JP2012151223A - Housing case, electronic component module, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To lower the frequency of repair in the manufacturing of an electronic component module, in which electronic components are housed in a housing case and the housing case is filled with a resin to seal the electronic components, thereby improving manufacturing efficiency of the electronic component module and achieving the reduction of the manufacturing cost.SOLUTION: A housing case 13 includes a cylinder part 31 housing electronic components 11 and a wiring board part 32, which has electronic wiring 33 electrically connecting with the electronic components 11 and closing one opening part 31A of the cylinder part 31. A mount region on which the electronic components 11 are formed on one main surface of the wiring board part 32 facing the interior of the cylinder part 31. Further, grooves 35, recessed from the one main surface and extending from the mount region to the exterior of the mount region, are formed at the wiring board part 32. The housing case 13 having this structure is provided as a solution.

Description

  The present invention relates to a housing case, an electronic component module including the housing case, and an electronic apparatus.

  2. Description of the Related Art Conventionally, there are electronic devices such as inverter power supply devices in which an electronic circuit is configured by various electronic components 101 and 102 such as bare chips and electrolytic capacitors as shown in FIGS. In this electronic apparatus, an electronic component 101 is accommodated in a case 103, and an electrolytic capacitor (electronic component) 102 is fixed in a state protruding from the case 103.

  Further, this electronic device is configured such that the electrolytic capacitor 102 is fixed to the support member 104 to form a capacitor module (electronic component module) 105 and then the capacitor module 105 is mounted on the case 103. Thereby, the plurality of electrolytic capacitors 102 can be easily attached to the case 103. More specifically, the support member 104 is formed with an insertion hole 106 through which a plurality of electrolytic capacitors 102 are individually inserted. The electrolytic capacitor 102 is liquid-tight with respect to the support member 104 by, for example, forming the support member 104 with a grommet so that no gap is generated between the insertion hole 106 and the electrolytic capacitor 102 inserted through the insertion hole 106. Is retained.

Further, in this electronic apparatus, after the lead electrode 108 protruding from one end of the main body (capacitor main body 107) of the electrolytic capacitor 102 is inserted into the joint hole of the wiring board 109, the lead electrode 108 is connected to the wiring board 109 by solder or the like. As a result, the electrolytic capacitor 102 is electrically connected to the wiring substrate 109. The joint between the lead electrode 108 and the wiring substrate 109 is sealed with a resin 110 filled in the case 103.
In the electronic apparatus configured as described above, the bonding portion between the lead electrode 108 and the wiring substrate 109 is sealed with the resin 110 to prevent moisture and the like from reaching the bonding portion, and the electrolytic capacitor 102 due to moisture and the like. To prevent electrical short circuit.

JP 2007-281127 A

By the way, in this type of electronic apparatus, it is necessary to change the number of electrolytic capacitors 102 according to the specifications. However, in the conventional capacitor module 105 described above, the number of insertion holes 106 formed in the support member 104 needs to be appropriately changed in accordance with the number of electrolytic capacitors 102. Therefore, the support member 104 is separately provided according to the specifications of the electronic device. It is necessary to produce it. That is, the conventional capacitor module 105 has a problem of low versatility.
In addition, when the electrolytic capacitor 102 having a configuration in which the lead electrode 108 protrudes from the capacitor body 107 is electrically connected to the wiring board 109, the capacitor body 107 is arranged to be placed (placed) on the main surface of the wiring board 109. There are many cases. When the molten resin 110 is poured into the case 103 in such an arrangement state, air may remain as bubbles in the gap between the capacitor main body 107 and the wiring board 109.

The bubbles often escape from the gap and rise to the upper surface of the resin 110 when the resin 110 is cured (thermoset), and often escape outward from the upper surface. However, the resin 110 is cured after the resin 110 is cured. It may remain as a dent that is recessed from the top surface. When this recess reaches the junction between the lead electrode 108 in the resin 110 and the wiring substrate 109 from the upper surface of the resin 110, an electrical short circuit of the electrolytic capacitor 102 occurs due to intrusion of moisture or the like into the recess. May occur.
For this reason, conventionally, when a dent is found on the upper surface of the cured resin 110, repair is performed by separately filling the dent with a resin or an adhesive. There is a problem that not only the manufacturing efficiency of the device is lowered, but also the manufacturing cost is increased.

  The present invention has been made in view of the circumstances described above, and is an electronic device that can improve versatility and can reduce the frequency of repairs described above and suppress the reduction in manufacturing efficiency and the increase in manufacturing costs. An object of the present invention is to provide a housing case and an electronic component module provided for this.

  In order to solve this problem, the housing case of the present invention is fixed to a main unit containing an electronic circuit in a state in which an electronic component having a configuration in which an electrode is provided on the outer surface of the main body, and the electronic component is A storage case for electrical connection to the electronic circuit, having a cylindrical portion that has openings at both ends and can store one or more electronic components, and closes one opening of the cylindrical portion A wiring board portion that is formed in a plate shape and has an electrical wiring for electrically connecting the electrode of the electronic component housed in the cylindrical portion to the electronic circuit, and the interior of the cylindrical portion A mounting region for mounting the electronic component is formed on one main surface of the wiring board portion facing the substrate, and a groove portion recessed from the one main surface is mounted on the wiring board portion from the mounting region. Formed to extend outside the area. It is characterized in.

  In the electronic component module of the present invention, in the state in which an electronic component configured by providing an electrode on the outer surface of the main body portion is accommodated in the cylindrical portion of the housing case, the main body portion is the wiring board portion. The electrode and the electrical wiring are mounted on the mounting region, and the one main surface of the wiring board portion and the electrical connection portion between the electrode and the electrical wiring are connected to the cylinder. It is sealed with a resin filled in the shape portion.

  According to another aspect of the present invention, there is provided an electronic apparatus comprising: the electronic component module; and a main body unit that includes the electronic circuit that fixes the electronic component module and is electrically connected to the electrical wiring of the wiring board portion. .

  When manufacturing the electronic component module or the electronic device using the housing case described above, first, the body of the electronic component is accommodated in the cylindrical portion, and the electrode of the electronic component is connected to the electrical wiring of the wiring board portion. What is necessary is just to mount the said main-body part in the mounting area | region of one main surface of a wiring board part so that it may be connected. After that, by pouring molten resin from the other opening side of the cylindrical portion and curing it, one main surface of the wiring board part and the joint part between the electrode of the electronic component and the electric wiring of the wiring board part What is necessary is just to seal with resin.

