JPH0528017U - Surface mount electronic components - Google Patents
Surface mount electronic componentsInfo
- Publication number
- JPH0528017U JPH0528017U JP8491391U JP8491391U JPH0528017U JP H0528017 U JPH0528017 U JP H0528017U JP 8491391 U JP8491391 U JP 8491391U JP 8491391 U JP8491391 U JP 8491391U JP H0528017 U JPH0528017 U JP H0528017U
- Authority
- JP
- Japan
- Prior art keywords
- insulating base
- recess
- lead
- base
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
Abstract
(57)【要約】
【目的】 金属ベースの下面に絶縁台を設け、電子部品
をチップ部品化することにより、従来のセラミックパッ
ケージを使った電子部品くらべ気密性の高い信頼性のあ
る製品を提供することができる。
【構成】 金属製のキャップ１２とベース４を有する電
子部品において、金属ベース４の下面に絶縁台１を設置
し、絶縁台１の上面に前記リード端子のアウターリード
の長さと同等の深さの凹部を有し、引き出し端子板２が
絶縁台１の側面を貫通しかつ各凹部底面において露出し
ているとともに絶縁台１の外壁面に沿って下面へと配設
され、表面実装化したことを特徴とする。また絶縁台上
面に少なくとも２つ以上の対向する位置決め用の突起１
１２ａ、１１２ｂを設けたことを特徴とする。また各凹
部において、外壁面に向かって凹部底面より浅い溝１１
１を設けたことを特徴とする。
(57) [Abstract] [Purpose] By providing an insulating base on the lower surface of the metal base and converting electronic parts into chip parts, we provide highly reliable products with higher airtightness than electronic parts using conventional ceramic packages. can do. In an electronic component having a metal cap 12 and a base 4, an insulating base 1 is installed on the lower surface of the metal base 4, and the upper surface of the insulating base 1 has a depth equivalent to the length of the outer lead of the lead terminal. It has a concave portion, the lead-out terminal plate 2 penetrates the side surface of the insulating base 1, is exposed at the bottom surface of each concave portion, and is arranged on the lower surface along the outer wall surface of the insulating base 1 to be surface-mounted. Characterize. In addition, at least two or more opposing positioning projections 1 are provided on the upper surface of the insulating base.
It is characterized in that 12a and 112b are provided. Further, in each recess, a groove 11 that is shallower toward the outer wall surface than the bottom surface of the recess is formed.
1 is provided.
Description
【０００１】[0001]
本考案は発振器等の表面実装型電子部品の構造に関するものである。 The present invention relates to the structure of surface mount electronic components such as oscillators.
【０００２】[0002]
従来の表面実装型電子部品の構造を、発振器を例にし、図５を参照にして説明 する。図５は従来のチップ型発振器を示す斜視図である。 電子機器の小型化に伴い、電子部品はその全高が底くかつプリント配線基板上 に高密度に実装されることが要求され、しかもその実装は自動機によって行うこ とが要求されている。この要求に応えるべく電子部品を薄型でリードレス化した チップタイプとする動きが急となっていた。図５に示すようなチップ型発振器は その下面に引出し電極が設けられており、この引出しの電極によりプリント配線 基板等の外部電極と接続を行っていた。この接続は電子機器のアッセンブリーの 自動化の流れで、プリント配線基板へのチップ型発振器の電気的機械的接合を、 リフローソルダリングにより行うことが多くなってきている。リフローソルダリ ングとは、あらかじめ接合箇所に適量の半田を供給しておき、外部からの熱源に よって半田を溶融させ、半田付けを行う方法である。 The structure of a conventional surface mount electronic component will be described with reference to FIG. 5, taking an oscillator as an example. FIG. 5 is a perspective view showing a conventional chip oscillator. With the miniaturization of electronic equipment, it is required that electronic components have a low total height and be mounted on a printed wiring board at a high density, and that the mounting is performed by an automatic machine. In order to meet this demand, there has been an urgent move to make electronic parts thinner and leadless chip type. The chip type oscillator as shown in FIG. 5 is provided with a lead electrode on the lower surface thereof, and the lead electrode is connected to an external electrode such as a printed wiring board. This connection is a flow of automation of assembly of electronic devices, and electromechanical bonding of a chip oscillator to a printed wiring board is often performed by reflow soldering. Reflow soldering is a method in which an appropriate amount of solder is supplied to the joint in advance and the solder is melted by an external heat source to perform soldering.
