JP3661536B2 - Printed wiring board manufacturing apparatus and printed wiring board manufacturing method using the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a printed wiring board manufacturing apparatus used for various electronic devices and the like, and a printed wiring board manufacturing method using the same.
[0002]
[Prior art]
2. Description of the Related Art In recent years, printed wiring boards that are widely used in various electronic devices and the like have been required to have high reliability along with higher wiring density as electronic devices have become smaller and more multifunctional.
[0003]
In the following, a manufacturing apparatus used for forming a conductive pattern of a conventional printed wiring board, particularly an etching apparatus will be described.
[0004]
FIG. 4 shows an outline of an etching apparatus as a conventional printed wiring board manufacturing apparatus. In FIG. 4, 21 is a spray nozzle, 22 is an upper surface nozzle pipe, 23 is a lower surface nozzle pipe, 24 is an upper surface pressure gauge, 25 is a lower surface pressure gauge, 26 is an upper surface pressure adjustment valve, and 27 is a lower surface pressure. An adjustment valve, 28 is a spray pump for the upper surface, 29 is a spray pump for the lower surface, 30 is a feed roller, 31 is an etching booth as a processing booth, and 32 is a printed wiring board.
[0005]
A method for etching a printed wiring board in the etching apparatus configured as described above will be described below.
[0006]
First, a printed wiring board 32 in which an etching resist is formed on a copper-clad laminate (not shown) cut to a predetermined size by a screen printing method, a photographic method, etc., is a traveling direction of the printed wiring board 32 in the etching booth 31. Between the nozzle pipe 22 for the upper surface and the nozzle pipe 23 for the lower surface that are piped in parallel or at an angle to each other, transported at a predetermined speed on the roller 30, and an etching solution such as cupric chloride on the upper and lower surfaces. Spray from the spray nozzle 21 dissolves the exposed copper in the portion where the etching resist is not formed (hereinafter referred to as etching) to obtain a conductor pattern.
[0007]
At this time, a plurality of upper surface nozzle pipes 22 and lower surface nozzle pipes 23 are simultaneously oscillated by oscillating all the nozzle pipes at an angle of 45 ° to 60 ° with respect to the traveling direction of the printed wiring board 32. I am letting.
[0008]
Thereafter, a conductor pattern is formed from the copper clad laminate through processes such as peeling of the etching resist, washing with water, and drying.
[0009]
[Problems to be solved by the invention]
However, with the conventional etching apparatus and etching method, it is difficult to accurately and uniformly etch the copper on the upper and lower surfaces of the substrate. In particular, there is a large difference in the etching speed between the upper and lower surfaces of the printed wiring board. Cheap. This is because the deteriorated etching solution containing a large amount of dissolved copper is likely to stay on the upper surface of the printed wiring board, but the deteriorated etching solution in the peripheral portion immediately flows down from the printed wiring board and stays there. This is because there is no stagnation of the etching solution on the lower surface of the printed wiring board, and a new etching solution having a high etching ability is always supplied to the lower surface.
[0010]
As a result, there is a large difference in the etching accuracy of the conductor pattern between the central part and the peripheral part of the printed wiring board on the upper surface, and the difference is significant between the upper and lower surfaces, and it is extremely difficult to etch the conductive pattern of the high-density and high-precision printed wiring board. Thus, there is a problem that the process yield is remarkably deteriorated, and the thinner the printed wiring board is and the denser the conductor pattern is, the more remarkable it is.
[0011]
As a method for solving these problems, conventionally, a method has been devised in which a printed wiring board is inclined or vertically and an etching solution is ejected from a horizontal spray nozzle to eliminate the retention of the etching solution. It is difficult to set the transfer and etching conditions, the productivity is remarkably hindered, and the manufacturing cost of the manufacturing apparatus is increased.
