JPS6134217B2 - - Google Patents
Info
- Publication number
- JPS6134217B2 JPS6134217B2 JP4065085A JP4065085A JPS6134217B2 JP S6134217 B2 JPS6134217 B2 JP S6134217B2 JP 4065085 A JP4065085 A JP 4065085A JP 4065085 A JP4065085 A JP 4065085A JP S6134217 B2 JPS6134217 B2 JP S6134217B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- center
- chip
- fusing material
- fuse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000010304 firing Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は新規な包装ヒユーズ、具体的には、
セラミツクを包装材料とするチツプ型セラミツク
ヒユーズの製造方法に関する。[Detailed Description of the Invention] (Industrial Application Field) This invention provides a novel packaging fuse, specifically,
This invention relates to a method for manufacturing chip-type ceramic fuses using ceramic as a packaging material.
（従来の技術）
一般に、包装ヒユーズは小径のガラス管の両端
にキヤツプ状の外部接続用金属端子を固着し、糸
状の溶断材料をガラス管内に通してその両端の金
属端子に溶接させた構造のものが汎用されてい
る。(Prior art) In general, a packaging fuse has a structure in which a cap-shaped metal terminal for external connection is fixed to both ends of a small-diameter glass tube, and a thread-shaped fusing material is passed through the glass tube and welded to the metal terminals at both ends. Things are commonly used.
また、近年、特開昭54−13950号公報や実開昭
54−73939号公報にて、細隙型ヒユーズが提案さ
れている。 In addition, in recent years, Japanese Unexamined Patent Publication No. 54-13950 and
A slit-type fuse is proposed in Publication No. 54-73939.
（発明が解決しようとする問題）
しかしながら、前者のものではIC化あるいは
LSI化された機器の回路に組み込む場合、IC化あ
るいはLSI化の素子に比べて回路基板上での占有
面積が大きく実装回路設計上の障害となり、しか
も、包装材料がガラス管であるため破損し易いと
いう問題があつた。(Problem to be solved by the invention) However, in the former case, IC or
When incorporated into the circuit of an LSI-based device, it occupies a larger area on the circuit board than an IC or LSI-based element, which poses an obstacle to the mounting circuit design.Furthermore, since the packaging material is a glass tube, it can be easily damaged. There was a problem with how easy it was.
また、後者のものでは良好な限流特性を有する
が、細隙中で発生する火花をそれ自体の内圧力で
外部に放出させる構造上、溶断材料が外気の影響
を受けやすく、しかも外部に放出された火花によ
つて出火の恐れがある他、細隙を介して相対向す
る絶縁板をボルトで組み付けるため小形化が困難
であるという問題がある。 In addition, the latter type has good current limiting characteristics, but due to its structure in which the sparks generated in the slit are discharged to the outside by its own internal pressure, the fusing material is easily affected by the outside air, and furthermore, the sparks generated in the slit are discharged to the outside. In addition to the risk of fire caused by the sparks generated, there is also the problem that miniaturization is difficult because the insulating plates facing each other are assembled with bolts with a gap between them.
（発明の目的）
この発明は、これらの問題を解決し、包装ヒユ
ーズの小型化を計ると同時に強固で動作の確実な
ヒユーズを得ることを目的とするものである。(Objective of the Invention) The object of the present invention is to solve these problems, to reduce the size of a packaging fuse, and at the same time to obtain a fuse that is strong and operates reliably.