【０００３】[0003]
これは、次のような欠点があった。 セラミックパッケージを使うことが多く、価格が高価になることがあった。 パッケージの封止を半田や低融点ガラスを用いて行うが、金属製のケースを用 い抵抗溶接等を行った封止に較べて気密性が低い。 経時変化比較的大きく、製品の信頼性が低い。 本考案は、これらの欠点を除くためになされたものである。 This had the following drawbacks. Ceramic packages are often used, and the price is often high. Although the package is sealed using solder or low melting point glass, its airtightness is lower than that obtained by resistance welding using a metal case. Change over time is relatively large, and product reliability is low. The present invention has been made to eliminate these drawbacks.
【０００４】[0004]
上記問題点を解決するために、本考案の表面実装型電子部品は、電気的に独立 して設けられた複数のリード端子を有する金属製のベースが有り、金属製のキャ ップで封止した電子部品において、金属ベースの下面に絶縁台を設置し、絶縁台 の上面に前記リード端子のアウターリードの長さと同等の深さの凹部を有し、引 き出し端子板が絶縁台の側面を貫通しかつ各凹部底面において露出しているとと もに絶縁台の下面側に外壁面に沿って下面へと配設され、表面実装化した。 In order to solve the above problems, the surface mount type electronic component of the present invention has a metal base having a plurality of electrically independent lead terminals and is sealed with a metal cap. In the electronic component, the insulating base is installed on the lower surface of the metal base, and the upper surface of the insulating base has a recess having a depth equal to the length of the outer lead of the lead terminal. It is also mounted on the lower surface of the insulating base along the outer wall surface to the lower surface, and is surface-mounted.
【０００５】 電気的に独立して設けられた複数のリード端子を有する金属製のベースが有り 、金属製のキャップで封止した電子部品の金属ベースの下面に絶縁台を設置し、 絶縁台の上面に前記リード端子のアウターリードの長さと同様の深さの凹部を有 し、各凹部底面に引き出し端子板が配設された前記絶縁台において、絶縁台上面 に少なくとも２つ以上の対向する位置決め用の突起を有した。There is a metal base having a plurality of electrically independent lead terminals, and an insulating base is installed on the lower surface of the metal base of an electronic component sealed with a metal cap. At least two or more opposing positionings on the upper surface of the insulating base in the insulating base having a recess on the upper surface having the same depth as the length of the outer lead of the lead terminal and having a lead terminal plate on the bottom of each recess. It had a projection for.
【０００６】 電気的に独立して設けられた複数のリード端子を有する金属製のベースが有り 、金属製のキャップで封止した電子部品の金属ベースの下面に絶縁台を設置し、 絶縁台の上面に前記リード端子のアウターリードの長さと同様の深さの凹部を有 し、各凹部底面に引き出し端子板が配設された前記絶縁台において、各凹部に導 電性接合材があふれ出さないように溝を設けた。There is a metal base having a plurality of electrically independent lead terminals, and an insulating stand is installed on the lower surface of the metal base of an electronic component sealed with a metal cap. In the above-mentioned insulating base in which the upper surface has a recess having the same depth as the length of the outer lead of the lead terminal and the bottom of each recess is provided with a lead-out terminal plate, the conductive bonding material does not overflow into each recess. So that the groove is provided.
