JPH0644600B2 - 半導体組立ユニット - Google Patents
半導体組立ユニットInfo
- Publication number
- JPH0644600B2 JPH0644600B2 JP62319094A JP31909487A JPH0644600B2 JP H0644600 B2 JPH0644600 B2 JP H0644600B2 JP 62319094 A JP62319094 A JP 62319094A JP 31909487 A JP31909487 A JP 31909487A JP H0644600 B2 JPH0644600 B2 JP H0644600B2
- Authority
- JP
- Japan
- Prior art keywords
- assembly unit
- housing
- semiconductor
- current terminal
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W78/00—
-
- H10W90/00—
Landscapes
- Die Bonding (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19863643288 DE3643288A1 (de) | 1986-12-18 | 1986-12-18 | Halbleiterbaueinheit |
| DE3643288.1 | 1986-12-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63240056A JPS63240056A (ja) | 1988-10-05 |
| JPH0644600B2 true JPH0644600B2 (ja) | 1994-06-08 |
Family
ID=6316501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62319094A Expired - Lifetime JPH0644600B2 (ja) | 1986-12-18 | 1987-12-18 | 半導体組立ユニット |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH0644600B2 (cg-RX-API-DMAC10.html) |
| DE (1) | DE3643288A1 (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013500555A (ja) * | 2009-07-25 | 2013-01-07 | ツェーデニック、イノベイティブ、メタル‐ウント、クンストシュトフテヒニック、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツング | 相互に連結されたセルの末端連結部に電気伝導体を連結するための装置 |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3930858C2 (de) * | 1988-09-20 | 2002-01-03 | Peter H Maier | Modulaufbau |
| DE3837974A1 (de) * | 1988-11-09 | 1990-05-10 | Telefunken Electronic Gmbh | Elektronisches steuergeraet |
| DE4009289A1 (de) * | 1990-03-22 | 1991-09-26 | Siemens Ag | Elektronisches einschubteil zum einschieben in den rahmen eines schaltschrankes |
| US5316831A (en) * | 1991-05-08 | 1994-05-31 | Fuji Electric Co., Ltd. | Metallic printed board |
| DE4131200C2 (de) * | 1991-09-19 | 1995-05-11 | Export Contor Ausenhandelsgese | Schaltungsanordnung |
| DE4237632A1 (de) * | 1992-11-07 | 1994-05-11 | Export Contor Ausenhandelsgese | Schaltungsanordnung |
| DE19523010A1 (de) * | 1995-04-25 | 1996-11-07 | Duerrwaechter E Dr Doduco | Schaltungsanordnung aus einem Leistungshalbleiter und einer Ansteuerschaltung dafür |
| DE19529237C1 (de) * | 1995-08-09 | 1996-08-29 | Semikron Elektronik Gmbh | Schaltungsanordnung |
| DE19703329A1 (de) * | 1997-01-30 | 1998-08-06 | Asea Brown Boveri | Leistungshalbleitermodul |
| US6020750A (en) * | 1997-06-26 | 2000-02-01 | International Business Machines Corporation | Wafer test and burn-in platform using ceramic tile supports |
| DE19942770A1 (de) * | 1999-09-08 | 2001-03-15 | Ixys Semiconductor Gmbh | Leistungshalbleiter-Modul |
| DE10024377B4 (de) * | 2000-05-17 | 2006-08-17 | Infineon Technologies Ag | Gehäuseeinrichtung und darin zu verwendendes Kontaktelement |
| DE10142614A1 (de) | 2001-08-31 | 2003-04-03 | Siemens Ag | Leistungselektronikeinheit |
| JP2004088989A (ja) * | 2002-07-03 | 2004-03-18 | Auto Network Gijutsu Kenkyusho:Kk | 電力回路部の防水方法 |
| WO2007025489A1 (de) * | 2005-08-26 | 2007-03-08 | Siemens Aktiengesellschaft | Leistungshalbleitermodul mit auf schaltungsträger aufgebrachten lastanschlusselementen |
| DE102006006175A1 (de) | 2006-02-10 | 2007-08-23 | Ecpe Engineering Center For Power Electronics Gmbh | Leistungselektronikanordnung |
| DE102006006424B4 (de) * | 2006-02-13 | 2011-11-17 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit mindestens einem Leistungshalbleitermodul und einem Kühlbauteil und zugehöriges Herstellungsverfahren |
