JPH0642340Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0642340Y2
JPH0642340Y2 JP1987160133U JP16013387U JPH0642340Y2 JP H0642340 Y2 JPH0642340 Y2 JP H0642340Y2 JP 1987160133 U JP1987160133 U JP 1987160133U JP 16013387 U JP16013387 U JP 16013387U JP H0642340 Y2 JPH0642340 Y2 JP H0642340Y2
Authority
JP
Japan
Prior art keywords
bonding pad
layer
insulating film
wiring
interlayer insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987160133U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0165148U (US20080094685A1-20080424-C00004.png
Inventor
和男 冨塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP1987160133U priority Critical patent/JPH0642340Y2/ja
Publication of JPH0165148U publication Critical patent/JPH0165148U/ja
Application granted granted Critical
Publication of JPH0642340Y2 publication Critical patent/JPH0642340Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987160133U 1987-10-20 1987-10-20 半導体装置 Expired - Lifetime JPH0642340Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987160133U JPH0642340Y2 (ja) 1987-10-20 1987-10-20 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987160133U JPH0642340Y2 (ja) 1987-10-20 1987-10-20 半導体装置

Publications (2)

Publication Number Publication Date
JPH0165148U JPH0165148U (US20080094685A1-20080424-C00004.png) 1989-04-26
JPH0642340Y2 true JPH0642340Y2 (ja) 1994-11-02

Family

ID=31441933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987160133U Expired - Lifetime JPH0642340Y2 (ja) 1987-10-20 1987-10-20 半導体装置

Country Status (1)

Country Link
JP (1) JPH0642340Y2 (US20080094685A1-20080424-C00004.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4740536B2 (ja) * 2003-11-26 2011-08-03 ローム株式会社 半導体装置およびその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5996851U (ja) * 1982-12-20 1984-06-30 日本電気株式会社 半導体装置
JPS6074658A (ja) * 1983-09-30 1985-04-26 Toshiba Corp 半導体集積回路装置

Also Published As

Publication number Publication date
JPH0165148U (US20080094685A1-20080424-C00004.png) 1989-04-26

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