JPH0643143Y2 - 半導体ウエハと薄板を接着する接着剤の接着力制御装置 - Google Patents
半導体ウエハと薄板を接着する接着剤の接着力制御装置Info
- Publication number
- JPH0643143Y2 JPH0643143Y2 JP1985190304U JP19030485U JPH0643143Y2 JP H0643143 Y2 JPH0643143 Y2 JP H0643143Y2 JP 1985190304 U JP1985190304 U JP 1985190304U JP 19030485 U JP19030485 U JP 19030485U JP H0643143 Y2 JPH0643143 Y2 JP H0643143Y2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- container
- thin plate
- work
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 title claims description 47
- 230000001070 adhesive effect Effects 0.000 title claims description 46
- 239000004065 semiconductor Substances 0.000 title claims description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 14
- 239000001301 oxygen Substances 0.000 claims description 14
- 229910052760 oxygen Inorganic materials 0.000 claims description 14
- 229920003002 synthetic resin Polymers 0.000 claims description 6
- 239000000057 synthetic resin Substances 0.000 claims description 6
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 4
- 229910052753 mercury Inorganic materials 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 229910001873 dinitrogen Inorganic materials 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985190304U JPH0643143Y2 (ja) | 1985-12-12 | 1985-12-12 | 半導体ウエハと薄板を接着する接着剤の接着力制御装置 |
| PH34571A PH25206A (en) | 1985-12-12 | 1986-12-09 | Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
| DE8686117185T DE3686314T2 (de) | 1985-12-12 | 1986-12-10 | Vorrichtung zur bestimmung der haftkraefte eines klebstoffes zwischen einem halbleiter und seinem substrat. |
| EP86117185A EP0226949B1 (en) | 1985-12-12 | 1986-12-10 | Control apparatus for adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
| US06/940,328 US4718967A (en) | 1985-12-12 | 1986-12-11 | Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
| KR1019860010635A KR900004688B1 (ko) | 1985-12-12 | 1986-12-12 | 반도체 웨이퍼와 박판을 접착하는 접착제의 접착력 제어장치 |
| SG1063/92A SG106392G (en) | 1985-12-12 | 1992-10-13 | Control apparatus for adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985190304U JPH0643143Y2 (ja) | 1985-12-12 | 1985-12-12 | 半導体ウエハと薄板を接着する接着剤の接着力制御装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62101835U JPS62101835U (enExample) | 1987-06-29 |
| JPH0643143Y2 true JPH0643143Y2 (ja) | 1994-11-09 |
Family
ID=31143400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985190304U Expired - Lifetime JPH0643143Y2 (ja) | 1985-12-12 | 1985-12-12 | 半導体ウエハと薄板を接着する接着剤の接着力制御装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0643143Y2 (enExample) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5850164B2 (ja) * | 1977-04-01 | 1983-11-09 | 日立化成工業株式会社 | 表面保護方法 |
-
1985
- 1985-12-12 JP JP1985190304U patent/JPH0643143Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62101835U (enExample) | 1987-06-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0745556A (ja) | ダイシング装置 | |
| CN105895569B (zh) | 晶片处理系统 | |
| US5775510A (en) | UV light sensitive die-pac for securing semiconductor dice during transport | |
| JP5312997B2 (ja) | 紫外線照射装置 | |
| CN110064849B (zh) | 被加工物的加工方法、蚀刻装置和激光加工装置 | |
| KR20160070703A (ko) | 절삭 장치 | |
| CN102024733A (zh) | 搬送机构和加工装置 | |
| CN105633017B (zh) | 封装基板的分割方法 | |
| JPH0643143Y2 (ja) | 半導体ウエハと薄板を接着する接着剤の接着力制御装置 | |
| JP5993729B2 (ja) | パッケージ基板の分割方法 | |
| JP2001210701A (ja) | 半導体ウエハ保護用フィルムの貼付方法及びその装置 | |
| KR100849589B1 (ko) | 절삭장치 | |
| EP0226949B1 (en) | Control apparatus for adhesive force of adhesive agent adhering between semiconductor wafer and substrate | |
| JP2002299295A (ja) | 被加工物の加工方法 | |
| JP7245118B2 (ja) | 処理装置 | |
| JPH08288318A (ja) | ピックアップ方法および装置 | |
| JPH0543079Y2 (enExample) | ||
| JP7308621B2 (ja) | 搬送装置 | |
| KR20060044663A (ko) | 초박 칩의 제조 프로세스 및 제조장치 | |
| KR19980039731A (ko) | 반도체패키지용 웨이퍼 마운팅 방법 및 그 장치 | |
| KR100192389B1 (ko) | 웨이퍼 뒷면 연삭공정 후의 웨이퍼 전면 보호용 테이프 제거장치 | |
| JPH0325407Y2 (enExample) | ||
| KR20040037815A (ko) | 자외선 조사 및 다이 접착 장치 | |
| JP3170892B2 (ja) | 板状物のハンドリング方法 | |
| JPS63204624A (ja) | ペレツトマウント装置 |