1981071178 U JP 1981071178U JP 7117881 U JP7117881 U JP 7117881U JP S6317231 Y2 JPS6317231 Y2 JP S6317231Y2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- case
- circuit board
- capacitor element
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 37
- 238000007789 sealing Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
本考案は印刷基板取付用コンデンサの改良に関
するものである。[Detailed Description of the Invention] The present invention relates to an improvement of a capacitor for mounting on a printed circuit board.
一般に、ケースに収納したコンデンサ、例えば
電解コンデンサは第１図に示すように陽極用、陰
極用の電極箔に各々引出リード端子１を加締など
の方法により接続せしめ、セパレータを介して電
極箔を対向せしめて巻回し、コンデンサ素子２を
形成している。 Generally, for a capacitor housed in a case, such as an electrolytic capacitor, as shown in Figure 1, the lead terminals 1 are connected to the anode and cathode electrode foils by crimping or other methods, and the electrode foils are connected through a separator. The capacitor element 2 is formed by winding the capacitors facing each other.
次に該コンデンサ素子２に電解液を含浸せしめ
て、弾性を有する封口体３を引出リード端子１が
貫通するように装着し、アルミニウムなどよりな
るケース４に挿入し、その開口端面を巻締めなど
して密封して構成されている。 Next, the capacitor element 2 is impregnated with an electrolytic solution, an elastic sealing body 3 is attached so that the lead terminal 1 passes through the capacitor element 2, and the capacitor element 2 is inserted into a case 4 made of aluminum or the like, and the open end surface of the capacitor element 2 is tightened by wrapping. It is sealed and constructed.
また最近では、音響用などの電解コンデンサで
は樹脂ケースが多用されつつあることは公知であ
る。 Furthermore, it is known that resin cases are increasingly being used in electrolytic capacitors for acoustics and the like.
一般にこれらのコンデンサを印刷基板に実装し
た場合、第２図に示すように印刷基板５、封口体
３、ケース４の周辺端部とで囲まれた空間６は密
封状態に近く、印刷基板５を溶融はんだに接触さ
せ、リード端子１と基板電極８とをはんだ７で接
続する場合、溶融はんだの熱により空間部６の空
気が膨脹し、該空気がリード端子を挿入する印刷
基板５に設けた孔５′から溶融したはんだ７をつ
き破り外へ出て、はんだ７はその状態またはそれ
に近い状態で硬化し、リード端子１のはんだ付け
性が低下し、長期間使用中には断線や接触不良を
起こし、他の電子部品の損傷や劣化を誘発する可
能性がある。また音響用機器に使用すると音の歪
やにごりとなつて現われたりする。 Generally, when these capacitors are mounted on a printed circuit board, as shown in FIG. When the lead terminal 1 and the board electrode 8 are connected with the solder 7 by contacting with molten solder, the air in the space 6 expands due to the heat of the molten solder, and the air is transferred to the printed board 5 provided on the printed board 5 into which the lead terminal is inserted. The molten solder 7 is broken through the hole 5' and comes out, and the solder 7 hardens in that state or a state close to it, reducing the solderability of the lead terminal 1 and causing disconnection or poor contact during long-term use. may cause damage or deterioration of other electronic components. Also, when used in audio equipment, it may appear as distorted or cloudy sound.
一般に以上のようなはんだ付け性の劣化を防ぐ
ため、封口体３の形状をリード端子１の周辺部の
空気が外部に漏れるように改良されたものもある
が、封口体の形状が複雑となり、基板装着時など
においてコンデンサの座りが悪く安定して固定で
きなくなつたり、樹脂ケースの場合密封方法が困
難になつたりする欠点があつた。 Generally, in order to prevent the deterioration of solderability as described above, the shape of the sealing body 3 has been improved so that the air around the lead terminal 1 can leak to the outside, but the shape of the sealing body is complicated, There were drawbacks such as when the capacitor was mounted on a board, the capacitor did not sit well and could not be fixed stably, and in the case of a resin case, it was difficult to seal the capacitor.