【０００７】[0007]
金属ベースの下面に絶縁台を設け、電子部品をチップ部品化することにより、 従来のセラミックパッケージを使った電子部品くらべ気密性の高い信頼性のある 製品を提供することができる。 By providing an insulating base on the lower surface of the metal base and converting the electronic parts into chip parts, it is possible to provide a reliable product with higher airtightness than conventional electronic parts using a ceramic package.
【０００８】[0008]
次に、本考案について、表面実装型電子部品の構造を、発振器を例にし、図面 を参照にして説明する。 図１は本考案の実施例を示す斜視図であり、図２は本考案の実施例を示す絶縁 台の斜視図であり、図３は本考案の実施例を示した分解断面図である。図４は本 考案の実施例を示す絶縁台の平面図である。なお、他の実施例および従来の実施 例における図面と同種類もしくは同様の部分については、同番号を付した。 ベース４は、金属からなる。ベース４にはガラス５を介してリード端子６が気 密かつ絶縁して封着されており、アース端子６１を有している。 リード端子６の上面には基板７が設けられ、前記基板表面には外部回路を構成 するＩＣ１０、抵抗等の電子部品１１並びに圧電板９を支持し金属柱等からなる サポート８を搭載し、必要な接続がなされている。さらにこのサポート上部には 図示していないが電極形成された圧電板９が搭載され、導電性接合材によって電 気的、機械的接合がなされている。 ベース４と金属からなるキャップ１２とを気密封止する。 絶縁台１は、樹脂等からなる。絶縁台１の上面には前記リード端子６のアウタ ーリードの長さと同様の深さの凹部１１３、凹部１１４、凹部１１５を有し、各 凹部底面には引き出し端子板２が露出しているとともに絶縁板１の側面を貫通し 絶縁台１の下面側に外壁面に沿って下面へとそれぞれ配設されている。 上記のようにして形成された絶縁台１の凹部１１３、凹部１１４、凹部１１ ５にそれぞれ導電性接合材３を注入し、上記のようにして形成された発振 器のリード端子６、６ アース端子６１を前記凹部の底面にある各引き出し端子 板２、２、２に接触させ、絶縁台１に発振器を搭載した状態で加熱して固着接合 する。この場合、図２、図４のように貫通孔２２を設けて、リード端子６、６・ アース端子６１を長くして、貫通孔２２に貫通するようにしてもよい。 Next, the present invention will be described with reference to the drawings by taking the oscillator as an example and explaining the structure of the surface mount electronic component. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a perspective view of an insulating base showing an embodiment of the present invention, and FIG. 3 is an exploded sectional view showing an embodiment of the present invention. FIG. 4 is a plan view of an insulating base showing an embodiment of the present invention. It should be noted that the same types or similar parts as those in the drawings in the other embodiments and the conventional embodiments are denoted by the same reference numerals. The base 4 is made of metal. A lead terminal 6 is hermetically and insulatively sealed to the base 4 via a glass 5, and has a ground terminal 61. A substrate 7 is provided on the upper surface of the lead terminal 6, and an IC 10 that constitutes an external circuit, an electronic component 11 such as a resistor, and a support 8 that supports a piezoelectric plate 9 and that is composed of a metal pillar or the like are mounted on the surface of the substrate. Connections are made. Although not shown, a piezoelectric plate 9 on which electrodes are formed is mounted on the upper portion of the support, and electrically and mechanically joined by a conductive joining material. The base 4 and the cap 12 made of metal are hermetically sealed. The insulating base 1 is made of resin or the like. The upper surface of the insulating base 1 has a recess 113, a recess 114, and a recess 115 having the same depth as the length of the outer lead of the lead terminal 6, and the lead terminal plate 2 is exposed and insulated from the bottom of each recess. It penetrates the side surface of the plate 1 and is arranged on the lower surface side of the insulating base 1 along the outer wall surface to the lower surface. The conductive bonding material 3 is injected into each of the recess 113, the recess 114, and the recess 115 of the insulating base 1 formed as described above, and the lead terminals 6 and 6 ground terminals of the oscillator formed as described above 61 is brought into contact with each of the lead-out terminal plates 2, 2 and 2 on the bottom surface of the recess, and heating is carried out in a state where the oscillator is mounted on the insulating base 1 to fix and bond them. In this case, the through hole 22 may be provided as shown in FIGS. 2 and 4, and the lead terminals 6, 6 and the ground terminal 61 may be lengthened to penetrate the through hole 22.
