JPH06507275A - 薄膜法を用いた多層成形プラスチックパッケージ - Google Patents

薄膜法を用いた多層成形プラスチックパッケージ

Info

Publication number
JPH06507275A
JPH06507275A JP5514358A JP51435893A JPH06507275A JP H06507275 A JPH06507275 A JP H06507275A JP 5514358 A JP5514358 A JP 5514358A JP 51435893 A JP51435893 A JP 51435893A JP H06507275 A JPH06507275 A JP H06507275A
Authority
JP
Japan
Prior art keywords
layer
conductive
lead frame
integrated circuit
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5514358A
Other languages
English (en)
Japanese (ja)
Inventor
バッタチャリヤ　ビデュト　ケー
マリク　デベンドラ
俊祐 坂
貴稔 瀧川
山中　正策
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Intel Corp
Original Assignee
Sumitomo Electric Industries Ltd
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd, Intel Corp filed Critical Sumitomo Electric Industries Ltd
Publication of JPH06507275A publication Critical patent/JPH06507275A/ja
Pending legal-status Critical Current

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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Physical Vapour Deposition (AREA)
JP5514358A 1992-02-18 1993-02-18 薄膜法を用いた多層成形プラスチックパッケージ Pending JPH06507275A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US83728592A 1992-02-18 1992-02-18
US07/837.285 1992-02-18
PCT/US1993/001481 WO1993016492A1 (en) 1992-02-18 1993-02-18 Advance multilayer molded plastic package using mesic technology

Publications (1)

Publication Number Publication Date
JPH06507275A true JPH06507275A (ja) 1994-08-11

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JP5514358A Pending JPH06507275A (ja) 1992-02-18 1993-02-18 薄膜法を用いた多層成形プラスチックパッケージ
JP5051328A Pending JPH0629452A (ja) 1992-02-18 1993-02-18 集積回路パッケージ及びその製造方法

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US (2) US5556807A (enExample)
EP (2) EP0603158A3 (enExample)
JP (2) JPH06507275A (enExample)
CA (2) CA2108542A1 (enExample)
WO (1) WO1993016492A1 (enExample)

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Also Published As

Publication number Publication date
JPH0629452A (ja) 1994-02-04
US5488257A (en) 1996-01-30
EP0580855A4 (enExample) 1994-03-16
EP0603158A3 (en) 1994-07-13
EP0580855A1 (en) 1994-02-02
US5556807A (en) 1996-09-17
CA2108542A1 (en) 1993-08-19
WO1993016492A1 (en) 1993-08-19
CA2120464A1 (en) 1993-08-19
EP0603158A2 (en) 1994-06-22

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