（発明の構成）
したがつて、この発明の要旨とするところは、
同一表面上にその相対する端部から中央部に向か
つて伸張し略中央部で所定間隔をおいて終端する
一対の内部接続用導電体層と、該導電体層間を接
続する溶断材料とが形成されたセラミツクグリー
ンシート上に、略中央部に凹所が形成されたセラ
ミツクグリーンシートを積層して一体化し、これ
を焼成して得られたセラミツクチツプ内部に内部
接続用導電体層と溶断材料とを一体的に封入する
と共に、溶断材料を包囲するセラミツクチツプの
中央部に空洞部を形成し、セラミツクチツプの両
端部には外部接続端子を形成して内部接続用導電
体層と電気的に接続してなることを特徴とするチ
ツプ型セラミツクヒユーズの製造方法である。(Structure of the invention) Therefore, the gist of this invention is as follows:
A pair of conductor layers for internal connection extending from opposing ends toward the center and terminating at a predetermined interval substantially in the center on the same surface, and a fusing material connecting the conductor layers are formed. Ceramic green sheets with a recess formed approximately in the center are laminated and integrated on top of the ceramic green sheet, and then fired to form a ceramic chip with internal conductor layers and fusing material inside. At the same time, a cavity is formed in the center of the ceramic chip surrounding the fusing material, and external connection terminals are formed at both ends of the ceramic chip to electrically connect with the internal connection conductor layer. This is a method for manufacturing a chip-type ceramic fuse characterized by the following steps.
（実施例）
以下、この発明の一実施例を示す図面を参照し
て説明すると、第１図において、１はセラミツク
チツプで、その内部に相対する端部から同一平面
上を中央部に向つて伸張した一対の内部接続用導
電体層２，３が形成され、導電体層２，３は中央
部である間隔をおいて終端し、その終端部間に配
設された溶断材料（ヒユーズ）４によつて電気的
に接続されている。溶断材料４の少なくとも片側
（図では上側）でセラミツクチツプの中央部に空
洞部７が形成されており、溶断材料４が溶断した
場合に退避できるようにし、導電体層２，３が再
び連絡するのを防止している。また、各導電体層
２，３はセラミツクチツプ１の相対する端部側で
該端部を包囲するように形成された外部接続端子
５，６にそれぞれ接続されている。導電体層２，
３は溶断材料と同じ材料であつてもよく、また、
導電体層２，３および溶断材料４は公知導電性ペ
ーストで印刷により形成したり金属で蒸着その他
の手段により形成してもよい。(Embodiment) Hereinafter, an embodiment of the present invention will be explained with reference to the drawings. In FIG. A pair of elongated internal connection conductor layers 2 and 3 are formed, the conductor layers 2 and 3 terminate at a certain interval in the center, and a fusing material (fuse) 4 is disposed between the termination portions. electrically connected by. A cavity 7 is formed in the center of the ceramic chip on at least one side (the upper side in the figure) of the fusing material 4, so that the fusing material 4 can be evacuated when it is blown out, and the conductor layers 2 and 3 can communicate again. It prevents Further, each of the conductor layers 2 and 3 is connected to external connection terminals 5 and 6 formed on opposite end sides of the ceramic chip 1 so as to surround the ends. conductor layer 2,
3 may be the same material as the fusing material, and
The conductor layers 2 and 3 and the fusing material 4 may be formed by printing with a known conductive paste, or may be formed with metal by vapor deposition or other means.
このチツプ型セラミツクヒユーズは、例えば、
次の様にして製造することができる。すなわち、
まず、公知方法によりセラミツクグリーンシート
１ａ，１ｂを作成し、この一方のグリーンシート
１ａに第２図に示すように、導電性ペーストによ
り内部接続用導電体層２，３を印刷し、シート１
ａ上の導電体層２，３を糸状あるいは板状溶断材
料４で接続した後、シート１ａと、空洞部７とな
る凹所が略中央部に形成されたセラミツクグリー
ンシート１ｂとを積層し、これを焼成して一体化
し、形成したチツプ１の両端に外部端子５，６を
形成することにより第１図のチツプ型セラミツク
ヒユーズを得る。 This chip type ceramic fuse is, for example,
It can be manufactured as follows. That is,
First, ceramic green sheets 1a and 1b are prepared by a known method, and as shown in FIG.
After connecting the conductive layers 2 and 3 on a with a filament-like or plate-like fusing material 4, the sheet 1a and the ceramic green sheet 1b having a recess formed approximately in the center, which will become the cavity 7, are laminated, This is baked and integrated, and external terminals 5 and 6 are formed at both ends of the formed chip 1, thereby obtaining the chip-shaped ceramic fuse shown in FIG.
