JP2001196723A - Apparatus for manufacturing printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a convenient and easy-to- spread printed wiring board, without causing increase of manufacturing cost and to produce a high density high accuracy printed wiring board with high yield by making uniform the etching accuracy of upper and lower surfaces, without lowering productivity. SOLUTION: A high density high accuracy printed wiring board can be produced with high yield, by making uniform the etching accuracy at the central part and peripheral part on the upper surface of the printed wiring board, without lowering productivity in the etching thereof using an apparatus for manufacturing a printed wiring board, where a nozzle pipe located in the center has a diameter larger than that of nozzle pipes on the opposite sides or a pipe coupled with the nozzle pipe located in the center has a diameter larger than that of nozzle pipes on the opposite sides.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a printed wiring board used for various electronic devices and the like.

[0002]

2. Description of the Related Art In recent years, printed wiring boards, which are widely used in various electronic devices and the like, have been required to have higher wiring density and higher reliability as electronic devices have become smaller and more multifunctional. ing.

A conventional manufacturing apparatus used for forming a conductor pattern on a printed wiring board, particularly an etching apparatus, will be described below.

FIG. 3 schematically shows a conventional apparatus for manufacturing a printed wiring board. In FIG. 3, 21 is a spray nozzle, 22 is a nozzle pipe for the upper surface, 23 is a nozzle pipe for the lower surface, 24 is a pressure gauge for the upper surface, 25 is a pressure gauge for the lower surface,
26 is a pressure adjusting valve for the upper surface, 27 is a pressure adjusting valve for the lower surface, 28 is a spray pump for the upper surface, 29 is a spray pump for the lower surface, 30 is a feed roller, 31 is an etching booth, and 32 is a printed wiring board.

[0005] A method of etching a printed wiring board in the etching apparatus configured as described above will be described below.

First, a printed wiring board 32 in which an etching resist is formed on a copper-clad laminate (not shown) cut to a predetermined size by a screen printing method, a photographic method, or the like is placed in an etching booth 31. Between the nozzle pipe 22 for the upper surface and the nozzle pipe 23 for the lower surface, which are piped in parallel or at an angle to the traveling direction of the water, transported at a predetermined speed on the roller 30, and
An etching solution such as copper is sprayed from the spray nozzle 21 to dissolve (hereinafter, referred to as "etching") the exposed copper in the portion where the etching resist is not formed, thereby obtaining a conductor pattern.
At this time, the upper surface nozzle pipe 22 and the lower surface nozzle pipe 23 are at 45 ° with respect to the traveling direction of the printed wiring board 32.
It is also possible to swing (oscillate) at an angle of up to 60 °. After that, peel off the etching resist and wash with water.
The conductor pattern is formed from the copper-clad laminate through a process such as drying.

[0007]

However, with the conventional etching apparatus and etching method, it is difficult to perform uniform and accurate copper etching on the upper and lower surfaces of the substrate. On the lower surface, a large difference tends to occur in the etching speed. This is because, on the upper surface of the printed wiring board, the deteriorated etching solution containing a large amount of copper dissolved in the central portion is likely to stay, but the deteriorated etching solution in the peripheral portion immediately flows down from the printed wiring board and stays there. This is because the etching liquid does not stay on the lower surface of the printed wiring board, and the etching liquid in a new liquid state having a high etching ability is always supplied to the lower surface.

As a result, there is a large difference in the etching accuracy of the conductor pattern between the central portion and the peripheral portion of the printed wiring board on the upper surface, and also a difference between the upper and lower surfaces. Is extremely difficult, the process yield is remarkably deteriorated, and the problem is more remarkable as the thickness of the printed wiring board is smaller and the conductor pattern is denser.

As a method for solving these problems, a method has been devised in which a printed wiring board is inclined or set upright, and an etching solution is jetted from a horizontal spray nozzle to eliminate the accumulation of the etching solution. It is also difficult to transport the wiring board and to set the etching conditions, which significantly impairs the productivity and raises the manufacturing cost of the etching apparatus.

The present invention solves the above-mentioned conventional problems, and provides a simple and easy-to-use apparatus for manufacturing a printed wiring board without increasing the manufacturing cost of the manufacturing apparatus. An object of the present invention is to make the etching accuracy of the upper and lower surfaces uniform without lowering the productivity of the etching of the board, and to produce a high-density and high-precision printed wiring board with high yield.

[0011]