| DE102006037159B4 (de) * | 2006-08-02 | 2012-03-29 | Oechsler Ag | Komponententräger und Verfahren zum Herstellen einer elektrischen Baugruppe durch Verdrahten ihrer Komponenten |
| JP2008227131A (ja) * | 2007-03-13 | 2008-09-25 | Renesas Technology Corp | 半導体装置及びその製造方法 |
| CN101681907B (zh) * | 2007-11-30 | 2012-11-07 | 松下电器产业株式会社 | 散热结构体基板和使用其的模块及散热结构体基板的制造方法 |
| JP4798170B2 (ja) * | 2008-05-13 | 2011-10-19 | 株式会社豊田自動織機 | 半導体装置 |
| DE102009002191B4 (de) | 2009-04-03 | 2012-07-12 | Infineon Technologies Ag | Leistungshalbleitermodul, Leistungshalbleitermodulanordnung und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung |
| DE102010010926A1 (de) * | 2010-03-10 | 2011-09-15 | Knorr-Bremse Systeme für Nutzfahrzeuge GmbH | Verbindungseinrichtung zum Verbinden einer elektronischen Komponente mit einem Gehäuseteil und elektronisches Steuergerät |
| JP5939041B2 (ja) | 2012-06-01 | 2016-06-22 | 住友電気工業株式会社 | 半導体モジュール及び半導体モジュールの製造方法 |
| DE102014225270A1 (de) * | 2014-12-09 | 2016-06-09 | Gebr. Schmid Gmbh | Kontaktrahmen für elektrochemische Substratbeschichtung |
| WO2018100600A1 (ja) * | 2016-11-29 | 2018-06-07 | 三菱電機株式会社 | 半導体装置、制御装置および半導体装置の製造方法 |
| JP7110599B2 (ja) * | 2018-01-17 | 2022-08-02 | 沖電気工業株式会社 | 電子機器 |
| JP7725396B6 (ja) * | 2022-03-15 | 2025-09-19 | 株式会社東芝 | 半導体装置 |
| DE102023116462A1 (de) | 2023-06-22 | 2024-12-24 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit Leitungskörper und Verfahren zu seiner Herstellung |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3005313C2 (de) * | 1980-02-13 | 1986-05-28 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleiteranordnung |
| DE3232184A1 (de) * | 1982-08-30 | 1984-03-01 | Siemens AG, 1000 Berlin und 8000 München | Leistungs-halbleiterelement |
| JPS5968958A (ja) * | 1982-10-12 | 1984-04-19 | Mitsubishi Electric Corp | ゲ−トタ−ンオフサイリスタ組立体 |
| DE3426291A1 (de) * | 1984-07-17 | 1986-01-30 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Halbleitervorrichtung |
| DE3508456C2 (de) * | 1985-03-09 | 1987-01-08 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungshalbleitermodul und Verfahren zur Herstellung eines solchen Moduls |
| JPS61218151A (ja) * | 1985-03-23 | 1986-09-27 | Hitachi Ltd | 半導体装置 |
-
1986
- 1986-12-18 DE DE19863643288 patent/DE3643288A1/de active Granted
-
1987
- 1987-12-18 JP JP62319094A patent/JPH0644600B2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013500555A (ja) * | 2009-07-25 | 2013-01-07 | ツェーデニック、イノベイティブ、メタル‐ウント、クンストシュトフテヒニック、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツング | 相互に連結されたセルの末端連結部に電気伝導体を連結するための装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3643288C2 (cg-RX-API-DMAC10.html) | 1993-04-22 |
| JPS63240056A (ja) | 1988-10-05 |
| DE3643288A1 (de) | 1988-06-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
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| R250 | Receipt of annual fees |
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| S533 | Written request for registration of change of name |
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| R250 | Receipt of annual fees |
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| R250 | Receipt of annual fees |
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| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
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