[0012]
SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and provides a printed wiring board manufacturing apparatus that is simple and easy to spread without causing an increase in manufacturing cost of the manufacturing apparatus, and a printed wiring board manufacturing method using the same. The purpose of this is to make the etching accuracy of the upper and lower surfaces uniform without reducing the productivity of etching of the printed wiring board, and to produce a high density and high precision printed wiring board with a high yield. .
[0013]
[Means for Solving the Problems]
In order to achieve this object, the present invention includes a feed roller for transporting a substrate at a predetermined speed, a plurality of nozzle pipes attached with a plurality of spray nozzles and piped parallel or at an angle to the traveling direction of the printed wiring board. A swing mechanism provided for each nozzle pipe, and a pump for supplying the processing liquid to the nozzle pipe, and the swing mechanism is a cam, a link mechanism, and a control whose rotation speed can be changed in conjunction with the cam. Using a printed wiring board manufacturing apparatus characterized by being capable of changing the swing angle and speed for each nozzle pipe, and swinging by a swing mechanism provided for each nozzle pipe. By changing the rotation angle of the control motor to make the angle and swing speed smaller than the swing angle of the nozzle pipes on both sides and the swing angle with the center nozzle pipe, A printed wiring board is manufactured by setting the pipe rocking speed faster than the nozzle pipe rocking speeds on both sides and moving the nozzle pipe at a predetermined speed while spraying the processing liquid on the substrate. It is.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
According to the first aspect of the present invention, there are provided a feed roller for transporting a substrate at a predetermined speed, and a plurality of nozzle pipes provided with a plurality of spray nozzles and piped parallel or at an angle to the traveling direction of the printed wiring board. And a swing mechanism provided for each nozzle pipe, and a pump for supplying processing liquid to the nozzle pipe. The swing mechanism can change the rotational speed in conjunction with the cam, the link mechanism, and the cam. This is a printed wiring board manufacturing device that consists of a control motor and can change the swing angle and swing speed for each nozzle pipe. The swing angle of the nozzle pipe depends on the position of the nozzle pipe. The swing speed condition can be easily set independently for each nozzle pipe. Thereby, the flow of the etching solution on the printed wiring board is set so that the etching force becomes uniform, and the etching rate of the central portion, the peripheral portion, and the upper and lower surfaces can be made uniform, and a highly accurate conductor pattern can be formed. .
[0015]
According to a second aspect of the present invention, the rocking angle and the rocking speed of the rocking mechanism provided for each nozzle pipe of the printed wiring board manufacturing apparatus according to the first aspect are determined based on the central nozzle. By making the swing angle of the pipe smaller than the swing angle of the nozzle pipes on both sides and changing the rotation speed of the control motor, the swing speed of the central nozzle pipe is made higher than the swing speed of the nozzle pipes on both sides. Is a method of manufacturing a printed wiring board characterized in that the nozzle pipe is swung and the processing liquid is sprayed onto the substrate and conveyed at a predetermined speed. Since the etching solution at the center of the upper surface does not stay and flows immediately by increasing the amount of the etchant sprayed and the flow of the etching solution, the etching rate at the center, the peripheral part, and the upper and lower surfaces is uniform. Further, by making the angle smaller than the swing angle of the central portion, etching can be performed at an angle close to the vertical, thereby reducing the amount of side etching and forming a highly accurate conductor pattern. Can do.
[0016]
(Embodiment)
Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1 and 2 are diagrams schematically showing an etching apparatus as a printed wiring board manufacturing apparatus according to an embodiment of the present invention, and FIG. 3 is a nozzle pipe of the manufacturing apparatus according to an embodiment of the present invention. It is a figure which shows the detail of this rocking | fluctuation mechanism.