When the resin is poured into the cylindrical portion, air in the gap between the main body portion of the electronic component and the wiring board portion is pushed out of the mounting area through the groove portion by the poured resin. The air can be efficiently discharged outside the housing case. That is, since it is possible to suppress the air from remaining as bubbles in the state where the resin is poured into the cylindrical part, the resin is cured after the resin is poured into the cylindrical part, as in the related art. It can suppress that a bubble raises in resin and remains as a hollow part hollow from the upper surface of resin.
Therefore, according to the housing case and the electronic component module having the above-described configuration, the frequency of repair for filling the hollow portion described above is reduced, thereby improving the manufacturing efficiency of the electronic component module and the electronic device and reducing the manufacturing cost. Can do.

  In addition, since the storage case having the above configuration is formed in a bottomed cylindrical shape into which an arbitrary number of electronic components can be inserted at once, even if the number of electronic components to be connected to the electronic circuit of the main unit changes, It is possible to use the same storage case. Also, if the electrical connection structure of the electronic component to the wiring board portion is the same, there is no need to change the electrical connection structure of the wiring board portion to the electronic component even if the number of electronic components is changed. Any number of electronic components can be electrically connected. Therefore, the versatility of the electronic component module can be improved.

And in the said storage case, it is preferable that the said groove part is arranged in multiple numbers at intervals in the circumferential direction of the periphery of the said mounting area | region.
In this configuration, for example, by setting the resin so as to enter one groove portion extending in one direction, the air in the gap can be efficiently released from the other groove portion extending in the other direction to the outside. Become.

Moreover, in the said storage case, it is good for the both ends of the longitudinal direction of the said groove part extended in the direction in alignment with said one main surface to be located in the outer side of the said mounting area | region.
In this configuration, for example, by setting the resin so as to enter from one end portion in the longitudinal direction of the groove portion, the air in the gap can be efficiently released from the other end portion of the groove portion to the outside.

Furthermore, in the said storage case, it is preferable that the depth of the said groove part becomes shallow as it goes to the outer side from the said mounting area | region.
In other words, in the above configuration, the bottom surface of the groove portion is formed as an inclined surface that is inclined so that the depth of the groove portion decreases from the mounting region toward the outside.
In this configuration, since resin and air flow along the inclined surface, it is possible to suppress a decrease in the flow rate of the resin entering the groove portion from the outside of the mounting region and the flow rate of the air discharged from the groove portion to the outside of the mounting region. . Therefore, the air in the gap can be released to the outside in a short time.

Further, in the housing case, the groove portion includes a first inclined surface that is inclined so that a depth of the groove portion becomes deeper from the mounting region side toward the outside thereof at least in a region overlapping the mounting region, and at least A second inclined surface that is inclined so that a depth of the groove portion becomes shallower from the mounting region side toward the outer side in a region located outside the mounting region, and the first inclined surface and the second inclined surface More preferably, the inclined surface is arranged in the longitudinal direction of the groove extending from the mounting area to the outside of the mounting area.
In addition, when it arrange | positions so that a 1st inclined surface and a 2nd inclined surface may continue, for example, a groove part will be formed in a cross-sectional V shape, and a 1st inclined surface and a 2nd inclined surface are mutually spaced apart, for example. In the case of being arranged with a gap, the groove is formed in a trapezoidal cross section.
In this configuration, as described above, in addition to suppressing a decrease in the flow velocity of the resin or air flowing between the outside of the mounting region and the groove portion by the second inclined surface, the first inclined surface allows the gap between the gap and the groove portion. It is also possible to suppress a decrease in the flow rate of resin and air flowing through the. Therefore, the air in the gap can be released to the outside in a shorter time.

Further, in the housing case, a positioning guide portion that protrudes upward from the one main surface so as to surround the electronic component disposed in the mounting region is provided outside the mounting region of the wiring board portion. It is good to form integrally.
With this configuration, it is possible to easily attach the electronic component to the housing case.

  In the housing case, the positioning guide part may be defined by the cylindrical part.

Furthermore, in the said storage case, it is preferable that the said several positioning guide part is arranged at intervals in the circumferential direction of the peripheral edge of the said mounting area | region.
In this configuration, it is possible to form a groove portion between the two positioning guide portions, and therefore it is possible to reliably prevent the positioning guide portion from obstructing the flow of resin or air passing through the groove portion.

In the housing case, the positioning guide portion protrudes from the bottom surface of the groove portion, and a gap is defined between the electronic component and the positioning guide portion in a state where the electronic component is disposed in the mounting region. May be.
In this configuration, since the gap between the outer peripheral surface of the electronic component and the positioning guide portion is defined so as to extend above the groove portion, the air discharged through the groove portion from the gap between the electronic component and the wiring board portion. However, the gap is guided above the groove so as to flow toward the other opening of the cylindrical portion. Therefore, the air in the gap can be efficiently discharged outside the storage case.

Furthermore, in the said storage case, it is good for the said cylindrical part and the said wiring board part to be integrally formed.
In this configuration, the process of fixing the wiring board part to the cylindrical part is not required as compared to the case where the cylindrical part and the wiring board part are formed separately, so the number of manufacturing steps of the electronic component module is reduced. Thus, the manufacturing efficiency can be improved.

Further, in the housing case, a distal end portion of the external extension portion of the electric wiring extending and projecting from the other main surface of the wiring board portion is bent with respect to a base end portion of the external extension portion, More preferably, it extends so as to be parallel to the other main surface.
In this configuration, when the electronic component module is mounted on the wiring board forming the electronic circuit of the main unit, the longitudinal direction of the cylindrical portion (the direction in which the openings at both ends are arranged) is along the main surface of the wiring board. Thus, an electronic component module can be mounted. Therefore, compared with the case where electronic components are directly mounted on the main surface of the wiring board, the protruding height of the electronic components protruding from the main surface of the wiring board can be suppressed, and the electronic device can be made thinner.