【０００９】 絶縁台に位置決め用の突起を設けた場合の実施例を説明する。絶縁台１は、樹 脂等からなる。絶縁台１の上面には前記リード端子６のアウターリードの長さと 同様の深さの凹部１１３、凹部１１４、凹部１１５を有し、各凹部底面には引き 出し端子板２が露出しているとともに絶縁板１の側面を貫通し絶縁台１の下面側 に外壁面に沿って下面へとそれぞれ配設されている。また、絶縁台１の上面に少 なくとも２つ以上の対向する位置決め用の突起１１２ａ、１１２ｂを設け、発振 器のベース４には普通位置決め用の角部を設けてあり、突起１１２ａには前記角 部を挿入するための係止溝２３を設けた。突起１１２ａ、１１２ｂを設けること により前記発振器を搭載する際、ずれをなくすことができ取付精度を向上させる ことができる。An embodiment in which a positioning protrusion is provided on the insulating base will be described. The insulating base 1 is made of resin or the like. The upper surface of the insulating base 1 has a recess 113, a recess 114, and a recess 115 having the same depth as the length of the outer lead of the lead terminal 6, and the drawer terminal plate 2 is exposed at the bottom of each recess. It penetrates the side surface of the insulating plate 1 and is arranged on the lower surface side of the insulating base 1 along the outer wall surface to the lower surface. Further, at least two or more facing positioning projections 112a and 112b are provided on the upper surface of the insulating base 1, and the base 4 of the oscillator is provided with a corner for normal positioning. A locking groove 23 for inserting a corner is provided. By providing the projections 112a and 112b, when mounting the oscillator, it is possible to eliminate the deviation and improve the mounting accuracy.
【００１０】 絶縁台の各凹部に溝を設けた場合の実施例を説明する。絶縁台１は、樹脂等か らなる。絶縁台１の上面には前記リード端子６のアウターリードの長さと同様の 深さの凹部１１３、凹部１１４、凹部１１５を有し、各凹部底面には引き出し端 子板２が露出しているとともに絶縁板１の側面を貫通し絶縁台１の下面側に外壁 面に沿って下面へとそれぞれ配設されている。そこで、前記各凹部には、外壁面 に向かって最短距離で凹部底面より浅い溝１１１を設けた。溝１１１は各凹部に １つであっても複数であってもよい。溝１１１を設けることにより導電性接合材 を注入する際、導電性接合材３があふれ出して隣の凹部にある導電性接合材ある いは引き出し端子板とつながり短絡事故が起こることを避けることができる。An embodiment in which a groove is provided in each recess of the insulating base will be described. The insulating base 1 is made of resin or the like. The upper surface of the insulating base 1 has a recess 113, a recess 114, and a recess 115 having the same depth as the length of the outer lead of the lead terminal 6, and the drawer terminal plate 2 is exposed at the bottom of each recess. It penetrates the side surface of the insulating plate 1 and is arranged on the lower surface side of the insulating base 1 along the outer wall surface to the lower surface. Therefore, each of the recesses is provided with a groove 111 shallower than the bottom surface of the recess toward the outer wall surface. There may be one groove 111 or a plurality of grooves 111 for each recess. When the conductive bonding material is injected by providing the groove 111, it is possible to prevent the conductive bonding material 3 from overflowing and connecting to the conductive bonding material or the lead-out terminal plate in the adjacent recess to cause a short circuit accident. it can.
