JPH0543079Y2 - - Google Patents
Info
- Publication number
- JPH0543079Y2 JPH0543079Y2 JP1986168197U JP16819786U JPH0543079Y2 JP H0543079 Y2 JPH0543079 Y2 JP H0543079Y2 JP 1986168197 U JP1986168197 U JP 1986168197U JP 16819786 U JP16819786 U JP 16819786U JP H0543079 Y2 JPH0543079 Y2 JP H0543079Y2
- Authority
- JP
- Japan
- Prior art keywords
- container
- carry
- workpiece
- adhesive
- arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986168197U JPH0543079Y2 (enExample) | 1986-11-04 | 1986-11-04 | |
| PH34571A PH25206A (en) | 1985-12-12 | 1986-12-09 | Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
| DE8686117185T DE3686314T2 (de) | 1985-12-12 | 1986-12-10 | Vorrichtung zur bestimmung der haftkraefte eines klebstoffes zwischen einem halbleiter und seinem substrat. |
| EP86117185A EP0226949B1 (en) | 1985-12-12 | 1986-12-10 | Control apparatus for adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
| US06/940,328 US4718967A (en) | 1985-12-12 | 1986-12-11 | Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
| KR1019860010635A KR900004688B1 (ko) | 1985-12-12 | 1986-12-12 | 반도체 웨이퍼와 박판을 접착하는 접착제의 접착력 제어장치 |
| SG1063/92A SG106392G (en) | 1985-12-12 | 1992-10-13 | Control apparatus for adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986168197U JPH0543079Y2 (enExample) | 1986-11-04 | 1986-11-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6373337U JPS6373337U (enExample) | 1988-05-16 |
| JPH0543079Y2 true JPH0543079Y2 (enExample) | 1993-10-29 |
Family
ID=31100851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986168197U Expired - Lifetime JPH0543079Y2 (enExample) | 1985-12-12 | 1986-11-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543079Y2 (enExample) |
-
1986
- 1986-11-04 JP JP1986168197U patent/JPH0543079Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6373337U (enExample) | 1988-05-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101197254B (zh) | 基板粘合方法及采用该方法的装置 | |
| JPH0745556A (ja) | ダイシング装置 | |
| JP2000232080A (ja) | 被加工物の分割システム及びペレットの移し替え装置 | |
| JP5580066B2 (ja) | 切削装置 | |
| CN101840855B (zh) | 紫外线照射装置 | |
| CN102024733A (zh) | 搬送机构和加工装置 | |
| CN101556910B (zh) | 加工装置 | |
| KR100849589B1 (ko) | 절삭장치 | |
| JP3533632B2 (ja) | 半導体装置のリード切断装置およびリード加工装置 | |
| US4718967A (en) | Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate | |
| CN108735918A (zh) | 柔性设备的制造装置及制造方法 | |
| JP3273352B2 (ja) | 移動転写部を有するボンディング装置 | |
| KR100441128B1 (ko) | 반도체패키지용웨이퍼마운팅방법및그장치 | |
| JPH0643143Y2 (ja) | 半導体ウエハと薄板を接着する接着剤の接着力制御装置 | |
| JP5504022B2 (ja) | 分割加工方法及び分割装置 | |
| JP7308621B2 (ja) | 搬送装置 | |
| CN116038152A (zh) | 一种柔性屏幕的激光切割系统 | |
| JPH03124625A (ja) | 半導体ウエハ貼付け保持用リングフレームの搬送装置 | |
| CN116487317A (zh) | 板状物的支承装置 | |
| KR100199821B1 (ko) | 반도체패키지용 웨이퍼마운팅시스템의 얼라이먼트 | |
| JP4968849B2 (ja) | レーザ加工方法 | |
| KR100199827B1 (ko) | 반도체패키지용 웨이퍼마운팅시스템의 테이프 정량이송장치 | |
| JP2024124678A (ja) | 液状樹脂の搬出方法 | |
| KR19980039723A (ko) | 반도체패키지용 웨이퍼 마운팅 시스템의 스테이션 | |
| CN121105240A (zh) | 基板切割装置以及基板切割方法 |