And in the said electronic component module, while the electrode of the said electronic component is formed so that it may protrude from the flat surface of the main-body part of the said electronic component, the said main-body part is the cyclic | annular protrusion which protrudes from the periphery of the said flat surface In the case of having a portion, the groove portion may extend to the inside of the mounting region with respect to the annular projection portion in plan view.
In this configuration, even if the main body portion of the electronic component has a ring-shaped protruding portion like an electrolytic capacitor, the flat surface of the main body portion is placed in a state where the main body portion is placed on one main surface of the wiring board portion. In addition, the gap defined by the one main surface of the annular protrusion and the wiring board portion can be reliably communicated outward through the groove portion. Therefore, even when the electronic component is an electrolytic capacitor, the air in the gap can be efficiently released when the resin is filled.

ADVANTAGE OF THE INVENTION According to this invention, the frequency of repair at the time of manufacturing an electronic component module or an electronic device can be reduced, the improvement of the manufacturing efficiency of an electronic component module or an electronic device, and the reduction of manufacturing cost can be aimed at.
Moreover, even if the number of electronic components required for the electronic device is changed, the same housing case can be used, so that the versatility of the electronic component module can be improved.

It is a perspective view which shows the state which looked at the electronic device formed by fixing the capacitor | condenser module which concerns on 1st embodiment of this invention to a main body unit from the other opening part side of the cylindrical part. It is a perspective view which shows the state which looked at the capacitor | condenser module shown in FIG. 1 from the one opening part side of the cylindrical part obstruct | occluded by the wiring board part. It is a top view which shows the state which looked at the capacitor | condenser module shown in FIG.1, 2 from the other opening part side of the cylindrical part. It is AA arrow sectional drawing of FIG. It is a BB arrow sectional view of Drawing 3. It is CC sectional view taken on the line of FIG. It is DD sectional view taken on the line of FIG. It is explanatory drawing which shows an example of the inflow direction of the resin to the clearance gap between an electrolytic capacitor and a wiring board part, and the discharge direction of the air discharged | emitted from a clearance gap. It is EE arrow sectional drawing of FIG. It is an expanded sectional view showing an important section of a capacitor module concerning a second embodiment of the present invention. It is an expanded sectional view showing an important section of a capacitor module concerning a third embodiment of the present invention. It is a top view which shows the principal part outline of the capacitor | condenser module which concerns on 4th embodiment of this invention. It is an expanded sectional view showing an important section of a capacitor module concerning a fifth embodiment of the present invention. FIG. 14 is a schematic plan view illustrating an example of a planar view shape and an arrangement of a groove and a positioning guide in the capacitor module of FIG. 13. It is a perspective view which shows an example of the conventional electronic device. It is sectional drawing which shows the principal part of the electronic device of FIG.

[First embodiment]
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
As shown in FIGS. 1 to 7, a capacitor module (electronic component module) 3 according to this embodiment constitutes an electronic apparatus 1 together with the main unit 5 by being fixed to the outside of the main unit 5 containing an electronic circuit. To do. The main unit 5 is configured by housing a wiring board 7 and a plurality of electronic components constituting an electronic circuit in a case 9 as in the conventional case.
The capacitor module 3 includes a plurality of electrolytic capacitors (electronic components) 11, a housing case 13 that houses the electrolytic capacitor 11, and a sealing resin 15 that seals the electrolytic capacitor 11 in the housing case 13. Yes.

Each electrolytic capacitor 11 is, for example, an existing aluminum electrolytic capacitor. As shown in FIGS. 4 to 7, as shown in FIGS. 4 to 7, a capacitor body (main body portion) 21 formed in a columnar shape and a flat one facing one end in the longitudinal direction thereof. A pair of lead electrodes (electrodes) 22 extending so as to protrude from the end surface (flat surface) 21a is provided. The capacitor main body 21 is formed with an annular projecting portion 23 that protrudes from the periphery of the one end face 21a. The protruding length of the lead electrode 22 is set longer than that of the annular protrusion 23.
An explosion-proof valve (not shown) for preventing an excessive increase in internal pressure of the electrolytic capacitor 11 is formed on the other end surface 21b in the longitudinal direction of the capacitor body 21. In other words, the explosion-proof valve bursts when the internal pressure of the electrolytic capacitor 11 exceeds a predetermined value set in advance.

The housing case 13 is formed by integrally forming a cylindrical portion 31 having openings 31A and 31B at both ends and a flat wiring board portion 32 that closes one opening 31A of the cylindrical portion 31. Yes. The housing case 13 has a bottomed cylindrical shape by integrally forming the cylindrical portion 31 and the wiring board portion 32 by resin molding, for example.
The cylindrical portion 31 includes a plurality of electrolytic capacitors 11 so that the longitudinal direction of each electrolytic capacitor 11 coincides with the longitudinal direction of the cylindrical portion 31 (the direction in which the openings 31A and 31B at both ends are arranged (Z direction)). It is formed in a shape to accommodate. Furthermore, the cylindrical part 31 in this embodiment arranges the plurality of electrolytic capacitors 11 in a line in one direction (the width direction (X direction) of the cylindrical part 31) perpendicular to the longitudinal direction (Z direction) of the cylindrical part 31. It is formed in an elongated cross-sectional shape that accommodates side by side. In addition, both ends in the width direction (X direction) of the cylindrical portion 31 of the present embodiment are formed in an arc shape corresponding to the outer peripheral surface of the capacitor body 21 that has a cylindrical shape.
In addition, although the cylindrical part 31 in the example of illustration is set to the magnitude | size which can accommodate the three electrolytic capacitors 11, it does not restrict to this but is set to the magnitude | size which can accommodate any number of electrolytic capacitors 11. It's okay.

The wiring board part 32 is for electrically connecting the electrolytic capacitor 11 accommodated in the cylindrical part 31 to the electronic circuit of the main unit 5, and one of the wiring board parts 32 facing the inside of the cylindrical part 31. A plurality of mounting areas S1 on which the electrolytic capacitors 11 are mounted are formed on the main surface 32a.
Here, the mounting area S1 of each electrolytic capacitor 11 is an area of one main surface 32a on which the capacitor main body 21 is placed. In this embodiment, as shown in FIGS. The one main surface 32a of the plate portion 32 is shown in a circular shape. Further, the plurality of mounting areas S1 are formed at intervals.
As shown in FIGS. 4 to 7, the capacitor body 21 has the tip end of the annular protrusion 23 on one main surface 32 a so that the one end surface 21 a faces the one main surface 32 a of the wiring board portion 32. By abutting, it is placed on one main surface 32a. In the state where the capacitor main body 21 is placed in this manner, the gap V <b> 1 is defined by the one end surface 21 a and the annular protrusion 23 of the capacitor main body 21 and the one main surface 32 a of the wiring board portion 32.