[0017]
1 to 3, 1 is a spray nozzle, 2a to 2f are a plurality of spray nozzles 1 and a plurality of upper surface nozzle pipes piped parallel or at an angle to the direction of travel of the printed wiring board, 3a to 3f Upper surface pressure gauges, 4a to 4f are upper surface pressure adjusting valves as means for adjusting the spray pressure, 5 is an upper surface spray pump for supplying an etching solution as a processing solution to the nozzle pipes 2a to 2f, and 6 is a feed roller. 7a is a first etching booth as a processing booth, 7b is a second etching booth as a processing booth, 8 is a printed wiring board as a substrate, 9a to 9f are swinging mechanisms of the upper surface nozzle pipe, and 10 is a control Motor 11, cam 12, 12 a and 12 b link mechanisms, 12 c a fulcrum of the rotating plate and link mechanism, and 13 an inverter circuit unit.
[0018]
First, an etching apparatus that is a printed wiring board manufacturing apparatus according to an embodiment of the present invention will be described.
[0019]
The configuration of the etching apparatus according to the embodiment of the present invention is an apparatus that can simultaneously etch both surfaces from the upper surface and the lower surface as in the prior art, and the configurations of the upper surface and the lower surface are basically the same. Therefore, in order to facilitate the description of the present invention, only the structure of the upper surface will be described with reference to the drawings.
[0020]
As shown in FIG. 1, upper surface nozzle pipes 2a to 2f are arranged parallel to the first etching booth 7a or at an angle of 1 to 5 [deg.], And each nozzle pipe has an independent swing mechanism.
[0021]
FIG. 2 also includes two etching booths, a first etching booth 7a and a second etching booth 7b. The first etching booth 7a has 1 to 5 in the traveling direction of the printed wiring board 8. The upper surface nozzle pipes 2a to 2f are piped at an angle of .degree., And in the second etching booth 7b, the upper surface nozzle pipes 2a 'to 2f' are 1 to 5 in the direction opposite to the nozzle pipe of the first etching booth. Piped at an angle of °.
[0022]
FIG. 3 shows details of the independent swing mechanism of the nozzle pipe in the embodiment of the present invention.
[0023]
The independent swing mechanism corresponding to each nozzle pipe is composed of a cam (rotary plate) 11 and link mechanisms 12a and 12b, and the swing angle is changed by moving the position of the rotary plate and the fulcrum 12c of the link mechanism. be able to. The cam 11 is linked to the control motor 10 directly or by a belt or gear, and the control motor 10 can easily change the rotation speed by an inverter circuit.
[0024]
With this configuration, the swing angle and swing speed can be changed independently in each nozzle pipe.
[0025]
When only the swing angle is changed for each nozzle pipe, it is possible to use only one control motor 10 and reduce the equipment cost.
[0026]
A method for etching a printed wiring board in the etching apparatus configured as described above will be described below.
[0027]
The condition setting in the etching apparatus using only the first etching booth 7a of the printed wiring board in FIG. 1 according to the embodiment of the present invention will be described.
[0028]
First, by moving the swing angle of the central nozzle pipes 2c and 2d to the position of the fulcrum 12c of the link mechanism in the swing mechanism shown in FIG. 2, the swing angles of the other nozzle pipes 2a and 2b and 2e and 2f are moved. Is set to be small to some extent. Further, the center nozzle pipes 2c and 2d or the swing speed is set by the inverter circuit unit 12, the current or voltage control circuit so as to be larger than the other nozzle pipes 2a and 2b and 2e and 2f.
[0029]
As a result, the amount of the etchant sprayed at the center of the printed wiring board and the flow of the etchant are increased, so that the etchant does not stay in the center of the upper surface and immediately flows down.
[0030]
First of all, the device is cut to a predetermined size and a 35 μm thick copper foil is formed on a copper clad laminate (not shown) formed on both sides of the insulating substrate by screen printing or photographic method. An etching resist is formed to obtain the printed wiring board 8.
[0031]
The printed wiring board 8 is placed on the feed roller 6 at a predetermined speed between the upper surface nozzle pipes 2a to 2f and the lower surface nozzle pipes which are piped in the etching booths 7a and 7b in parallel to the traveling direction or at an angle. Etching is performed by spraying an etchant such as cupric chloride from the spray nozzle 1 on the upper and lower surfaces.
