JPH0639811Y2 - Spray equipment - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spray device. That is, the present invention relates to a spray device that sprays a chemical solution onto a thin plate material such as a printed wiring board that is conveyed by a large number of spray nozzles.

[0002]

2. Description of the Related Art First, the technical background of a printed wiring board will be described. Recently, the printed circuit boards have become higher in density, smaller in size and lighter in weight, and have increased in number of layers, and their circuits are becoming finer and finer. By the way, in the manufacturing process of a printed wiring board, for example, each of its developing, etching, and peeling processes, a developing solution, a corrosive solution, and a stripping solution are respectively applied to a conveyed printed wiring board by a large number of spray nozzles of each spray device. A chemical solution such as is sprayed, and thus predetermined processing such as development, etching, and film peeling is performed. And
Such a spray device includes a main pipe connected to a liquid tank of a chemical solution via a pump, a branch pipe connected to the main pipe, a plurality of spray pipes branched from the branch pipe, and a plurality of spray pipes provided for each spray pipe. And a spray nozzle.

In order to obtain a uniform and clear circuit in the printed wiring board in which the circuit is becoming finer and finer as described above, the uniformity of processing such as development, etching, and film peeling is an important point. . In order to achieve uniform processing such as development, etching, and film removal, the spray pipes and spray nozzles should be properly arranged in each spray device, and the pressure difference of the chemical liquid should be different between the spray pipes. Is a necessary condition. For the first time, the spraying of the chemical liquid onto the printed wiring board by the spray nozzle is carried out and spraying is carried out uniformly, whereby uniform processing such as development, etching and film peeling is realized.

Regarding the above-mentioned arrangement of the spray pipe,
Various research and development have been conducted in the past. On the other hand, regarding the elimination of the pressure difference of the chemical liquid between the above-mentioned spray pipes,
as follows. That is, the spray pipe branched from the upstream side of the branch pipe has a lower pressure of the chemical liquid supplied from the branch pipe, and conversely, the spray pipe branched from the downstream side of the branch pipe has a pressure of the supplied chemical liquid. Can be higher
Known from the past. Therefore, conventionally, a pressure adjusting valve and a pressure gauge are provided near the inlet of each spray pipe, and the flow rate of the chemical liquid supplied to each spray pipe is adjusted by operating the pressure adjusting valve with the pressure gauge. Therefore, the pressure difference of the chemical liquid between the spray pipes is eliminated, and the pressure of the chemical liquid between the spray pipes is made uniform.

[0005]

The following problems have been pointed out in such a conventional example. First of all, when the distance between the spray pipes is small, it is extremely difficult to provide the pressure regulating valve and the pressure gauge for each spray pipe in this way. That is, since the intervals are narrow, there is a problem that it is extremely difficult to mount them due to the mechanical structure. Secondly, such a pressure regulating valve and a pressure gauge, especially a pressure gauge, are required to have excellent corrosion resistance because they are used under the condition that a chemical solution is injected, and are expensive. Therefore, a large number of such expensive pressure gauges and the like are provided for each spray pipe, which causes a problem in cost. Thirdly, since pressure gauges are provided outside the spray pipes respectively, the appearance becomes complicated, and the aesthetic appearance of the whole is significantly impaired, resulting in a decrease in commercial value.

The present invention has been made in view of the above circumstances and has been made to solve the problems of the above-mentioned conventional example. In each spray pipe, the orifice-shaped flow rate adjusting member having a different hole diameter is provided. By providing the first
In addition, the flow rate can be easily adjusted even when the distance between the spray pipes is small.
Fourthly, it is an object of the present invention to propose a spray device in which the appearance is not impaired and the pressure of the chemical liquid between the spray pipes is uniform.

[0007]

The technical means of the present invention for achieving this object are as follows. That is, this spray device sprays a chemical solution onto a thin plate material such as a printed wiring board being conveyed by a large number of spray nozzles. Then, a main pipe connected to the liquid tank of the chemical liquid via a pump, a branch pipe having one end connected to the main pipe and the other end closed, a plurality of spray pipes branched from the branch pipe, and each of the sprays It comprises a plurality of the spray nozzles provided on the pipes, and an orifice-shaped flow rate adjusting member provided near the inflow port of each of the spray pipes. The flow rate adjusting member has a larger hole diameter for the spray pipe branched from one end side of the branch pipe, that is, the upstream side, and has a hole diameter for eliminating the pressure difference of the chemical liquid between the spray pipes. ing.

[0008]

The present invention has the above-mentioned means, and therefore operates as follows. In a thin plate material processing step such as a printed wiring board manufacturing step, a spray device sprays a chemical solution such as a developing solution, a corrosive solution, or a stripping solution onto a thin plate material such as a printed wiring board to be transported. In the spray device, a chemical solution is pumped from a liquid tank through a main pipe to a branch pipe, is supplied from the branch pipe to each spray pipe, and is sprayed from each spray nozzle. By the way, the spray pipe branched from the upstream side of the branch pipe has a lower pressure of the chemical liquid supplied from the branch pipe. Therefore, in this spray device, a flow rate adjusting member is provided near the inflow port of each spray pipe, and this flow rate adjusting member has a hole diameter that is larger than that of the spray pipe branched from the upstream side of the branch pipe. , The size of the hole of the flow adjustment member of each spray pipe is
It is installed so as to be inversely proportional to the above-mentioned pressure level.