  As shown in FIG. 2 and the like, the wiring board portion 32 includes a plurality of terminal boards (electrical wiring) 33 for electrically connecting the electrolytic capacitor 11 arranged in the mounting area S1 to the wiring board 7 of the main unit 5. Have. As shown in FIGS. 2 and 4, each terminal plate 33 has one end portion (external extension portion) 33 </ b> A extending in the longitudinal direction protruding from the other main surface 32 b of the wiring board portion 32, and the other end portion 33 </ b> B. Is attached to the wiring board portion 32 so as to be embedded in the wiring board portion 32.

Further, as shown in FIGS. 2, 4, and 9, the wiring board portion 32 is formed with an insertion hole 34 penetrating in the thickness direction, and the other end portion 33 </ b> B of each terminal plate 33 projects into the insertion hole 34. It is arranged to do. Further, a hole penetrating in the penetrating direction of the insertion hole 34 is also formed in the other end portion 33 </ b> B of the terminal plate 33.
Then, after the lead electrode 22 of the electrolytic capacitor 11 is inserted into the insertion hole 34 of the wiring board portion 32 and the hole of the terminal plate 33, the lead electrode 22 and the other end portion 33 B of the terminal plate 33 are connected with the solder 17. By joining, the electrolytic capacitor 11 is electrically connected to the terminal plate 33. The number of terminal plates 33 and insertion holes 34 provided in one mounting region S1 corresponds to the number of lead electrodes 22 of each electrolytic capacitor 11.

On the other hand, one end portion 33A of the terminal plate 33 protruding from the wiring board portion 32 is formed so that the distal end portion in the protruding direction is bent with respect to the proximal end portion. The distal end portion of the one end portion 33 </ b> A extends in a direction parallel to the other main surface 32 b of the wiring board portion 32. More specifically, the distal end portion of the one end portion 33A extends in a direction orthogonal to both the longitudinal direction (Z direction) of the electrolytic capacitor 11 and the arrangement direction (X direction) of the plurality of electrolytic capacitors 11.
One end portion 33 </ b> A of the terminal board 33 formed in this way is electrically connected to the wiring board 7 by having its tip end portion inserted into the wiring board 7 of the main unit 5 in the thickness direction. By connecting the wiring board 7 and the terminal plate 33 in this way, the capacitor module 3 has a wiring board in which the longitudinal direction (Z direction) of the cylindrical portion 31 and the arrangement direction (X direction) of the plurality of electrolytic capacitors 11 are arranged. 7 to be mounted on the wiring board 7 along the main surface of FIG.

Furthermore, as shown in FIGS. 3 to 5 and 8, the wiring board portion 32 is formed with a plurality of bottomed groove portions 35 that are recessed from one main surface 32 a thereof.
Each groove portion 35 is formed to extend from the mounting region S1 of the electrolytic capacitor 11 to the outside of the mounting region S1. More specifically, each groove portion 35 is formed in a rectangular shape in a sectional view, and is formed in a rectangular shape or a substantially rectangular shape in a plan view extending in the radial direction of the mounting region S1 having a circular shape in a plan view. Yes. Moreover, each groove part 35 is formed so that it may space apart with respect to the insertion hole 34 formed in the mounting region S1. A plurality of groove portions 35 formed for each mounting region S1 are arranged so as to be spaced apart in the circumferential direction of the periphery of each mounting region S1. In the present embodiment, four groove portions 35 are arranged at equal intervals in the circumferential direction of the periphery of the mounting region S1 for each mounting region S1.

More specifically, the first groove portion 35A extending from the periphery of the mounting region S1 toward the inner peripheral surface of the cylindrical portion 31 in plan view has one end in the longitudinal direction of the mounting region S1 more than the annular protrusion 23. It is located inside and communicates with a gap V1 between the wiring board portion 32 and the electrolytic capacitor 11 mounted thereon. On the other hand, the other end of the first groove portion 35A is located outside the mounting region S1, and thereby the first groove portion 35A communicates with the space in the housing case 13.
Further, the second groove portion 35B formed between two mounting regions S1 adjacent to each other in plan view extends in the arrangement direction (X direction) of the two mounting regions S1, and both ends in the longitudinal direction are annular protrusions. It is located inside each mounting area S <b> 1 than the part 23. As a result, the second groove portion 35B communicates with the gap V1 between the electrolytic capacitor 11 mounted on the two adjacent mounting regions S1 and the wiring board portion 32. On the other hand, since the midway portion in the longitudinal direction of the second groove portion 35B located between the two mounting regions S1 is located outside the two mounting regions S1, the second groove portion 35B is formed in the space inside the housing case 13. Communicate.
Therefore, the gap V1 between the wiring board portion 32 and the electrolytic capacitor 11 communicates with the space in the housing case 13 via the first groove portion 35A and the second groove portion 35B.

In addition, as shown in FIGS. 3, 6, and 7, on the outside of each mounting area S <b> 1 of the wiring board portion 32, from one main surface 32 a to surround the electrolytic capacitor 11 arranged in each mounting area S <b> 1. A plurality of (four in the illustrated example) positioning guide portions 36 projecting upward are integrally formed.
Each positioning guide portion 36 is formed in an arc shape corresponding to the outer peripheral surface of the capacitor body 21 in plan view. In the present embodiment, with the electrolytic capacitor 11 mounted on the wiring board portion 32, the outer peripheral surface of the capacitor main body 21 contacts the positioning guide portion 36, or the outer peripheral surface of the capacitor main body 21 and the positioning guide portion 36 are minute. They are opposed to each other through a gap.

And the some positioning guide part 36 formed with respect to each mounting area | region S1 is arranged at intervals in the circumferential direction of the periphery of mounting area S1. If it demonstrates in detail, the several positioning guide part 36 will be distribute | arranged between the some groove parts 35 arranged in the circumferential direction of mounting area | region S1, and it will not interfere with the groove part 35. FIG.
A part (two in the illustrated example) of the plurality of positioning guide portions 36 surrounding each electrolytic capacitor 11 arranged at both ends in the arrangement direction (X direction) of the electrolytic capacitors 11 is an inner circumference of the cylindrical portion 31. It is integrally formed on the surface. In other words, a part of the positioning guide part 36 is defined by the cylindrical part 31.