（発明の効果）
上記した工程により得られたチツプ型セラミツ
クヒユーズは、セラミツクによつて完全に外部絶
縁されているため、過電流による溶断時火花がで
てもチツプ内部のみに限られ、出火の恐れがな
い、また外気の影響を受けず溶断材料の特性が劣
化せず、従つて過電流が流れると必ず溶断し動作
が確実である。さらに、セラミツクを包装材料と
しているため強固であり、小型化はもちろんのこ
とチツプコンデンサ等と同形状に形成でき、プリ
ント基板等への自動取付けが可能となる他、従来
の積層技術を利用して多量生産も可能である、な
どの利点がある。(Effect of the invention) The chip-type ceramic fuse obtained through the above process is completely insulated externally by the ceramic, so even if sparks are generated when melting due to overcurrent, it is limited to the inside of the chip, preventing fire from occurring. There is no fear, and the properties of the fusing material do not deteriorate as it is not affected by the outside air, so if an overcurrent flows, it will always melt and operate reliably. Furthermore, since ceramic is used as the packaging material, it is strong and can not only be miniaturized but also formed into the same shape as chip capacitors, etc., and can be automatically attached to printed circuit boards. It has advantages such as being able to be mass-produced.
第１図はこの発明により得られたチツプ型セラ
ミツクヒユーズの断面斜視図、第２図はその一部
分解斜視図である。
１……セラミツクチツプ、２，３……導電体
層、４……溶断材料、５，６……外部接続端子、
７……空洞部。
FIG. 1 is a cross-sectional perspective view of a chip-type ceramic fuse obtained according to the present invention, and FIG. 2 is a partially exploded perspective view thereof. 1... Ceramic chip, 2, 3... Conductive layer, 4... Fusing material, 5, 6... External connection terminal,
7...Cavity part.
Claims (1)
向かつて伸張し略中央部で所定間隔をおいて終端
する一対の内部接続用導電体層と、該導電体層間
を接続する溶断材料とが形成されたセラミツクグ
リーンシート上に、略中央部に凹所が形成された
セラミツクグリーンシートを積層して一体化し、
これを焼成して得られたセラミツクチツプ内部に
内部接続用導電体層と溶断材料とを一体的に封入
すると共に、溶断材料を包囲するセラミツクチツ
プの中央部に空洞部を形成し、セラミツクチツプ
の両端部には外部接続端子を形成して内部接続用
導電体層と電気的に接続してなることを特徴とす
るチツプ型セラミツクヒユーズの製造方法。1 A pair of conductor layers for internal connection extending from opposite ends toward the center on the same surface and terminating at a predetermined interval at approximately the center, and a fusing material connecting the conductor layers. On the formed ceramic green sheet, a ceramic green sheet with a recess formed approximately in the center is laminated and integrated,
A conductor layer for internal connection and a fusing material are integrally sealed inside the ceramic chip obtained by firing this, and a cavity is formed in the center of the ceramic chip surrounding the fusing material, and a cavity is formed in the center of the ceramic chip to surround the fusing material. A method for manufacturing a chip-type ceramic fuse, characterized in that external connection terminals are formed at both ends and electrically connected to an internal connection conductor layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4065085A JPS60221921A (en) | 1985-02-28 | 1985-02-28 | Method of producing chip type ceramic fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4065085A JPS60221921A (en) | 1985-02-28 | 1985-02-28 | Method of producing chip type ceramic fuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60221921A JPS60221921A (en) | 1985-11-06 |
| JPS6134217B2 true JPS6134217B2 (en) | 1986-08-06 |
Family
ID=12586424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4065085A Granted JPS60221921A (en) | 1985-02-28 | 1985-02-28 | Method of producing chip type ceramic fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60221921A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5726621A (en) * | 1994-09-12 | 1998-03-10 | Cooper Industries, Inc. | Ceramic chip fuses with multiple current carrying elements and a method for making the same |
| DE19644026A1 (en) * | 1996-10-31 | 1998-05-07 | Wickmann Werke Gmbh | Electrical fuse element and method for its production |
-
1985
- 1985-02-28 JP JP4065085A patent/JPS60221921A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60221921A (en) | 1985-11-06 |
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