【００１１】 絶縁台に位置決め用の突起１１２ａ、１１２ｂと各凹部に溝を設けた場合の実 施例を説明する。絶縁台１は、樹脂等からなる。絶縁台１の上面には前記リード 端子６のアウターリードの長さと同様の深さの凹部１１３、凹部１１４、凹部１ １５を有し、各凹部底面には引き出し端子板２が露出しているとともに絶縁板１ の側面を貫通し絶縁台１の下面側に外壁面に沿って下面へとそれぞれ配設されて いる。そこで、前記各凹部には、互いの凹部と交わらないように外壁面に向かっ て最短距離で凹部底面より浅い溝１１１を設けた。溝１１１は各凹部に１つであ っても複数であってもよい。また、絶縁台１の上面に少なくとも２つ以上の対向 する位置決め用の突起１１２ａ、１１２ｂを設けた。発振器のベース４には普通 位置決め用の角部を設けてあり、突起１１２ａには前記角部を挿入するための係 止溝２３を設けた。An example of the case where positioning projections 112a and 112b and grooves are provided on the insulating base will be described. The insulating base 1 is made of resin or the like. The upper surface of the insulating base 1 has a recess 113, a recess 114, and a recess 115 having the same depth as the length of the outer lead of the lead terminal 6, and the lead terminal plate 2 is exposed at the bottom of each recess. It penetrates the side surface of the insulating plate 1 and is arranged on the lower surface side of the insulating base 1 along the outer wall surface to the lower surface. Therefore, each of the recesses is provided with a groove 111 that is shallower than the bottom surface of the recess at the shortest distance toward the outer wall surface so as not to intersect with each other. There may be one groove 111 or a plurality of grooves 111 in each recess. Moreover, at least two or more facing positioning projections 112a and 112b are provided on the upper surface of the insulating base 1. The oscillator base 4 is usually provided with a corner for positioning, and the protrusion 112a is provided with a locking groove 23 for inserting the corner.
【００１２】[0012]
本考案の効果として次のものがあげられる。 従来のセラミックパッケージを使った電子部品くらべ本考案の電子部品は金属 製のベースとキャップを用いた抵抗溶接等の金属間結合による封止を行うために 気密性を損なうことはなく経時変化することがない。また外部からの歪応力を電 子部品内部に伝えにくいので、絶縁台との組合せにより信頼性の高い表面実装型 電子部品を提供することができる。 絶縁台に位置決め用の突起を設けることにより、電子部品等を搭載する際、ず れをなくすことができ取付精度を向上させることができる。 絶縁台の各凹部に溝を設けることにより、導電性接合材を注入する際、導電性 接合材３があふれ出して隣の凹部とつながり短絡事故が起こりショート等を起こ すことを避けることができ、信頼性の高い表面実装型電子部品を提供することが できる。 The effects of the present invention are as follows. Compared to conventional electronic components using a ceramic package, the electronic components of the present invention are sealed by metal-to-metal bonding such as resistance welding using a metal base and a cap, so that airtightness is not impaired and changes over time. There is no. In addition, since it is difficult to transmit strain stress from the outside to the inside of the electronic component, it is possible to provide a highly reliable surface mount electronic component by combining it with an insulating base. Providing the positioning protrusions on the insulating base can prevent displacement when mounting electronic components and improve the mounting accuracy. By providing a groove in each recess of the insulating base, it is possible to prevent the conductive bonding material 3 from overflowing and connecting to the adjacent recess to cause a short circuit when the conductive bonding material is injected. It is possible to provide a highly reliable surface mount type electronic component.
【図１】本考案の実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.
【図２】本考案の実施例を示す絶縁台の斜視図である。FIG. 2 is a perspective view of an insulating base according to an embodiment of the present invention.
【図３】本考案の実施例を示した分解断面図である。FIG. 3 is an exploded sectional view showing an embodiment of the present invention.
【図４】本考案の実施例を示す絶縁台の平面図である。FIG. 4 is a plan view of an insulating base according to an embodiment of the present invention.