  Further, as shown in FIG. 2 and the like, the capacitor module 3 is fixed to the case 9 of the main body unit 5 on the side surface along the thickness direction of the wiring board portion 32 and the outer peripheral surface of the cylindrical portion 31 connected thereto. An engagement groove 37 is formed. The capacitor module 3 is fixed to the case 9 of the main unit 5 by engaging the engaging groove 37 with the edge of the opening formed in a part of the side wall of the case 9 of the main unit 5 (see FIG. 1). can do.

As shown in FIGS. 4 to 7, the sealing resin 15 is formed in the housing case 13 so as to seal one main surface 32 a of the wiring board portion 32 and the entire electrolytic capacitor 11. The electrolytic capacitor 11 is fixed to the housing case 13. That is, in the present embodiment, the other end surface 21 b of the electrolytic capacitor 11 including the explosion-proof valve is covered with the sealing resin 15. Here, the hardness of the sealing resin 15 and the thickness of the sealing resin 15 covering the explosion-proof valve are adjusted so as not to hinder the normal operation of the explosion-proof valve. For example, when the material of the sealing resin 15 is soft, the thickness of the sealing resin 15 that covers the explosion-proof valve may be increased, but when the material of the sealing resin 15 is hard, the explosion-proof function of the electrolytic capacitor 11. It is necessary to adjust the thickness of the sealing resin 15 to be small so as not to impair the thickness.
In the illustrated example, the sealing resin 15 is positioned inside the housing case 13 with respect to the other opening 31B of the cylindrical portion 31, but the relationship between the explosion-proof valve and the hardness of the sealing resin 15 described above. Alternatively, depending on the position of the other end surface 21b of the electrolytic capacitor 11 with respect to the other opening 31B, the entire housing case 13 may be filled, for example.

Next, an example of a method for manufacturing the capacitor module 3 having the above configuration will be described.
When manufacturing the capacitor module 3, first, the electrolytic capacitor 11 is accommodated in the cylindrical portion 31 from the other opening 31 </ b> B side, and the lead electrode 22 of the electrolytic capacitor 11 is inserted into the insertion hole 34 and the wiring board portion 32. The capacitor body 21 is placed on one main surface 32a of the wiring board portion 32 so as to be inserted through the hole of the terminal board 33 (accommodating step).
Thus, when the electrolytic capacitor 11 is accommodated in the cylindrical portion 31, the electrolytic capacitor 11 is guided on the mounting region S1 of the one main surface 32a by the positioning guide portion 36, so that the electrolytic capacitor 11 is easily mounted. It can be arranged in the area S1.

  Next, the lead electrode 22 of the electrolytic capacitor 11 and the other end portion 33B of the terminal plate 33 are joined by the solder 17 (connection process). The bonding with the solder 17 may be performed from the other main surface 32b side of the wiring board portion 32 where the tip portion of the lead electrode 22 and the other end portion 33B of the terminal plate 33 are exposed. Through this connection step, the lead electrode 22 of the electrolytic capacitor 11 is electrically connected to the terminal plate 33 of the wiring board portion 32.

  Finally, the molten resin is poured into the cylindrical portion 31 from the other opening portion 31B and is cured, so that the sealing resin 15 causes the electrolytic capacitor 11 as a whole and the wiring board portion 32 to be one main part in the housing case 13. The surface 32a is sealed, and the electrolytic capacitor 11 is fixed to the housing case 13 (sealing process). Thereby, manufacture of the capacitor module 3 is completed.

When the molten resin is poured into the housing case 13 in the above-described sealing step, the molten resin is inserted into the gap V1 between the capacitor body 21 and the wiring board portion 32 through one groove portion 35, for example, as shown in FIG. Flows in. For this reason, air in the gap V1 between the capacitor main body 21 and the wiring board portion 32 is pushed out of the mounting area S1 from the gap V1 through the other groove 35 by the flow of the molten resin. A certain amount of air can be efficiently discharged outside the housing case 13.
In addition, the code | symbol D1 in FIG. 9 has shown the flow direction of the molten resin which flows toward the clearance gap V1 from the one groove part 35, and the code | symbol D2 is the air which flows outside the mounting area | region S1 through the other groove part 35 from the clearance gap V1. Shows the flow direction.

In this sealing step, for example, a nozzle of a potting device that discharges molten resin is moved in the arrangement direction (X direction) of the plurality of electrolytic capacitors 11 above the other opening 31B of the cylindrical portion 31. It is good to carry out.
In this case, for example, as shown in FIG. 8, the molten resin easily enters the groove portions 35 arranged in the arrangement direction (X direction) of the electrolytic capacitors 11 and is arranged in a direction (vertical direction in the drawing) perpendicular to the arrangement direction. It is difficult to enter the groove 35. For this reason, the air in the gap V1 between the electrolytic capacitor 11 and the wiring board portion 32 is pushed out of the mounting region S1 through the groove portions 35 arranged in the vertical direction on the paper surface, and the air in the gap V1 is accommodated in the housing case 13. Can be efficiently discharged to the outside.

  Further, when the capacitor module 3 manufactured as described above is fixed to the main unit 5, for example, after the one end portion 33 </ b> A of the terminal plate 33 is joined and electrically connected to the wiring substrate 7 with solder or the like, the wiring substrate 7 is then connected. The capacitor module 3 may be fixed to the case 9 so that is accommodated in the case 9. In addition, after the fixing, for example, resin may be poured into the case 9 of the main unit 5 to seal the other main surface 32b of the wiring board portion 32, the wiring board 7, and the like. Depending on the usage environment, for example, resin sealing is not necessary.

As described above, according to the storage case 13 and the capacitor module 3 according to the present embodiment, when the molten resin is poured into the storage case 13, the electrolytic capacitor 11, the wiring board 32, and the air in the gap V1 are efficiently stored. It can be discharged to the outside of the case 13.
In particular, in the present embodiment, since a plurality of the groove portions 35 are arranged at intervals in the circumferential direction of the periphery of each mounting region S1, as illustrated in FIG. 8, one groove portion extending the molten resin in one direction. If it is set so that it can easily enter 35, the air in the gap V <b> 1 can be efficiently released from the other groove portion 35 extending in the other direction to the outside of the mounting region S <b> 1.

