JPH0648836Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPH0648836Y2 JPH0648836Y2 JP1988133978U JP13397888U JPH0648836Y2 JP H0648836 Y2 JPH0648836 Y2 JP H0648836Y2 JP 1988133978 U JP1988133978 U JP 1988133978U JP 13397888 U JP13397888 U JP 13397888U JP H0648836 Y2 JPH0648836 Y2 JP H0648836Y2
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- semiconductor device
- film
- substrate
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 21
- 230000001681 protective effect Effects 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 13
- 229920002379 silicone rubber Polymers 0.000 description 11
- 239000004945 silicone rubber Substances 0.000 description 10
- 230000035882 stress Effects 0.000 description 9
- 239000002585 base Substances 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 239000003513 alkali Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000010073 coating (rubber) Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005247 gettering Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000000391 smoking effect Effects 0.000 description 1
Landscapes
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988133978U JPH0648836Y2 (ja) | 1988-10-13 | 1988-10-13 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988133978U JPH0648836Y2 (ja) | 1988-10-13 | 1988-10-13 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0254231U JPH0254231U (enrdf_load_stackoverflow) | 1990-04-19 |
| JPH0648836Y2 true JPH0648836Y2 (ja) | 1994-12-12 |
Family
ID=31392339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988133978U Expired - Lifetime JPH0648836Y2 (ja) | 1988-10-13 | 1988-10-13 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648836Y2 (enrdf_load_stackoverflow) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5662327A (en) * | 1979-10-26 | 1981-05-28 | Hitachi Ltd | Semiconductor device |
| JPS5740935A (en) * | 1980-08-25 | 1982-03-06 | Fujitsu Ltd | Semiconductor device |
| JPS58206144A (ja) * | 1982-05-26 | 1983-12-01 | Hitachi Ltd | 半導体装置の製造方法 |
-
1988
- 1988-10-13 JP JP1988133978U patent/JPH0648836Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0254231U (enrdf_load_stackoverflow) | 1990-04-19 |
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