JPH06509389A - 金属蒸着法 - Google Patents
金属蒸着法Info
- Publication number
- JPH06509389A JPH06509389A JP5503263A JP50326393A JPH06509389A JP H06509389 A JPH06509389 A JP H06509389A JP 5503263 A JP5503263 A JP 5503263A JP 50326393 A JP50326393 A JP 50326393A JP H06509389 A JPH06509389 A JP H06509389A
- Authority
- JP
- Japan
- Prior art keywords
- precursor
- liquid
- carrier gas
- tmi
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/301—AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
- C23C16/4482—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material by bubbling of carrier gas through liquid source material
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (23)
- 1.金属前駆体を源とする金属を好適な基板上に蒸着するために搬送ガスを介し て前記前駆体から蒸発した前躯体物質を前記基板に輸送することを含む方法にお いて、一定の温度では通常固体である前記前駆体を含む液体中に流通させること により前記温度で前記搬送ガスに前記前駆体物質を同伴させることを特徴とする 方法。
- 2.前記前駆体が前記液体と接触している請求項1に記載の方法。
- 3.前記前駆体が前記液体中に融解している請求項1または2に記載の方法。
- 4.前記液体が、前駆体の蒸気圧に比べて相対的に低い蒸気圧を有している請求 項1から3のいずれか一項に記載の方法。
- 5.前記蒸気圧が前駆体の蒸気圧より少なくとも1次数小さい大きさである請求 項4に記載の方法。
- 6.前記液体が前記前駆体で飽和している請求項1から5のいずれか一項に記載 の方法。
- 7.前記流通の間に初期に存在する前記前駆体の実質的な量が溶解されないまま 残留している請求項1から6のいずれか一項に記載の方法。
- 8.前記流通の間に前記液体の多くて50重量パーセントが蒸発する請求項1か ら7のいずれか一項に記載の方法。
- 9.前記方法が有機金属化学蒸着(MOCVD)法で適用される請求項1から8 のいずれか一項に記載の方法。
- 10.前記液体が泡箱容器内に含まれている請求項1から9のいずれか一項に記 載の方法。
- 11.前記搬送ガスを浸せき管を介して供給し、前記浸せき管が液体面以下に伸 張するように前記液体を供給する請求項1から10のいずれか一項に記載の方法 。
- 12.前記温度が周囲温度である請求項1に記載の方法。
- 13.前駆体がトリメチルインジウムである請求項1から12のいずれか一項に 記載の方法。
- 14.液体が周囲温度以下の融点と少なくとも150℃の沸点とを有している炭 化水素である請求項1から13のいずれか一項に記載の方法。
- 15.液体が少なくとも200℃の沸点を有している請求項14に記載の方法。
- 16.液体が少なくとも12個の炭素原子を含む直鎖もしくは分岐脂肪族または 芳香族炭化水素である請求項14に記載の方法。
- 17.液体がヘキサデカンである請求項14に記載の方法。
- 18.液体がルイス塩基の添加によって形成される請求項1から13のいずれか 一項に記載の方法。
- 19.ルイス塩基がN,N−ジメチルドデシルアミンである請求項18に記載の 方法。
- 20.ルイス塩基が1,3,5−トリエチルヘキサヒドロ−13,5−トリアジ ンである請求項18に記載の方法。
- 21.ルイス塩基がテトラグリムである請求項18に記載の方法。
- 22.ほぼ実施例1から4を参照した説明に記載されているように、好適な基板 上に金属前駆体を蒸着するための方法。
- 23.請求項1から22のいずれか一項に記載の方法を使用することによって得 られた少なくとも一つの層を含む層配置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB919116381A GB9116381D0 (en) | 1991-07-30 | 1991-07-30 | Method for deposition of a metal |
GB9116381.6 | 1991-07-30 | ||
PCT/EP1992/001744 WO1993003196A1 (en) | 1991-07-30 | 1992-07-28 | Method for deposition of a metal |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06509389A true JPH06509389A (ja) | 1994-10-20 |
JP3347327B2 JP3347327B2 (ja) | 2002-11-20 |
Family
ID=10699189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50326393A Expired - Lifetime JP3347327B2 (ja) | 1991-07-30 | 1992-07-28 | 金属蒸着法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5232869A (ja) |
JP (1) | JP3347327B2 (ja) |
AU (1) | AU2387192A (ja) |
GB (1) | GB9116381D0 (ja) |
TW (1) | TW227624B (ja) |
WO (1) | WO1993003196A1 (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1994021840A1 (en) * | 1993-03-18 | 1994-09-29 | Advanced Technology Materials, Inc. | Apparatus and method for delivering reagents in vapor form to a cvd reactor |
US5502227A (en) * | 1993-07-27 | 1996-03-26 | Cvd, Incorporated | Liquid indium source |
US5389396A (en) * | 1993-08-11 | 1995-02-14 | Northwestern University | InGaAsP/GaAs diode laser |
US5492724A (en) * | 1994-02-22 | 1996-02-20 | Osram Sylvania Inc. | Method for the controlled delivery of vaporized chemical precursor to an LPCVD reactor |
US5410178A (en) * | 1994-08-22 | 1995-04-25 | Northwestern University | Semiconductor films |
US5668395A (en) * | 1994-11-22 | 1997-09-16 | Northwestern University | Composition for InSB and GaAs thin film on silicon substrate for use in photodetectors |
US5650635A (en) * | 1995-07-14 | 1997-07-22 | Northwestern University | Multiple stacked Sb-based heterostructures |