Thereby, in the state after pouring molten resin into the storage case 13, it can suppress that the air in the clearance gap V1 remains in a molten resin as a bubble. That is, as in the prior art, after the molten resin is poured into the cylindrical portion 31 and until the molten resin is cured, the above-mentioned bubbles rise in the resin and remain as hollow portions that are recessed from the upper surface of the resin. Can be suppressed.
Therefore, it is possible to reduce the frequency of repair for filling the above-described depressions, thereby improving the manufacturing efficiency of the capacitor module 3 and the electronic device 1 and reducing the manufacturing cost.

  In addition, since the housing case 13 is formed in a bottomed cylindrical shape into which an arbitrary number of electrolytic capacitors 11 can be collectively inserted, even if the number of electrolytic capacitors 11 to be connected to the electronic circuit of the main unit 5 changes. Thus, the same storage case 13 can be used. Further, if the shape and arrangement (electrical connection structure) of the lead electrode 22 of the electrolytic capacitor 11 with respect to the terminal plate 33 of the wiring board portion 32 are the same, the wiring board for the electrolytic capacitor 11 can be changed even if the number of electrolytic capacitors 11 is changed. Since it is not necessary to change the shape and arrangement (electrical connection structure) of the terminal plate 33 of the part 32, an arbitrary number of electrolytic capacitors 11 can be electrically connected to the same housing case 13. Therefore, the versatility of the capacitor module 3 can be improved.

Furthermore, since the positioning guide part 36 is formed in the storage case 13 of this embodiment, the electrolytic capacitor 11 can be easily attached to the storage case 13.
In addition, the positioning guide part 36 is arranged in a plurality at intervals in the circumferential direction of the periphery of the same mounting region S1 so as not to interfere with the groove part 35. It is possible to reliably prevent the air flow from being obstructed by the positioning guide portion 36.

Furthermore, the housing case 13 of the present embodiment has the tubular portion 31 and the wiring board portion 32 formed integrally, so that the case 31 is compared with the case where the tubular portion 31 and the wiring board portion 32 are formed separately. And since the process which fixes the wiring board part 32 to the cylindrical part 31 becomes unnecessary, it also becomes possible to reduce the manufacturing process number of the capacitor module 3, and to improve the manufacturing efficiency.
Moreover, in the storage case 13 of this embodiment, since the one end part 33A of the terminal board 33 which protrudes from the other main surface 32b of the wiring board part 32 is bent in L shape, the longitudinal direction ( The capacitor module 3 can be mounted on the wiring board 7 such that the Z direction) and the arrangement direction (X direction) of the plurality of electrolytic capacitors 11 are along the main surface of the wiring board 7. Therefore, compared with the case where the electrolytic capacitor 11 is directly mounted on the main surface of the wiring board 7, the protruding height of the electrolytic capacitor 11 protruding from the main surface of the wiring board 7 is suppressed, and the electronic device 1 is made thinner. be able to.

Furthermore, according to the capacitor module 3 of the present embodiment, the entire electrolytic capacitor 11 including the lead electrode 22 and the one main surface 32a of the wiring board portion 32 are sealed with the sealing resin 15, so that the housing case 13. Even if moisture or the like enters the housing case 13 from the other opening 31B, the lead electrode 22, the wiring board 32, or the capacitor main body 21 is not reached, so that an electrical short circuit of the electrolytic capacitor 11 can be prevented.
Further, since the plurality of electrolytic capacitors 11 collectively stored in the storage case 13 are fixed together by the sealing resin 15, the electrolytic capacitor 11 can be prevented from vibrating with respect to the storage case 13, As a result, the reliability of electrical connection between the electrolytic capacitor 11 and the terminal plate 33 is improved.
From the above, it is possible to provide the capacitor module 3 with high electrical reliability.

  In the first embodiment, the number of the groove portions 35 is not limited to a plurality, and for example, only one groove portion 35 may be formed. In such a configuration, it is preferable that the groove 35 is formed wide so that resin and air can flow in the same groove in opposite directions.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIG.
As shown in FIG. 10, the capacitor module according to this embodiment differs from the capacitor module 3 according to the first embodiment only in the cross-sectional shape of the groove 35.
As shown in FIG. 10, the groove part 35 of the wiring board part 32 which comprises the capacitor | condenser module 3 of this embodiment is mounting the electrolytic capacitor 11 in the one main surface 32a of the wiring board part 32 similarly to 1st embodiment. It is formed so as to extend from the region to the outside of the mounting region, and one end in the longitudinal direction thereof is located inside the annular protrusion 23.

And this groove part 35 is formed so that the depth may become shallow as it goes to the outer side from the mounting area | region. In other words, the bottom surface 35c of the groove portion 35 is an inclined surface that is inclined so as to approach one main surface 32a of the wiring board portion 32 from the inner side to the outer side of the mounting region S1.
According to the storage case of this embodiment, there exists an effect similar to 1st embodiment. Further, according to the housing case of the present embodiment, since the molten resin and air flow along the inclined surface of the groove portion 35 in the sealing process, the flow rate of the molten resin entering the groove portion 35 from the outside of the mounting region S1 is reduced. And the fall of the flow velocity of the air discharged | emitted from the groove part 35 to the outer side of mounting area | region S1 can be suppressed. Therefore, the air in the gap V1 can escape to the outside in a short time.

[Third embodiment]
Next, a third embodiment of the present invention will be described with reference to FIG.
As shown in FIG. 11, the capacitor module according to this embodiment differs from the capacitor module 3 according to the first and second embodiments only in the cross-sectional shape of the groove 35.
As shown in FIG. 11, the groove portion 35 of the wiring board portion 32 constituting the capacitor module 3 of this embodiment has a depth of the groove portion 35 in the region overlapping the mounting region S1 of the electrolytic capacitor 11 from the mounting region S1 side. It has the 1st inclined surface 35d which inclines so that it may become deep as it goes outside. Moreover, the groove part 35 has the 2nd inclined surface 35e which inclines so that the depth of the groove part 35 may become shallow as it goes to the outer side from the mounting area S1 in the area | region located outside the mounting area S1. . The first inclined surface 35d and the second inclined surface 35e are arranged in the longitudinal direction of the groove 35 extending from the mounting region S1 toward the outside of the mounting region S1.
In the present embodiment, the first inclined surface 35d and the second inclined surface 35e are arranged so as to be continuous with each other, whereby the groove portion 35 is formed in a V-shaped cross section. In the illustrated example, the connection portion between the first inclined surface 35d and the second inclined surface 35e overlaps the annular protrusion 23 of the electrolytic capacitor 11 by extending the second inclined surface 35e to the region overlapping the mounting region S1. For example, it may be positioned so as to overlap the gap V1, or may be positioned outside the mounting area S1.

