JPH064218B2 - Wafer automatic beveling device - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an invention of a beveling device used for peripheral edge finishing of a wafer such as a silicon wafer used for semiconductors. 2. Description of the Related Art Conventionally, as a beveling device for grinding the outer peripheral edges of a wafer, the wafers are fixed one by one by a chuck of a work piece mounting base of the beveling device and then ground one by one. Therefore, not only the processing efficiency is extremely low, but because the wafer is fixed, the shape will not be uniform unless the pressure applied to the grinding is precisely controlled, or cracks, chips, chips, etc. will occur during processing. It has been hoped for improvement. Problems to be solved by the invention The conventional beveling device is used to fix and polish sliced silicon wafers one by one with a chuck, so that a silicon wafer of a brittle material has a high incidence of cracking, chipping, chips, etc. . Instead of this, the present invention provides an apparatus capable of supplying and setting a large number of wafers to a processing position and simultaneously performing a plurality of polishing operations by a pressurization method using only the weight of the wafers. Means for Solving the Problems The present invention has at least a pair of right and left guide members 1 and 2 provided in the horizontal direction having a plurality of grooves, and a plurality of bevel grindstone grooves having a common plane with the grooves, Bevel grindstone roller 3 provided below the guide member in parallel with the guide member
A feed roller 4 parallel to the bevel grindstone roller, a supply arm 5 provided on the same side as the grindstone roller with respect to a plane including the pair of guide members so as to be capable of reciprocating beyond the plane, and to the plane. On the other hand, a plurality of wafers to be processed are held parallel to each other on the side opposite to the supply arm, and a carrier 7 that holds the wafers at substantially the same intervals as the grooves is supported and the wafers held by the carriers are rotated in a vertical direction. And a rotating frame 8a for moving the wafer while holding the wafer in the vertical direction on the supply arm and moving the pair of guide members 1 and 2.
A gist of an automatic bevelling device for a wafer is that the lower part of the wafer is supported in the groove and is brought into contact with the bevel grindstone roller and the feed roller. A wafer carrier 7 capable of accommodating a plurality of wafers 6 for operation is attached to and detached from a predetermined position, and the plurality of wafers 6 accommodated in the carrier are moved downward from above with a lower portion of the wafer being supported by a supply arm 5, Each wafer passes between the plurality of grooves 1 and 2 and comes into contact with each corresponding bevel grindstone of the bevel grindstone roller 3 and also with the feed member 4. A plurality of wafers are moved so that the centers of the wafers are substantially aligned with the center line of the guide member 1 which is supported by the supply arm 5 to control the position of the workpiece and the guide member 2 which is symmetrical to the guide member 1. It stops by contacting the grindstone roller and the feed roller. In FIG. 1 of the embodiment, the transfer of the wafer 6 between the carrier 7 and the guide members 1 and 2 is carried out as follows. The rotating frame 8a having the cylinder 8 can take both horizontal and upright positions around the axis of the feed roller 4 as shown in the figure. For example, 24 wafers are stored in the carrier 7 and the carrier 7 The inner wafer 6 is held at three positions, that is, the groove of the supply arm 5 and the groove 7'in the carrier, and is mounted on the rotating frame 8a lying down by a slide mechanism. After mounting the carrier 7, the rotary frame 8a is moved to the upright position and the cylinder 8 is operated. Supply arm 5 is this cylinder 8
Then, the wafer 6 is guided downward to the bevel grindstone roller 3 and the feed roller 4. The bevel grindstone roller 3 has a roller shape in which a large number of bevel type grindstones suitable for processing the front and back sides of the respective wafers are formed into a roller shape for each wafer and simultaneously grinds a plurality of wafers 6. The material of the feed roller 4 is preferably one having a large friction with silicon, for example, one having a deep groove made of special rubber. FIG. 2 shows the transfer of the wafer, and the supply arm 5 descends to the descending position 5 ′, and the wafer 6 is guided by the guide members 1, 2.
And the bevel-type grindstone roller 3 and the feeding member 4. When the guide members 1 and 2 are rotated clockwise or counterclockwise by the motor 9, the bevel grindstone roller 3 is rotated by the motor 10, and the feed roller 4 is also rotated by the motor 11,
While the wafer is standing almost vertically, its peripheral edge is ground with a grinding pressure almost equal to its own weight. FIG. 3 is a functional diagram briefly showing these relationships. FIG. 4 shows the inner wall of the carrier 7 with the bottom removed, and the wafers 6 are housed in these small grooves 7'one by one. The capacity (the number of stored) of the carrier is 24, the rotation speed of the guide member 1 is 50 to 70 rpm, the rotation speed of the guide member 2 is 50 to 70 rpm, and the rotation speed of the bevel grindstone roller is 2500 to 3500 rpm. The time required for polishing was 5 mm, and the bevelling yield was 99,6%.
Is getting Effects of the Invention After mounting the carrier 7 with the supply arm 5 in the horizontal direction and holding the plurality of wafers 6 stored in the carrier 7, the carrier 7 is erected upright and the supply arm is lowered to move the plurality of wafers 6 Is loosely set between the guide members 1 and 2, the bevel grindstone roller 3, and the feed roller 4 and the rollers are rotated, so that a plurality of wafers can be beveled at the same time. Also, without chucking the wafer,
Since it can be automatically supplied and processed, high quality wafers can be produced with high efficiency.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partial cross-sectional front view showing an embodiment of the present invention, FIG. 2 is a side view with a part omitted, and FIG. 3 describes wafer automatic beveling. FIG. 4 is a cross-sectional view showing the inner wall of the carrier. 1, 2: Guide member 3: Bevel grindstone roller 4: Feed roller 5: Supply arm 6: Wafer 7: Carrier.

Claims (1)

What is claimed is: 1. At least a pair of left and right guide members (1, 2) provided in the horizontal direction having a plurality of grooves, and a plurality of bevel grindstone grooves having a common plane with the grooves are provided below the guide member. A bevel grindstone roller (3) provided in parallel with the guide member, a feed roller (4) parallel to the bevel grindstone roller, and a plane including the pair of guide members on the same side as the grindstone roller and beyond the plane. And a carrier for holding a plurality of wafers to be processed parallel to each other on the side opposite to the supply arm with respect to the plane at approximately the same intervals as the grooves. 7)
A rotation frame (8a) for supporting the wafer and rotating it so that the wafer held in the carrier is in the vertical direction, and is configured to move while holding the wafer in the vertical direction on the supply arm. An automatic wafer beveling device, wherein the lower part of the wafer is supported in the groove of (1, 2) and is brought into contact with the bevel grindstone roller and the feed roller.