In order to achieve the above object, the present invention provides a feed roller for conveying a substrate at a predetermined speed, a plurality of spray nozzles attached, and an angle parallel or at an angle to the traveling direction of the printed wiring board. A plurality of nozzle pipes arranged at equal intervals, a mechanism for swinging the nozzle pipe, and a pump for supplying a processing liquid to the nozzle pipe, wherein the plurality of nozzle pipes have different pipe diameters. Alternatively, a pipe provided with a plurality of piping pipes between the plurality of nozzle pipes and the pump, in particular, a pipe in which a pipe diameter of a nozzle pipe located at the center is larger than a pipe diameter of nozzle pipes on both sides or a pipe connected to a central nozzle pipe. An object of the present invention is to manufacture a printed wiring board by using a printed wiring board manufacturing apparatus with the pipe diameter being larger than the pipe diameters of the pipes on both sides.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first and fifth aspects of the present invention, a feed roller for transporting a substrate at a predetermined speed, a plurality of spray nozzles attached and parallel to or in parallel with the traveling direction of the printed wiring board are provided. A plurality of nozzle pipes arranged at equal intervals at an angle, a mechanism for swinging the nozzle pipe, and a pump for supplying an etchant to the nozzle pipe, wherein the plurality of nozzle pipes have different pipe diameters. This is a device for manufacturing a printed wiring board equipped with pipes, and the diameter of the processing liquid sprayed from the spray nozzle and sprayed onto the printed wiring board is not retained on the printed wiring board due to the different nozzle pipe diameters. With this setting, high-precision etching can be realized, and a simple manufacturing apparatus can be supplied at a predetermined substrate transfer speed. Since it is, it is that it provides neither production apparatus causing a steep rise and a decrease in device manufacturing cost of productivity.

According to a second aspect of the present invention, there is provided the printed wiring according to the first aspect, wherein the diameter of the nozzle pipe located at the center of the plurality of nozzle pipes is larger than the diameters of the nozzle pipes on both sides. This is a board manufacturing device, and the flow rate of the central nozzle pipe is set to be higher than the flow rates of the nozzle pipes on both sides in order to allow the processing liquid to flow immediately without stagnating at the center of the upper surface of the printed wiring board. In addition, it is possible to provide a manufacturing apparatus capable of forming a conductor pattern with high accuracy by achieving uniform etching of the central portion and the peripheral portion.

According to a third aspect of the present invention, there is provided a feed roller for transporting a substrate at a predetermined speed, a plurality of spray nozzles attached, and pipes arranged at equal intervals parallel to or at an angle to the traveling direction of the printed wiring board. A plurality of nozzle pipes, a mechanism for swinging the nozzle pipe, a pump for supplying a processing liquid to the nozzle pipe, and a plurality of piping pipes between the plurality of nozzle pipes and the pump, This is a device for manufacturing a printed wiring board equipped with different piping pipes in a plurality of piping pipes, and prints the distribution of the amount of processing liquid sprayed from a spray nozzle and sprayed onto the printed wiring board, depending on the pipe diameter of the different piping pipes. It can be set so that it does not stay on the wiring board, high-accuracy etching can be realized, and the diameter of the nozzle pipe can be set. It can be easily mounted and replaced than are those that can provide a more manufacturing apparatus capable of also remodeling in an easy and low cost with respect to conventional production apparatus.

According to a fourth aspect of the present invention, the diameters of the plurality of nozzle pipes are all the same, and the diameters of the pipes of the plurality of pipes that are piped to the central nozzle pipe are set at both sides. 4. The apparatus for manufacturing a printed wiring board according to claim 3, wherein the diameter is larger than the pipe diameter of the piping pipe. The flow rate of the pipes is set to be higher than the flow rates of the nozzle pipes on both sides, so that the etching of the center part and the peripheral part can be made uniform and a high-precision conductor pattern can be formed. -It is possible to provide a manufacturing apparatus that can be easily mounted.

(Embodiment) An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic diagram illustrating a printed wiring board manufacturing apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic diagram illustrating details of the manufacturing apparatus according to the embodiment of the present invention.

In FIG. 1, 1 is a spray nozzle, 2a
2f are a plurality of upper surface nozzle pipes attached with a plurality of spray nozzles 1 and arranged in parallel or at an angle to the traveling direction of the printed wiring board; A plurality of nozzle pipes for the lower surface, which are piped in parallel or at an angle to the traveling direction, 8 is a nozzle pipe for nozzle pipes 2a to 2a.
spray pump 9 for lower surface for supplying an etching solution to nozzle pipes 3a to 3f, 10 for feed roller, 11 for etching booth,
Reference numeral 12 denotes a printed wiring board as a substrate.

In the above, the central nozzle pipes 2c, 2
The pipe diameters of d, 3c and 3d are the nozzle pipes 2a and 2
Those that are about 20 to 30% larger than b and 2e, 2f are used.

In FIG. 2, 4a-4f, 5a-5
f is a piping pipe, and the spray pump 8 for the upper surface, the spray pump 9 for the lower surface, and the nozzle pipes 2a-2 for the upper surface.
f and the lower-surface nozzle pipes 3a to 3f, and the central nozzle pipes 2c, 2d, 3c, 3d
The pipe diameters of the pipes 4c, 4d, 5c, 5d provided on the pipes are the same as those of the pipes 4a, 4b and 5e, 5f on both sides.
It is about 20 to 30% larger than that used.

A method for etching a printed wiring board in the manufacturing apparatus configured as described above will be described below.

First, cut into a predetermined size,
An etching resist is formed on a copper-clad laminate (not shown) formed on both surfaces of an insulating substrate with a thickness of copper by a screen printing method, a photographic method, or the like to obtain a printed wiring board 12.