According to the storage case of this embodiment, there exists an effect similar to 1st embodiment. Moreover, according to the storage case of this embodiment, in addition to suppressing the fall of the flow velocity of the resin and air which flow between the outer side of mounting area | region S1, and the groove part 35 by the 2nd inclined surface 35e, by the 1st inclined surface 35d. A decrease in the flow velocity of resin or air flowing between the gap V1 and the groove 35 can also be suppressed. Therefore, the air in the gap V1 can be released to the outside in a shorter time.
In the third embodiment, the first inclined surface 35d and the second inclined surface 35e are arranged in a row, but may be arranged at intervals, for example. In this case, the groove 35 is formed in a trapezoidal cross section.

[Fourth embodiment]
Next, a fourth embodiment of the present invention will be described with reference to FIG.
As shown in FIG. 12, the capacitor module according to this embodiment differs from the capacitor module 3 according to the first embodiment only in the shape of the groove 35 in plan view.
As shown in FIG. 12, the wiring board portion 32 of the housing case constituting the capacitor module of this embodiment has two groove portions 35 extending in the direction along one main surface 32a and formed in a strip shape in plan view. These two groove portions 35 are orthogonal to each other. That is, the two groove portions 35 have a cross shape in plan view. And each groove part 35 is extended in the radial direction of mounting area | region S1 similarly to 1st embodiment, The both ends are located in the outer side of mounting area | region S1.
In the illustrated example, the two groove portions 35 are formed so as to overlap the insertion hole 34, but may be formed so as not to overlap the insertion hole 34, for example.

According to the storage case of this embodiment, there exists an effect similar to 1st embodiment. Further, according to the housing case of the present embodiment, in the sealing process, for example, the molten resin is set so as to enter from one end portion in the longitudinal direction of the groove portion 35, so that the air in the gap V <b> 1 from the other end portion of the groove portion 35. It is possible to escape to the outside efficiently.
The configuration of the fourth embodiment can be applied to both the second and third embodiments described above.
In the fourth embodiment, two strip-shaped groove portions 35 orthogonal to each other are formed. However, for example, only one strip-shaped groove portion 35 may be formed.

[Fifth embodiment]
Next, a fifth embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 13, the capacitor module according to this embodiment differs from the capacitor module 3 according to the first embodiment only in the relative positional relationship between the groove portion 35 and the positioning guide portion 36.
As shown in FIG. 13, the wiring board portion 32 of the housing case 13 constituting the capacitor module 3 of this embodiment has a groove portion extending from the mounting region of the electrolytic capacitor 11 to the outside of the mounting region, as in the first embodiment. 35 and a positioning guide portion 36 surrounding the electrolytic capacitor 11 disposed in the mounting region are formed.

  In the present embodiment, the positioning guide portion 36 protrudes from the bottom surface 35c of the groove portion 35 and extends to above the one main surface 32a. More specifically, the positioning guide portion 36 is disposed at the end portion in the longitudinal direction of the groove portion 35 located outside the mounting region. Thereby, a gap V <b> 2 is defined between the outer peripheral surface of the capacitor main body 21 disposed in the mounting area and the positioning guide portion 36. Even when the gap V2 is defined, when the electrolytic capacitor 11 is accommodated in the cylindrical portion 31, it can be sufficiently guided by the positioning guide portion 36 onto the mounting region of the one main surface 32a. is there.

Thus, in the configuration in which the positioning guide portion 36 protrudes from the bottom surface 35c of the groove portion 35, for example, as shown in FIG. 14, the circumferential length of the groove portion 35 along the circumferential direction of the mounting region S1 is set to the circumferential direction of the positioning guide portion 36. It is preferable to set the length longer than the length. By setting in this way, the molten resin can easily enter the groove 35 in the sealing step. 14 is equivalent to the cross-sectional view shown in FIG.
According to the storage case of this embodiment, there exists an effect similar to 1st embodiment. Further, in the housing case of the present embodiment, the gap V2 between the outer peripheral surface of the capacitor main body 21 and the positioning guide portion 36 is defined so as to extend above the groove portion 35. Therefore, the capacitor main body 21, the wiring board portion 32, and the like. The air discharged from the gap V1 through the groove 35 to the outside of the mounting region S1 is guided above the groove 35 so as to flow toward the other opening 31B of the cylindrical portion 31 through the gap V2. Therefore, the air in the gap V1 can be efficiently discharged to the outside of the housing case 13.
The configuration of the fifth embodiment can be applied to any of the second to fourth embodiments described above.

The details of the present invention have been described above with reference to the first to fifth embodiments of the present invention. However, the technical scope of the present invention is not limited thereto, and is appropriately within a range not departing from the technical idea of the present invention. It can be changed.
That is, the grooves 35 are not limited to the shapes and arrangements of all the embodiments described above, and may be formed in an annular shape in plan view along the circumferential direction of the peripheral edge of the electrolytic capacitor mounting region, for example.
The cylindrical portion 31 of the storage case 13 is formed in an elongated cross-sectional shape that stores a plurality of electrolytic capacitors 11 in a line (X direction) perpendicular to the longitudinal direction (Z direction) of the cylindrical portion 31. In addition, the plurality of electrolytic capacitors 11 may be formed in an arbitrary cross-sectional shape such as a regular polygon or a circle so that the plurality of electrolytic capacitors 11 can be arbitrarily arranged in a matrix shape, a staggered shape, or the like.

Furthermore, although the cylindrical part 31 of the storage case 13 is formed so that the some electrolytic capacitor 11 can be accommodated, you may form in the shape which can accommodate only the one electrolytic capacitor 11, for example. In this case, the entire positioning guide portion 36 may be defined by the inner peripheral surface of the cylindrical portion 31, for example.
Moreover, although the positioning guide part 36 was formed in the wiring board part 32, it does not need to be formed, for example. In this configuration, not only the number of electrolytic capacitors 11 that can be accommodated in the same accommodating case 13 but also the size of the electrolytic capacitors 11 can be set arbitrarily. Therefore, the versatility of the storage case 13 can be further improved.

