JP5088696B2

JP5088696B2 - Electronics

Info

Publication number: JP5088696B2
Application number: JP2008220607A
Authority: JP
Inventors: 肇夫早川
Original assignee: Nippon Seiki Co Ltd
Current assignee: Nippon Seiki Co Ltd
Priority date: 2008-08-29
Filing date: 2008-08-29
Publication date: 2012-12-05
Anticipated expiration: 2028-08-29
Also published as: JP2010056351A

Description

本発明は、回路基板をケース内に配設し、前記ケース内に合成樹脂からなる充填部材を充填することによって前記回路基板を覆い密封する電子機器に関する。 The present invention relates to an electronic apparatus in which a circuit board is disposed in a case and the case is filled with a filling member made of synthetic resin so as to cover and seal the circuit board.

従来の電子機器は、電子部品を実装した回路基板をケース内に配設し、前記ケース内に合成樹脂からなる充填部材を流し込んで前記電子部品とともに回路基板を覆うものである。 In a conventional electronic device, a circuit board on which electronic components are mounted is disposed in a case, and a filling member made of synthetic resin is poured into the case to cover the circuit board together with the electronic components.

このような電子機器は、前記ケースの壁部に隣接して仕切り壁を設け、この仕切り壁側の底面と、前記ケースの前記回路基板を収納する収納空間の底面とが連通するように排気部が構成され、前記回路基板を前記収納空間に配設し、この収納空間内に充填部材を充填するとともに、充填中に溜まってしまう気泡を前記排気部から外方へ放出させるものであった。
実開昭５９−１８２９８３号公報 Such an electronic device is provided with a partition wall adjacent to the wall portion of the case, and an exhaust section so that a bottom surface on the partition wall side communicates with a bottom surface of a storage space for storing the circuit board of the case. The circuit board is disposed in the storage space, and the storage space is filled with a filling member, and bubbles accumulated during the filling are discharged from the exhaust portion to the outside.
Japanese Utility Model Publication No.59-182983

しかしながら、このような電子機器は、前記ケースの前記仕切り壁に前記排気部を備える構成であるため、小型化できないといった問題を有していた。 However, such an electronic device has a problem in that it cannot be reduced in size because the exhaust portion is provided on the partition wall of the case.

また、前記排気部を設けたために、前記収納空間内を隅々まで完全に前記充填部材で満たす前に前記排気部から前記充填部材があふれてしまう虞があるという問題を有していた。 Further, since the exhaust portion is provided, there is a problem that the filling member may overflow from the exhaust portion before the storage space is completely filled with the filling member.

そこで、本発明は前述した問題点に着目し、回路基板をケースに収納し、充填部材で覆う電子機器において、小型化が可能であり、また、充填部材を充分に充填することが可能な電子機器を提供することを目的とする。 Therefore, the present invention pays attention to the above-described problems, and an electronic device in which a circuit board is housed in a case and covered with a filling member can be downsized, and an electronic device that can be sufficiently filled with the filling member. The purpose is to provide equipment.

本発明は、電子部品を実装した回路基板をケース内に配設し、前記電子部品とともに回路基板を充填部材によって覆い密封する電子機器において、前記ケースの上端から少なくとも一段低くなった位置に設けられ前記回路基板を配設する第一の段差部と、前記第一の段差部よりも下方側に設けられ前記電子部品を収納する収納空間と、前記回路基板に設けられ前記収納空間に連通する連通部と、前記回路基板を間に挟んだ前記連通部の反対側であり、前記ケースの上端から前記第一の段差部よりもさらに低く、かつ前記収納空間である前記ケースの底よりは高い位置に、前記収納空間に連通するとともに前記収納空間の内側から外側に向かうに従ってすぼまる先細りの第二の段差部と、を設けたものである。
The present invention provides an electronic device in which a circuit board on which an electronic component is mounted is disposed in a case, and the circuit board is covered and sealed together with the electronic component by a filling member. A first stepped portion on which the circuit board is disposed; a storage space provided below the first stepped portion for storing the electronic component; and a communication provided on the circuit board and communicating with the storage space. And on the opposite side of the communication part with the circuit board interposed therebetween, a position that is further lower than the first step part from the upper end of the case and higher than the bottom of the case that is the storage space In addition, a tapered second stepped portion that communicates with the storage space and narrows from the inside to the outside of the storage space is provided.

