JPH11103178A - Board holding structure in vehicle mounted electronic controller - Google Patents

Board holding structure in vehicle mounted electronic controller

Info

Publication number
JPH11103178A
JPH11103178A JP26236197A JP26236197A JPH11103178A JP H11103178 A JPH11103178 A JP H11103178A JP 26236197 A JP26236197 A JP 26236197A JP 26236197 A JP26236197 A JP 26236197A JP H11103178 A JPH11103178 A JP H11103178A
Authority
JP
Japan
Prior art keywords
substrate
resin
housing
electronic control
control device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26236197A
Other languages
Japanese (ja)
Inventor
Toru Takase
徹 高瀬
Original Assignee
Keihin Corp
株式会社ケーヒン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Keihin Corp, 株式会社ケーヒン filed Critical Keihin Corp
Priority to JP26236197A priority Critical patent/JPH11103178A/en
Publication of JPH11103178A publication Critical patent/JPH11103178A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components

Abstract

(57) Abstract: To avoid generation of bubbles in a flowing resin which occurs during a manufacturing process of an electronic control device having a resin-embedded substrate. SOLUTION: A substrate on which an electronic component is mounted, a housing having an opening through which the substrate can pass and holding the substrate, and a resin which fills the housing in a fluid state and then hardens and embeds the substrate In the board structure of the electronic control device, at least one of a cutout portion and a through-opening for venting air bubbles of the flowing resin and passing the flowing resin is provided in a non-existent area of the wiring pattern of the board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board structure for holding a board inside an electronic control unit housing mounted on a vehicle such as an automobile.

[0002]

2. Description of the Related Art An electronic control device used for electronic control of an engine, a transmission, and the like mounted on a vehicle such as a ship, for example, may require waterproofness or the like depending on the installation site. is there. Such a control device fixes a substrate on which components such as electronic components are mounted in its housing, and fills the housing with a liquid or fluid resin for water resistance or the like, cures the resin, and cures the substrate. Embedded to improve waterproofing.

[0003]

However, in the resin filling step in the manufacturing process of the electronic control unit, bubbles formed between the housing and the substrate are difficult to escape and may remain in the resin after the resin filling. Therefore, a defoaming step for removing the air bubbles is required. Due to the defoaming step when there are residual bubbles in the resin, the number of manufacturing steps of the electronic control device increases, and furthermore, the space between the housing and the control board is increased overall to improve the flowability of the filled resin. Therefore, the size of the finished product tends to increase.

According to the present invention, when a casing of an electronic control unit is filled with a liquid or fluid resin, a fluid resin is easily injected between the casing and the control board, and the resin is left on the rear face of the control board. It is intended to make it easy to remove air bubbles that tend to occur.

[0005]

According to the present invention, there is provided a board holding structure in a vehicle-mounted electronic control device, comprising: a board on which electronic components are mounted; and a housing having an opening through which the board can pass and holding the board. And a cured resin filled in the housing to embed the substrate, wherein the substrate has at least one of a notch and a through-opening for ventilation and passage of a fluid resin. It is characterized by having.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a planar shape of a substantially rectangular substrate embedded in a resin in a hollow substantially rectangular parallelepiped control device housing 10. FIG. 1A shows a substrate 11 having a cut-out portion 1 having a through opening a substantially in the center and obliquely cutting the four corners in a straight line, and FIG. FIG. 1C shows a substrate 11 having cutouts 2 cut at four corners by a curve having a center of curvature, and FIG. 1C shows a cutout cut at four corners by a curve having a through opening a substantially at the center and having a center of curvature outside. 1 (d) shows a substrate 11 having four through openings a substantially in the vicinity of the center and having notches 1 obliquely cut at four corners.
In addition, as shown in FIG. 1A, the notch is a portion having a distance L larger than the average distance G of the gap from the inner wall of the housing 10 to the substrate 11, and is not limited to a straight line or an arc. It may be defined by a line. Further, it is preferable that the cutouts be provided at all four corners, but the cutouts may be provided at one corner of the substrate as long as the flow of the flowable resin and the passage of the flowable resin are sufficient. The shape of the through-opening is not limited to a circle, but may be a polygon, a rectangle, an ellipse, or other closed line. The number and positions of the through openings are not limited to one or four, and need not be at the center of the substrate. In any case, the control board shape can be defined without significantly affecting the shape and number of mounted electronic components and the wiring pattern. Even if the housing is a rectangular parallelepiped or a polyhedron, the entire shape of the substrate is contoured to the shape in one cross section, and a predetermined clearance, that is, a gap is maintained and defined. For the passage of the resin itself, at least one of the above notches and through openings
One may be formed.

Therefore, in the same board 10 as above, a board 11 having a cutout 4 extending from a corner to a substantially center from a corner as shown in FIG. 2A, and a fluid resin as shown in FIG. Substrate 11 having a slit opening 5 in consideration of the position of the injection nozzle 13 and the flow direction 15 of
As shown in FIG. 2C, the substrate 11 may have the notch 6 at the side edge instead of the corner of the substrate. As described above, by providing the through-opening inside the substrate and providing the notch on the peripheral edge, the resin injecting property and the defoaming property can be improved.

In this embodiment, without changing the basic clearance between the housing and the substrate, the four corners of the substrate are cut obliquely to partially secure the clearance, and the resin can be easily injected from that portion. , So that the bubbles can escape by themselves. In addition, a through hole is provided in the center of the substrate where the remaining air bubbles are least likely to escape, so that the air bubbles can easily escape, and the state of the resin near the center of the substrate can be visually checked.

It is desirable that the notch or the through-opening be provided in a portion of the substrate where no circuit wiring pattern exists, that is, in a region where no wiring pattern exists. In this case, it goes without saying that the design of the circuit wiring pattern should also be considered. No.
An example of an assembling method of the electronic control device will be described. First, FIG.
As shown in (1), a housing 10 whose inside is cleaned is prepared.
This housing has all the wall openings sealed for a connector for electrical connection to the internal substrate. Next, as shown in FIG. 4, the substrate 11 is placed on a substrate holding portion provided at the lower edge of the inner wall of the housing, and is substantially parallel to the bottom wall of the housing. Then, the substrate is fixed to the holder by screwing or the like.

Next, as shown in FIG. 5, while maintaining the casing 10 preferably in a horizontal state, the nozzle 13 of the synthetic resin injection device is moved from the substrate notch 1 at the corner of the inner wall of the casing to the vicinity of the bottom of the casing. And a flowable curable synthetic resin 20, such as an epoxy resin, is injected. Thereafter, as shown in FIG. 6, resin injection is continued until the substrate 11 is buried in the synthetic resin 20. At this time, the injection speed is set so that the flow does not involve air. That is, it is desirable that the tip of the nozzle be present in the resin, but it is not necessary that the tip be present in the resin. The air bubbles 30 trapped in the resin escape from the through holes a and the four corner cutouts 1 and float.

After the epoxy resin in the casing 10 reaches a predetermined amount, the injection is terminated, and as shown in FIG. 7, the epoxy resin is left for a predetermined time or more to cure. The electronic control device is completed as described above.

[0012]

According to the present invention, a substrate on which electronic components are mounted, a housing having an opening through which the substrate can pass and holding the substrate, a curable resin filling the interior of the housing, A substrate holding structure for an electronic control device, comprising: providing at least one of a cutout portion and a through opening for venting air bubbles of the fluidized resin and passing the fluidized resin on the substrate, so that the cured resin There is no danger of bubbles remaining inside, and aging due to the remaining bubbles can be avoided, and the defoaming step is reduced, workability is improved, and cost reduction is achieved.

[Brief description of the drawings]

FIG. 1 is a plan view of a housing for an electronic control device and a control board thereof.

FIG. 2 is a plan view of a housing for an electronic control device and a control board thereof.

FIG. 3 is a cross-sectional view of a housing and a control board during an assembly process of the electronic control device.

FIG. 4 is a sectional view of a housing and a control board during an assembly process of the electronic control device.

FIG. 5 is a sectional view of a housing and a control board during an assembly process of the electronic control device.

FIG. 6 is a sectional view of a housing and a control board during an assembly process of the electronic control device.

FIG. 7 is a cross-sectional view of a housing and a control board during an assembly process of the electronic control device.