[0032]
When performing the etching, the upper surface nozzle pipes 2a to 2f and the lower surface nozzle pipe are arranged such that the central nozzle pipes 2c and 2d are 45 ° with respect to the printed wiring board traveling direction, and the other nozzle pipes 2a, 2b and 2e 2f is set to 60 °, and is oscillated (oscillated) with independent oscillating angles and oscillating speeds. The etching liquid supplied from the upper surface spray pump 5 to the upper surface nozzle pipes 2a to 2f is The spray pressure shown in the upper surface pressure gauges 3a to 3f is adjusted by the ratio of opening and closing the pressure adjusting valves 4a to 4f.
[0033]
Similarly, the etching liquid supplied from the lower surface spray pump to the lower surface nozzle pipe also adjusts the spray pressure indicated on the upper surface pressure gauge by the ratio of opening and closing of the lower surface pressure adjusting valve.
[0034]
Here, the pressure displayed on the upper-surface pressure gauge 3a~3f the center of each 3a so that the nozzle pipe is high is 1.2 kg / cm ^2, 3b is 1.6 kg / cm ^2, 3c is 2.0kg / Cm ² , 3d is adjusted to 2.0 kg / cm ² , 3e is adjusted to 1.6 kg / cm ² , and 3f is adjusted to 1.2 kg / cm ² by adjusting the opening / closing ratio of the upper pressure regulating valves 4a to 4f. .
[0035]
Similarly, the pressure displayed on the lower surface pressure gauge is adjusted to the most suitable value according to the number and positional relationship of the feed rollers at the rate of opening and closing the lower surface pressure adjustment valve.
[0036]
When etching is performed with the above-described nozzle pipe swing angle, swing speed, and spray pressure setting, the conductor pattern width after etching by the conventional etching apparatus and etching method is the upper and lower surfaces of the printed wiring board and the printed wiring board. The variation between the central portion and the peripheral portion is 50 to 100 μm, but the variation can be extremely reduced to 10 to 20 μm with the etching apparatus and the etching method of the present invention.
[0037]
Next, as shown in FIG. 2, a method for manufacturing a printed wiring board in a printed wiring board etching apparatus having at least two etching booths of a first etching booth 7a and a second etching booth 7b will be described.
[0038]
By moving the oscillating angle of the central nozzle pipes 2c and 2d to the position of the fulcrum of the rotating plate and the link mechanism of the oscillating mechanism described above, the oscillating angle of the nozzle pipes 2a and 2b and 2e and 2f on both sides is made larger. The rotation speed is increased by increasing the rotational speed of the control motor using an inverter circuit.
[0039]
Next, in the plurality of nozzle pipes of the second etching booth, the swing angle of the central nozzle pipe is made smaller than the swing angle of the nozzle pipes on both sides and the swing speed is increased, and the first etching booth is also combined. Is set to be larger than the swing angle of the nozzle pipe, and the swing speed is set to be small.
[0040]
In the first etching booth, the central portion of the printed wiring board is etched at an angle close to the vertical (with high jetting pressure of the etching solution), thereby reducing the side etching amount and increasing the rocking speed. The retention of the etching solution in the part can be eliminated.
[0041]
In addition, the second etching booth can prevent the generation of the side foot of the etching circuit in a wide range and eliminate the retention of the etching solution in the central portion, thereby making it possible to manufacture a highly accurate printed wiring board.
[0042]
When etching is performed under the conditions of the rocking angle and rocking speed of the nozzle pipe in the first etching booth and the second etching booth, the conductor pattern width after etching by the conventional etching apparatus and etching method is as follows. The variation is 50 to 100 μm with respect to the set value on the upper and lower surfaces, the central portion and the peripheral portion of the printed wiring board, but the variation can be extremely reduced to 10 to 20 μm with the etching apparatus and the etching method of the present invention. .