US6130160A (en) * | 1996-10-02 | 2000-10-10 | Micron Technology, Inc. | Methods, complexes and system for forming metal-containing films |
US6066204A (en) * | 1997-01-08 | 2000-05-23 | Bandwidth Semiconductor, Llc | High pressure MOCVD reactor system |
US6001722A (en) * | 1997-06-20 | 1999-12-14 | Motorola, Inc. | Selective metallization/deposition for semiconductor devices |
DE1001049T1 (de) * | 1998-11-13 | 2000-11-02 | Epichem Ltd | Verfahren zur Reinigung von organometallischen Verbindungen |
US6984415B2 (en) * | 1999-08-20 | 2006-01-10 | International Business Machines Corporation | Delivery systems for gases for gases via the sublimation of solid precursors |
US6998152B2 (en) * | 1999-12-20 | 2006-02-14 | Micron Technology, Inc. | Chemical vapor deposition methods utilizing ionic liquids |
EP1160355B1 (en) * | 2000-05-31 | 2004-10-27 | Shipley Company LLC | Bubbler |
GB0017968D0 (en) * | 2000-07-22 | 2000-09-13 | Epichem Ltd | An improved process and apparatus for the isolation of pure,or substantially pure,organometallic compounds |
UA86810C2 (ru) * | 2004-05-20 | 2009-05-25 | Акцо Нобель Н.В. | Барботер для обеспечения испарения вещества в процессе химического осаждения из паровой фазы |
US20070175392A1 (en) * | 2006-01-27 | 2007-08-02 | American Air Liquide, Inc. | Multiple precursor dispensing apparatus |
US20070194470A1 (en) * | 2006-02-17 | 2007-08-23 | Aviza Technology, Inc. | Direct liquid injector device |
US9109287B2 (en) * | 2006-10-19 | 2015-08-18 | Air Products And Chemicals, Inc. | Solid source container with inlet plenum |
US9834860B2 (en) * | 2009-10-14 | 2017-12-05 | Alta Devices, Inc. | Method of high growth rate deposition for group III/V materials |
US20190272994A1 (en) * | 2009-10-14 | 2019-09-05 | Alta Devices, Inc. | High growth rate deposition for group iii/v materials |
US11393683B2 (en) * | 2009-10-14 | 2022-07-19 | Utica Leaseco, Llc | Methods for high growth rate deposition for forming different cells on a wafer |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4066481A (en) * | 1974-11-11 | 1978-01-03 | Rockwell International Corporation | Metalorganic chemical vapor deposition of IVA-IVA compounds and composite |
FR2419585A1 (fr) * | 1978-03-07 | 1979-10-05 | Thomson Csf | Procede d'obtention en phase gazeuse d'une couche epitaxiale de phosphure d'indium, et appareil d'application de ce procede |
US4297150A (en) * | 1979-07-07 | 1981-10-27 | The British Petroleum Company Limited | Protective metal oxide films on metal or alloy substrate surfaces susceptible to coking, corrosion or catalytic activity |
US4594173A (en) * | 1984-04-19 | 1986-06-10 | Westinghouse Electric Corp. | Indium doped gallium arsenide crystals and method of preparation |
JPS6311598A (ja) * | 1986-07-03 | 1988-01-19 | Toyo Sutoufuaa Chem:Kk | 有機金属気相成長用シリンダ− |
-
1991
- 1991-07-30 GB GB919116381A patent/GB9116381D0/en active Pending
-
1992
- 1992-07-15 TW TW081105591A patent/TW227624B/zh not_active IP Right Cessation
- 1992-07-28 WO PCT/EP1992/001744 patent/WO1993003196A1/en active Application Filing
- 1992-07-28 AU AU23871/92A patent/AU2387192A/en not_active Abandoned
- 1992-07-28 US US07/920,735 patent/US5232869A/en not_active Expired - Lifetime
- 1992-07-28 JP JP50326393A patent/JP3347327B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
GB9116381D0 (en) | 1991-09-11 |
WO1993003196A1 (en) | 1993-02-18 |
US5232869A (en) | 1993-08-03 |
AU2387192A (en) | 1993-03-02 |
TW227624B (ja) | 1994-08-01 |
JP3347327B2 (ja) | 2002-11-20 |
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