【図５】従来のチップ型発振器を示す斜視図である。FIG. 5 is a perspective view showing a conventional chip oscillator.
１ 絶縁台 ２ 引き出し端子板 ３ 導電性接合材 ４ ベース ５ ガラス ６ リード端子 ６１ アース端子 ７ 基板 ８ サポート ９ 圧電板 １０ ＩＣ １１ 電子部品 １２ キャップ １３ チップ型発振器 １１１ 溝 １１２ａ、１１２ｂ 突起 １１３、１１４、１１５ 凹部 ２２ 貫通孔 ２３ 係止溝 DESCRIPTION OF SYMBOLS 1 Insulation stand 2 Lead-out terminal board 3 Conductive joining material 4 Base 5 Glass 6 Lead terminal 61 Earth terminal 7 Substrate 8 Support 9 Piezoelectric plate 10 IC 11 Electronic component 12 Cap 13 Chip oscillator 111 Groove 112a, 112b Protrusion 113, 114, 115 recess 22 through hole 23 locking groove
Claims (3)
ド端子を有する金属製のベースが有り、金属製のキャッ
プで封止した電子部品において、金属ベースの下面に絶
縁台を設置し、絶縁台の上面に前記リード端子のアウタ
ーリードの長さと同等の深さの凹部を有し、引き出し端
子板が絶縁台の側面を貫通しかつ各凹部底面において露
出しているとともに絶縁台の外壁面に沿って下面へと配
設され、表面実装化したことを特徴とする表面実装型電
子部品。1. A metal base having a plurality of electrically independent lead terminals is provided, and in an electronic component sealed with a metal cap, an insulating base is installed on the lower surface of the metal base, The upper surface of the insulating base has a recess having a depth equal to the length of the outer lead of the lead terminal, and the lead-out terminal plate penetrates the side surface of the insulating base and is exposed at the bottom of each recess and the outer wall surface of the insulating base. A surface mount type electronic component, characterized in that it is disposed on the lower surface along with and is surface mounted.
する位置決め用の突起を設けたことを特徴とする実用新
案登録請求項１記載の表面実装型電子部品。2. The surface mount type electronic component according to claim 1, wherein at least two or more opposing projections for positioning are provided on the upper surface of the insulating base.
底面より浅い溝を設けたことを特徴とする実用新案登録
請求項１記載および実用新案登録請求項２記載の表面実
装型電子部品。3. The surface mount type electronic component according to claim 1 and claim 2, wherein each recess has a groove shallower than the bottom of the recess toward the outer wall surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8491391U JPH0739222Y2 (en) | 1991-09-20 | 1991-09-20 | Surface mount electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8491391U JPH0739222Y2 (en) | 1991-09-20 | 1991-09-20 | Surface mount electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0528017U true JPH0528017U (en) | 1993-04-09 |
| JPH0739222Y2 JPH0739222Y2 (en) | 1995-09-06 |
Family
ID=13843967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8491391U Expired - Fee Related JPH0739222Y2 (en) | 1991-09-20 | 1991-09-20 | Surface mount electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739222Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010154809A (en) * | 2008-12-27 | 2010-07-15 | Marukyu Co Ltd | Vessel for preparing artificial fishing bait, artificial fishing bait, and kit for artificial fishing bait |
| JP2012151223A (en) * | 2011-01-18 | 2012-08-09 | Shindengen Electric Mfg Co Ltd | Housing case, electronic component module, and electronic apparatus |
-
1991
- 1991-09-20 JP JP8491391U patent/JPH0739222Y2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010154809A (en) * | 2008-12-27 | 2010-07-15 | Marukyu Co Ltd | Vessel for preparing artificial fishing bait, artificial fishing bait, and kit for artificial fishing bait |
| JP2012151223A (en) * | 2011-01-18 | 2012-08-09 | Shindengen Electric Mfg Co Ltd | Housing case, electronic component module, and electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0739222Y2 (en) | 1995-09-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |