JPH0648902Y2 - 金属基板のフレームグランド構造 - Google Patents

金属基板のフレームグランド構造

Info

Publication number
JPH0648902Y2
JPH0648902Y2 JP1988123857U JP12385788U JPH0648902Y2 JP H0648902 Y2 JPH0648902 Y2 JP H0648902Y2 JP 1988123857 U JP1988123857 U JP 1988123857U JP 12385788 U JP12385788 U JP 12385788U JP H0648902 Y2 JPH0648902 Y2 JP H0648902Y2
Authority
JP
Japan
Prior art keywords
spacer
metal substrate
frame ground
ground structure
circuit pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988123857U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0244370U (US06174465-20010116-C00003.png
Inventor
耕一 吉田
正実 大山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP1988123857U priority Critical patent/JPH0648902Y2/ja
Publication of JPH0244370U publication Critical patent/JPH0244370U/ja
Application granted granted Critical
Publication of JPH0648902Y2 publication Critical patent/JPH0648902Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
JP1988123857U 1988-09-20 1988-09-20 金属基板のフレームグランド構造 Expired - Lifetime JPH0648902Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988123857U JPH0648902Y2 (ja) 1988-09-20 1988-09-20 金属基板のフレームグランド構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988123857U JPH0648902Y2 (ja) 1988-09-20 1988-09-20 金属基板のフレームグランド構造

Publications (2)

Publication Number Publication Date
JPH0244370U JPH0244370U (US06174465-20010116-C00003.png) 1990-03-27
JPH0648902Y2 true JPH0648902Y2 (ja) 1994-12-12

Family

ID=31373092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988123857U Expired - Lifetime JPH0648902Y2 (ja) 1988-09-20 1988-09-20 金属基板のフレームグランド構造

Country Status (1)

Country Link
JP (1) JPH0648902Y2 (US06174465-20010116-C00003.png)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4969318B2 (ja) * 2007-05-24 2012-07-04 Ｔｄｋラムダ株式会社 部品実装体及び部品実装体の製造方法
JP5158568B2 (ja) * 2008-04-25 2013-03-06 Ｔｄｋラムダ株式会社 メタルコア基板の導通構造

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4967948U (US06174465-20010116-C00003.png) * 1972-09-26 1974-06-13
JPS5461256U (US06174465-20010116-C00003.png) * 1977-10-07 1979-04-27
JPS6136558Y2 (US06174465-20010116-C00003.png) * 1980-05-29 1986-10-23
JPS5749432U (US06174465-20010116-C00003.png) * 1980-09-04 1982-03-19
JPS6024241Y2 (ja) * 1980-09-11 1985-07-19 三洋電機株式会社 ヘアドライヤ−
JPS5836619U (ja) * 1981-09-04 1983-03-10 ポツプリベツト・フアスナ−株式会社 ブラインドナツト
JPS58138368U (ja) * 1982-03-13 1983-09-17 株式会社フジクラ ほうろう基板
JPS59146607U (ja) * 1983-01-19 1984-10-01 ポツプリベツト・フアスナ−株式会社 ブラインドナツト
JPS6147243A (ja) * 1984-08-11 1986-03-07 松下電工株式会社 金属ベ−ス積層板
JPS6335809U (US06174465-20010116-C00003.png) * 1986-08-22 1988-03-08
JPS6377188A (ja) * 1986-09-19 1988-04-07 松下電工株式会社 金属ベ−スプリント配線板

Also Published As

Publication number Publication date
JPH0244370U (US06174465-20010116-C00003.png) 1990-03-27

Similar Documents

Publication Publication Date Title
US5779134A (en) Method for surface mounting a heatsink to a printed circuit board
JP3502776B2 (ja) バンプ付き金属箔及び回路基板及びこれを用いた半導体装置
JP2001189416A (ja) パワーモジュール
US6657866B2 (en) Electronics assembly with improved heatsink configuration
JPH0648902Y2 (ja) 金属基板のフレームグランド構造
JP3549316B2 (ja) 配線基板
JPH081371U (ja) 金属基板
JP2779537B2 (ja) フィン付き電子部品搭載用基板
JPH08331865A (ja) インバータ装置
JPH0593075U (ja) 電気部品の取付け構造
JP2809316B2 (ja) 電子部品搭載用基板
JP2000244080A (ja) プリント配線板
JP2574913Y2 (ja) 回路基板締結機構
JPH0341473Y2 (US06174465-20010116-C00003.png)
JP2706435B2 (ja) 回路基板
JP2544126Y2 (ja) 可撓性回路基板の接続構造
JPS6240754A (ja) ピングリッドアレイ
JPH0590984U (ja) 印刷回路基板
JPH03227094A (ja) 大電流プリント配線板
JP2834821B2 (ja) 電子部品搭載用基板
JPH0644141Y2 (ja) 基板接続装置
JPH09289370A (ja) プリント配線板と金属部品との接続構造
JPH0536872A (ja) 混成集積回路
JPH0818192A (ja) プリント基板の接続構造
JPH065752A (ja) 半導体装置