Therefore, first of all, the flow rate adjusting member is provided only inside each spray pipe. Therefore, even if the distance between the spray pipes is small, the flow rate can be adjusted without any trouble. Secondly, since it is only necessary to provide a flow rate adjusting member on each spray pipe, the cost is excellent. Thirdly, since the flow rate adjusting member is provided only inside each spray pipe, the appearance does not become complicated. Fourthly, and by providing such a flow rate adjusting member, the pressure difference of the chemical liquid between the spray pipes is eliminated and becomes uniform. Therefore, a thin plate material such as a printed wiring board can be uniformly sprayed and sprayed with a chemical solution by each spray pipe, and uniform processing such as development, etching, and film peeling can be realized.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to its embodiments shown in the drawings. FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is a front sectional view of the same part. FIG. 3 is a perspective view of the spray device. This spray device is used, for example, in the manufacturing process of the printed wiring board P. First, the printed wiring board P will be described. The printed wiring board P has a wide variety of purposes such as a consumer single-sided board, a double-sided board for OA, a multi-layered board for a computer, and other flexible boards for a computer, etc., and a variety of manufacturing processes thereof. , Material cutting, polishing / electrolytic treatment, resist sticking, exposure, development, etching, resist stripping, etc.

That is, first, a copper-clad laminate having an insulating material coated with copper foil is cut into a work-sized short material, and double-side polishing or electrolytic treatment is performed as surface treatment. Then, after the process of attaching the photosensitive resist to the film shape,
A circuit photograph is applied and exposed, and after that, the resist leaves the exposed and cured circuit portion, and the other portion is dissolved and removed by spraying a developing solution. Then, in the etching machine, the copper foil in the circuit portion where the resist is hardened in this way is left, and the copper foil in the portion where the resist is dissolved and removed as described above is dissolved and removed by the jetting of the corrosive liquid. After that, the remaining resist of the above-mentioned hardened circuit portion is dissolved and removed by spraying a stripping solution, whereby an electric circuit is formed and a printed wiring board P is manufactured. As described above, in the manufacturing process of the printed wiring board P, the chemical solution H such as the developing solution, the corrosive solution, the stripping solution, and the like is applied to the printed wiring board P transported in each processing chamber, and the spray nozzles are provided above and below the spray device. 1 (see FIG. 2). For example, in the etching process, in an etching machine that employs various transfer types such as vertical type, horizontal type, and inclined type, any of them can be used as a corrosive liquid H for dissolving and removing copper foil.
However, it is sprayed onto the conveyed printed wiring board P by a spraying device, so that unnecessary copper foil is dissolved and removed.

By the way, such a spray device is used for the chemical liquid H.
Main pipe 3 connected to the liquid tank (not shown) of
And a branch pipe 4 having one end connected to the main pipe 3 and the other end closed.
And a plurality of spray pipes 5 branched from the branch pipe 4.
And a plurality of spray nozzles 1 (see FIG. 2) provided in each spray pipe 5, and an orifice-shaped flow rate adjusting member 6 provided near the inlet of each spray pipe 5. In the illustrated example, two such spray devices are used so that the spray pipes 5 and the spray nozzles 1 are arranged above and below the conveyed printed wiring board P, respectively. The number of spray pipes 5 is generally several to one.
About 0 pieces are branched from one branch pipe 4 in parallel at a predetermined interval, and one spray pipe 5 is provided with several to several tens of spray nozzles 1 at regular intervals. Then, the flow rate adjusting member 6 embedded in each spray pipe 5
Is a larger diameter of the spray pipe 5 branched from one end side of the branch pipe 4, that is, the upstream side A (see FIG. 1), and is a hole diameter for eliminating the pressure difference of the chemical liquid H between the spray pipes 5. Has become. That is, the size of the hole diameter of the flow rate adjusting member 6 is set to be inversely proportional to the difference in the pressure of the chemical liquid H that is generated between the spray pipes 5. The shape of the flow rate adjusting member 6 used in FIG. 2 is such that the hole diameter gradually decreases toward the tip end side, but various other shapes are conceivable.