また、本発明は、前記ケースに前記回路基板を位置決めする位置決め部を設けたものである。 In the present invention, the case is provided with a positioning portion for positioning the circuit board.

本発明によれば、所期の目的を達成でき、回路基板をケースに収納し、充填部材で覆う電子機器において、小型化が可能であり、また、充填部材を充分に充填することが可能な電子機器を提供することができる。 According to the present invention, an intended purpose can be achieved, and an electronic device in which a circuit board is housed in a case and covered with a filling member can be reduced in size and can be sufficiently filled with the filling member An electronic device can be provided.

以下、本発明を採用した第１実施形態を添付図面に基づいて説明する。 Hereinafter, a first embodiment employing the present invention will be described with reference to the accompanying drawings.

本実施形態の電子機器Ｅは、電子部品１ａを実装した回路基板１と、ケース２と、このケース２内に充填される充填部材３とから構成されている。 The electronic device E according to this embodiment includes a circuit board 1 on which an electronic component 1a is mounted, a case 2, and a filling member 3 filled in the case 2.

回路基板１は、ガラスエポキシ樹脂などの硬質の絶縁材料からなる基材に、図示しない導電体をその表面に備えたものである。また、回路基板１には、その外周の一部を切り欠いて形成した連通部６を１つ備えている。この連通部６は、ケース２に設けられた後述する収納空間に連通するものである。 The circuit board 1 includes a base material made of a hard insulating material such as glass epoxy resin and a conductor (not shown) on the surface thereof. Further, the circuit board 1 is provided with one communicating portion 6 formed by cutting out a part of the outer periphery thereof. The communication portion 6 communicates with a storage space (described later) provided in the case 2.

電子部品１ａは、回路基板１の前記導電体に図示しない半田などによって電気的に接続されるものである。本実施形態では、ケース２の後述する収納空間に位置するように、回路基板１の下側の面に実装されている（図３〜５参照）。この電子部品１ａは、センサであり、ケース２の外側の図示しない検出対象の変化を検出するものである。なお、図中では、電子部品１ａ以外は図示されていないが、電子部品１ａ以外の電子部品を回路基板１に実装してもよい。 The electronic component 1a is electrically connected to the conductor of the circuit board 1 by solder (not shown). In this embodiment, it is mounted on the lower surface of the circuit board 1 so as to be positioned in a storage space (described later) of the case 2 (see FIGS. 3 to 5). This electronic component 1 a is a sensor, and detects a change in a detection target (not shown) outside the case 2. In the drawing, the components other than the electronic component 1 a are not shown, but an electronic component other than the electronic component 1 a may be mounted on the circuit board 1.

ケース２は、合成樹脂からなり、その形状は、底２ａと、この底２ａの周囲を囲む壁部２ｂを備えたカップ形状である。 The case 2 is made of a synthetic resin, and the shape thereof is a cup shape having a bottom 2a and a wall 2b surrounding the bottom 2a.

ケース２の壁部２ｂの上端から少なくとも一段低くなった位置に第一の段差部４が設けられている。この第一の段差部４に、回路基板１が配設される。 A first step portion 4 is provided at a position that is at least one step lower than the upper end of the wall portion 2 b of the case 2. The circuit board 1 is disposed on the first step portion 4.

そして、この第一の段差部４よりも下方側（底２ａ）に電子部品１ａを収納する収納空間５が設けられている。すなわち、ケース２の底２ａに収納空間５を備えており、この収納空間５の周囲に、底２ａより一段高い第一の段差部４が形成されている。 A storage space 5 for storing the electronic component 1a is provided below the first step 4 (bottom 2a). That is, the storage space 5 is provided on the bottom 2 a of the case 2, and a first step portion 4 that is one step higher than the bottom 2 a is formed around the storage space 5.