Furthermore, although the wiring board part 32 is formed integrally with the cylindrical part 31, for example, the cylindrical part is formed by an adhesive or the like so that one main surface 32a of the wiring board part 32 faces the housing case 13. 31 may be bonded and fixed to one opening 31A side. In this case, the area of one main surface 32a of the wiring board part 32 should just be set larger than the opening area of one opening part 31A of the storage case 13 so that one opening part 31A can be obstruct | occluded.
When manufacturing the capacitor module having the above-described configuration, the electrolytic capacitor 11 may be accommodated in the tubular portion 31 after the wiring board portion 32 is fixed to the tubular portion 31 as in the first embodiment. However, for example, after the electrolytic capacitor 11 is mounted on the wiring board part 32, the wiring board part 32 may be bonded and fixed to the one opening 31 </ b> A side of the cylindrical part 31.

Furthermore, although the lead electrode 22 of the electrolytic capacitor 11 and the terminal plate 33 of the wiring board portion 32 are joined by the solder 17, at least the lead electrode 22 and the terminal plate 33 may be electrically connected. It may be joined by other methods.
Further, the sealing resin 15 seals the entire electrolytic capacitor 11, but it is sufficient that at least one main surface 32 a of the wiring board portion 32 is sealed to fix the electrolytic capacitor 11 to the housing case 13. . That is, the sealing resin 15 may seal only the one end surface 21a side of the electrolytic capacitor 11 without covering the other end surface 21b of the electrolytic capacitor 11 including the explosion-proof valve, for example. Even with such a configuration, an electrical short circuit of the electrolytic capacitor 11 due to moisture or the like, and vibration of the electrolytic capacitor 11 with respect to the housing case 13 can be prevented.
Furthermore, when the explosion-proof valve is not covered with the sealing resin 15, for example, a lid member that closes the other opening 31 </ b> B of the housing case 13 may be provided, thereby protecting the entire electrolytic capacitor 11 including the explosion-proof valve. Can be achieved.

  In all the embodiments, the capacitor module 3 including the electrolytic capacitor 11 has been described. However, the electronic component module of the present invention is applied to a configuration including at least an arbitrary electronic component necessary for the electronic circuit of the main unit 5. It is possible. That is, the storage case 13 is not limited to the electrolytic capacitor 11 and may include other electronic components such as a bare chip.

1 Electronic equipment 3 Capacitor module (electronic component module)
5 Main unit 7 Wiring board 11 Electrolytic capacitor (electronic component)
21 Capacitor body (main body)
21a One end surface (flat surface)
22 Lead electrode (electrode)
23 annular projection 13 housing case 31 cylindrical portion 31A one opening 31B other opening 32 wiring board 32a one main surface 32b other main surface 33 terminal board (electrical wiring)
33A One end (external extension)
35, 35A, 35B Groove 35d First inclined surface 35e Second inclined surface 36 Positioning guide portion 15 Sealing resin S1 Mounting region V1 Gap V2 Gap

Claims (14)

In a state in which an electronic component having a configuration in which an electrode is provided on the outer surface of the main body portion is accommodated, the electronic component is fixed to the main unit, and the electronic component is electrically connected to the electronic circuit.
A cylindrical portion having openings at both ends and capable of accommodating one or more electronic components, and a plate shape that closes one opening of the cylindrical portion, and is accommodated in the cylindrical portion. A wiring board portion having electrical wiring for electrically connecting the electrodes of the electronic component to the electronic circuit,
A mounting region for mounting the electronic component is formed on one main surface of the wiring board portion facing the inside of the cylindrical portion,
The housing case, wherein the wiring board portion is formed with a groove portion recessed from the one main surface so as to extend from the mounting region to the outside of the mounting region.   The housing case according to claim 1, wherein a plurality of the groove portions are arranged at intervals in a circumferential direction of a peripheral edge of the mounting region.   2. The storage case according to claim 1, wherein both ends in the longitudinal direction of the groove extending in a direction along the one main surface are located outside the mounting region. The groove portion is positioned at least on the outer side of the mounting region, and at least a first inclined surface that inclines so that the depth of the groove portion becomes deeper from the mounting region side toward the outer side in the region overlapping at least the mounting region. A second inclined surface that inclines so that the depth of the groove portion becomes shallower from the mounting region side toward the outside in the region to be
The said 1st inclined surface and said 2nd inclined surface are arranged in the longitudinal direction of the said groove part extended from the said mounting area to the outer side of the said mounting area, The any one of Claims 1-3 characterized by the above-mentioned. The storage case described in the paragraph.   The storage case according to any one of claims 1 to 3, wherein the depth of the groove portion becomes shallower from the mounting region toward the outside thereof.   A positioning guide portion that protrudes upward from the one main surface is integrally formed outside the mounting area of the wiring board portion so as to surround the electronic component disposed in the mounting area. The storage case according to claim 1, wherein the storage case is characterized by the following.   The housing case according to claim 6, wherein the positioning guide portion is defined by the cylindrical portion.   The storage case according to claim 6 or 7, wherein a plurality of the positioning guide portions are arranged at intervals in the circumferential direction of the peripheral edge of the mounting region. The positioning guide part protrudes from the bottom surface of the groove part,
9. The gap according to claim 6, wherein a gap is defined between the electronic component and the positioning guide portion in a state in which the electronic component is arranged in the mounting region. Storage case.   The housing case according to any one of claims 1 to 9, wherein the cylindrical portion and the wiring board portion are integrally formed.   A distal end portion of the external extension portion of the electrical wiring that protrudes from the other main surface of the wiring board portion is bent with respect to a base end portion of the external extension portion, and is parallel to the other main surface. The storage case according to any one of claims 1 to 10, wherein the storage case extends. The main body portion is in a state where an electronic component configured by providing an electrode on the outer surface of the main body portion is accommodated in the cylindrical portion of the housing case according to any one of claims 1 to 11. While being placed in the mounting area of the wiring board portion, the electrode and the electrical wiring are electrically connected,
Furthermore, one main surface of the wiring board part and an electrical connection part between the electrode and the electrical wiring are sealed with a resin filled in the cylindrical part. . The electrode is formed so as to protrude from the flat surface of the main body portion, and the main body portion has an annular protrusion protruding from a peripheral edge of the flat surface,
The electronic component module according to claim 12, wherein the groove portion extends inward of the mounting region from the annular protrusion in a plan view.   14. An electronic component module according to claim 12 or 13, and a body unit that fixes the electronic component module and incorporates an electronic circuit that is electrically connected to the electric wiring of the wiring board portion. Electronics.

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