本考案は上述の欠点を除去し、印刷基板実装時
のはんだ付け性を著しく向上せしめるコンデンサ
を提供しようとするものである。 The present invention aims to eliminate the above-mentioned drawbacks and to provide a capacitor that significantly improves solderability when mounted on a printed circuit board.
すなわち、コンデンサ素子より導出したリード
端子を印刷基板の孔に挿入しはんだ付けして使用
する印刷基板取付用コンデンサにおいて、コンデ
ンサを収納するケースの上記基板と接触する面に
通気性の溝または切欠きを設けてなるコンデンサ
である。 In other words, in a capacitor for mounting on a printed circuit board, in which the lead terminal led out from the capacitor element is inserted into a hole in the printed circuit board and soldered, a ventilating groove or notch is provided on the surface of the case that houses the capacitor that comes into contact with the circuit board. This is a capacitor equipped with a
以下、本考案を第３図〜第５図に示す電解コン
デンサの実施例について説明する。 The present invention will now be described with reference to embodiments of electrolytic capacitors shown in FIGS. 3 to 5.
第３図は本考案に係るコンデンサ素子を収納す
るポリプロピレンなどの樹脂製ケースで、樹脂製
ケース９の開口端面に１箇所以上の通気用凹状の
切欠き１０が設けられている。第４図はコンデン
サの要部切断斜視図で、電解液が含浸されたコン
デンサ素子２に封口体３を装着後上記ケース９に
挿入し、次に凹状の溝または切欠き１０を有する
ケース９の開口端部を熱誘導、超音波などによつ
て内側に巻締ま完成したものである。このとき上
記の樹脂ケース９の開口端面に設けた凹状の溝ま
たは切欠き１０は、外ケース９の巻締部に溝また
は切欠き１０を形成した状態で密封される。そし
て上記溝または切欠き１０の位置は、リード端子
１の近傍に設けるとケース９を巻締めた後でもリ
ード端子１が動きやすく気密性に欠けるので、第
４図および第５図のように２つのリード端子１，
１が封口体３から突出する２点を結ぶ直線に対し
て封口体３の中心からほぼ垂直方向に配置する。
したがつてこのコンデンサ素子２より導出したリ
ード端子１を第５図のように印刷基板５の孔５′
に挿入し、溶融はんだに接触させてリード端子１
と基板電極８とを接続する場合、上記空間部６の
空気が膨脹することなく溝または切欠き１０を通
して脱出するために良好にはんだ付けが可能とな
る。そのため長期間高温で使用しても断線や接触
不良が生せず、音響機器に使用しても音の歪やに
ごりは除去され音質が著しく改善された。 FIG. 3 shows a resin case made of polypropylene or the like for housing the capacitor element according to the present invention, and one or more recessed notches 10 for ventilation are provided on the open end surface of the resin case 9. FIG. 4 is a cutaway perspective view of the main parts of a capacitor, in which a capacitor element 2 impregnated with an electrolytic solution is fitted with a sealing member 3 and then inserted into the case 9. The open end is sealed inward using heat induction, ultrasonic waves, etc. At this time, the concave groove or notch 10 provided on the open end surface of the resin case 9 is sealed with the groove or notch 10 formed in the seamed portion of the outer case 9. The position of the groove or notch 10 is such that if it is provided near the lead terminal 1, the lead terminal 1 will tend to move even after the case 9 is tightened and lack airtightness. two lead terminals 1,
1 is arranged in a direction substantially perpendicular to the center of the sealing body 3 with respect to a straight line connecting two points protruding from the sealing body 3.
Therefore, the lead terminal 1 led out from this capacitor element 2 is inserted into the hole 5' of the printed circuit board 5 as shown in FIG.
lead terminal 1 by inserting it into the molten solder and contacting it with the molten solder.
When connecting the substrate electrode 8 to the substrate electrode 8, the air in the space 6 escapes through the groove or notch 10 without expanding, so that good soldering is possible. As a result, even when used at high temperatures for long periods of time, there will be no disconnection or poor contact, and even when used in audio equipment, sound distortion and cloudiness are eliminated, significantly improving sound quality.