そして、第一の段差部４の回路基板１の連通部６を設けた側（図１、２中の右側の第一の段差部４）に対して、回路基板１の少なくとも一部を間に設けた第一の段差部４（図１、２中の左側の第一の段差部４）に、第二の段差部７が設けられている。この第二の段差部７は、回路基板１の上側と下側、すなわち、外部と回路基板１で覆われた収納空間５とを連通するものであり、第二の段差部７を構成する２つの側面７ａが、内側から外側に向かうに従って近づいている。すなわち、第二の段差部７は、収納空間５の内側から外側に向かうに従ってすぼまる先細りの形状である。なお、側面７ａは、収納空間５の最大幅の部分を始点とし、収納空間５の外側に向かうに従ってすぼまる先細りの形状である。
Then, at least a part of the circuit board 1 is interposed between the side of the first step part 4 where the communication part 6 of the circuit board 1 is provided (the first step part 4 on the right side in FIGS. A second step 7 is provided on the first step 4 provided ( the first step 4 on the left side in FIGS. 1 and 2). The second step portion 7 communicates the upper and lower sides of the circuit board 1, that is, the outside and the storage space 5 covered with the circuit substrate 1, and constitutes the second step portion 7. The two side surfaces 7a are approaching from the inside toward the outside. That is, the second stepped portion 7 has a tapered shape that narrows from the inside to the outside of the storage space 5. The side surface 7 a has a tapered shape that starts from the maximum width of the storage space 5 and narrows toward the outside of the storage space 5.

また、ケース２には、回路基板１を位置決めする位置決め部として、三つの位置決めピン８を備えている。三つの位置決めピン８のうち、一つは、第二の段差部７の部分に設けられており、他の二つは、第一の段差部４に設けられている。この位置決めピン８は、回路基板１に設けた貫通孔１ｂや切り欠き１ｃと組み合うことで、回路基板１とケース２との位置関係を定めるものである。また、位置決めピン８は、充填部材３が充填され硬化する前に、回路基板１を仮に固定するものでもある。 The case 2 includes three positioning pins 8 as positioning portions for positioning the circuit board 1. One of the three positioning pins 8 is provided in the second stepped portion 7, and the other two are provided in the first stepped portion 4. This positioning pin 8 determines the positional relationship between the circuit board 1 and the case 2 by being combined with a through hole 1b or a notch 1c provided in the circuit board 1. In addition, the positioning pins 8 temporarily fix the circuit board 1 before the filling member 3 is filled and cured.

この位置決めピン８によって、後述する充填作業中に回路基板１の位置がずれることを防止し、良好な充填作業を得ることができ、また、回路基板１に設けられた連通部６の位置決めができるため充填部材３の充填作業を機械化することができ、生産性を向上させることができる。 The positioning pins 8 prevent the position of the circuit board 1 from being shifted during the filling operation described later, can provide a satisfactory filling operation, and can position the communicating portion 6 provided on the circuit board 1. Therefore, the filling operation of the filling member 3 can be mechanized and the productivity can be improved.

充填部材３は、熱などによって硬化する流動性を有する合成樹脂であり、充填装置のニードル９から吐出されて、回路基板１をケース２内に配設し、回路基板１と電子部品１ａとを覆い密封し、回路基板１や電子部品１ａを水等から保護するものである。 The filling member 3 is a synthetic resin having fluidity that is cured by heat or the like. The filling member 3 is discharged from the needle 9 of the filling device, and the circuit board 1 is disposed in the case 2 so that the circuit board 1 and the electronic component 1a are connected. Cover and seal to protect the circuit board 1 and the electronic component 1a from water or the like.

次に、充填部材３を充填する行程を説明する。まず、前記充填装置のニードル９を収納空間５内に達するように連通部６に挿入する。 Next, the process of filling the filling member 3 will be described. First, the needle 9 of the filling device is inserted into the communication portion 6 so as to reach the storage space 5.