[0043]
In addition, in FIG. 2, it is also possible to set it as the etching apparatus of the form provided with the pressure gauge and the pressure control valve in each nozzle pipe like the embodiment of FIG. In addition to the setting of the rocking angle and rocking speed of the nozzle pipe in the etching booth 2, the etching conditions with higher accuracy can be set by adjusting the pressure of each nozzle pipe.
[0044]
In the present embodiment, the printed wiring board 8 is a double-sided printed wiring board without through-hole plating, but may be a single-sided printed wiring board, a double-sided printed wiring board with through-hole plating or a multilayer printed wiring board, or etching. As the resist, an organic material formed by a screen printing method or a photographic method is used, but a metal resist such as solder or a photosensitive electrodeposition resist may be used. Although the etching solution is cupric chloride, it may be an alkali etchant such as ferric chloride or ammonia.
[0045]
In addition, a copper-clad laminate with 35 μm thick copper foil cut to a predetermined size is formed on both sides of the insulating substrate, but it can also be set for various substrate sizes, required etching accuracy, and different conductor thicknesses. It is apparent from the configuration of the present invention that it can be easily handled by adjusting the pressure.
[0046]
Further, in the embodiment of the present invention, an explanation has been given of an etching apparatus that performs etching such as copper foil, among other printed wiring board manufacturing apparatuses, but the present invention develops an unexposed portion of a photosensitive resist. It can also be used as a developing device for removal.
[0047]
【The invention's effect】
As described above, the present invention uses an etching apparatus as a printed wiring board manufacturing apparatus in which the nozzle pipe swing mechanism is an independent mechanism for each nozzle pipe. The productivity of etching of printed wiring boards is reduced by reducing the nozzle pipe swing angle and increasing the swing speed, and transporting the etchant, which is the processing solution, to the substrate at a predetermined speed. This makes it possible to produce a high-density, high-precision printed wiring board with a good yield, and to increase the manufacturing cost of the equipment. It is possible to provide a simple manufacturing apparatus that can be easily spread without incurring.
[Brief description of the drawings]
FIG. 1 is a schematic view of a printed wiring board manufacturing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic view of a printed wiring board manufacturing apparatus according to an embodiment of the present invention. Detailed view of nozzle pipe swing mechanism of manufacturing apparatus in embodiment [FIG. 4] Schematic diagram of conventional printed wiring board manufacturing apparatus [description of symbols]
DESCRIPTION OF SYMBOLS 1 Spray nozzle 2a-2f Upper surface nozzle pipe 3a-3f Upper surface pressure gauge 4a-4f Upper surface pressure control valve 5 Upper surface spray pump 6 Feed roller 7a 1st etching booth 7b 2nd etching booth 8 Printed wiring board 9a ˜9f Upper surface nozzle pipe swing mechanism 10 Control motor 11 Cam 12a, 12b Link mechanism 12c Support point of rotating plate and link mechanism 13 Inverter circuit section

Claims (2)

A feed roller that transports the substrate at a predetermined speed, a plurality of nozzle pipes attached with a plurality of spray nozzles and piped parallel or at an angle to the traveling direction of the printed wiring board, and a swing provided for each nozzle pipe A mechanism and a pump for supplying the processing liquid to the nozzle pipe,
The swing mechanism is composed of a cam, a link mechanism, and a control motor whose rotation speed can be changed in conjunction with the cam, and the swing angle and swing speed can be changed for each nozzle pipe. Board manufacturing equipment. The swing angle and the swing speed of the swing mechanism provided for each nozzle pipe of the printed wiring board manufacturing apparatus according to claim 1 are set, and the swing angle of the central nozzle pipe is set to the swing of the nozzle pipes on both sides. By making it smaller than the moving angle and changing the rotation speed of the control motor, the center nozzle pipe swing speed is set faster than the nozzle pipe swing speed on both sides, and the nozzle pipe is swung. A method for manufacturing a printed wiring board, wherein a processing liquid is conveyed at a predetermined speed while spraying on a substrate.

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