なお、上述の実施例は樹脂製ケースについて述
べたが、金属製ケースでも同様な効果があり、ま
たケースの開口部に限定するものでなく、ケース
の底部よりリード端子が導出された構造にも適用
できるものである。 Although the above embodiment has been described with respect to a resin case, the same effect can be achieved with a metal case, and it is not limited to the opening of the case, but can also be applied to a structure in which the lead terminal is led out from the bottom of the case. It is applicable.
またコンデンサ組立後、端子側の印刷基板と接
触するケースの面に加熱圧着、研摩などの加工を
施こし、凹状の溝または切欠きを設けてもよい。 Further, after assembling the capacitor, the surface of the case that comes into contact with the printed circuit board on the terminal side may be processed by heat compression bonding, polishing, etc. to form a concave groove or notch.
叙上のように本考案のコンデンサははんだ付け
性の面において極めて有利となり、実用的価値の
大なるものである。 As mentioned above, the capacitor of the present invention is extremely advantageous in terms of solderability and has great practical value.
第１図は従来のコンデンサの断面図、第２図は
従来のコンデンサの印刷基板取付要部の断面図、
第３図〜第５図は本考案の一実施例で、第３図は
コンデンサ用ケースの斜視図、第４図はコンデン
サの要部切断斜視図、第５図はコンデンサの印刷
基板取付要部の断面図である。
１……リード端子、２……コンデンサ素子、３
……封口体、５……印刷基板、５′……孔、９…
…ケース、１０……通気性の溝または切欠き。
Figure 1 is a cross-sectional view of a conventional capacitor, Figure 2 is a cross-sectional view of the main parts of a conventional capacitor where it is attached to a printed circuit board,
Figures 3 to 5 show an embodiment of the present invention. Figure 3 is a perspective view of a capacitor case, Figure 4 is a cutaway perspective view of the main parts of the capacitor, and Figure 5 is the main part of the printed circuit board mounting part of the capacitor. FIG. 1...Lead terminal, 2...Capacitor element, 3
...Sealing body, 5... Printing board, 5'... Hole, 9...
...Case, 10... Ventilation groove or cutout.
Claims (1)
子１，１に封口体３を装着し、上記コンデンサ素
子２をケースに収納して密閉し、上記リード端子
１，１を印刷基板５の孔５′に挿入し、はんだ付
けして使用する印刷基板取付用コンデンサにおい
て、コンデンサ素子２を収納したケース９の上記
基板５と接触する面に通気性の溝または切欠き１
０を設けると共に該溝または切欠き１０が上記２
つのリード端子１，１が封口体３から突出する２
点を結ぶ直線に対して封口体３の上面中心からほ
ぼ垂直方向に配置してなるコンデンサ。 A sealing body 3 is attached to the two lead terminals 1, 1 led out from the capacitor element 2, the capacitor element 2 is housed in a case and sealed, and the lead terminals 1, 1 are inserted into the hole 5' of the printed circuit board 5. However, in a capacitor for mounting on a printed circuit board that is used by soldering, a ventilating groove or notch 1 is provided on the surface of the case 9 housing the capacitor element 2 that comes into contact with the substrate 5.
0 is provided and the groove or notch 10 is
Two lead terminals 1, 1 protrude from the sealing body 3 2
A capacitor arranged almost perpendicularly from the center of the upper surface of the sealing body 3 to a straight line connecting the points.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981071178U JPS6317231Y2 (en) | 1981-05-15 | 1981-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981071178U JPS6317231Y2 (en) | 1981-05-15 | 1981-05-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57183735U JPS57183735U (en) | 1982-11-20 |
| JPS6317231Y2 true JPS6317231Y2 (en) | 1988-05-16 |
Family
ID=29866975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981071178U Expired JPS6317231Y2 (en) | 1981-05-15 | 1981-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6317231Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4650599B2 (en) * | 2001-05-23 | 2011-03-16 | 日本ケミコン株式会社 | Electrolytic capacitor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56143849U (en) * | 1980-03-28 | 1981-10-30 |
-
1981
- 1981-05-15 JP JP1981071178U patent/JPS6317231Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57183735U (en) | 1982-11-20 |
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