次いで、ニードル９から充填部材３を吐出し、連通部６を設けた側から第二の段差部７へと充填部材３が流出するように充填する。この時、収納空間５内に存在した空気などの気体は、充填部材３が収納空間５内に流入することによって、収納空間５の外へ排出される。 Next, the filling member 3 is discharged from the needle 9 and filled so that the filling member 3 flows out from the side where the communication portion 6 is provided to the second stepped portion 7. At this time, a gas such as air existing in the storage space 5 is discharged to the outside of the storage space 5 when the filling member 3 flows into the storage space 5.

なお、第二の段差部７が先細りの形状であるために、第二の段差部７から充填部材３が流出するときに、充填部材３が第二の段差部７から排出されにくくなり、第二の段差部７内で充填部材３に加わる圧力が高まり、この圧力によって収納空間５の隅々まで充分に充填部材３で満たすことができる。 In addition, since the 2nd level | step-difference part 7 is a tapered shape, when the filling member 3 flows out from the 2nd level | step-difference part 7, it becomes difficult for the filling member 3 to be discharged | emitted from the 2nd level | step-difference part 7, The pressure applied to the filling member 3 in the second stepped portion 7 is increased, and the filling member 3 can be sufficiently filled up to every corner of the storage space 5 by this pressure.

また、側面７ａを、収納空間５の最大幅の部分を始点とし、収納空間５の外側に向かうに従ってすぼまる先細りの形状としたことによって、より充填部材３を収納空間５の隅々までに満たすことができる。 Further, the side surface 7a has a tapered shape starting from the maximum width portion of the storage space 5 and narrowing toward the outside of the storage space 5, so that the filling member 3 can be extended to every corner of the storage space 5. Can be satisfied.

そして、ニードル９から充填部材３を吐出し続けて、ケース２内を充填部材３で満たし、電子部品１ａと回路基板１を充填部材３によって覆い充填部材３の充填する行程が終了する。なお、充填された充填部材３に熱を加えて硬化させて、電子機器Ｅが完成する。 Then, the filling member 3 is continuously discharged from the needle 9, the inside of the case 2 is filled with the filling member 3, the process of covering the electronic component 1a and the circuit board 1 with the filling member 3 and filling the filling member 3 is completed. The filled filling member 3 is cured by applying heat to complete the electronic device E.

本発明の第１実施形態の電子機器の上面図。1 is a top view of an electronic apparatus according to a first embodiment of the present invention. 同実施形態のケースの上面図。The top view of the case of the embodiment. 図１中Ａ−Ａ線の断面図。Sectional drawing of the AA line in FIG. 図１中Ｂ−Ｂ線の断面図。Sectional drawing of the BB line in FIG. 同実施形態の充填行程を示す図。The figure which shows the filling process of the embodiment.

Explanation of symbols

Ｅ電子機器
１回路基板
１ａ電子部品
２ケース
２ｂ壁部
３充填部材
４第一の段差部
５収納空間
６連通部
７第二の段差部
８位置決め部 E Electronic device 1 Circuit board 1a Electronic component 2 Case 2b Wall 3 Filling member 4 First step portion 5 Storage space 6 Communication portion 7 Second step portion 8 Positioning portion

Claims

In an electronic device in which a circuit board on which an electronic component is mounted is disposed in a case and the circuit board is covered and sealed together with the electronic component by a filling member, the circuit board is provided at a position lower by at least one step from the upper end of the case. a first step portion arranged, a housing space for housing the electronic components provided on the lower side of said first stepped portion, and a communicating portion that communicates with the storage space is provided on the circuit board, wherein The housing is located on the opposite side of the communication portion with the circuit board therebetween, lower than the first step portion from the upper end of the case, and higher than the bottom of the case as the housing space. An electronic apparatus comprising: a tapered second stepped portion that communicates with a space and narrows from the inside to the outside of the storage space.

The electronic device according to claim 1, wherein a positioning portion that positions the circuit board is provided in the case.