[Explanation of symbols]

 a Through-opening 1, 2, 3, 4, 6 Notch 5 Slit opening 10 Housing for electronic control device 11 Substrate for electronic control device 13 Fluid resin injection nozzle 15 Resin flow direction 20 Curable synthetic resin 30 Bubbles

Claims (1)

    [Claims]
  1. A substrate having an electronic component mounted thereon, a housing having an opening through which the substrate can pass and holding the substrate;
    A cured resin filled in the housing to embed the substrate, wherein the substrate has at least one of a cutout and a through-opening for ventilation and passage of the fluid resin. A substrate holding structure, characterized in that:
JP26236197A 1997-09-26 1997-09-26 Board holding structure in vehicle mounted electronic controller Pending JPH11103178A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26236197A JPH11103178A (en) 1997-09-26 1997-09-26 Board holding structure in vehicle mounted electronic controller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26236197A JPH11103178A (en) 1997-09-26 1997-09-26 Board holding structure in vehicle mounted electronic controller

Publications (1)

Publication Number Publication Date
JPH11103178A true JPH11103178A (en) 1999-04-13

Family

ID=17374680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26236197A Pending JPH11103178A (en) 1997-09-26 1997-09-26 Board holding structure in vehicle mounted electronic controller

Country Status (1)

Country Link
JP (1) JPH11103178A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006328993A (en) * 2005-05-24 2006-12-07 Kokusan Denki Co Ltd Waterproof electronic circuit unit
WO2007139129A1 (en) * 2006-06-01 2007-12-06 Panasonic Corporation Brushless motor for washing machine and washing machine having the brushless motor mounted therein
JP2009222729A (en) * 2009-07-09 2009-10-01 Yazaki Corp Current sensor
JP2009277881A (en) * 2008-05-14 2009-11-26 Shindengen Electric Mfg Co Ltd Electronic apparatus, and method of manufacturing the same
JP2010056351A (en) * 2008-08-29 2010-03-11 Nippon Seiki Co Ltd Electronic device
JP2012028218A (en) * 2010-07-26 2012-02-09 Panasonic Electric Works Co Ltd Discharge lamp lighting-up device and lighting fixture equipped with the same
JP2012151223A (en) * 2011-01-18 2012-08-09 Shindengen Electric Mfg Co Ltd Housing case, electronic component module, and electronic apparatus
JP2015061407A (en) * 2013-09-19 2015-03-30 株式会社デンソー Rotary electric machine for vehicle

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006328993A (en) * 2005-05-24 2006-12-07 Kokusan Denki Co Ltd Waterproof electronic circuit unit
WO2007139129A1 (en) * 2006-06-01 2007-12-06 Panasonic Corporation Brushless motor for washing machine and washing machine having the brushless motor mounted therein
EP2012572A1 (en) * 2006-06-01 2009-01-07 Panasonic Corporation Brushless motor for washing machine and washing machine having the brushless motor mounted therein
US8269380B2 (en) 2006-06-01 2012-09-18 Panasonic Corporation Brushless motor for washing machine having stress reduction on sensor casing and washing machine having the brushless motor mounted therein
EP2012572A4 (en) * 2006-06-01 2015-04-29 Panasonic Corp Brushless motor for washing machine and washing machine having the brushless motor mounted therein
JP4821852B2 (en) * 2006-06-01 2011-11-24 パナソニック株式会社 Brushless motor for washing machine and washing machine equipped with the same
JP2009277881A (en) * 2008-05-14 2009-11-26 Shindengen Electric Mfg Co Ltd Electronic apparatus, and method of manufacturing the same
JP2010056351A (en) * 2008-08-29 2010-03-11 Nippon Seiki Co Ltd Electronic device
JP2009222729A (en) * 2009-07-09 2009-10-01 Yazaki Corp Current sensor
JP2012028218A (en) * 2010-07-26 2012-02-09 Panasonic Electric Works Co Ltd Discharge lamp lighting-up device and lighting fixture equipped with the same
JP2012151223A (en) * 2011-01-18 2012-08-09 Shindengen Electric Mfg Co Ltd Housing case, electronic component module, and electronic apparatus
JP2015061407A (en) * 2013-09-19 2015-03-30 株式会社デンソー Rotary electric machine for vehicle

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