The present invention is constructed as described above.
Then it becomes as follows. First, in the manufacturing process of the printed wiring board P, a developing solution is applied to the conveyed printed wiring board P by a large number of spray nozzles 1 of a spray device.
Chemical liquid H such as corrosive liquid, stripping liquid, etc. is sprayed, and development
Etching, stripping, etc. are performed. Then, in this spray device, the chemical liquid H is sucked from the liquid tank by the pump 2 and pressure-fed to reach the branch pipe 4 through the main pipe 3, and is supplied to each spray pipe 5 branched from the branch pipe 4, and each spray pipe. From each spray nozzle 1 of 5, the printed wiring board P is jetted and sprayed at a predetermined pressure. By the way, the spray pipe 5 branched from one end side of the branch pipe 4, that is, the upstream side A (see FIG. 1) has a lower pressure of the chemical liquid H to be supplied from the branch pipe 4, and conversely, the downstream side of the branch pipe 4. B (see FIG. 2), that is, the spray pipe 5 branched from the closed side of the other end has a higher pressure of the chemical liquid H to be supplied from the branch pipe 4. That is, in the case where the flow rate adjusting member 6 as in the present invention is not provided, for example, if six spray pipes 5 are arranged from the upstream side A to the downstream side B, the pressure is sequentially transferred from the upstream side A to the downstream side B. For, 1.50Kg / cm ² ,
1.51Kg / cm ² , 1.52Kg / cm ² , 1.53Kg / cm ² , 1.54Kg /
It becomes cm ² , 1.55 Kg / cm ² . Therefore, in this spray device, an orifice-shaped flow rate adjusting member 6 is provided near the inlet of each spray pipe 5, and the flow rate adjusting member 6 has a hole diameter of a spray pipe branched from the upstream side A of the branch pipe 4. No. 5 is larger, and that of the spray pipe 5 branched from the downstream side B of the branch pipe 4 is smaller, and the size of the hole diameter of the flow rate adjusting member 6 of each spray pipe 5 is the same as the above pressure difference. It is set to be inversely proportional to.

Therefore, the spray device of the present invention has the following first, second, third and fourth aspects. First of all, the flow rate adjusting member 6 is provided only in the vicinity of the inlet of each spray pipe 5, and no pressure gauge or the like is provided outside as in the conventional example of this kind. Therefore, even when the intervals between the spray pipes 5 are small and the intervals between the spray pipes 5 are narrow and close to each other, the flow rate of each spray pipe 5 can be easily adjusted without any trouble. Secondly, since it is only necessary to provide each spray pipe 5 with the orifice-shaped flow rate adjusting member 6,
Excellent in cost. Thirdly, since the flow rate adjusting member 6 is provided only inside each spray pipe 5 and no pressure gauge or the like is provided outside like the conventional example of this kind, the appearance does not become complicated. Fourth, and by providing such a flow rate adjusting member 6, each spray pipe 5
The flow rate of the chemical liquid H supplied to the spray pipe 5 is adjusted, the pressure difference of the chemical liquid H between the spray pipes 5 is eliminated, and the pressure becomes uniform. Therefore, the spray nozzle 1 of each spray pipe 5 sprays and sprays the chemical solution H uniformly onto the printed wiring board P, so that uniform development, etching, film removal, etc. can be achieved. To be realized.

[0015]

As described above, the spray device according to the present invention provides the following effects by providing each spray pipe with an orifice-shaped flow rate adjusting member having a different hole diameter.

First, the flow rate can be easily adjusted even if the distance between the spray pipes is small. That is,
Even when the distance is small and close, the flow rate adjustment of each spray pipe can be easily realized in terms of mechanical structure and mounting work. Secondly, it is excellent in cost. That is, unlike the conventional example of this kind, it is not necessary to provide a pressure adjusting valve, an expensive pressure gauge, or the like for each spray pipe, and it is sufficient to provide an orifice-shaped flow rate adjusting member, which is excellent in cost. . Third, the aesthetics are not compromised. That is, unlike the conventional example of this kind, pressure gauges are not provided outside the spray pipes respectively, so that the appearance is not complicated and the aesthetic appearance is not deteriorated. Fourth, and in this way, the pressure of the chemical liquid between the spray pipes is made uniform. That is, the pressure difference between the spray pipes is eliminated, and it becomes possible to uniformly spray and spray the chemical liquid by the spray nozzle onto a thin plate material such as a printed wiring board.
As a result, uniform processing such as development, etching, and film peeling is realized. Therefore, for example, it is possible to sufficiently cope with miniaturization and miniaturization of the circuit of the printed wiring board and obtain a uniform and clear circuit. As described above, the problems existing in this type of conventional example are eliminated, and the effects of the present invention are remarkable and significant.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a spray device according to the present invention.

FIG. 2 is a front sectional view of the same main part.

FIG. 3 is a perspective view of a spray device.

[Explanation of symbols]

 1 spray nozzle 2 pump 3 main pipe 4 branch pipe 5 spray pipe 6 flow rate adjusting member A upstream side B downstream side H chemical liquid P printed wiring board

Claims (1)

[Scope of utility model registration request] 1. A spray device for spraying a chemical solution onto a thin plate material such as a printed wiring board being conveyed by a large number of spray nozzles, the main tube being connected to a liquid tank of the chemical solution via a pump, and the main tube. A branch pipe having one end connected to and the other end closed, a plurality of spray pipes branched from the branch pipe, a plurality of the spray nozzles provided in each spray pipe, and an inlet of each spray pipe. An orifice-shaped flow rate adjusting member provided in the vicinity, and the flow rate adjusting member has a larger hole diameter as that of the spray pipe branched from one end side of the branch pipe, that is, the upstream side, A spray device having a hole diameter for eliminating the pressure difference of the chemical liquid between the spray pipes.