The printed wiring board 12 is placed on the feed roller 10 between the upper surface nozzle pipes 2a to 2f and the lower surface nozzle pipes 3a to 3f which are piped in the etching booth 11 in parallel or at an angle to the traveling direction. The wafer is transported at a predetermined speed, and etching is performed by spraying an etching solution such as cupric chloride from the spray nozzle 1 onto the upper and lower surfaces.

When performing the etching, the upper nozzle pipes 2a to 2f and the lower nozzle pipes 3a to 3f are oscillated (oscillated) at an angle of 45 ° to 60 ° with respect to the traveling direction of the printed wiring board. The flow rate of the etchant supplied from the spray pump 8 for the upper surface to the nozzle pipes 2a to 2f for the upper surface is proportional to the diameter of the nozzle pipe, and the central nozzle pipes 2c, 2d, 3c, and 3d are the nozzle pipes 2a on both sides. About 20 to about 2b and 3e, 3f
Therefore, the etching liquid at the center of the upper surface of the printed wiring board immediately flows down from both sides without stagnation, and the entire surface of the printed wiring board is constantly etched with the new etching liquid.

When etching is performed by setting the diameter of the nozzle pipe as described above, the width of the conductor pattern after the etching by the conventional etching apparatus and the etching method is different from the set value with respect to the upper and lower surfaces of the printed wiring board, the central portion, and the periphery. In the part, the variation is 50 to 100 μm, but it has been demonstrated that the variation can be extremely reduced to 10 to 20 μm by the etching apparatus and the etching method according to the present invention.

The above principle is, as shown in FIG. 2, that the pipe diameters of the pipes 4c, 4d, 5c, 5d are about 20-30% as compared with the pipes 4a, 4b and 5e, 5f on both sides.
Similar results are obtained when a large one is used.Especially in this case, it is possible to easily and inexpensively replace or install a conventional etching apparatus or change the pipe diameter of a pipe pipe. it can.

In the embodiment of the present invention, the pipe diameter of only the central nozzle pipe and the piping pipe is shown as being large, but the nozzle pipes 2b, 2e, 3b located adjacent to the central nozzle pipe and the piping pipe are shown. , 3e and piping pipe 4
As b, 4e, 5b, and 5e, pipes having a pipe diameter larger by 10 to 20% than the nozzle pipes and pipe pipes on both sides may be used, thereby having the same effect as described above.

Further, in the embodiment of the present invention, an etching apparatus for performing etching, such as copper foil, in a printed wiring board manufacturing apparatus has been described, but the present invention relates to an unexposed portion of a photosensitive resist. Can also be used as a developing device for developing and removing.

[0028]

As described above, according to the present invention, the pipe diameter of the centrally located nozzle pipe is larger than the pipe diameters of the nozzle pipes on both sides, or the pipe diameter of the pipes piped to the central nozzle pipe is set to the pipe diameter on both sides. By using a printed wiring board manufacturing device that is larger than the pipe diameter, the etching accuracy of the center part and the peripheral part of the upper surface of the printed wiring board can be made uniform without lowering the productivity of etching the printed wiring board, and high density can be achieved. A high-precision printed wiring board can be produced with a good yield, and a simple manufacturing apparatus which can be easily spread without increasing the manufacturing cost of the apparatus can be provided.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of a printed wiring board manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic view showing details of a manufacturing apparatus according to an embodiment of the present invention.

FIG. 3 is a schematic view of a conventional printed wiring board manufacturing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Spray nozzle 2a-2f Nozzle pipe for upper surface 3a-3f Nozzle pipe for lower surface 4a-4f Piping pipe for upper surface 5a-5f Piping pipe for lower surface 8 Spray pump for upper surface 9 Spray pump for lower surface 10 Feeding roller 11 Etching booth 12 Print wiring Board

Claims (5)

[Claims] 1. A feed roller for transporting a substrate at a predetermined speed, a plurality of nozzle pipes attached with a plurality of spray nozzles and arranged at equal intervals in parallel or at an angle to a traveling direction of a printed wiring board; An apparatus for manufacturing a printed wiring board, comprising: a mechanism for swinging a pipe; and a pump for supplying a processing liquid to the nozzle pipe, wherein the plurality of nozzle pipes include nozzle pipes having different diameters. 2. The apparatus for manufacturing a printed wiring board according to claim 1, wherein the diameter of the nozzle pipe located at the center of the plurality of nozzle pipes is larger than the diameters of the nozzle pipes on both sides. 3. A feed roller for transporting a substrate at a predetermined speed, a plurality of nozzle pipes having a plurality of spray nozzles mounted thereon and being piped at equal intervals in parallel or at an angle to a traveling direction of a printed wiring board; A mechanism for swinging a pipe, a pump for supplying a processing liquid to the nozzle pipe, a plurality of pipes between the plurality of nozzle pipes and the pump, and different pipes are provided in the plurality of pipes Printed wiring board manufacturing equipment. 4. A method according to claim 1, wherein all of the plurality of nozzle pipes have the same diameter, and among the plurality of pipes, the diameter of the pipe connected to the central nozzle pipe is larger than the diameter of the pipes on both sides. Item 4. An apparatus for manufacturing a printed wiring board according to item 3. 5. The apparatus according to claim 1, wherein the processing liquid is an etching liquid.