CN113613400A - Vertical continuous etching line - Google Patents

Abstract

The invention provides a vertical continuous etching line which is characterized in that the vertical continuous etching line comprises a vertical loading device adopting a vertical continuous carrying mode and an etching processing device adopting an etching processing mode, and a circuit board to be etched is etched and processed in the etching processing device through the vertical loading device; the vertical continuous etching line provided by the invention can realize the vertical continuous etching effect by adopting different etching devices and combining different etching methods through a vertical continuous etching mode, effectively reduces the 'pool effect' in the etching process, and can adopt different line processing aiming at different circuit board types and circuit layout types through the combined processing design of different flows to form a diversified and personalized processing mode.

Description

Vertical continuous etching line

Technical Field

The invention relates to the field of circuit board etching processing, in particular to a vertical continuous etching line.

Background

The circuit board etching is a process of removing copper foil except a conductive circuit by using etching solution, is a chemical process, and is a process of removing an unnecessary copper-clad layer area by using chemical solution to manufacture the circuit board.

At present, the etching process generally adopts horizontal etching line processing, the line generally comprises a board entering section → an etching section → a water washing section → a drying section → a board collecting section, and the circuit board is horizontally transported with the ground in the line in the whole process; the circuit board finishes the etching process in the etching section, the etching section comprises a conveying roller and etching matrix nozzles, the etching matrix nozzles are respectively arranged on the upper surface and the lower surface of the conveying roller, etching liquid medicine is sprayed to the upper surface and the lower surface of the circuit board through the nozzles, and meanwhile, the circuit board is conveyed forwards to finish the etching process. The horizontal etching line technology has high maturity and good stability.

However, as electronic products are developed towards multi-functionalization, miniaturization and intellectualization, the circuit fineness of the circuit board is higher and higher, the distribution of circuit patterns and the shapes of the circuit patterns are also more and more complex, and the requirements on processing equipment are also higher and higher. The horizontal etching line body is when processing the higher circuit board product of fineness, there is a great problem, promptly "pond effect", because the circuit board is the horizontality in horizontal etching line body inside, when the etching matrix shower nozzle of top sprays etching liquid medicine to the circuit board upper surface, because action of gravity liquid medicine can gather at the upper surface of circuit board, can not in time drain away, it is more if circuit board circuit figure is buckled, then liquid medicine gathers at the upper surface more easily, at this moment, old liquid medicine can not in time drain away, new liquid medicine constantly sprays to the upper surface, then form the liquid medicine flow form of "pond" appearance, promptly be "pond effect". The 'pool effect' can seriously affect the etching uniformity of the upper and lower plate surfaces etched by the circuit board, and is very easy to cause excessive etching of the upper surface and insufficient etching of the lower surface, and easily causes overlarge side etching to influence the quality of the circuit board.

The horizontal etching line body can generate the problems of scraping a pattern plate surface line, rolling a plate and the like due to a horizontal transportation mode besides easily generating a 'water pool effect', and a lower etching matrix spray head of the line body sprays liquid medicine upwards for a long time, so that the spraying effect of the line body is easily influenced, and the problem that equipment is debugged frequently is caused.

Aiming at the problems, a vertical continuous etching mode needs to be designed, the water tank effect of etching is improved, the etching efficiency and the etching effect are improved, the product reject ratio is reduced, and therefore the effect of fundamentally changing the etching mode is achieved.

Disclosure of Invention

The invention provides a vertical continuous etching line, which adopts a vertical continuous etching mode to solve the problem of 'water pool effect' in the etching process of a circuit board, changes the etching mode, improves the etching uniformity and improves the etching efficiency.

The invention provides a vertical continuous etching line which is characterized by comprising a vertical loading device adopting a vertical continuous carrying mode and an etching processing device adopting an etching processing mode, wherein a circuit board to be etched is etched and processed in the etching processing device through the vertical loading device.

It should be further noted that, the vertical loading device adopting the vertical continuous carrying mode and the etching device adopting the etching mode form a vertical continuous carrying mode based on the vertical continuous carrying mechanism described in the invention patent application "chemical deposition metal processing line and unit carrying transport structure (patent application No. 2021100347178)", the vertical carrying mechanism of the above patent is a general mechanism, and the metal parts of the mechanism contacting with the processing liquid medicine, such as the clamp, the side spraying mechanism, the following frame, the positive plate mechanism, etc., are replaced by titanium material to form an etching resistant mechanism, so that the specific carrying mode of the vertical continuous etching line of the invention can be formed; the vertical loading device carries out etching processing on the etching processing device, namely the vertical continuous carrying mechanism is adopted, and etching liquid medicine is added into the cylinder body or is prepared again, so that the integral effect of vertical continuous etching is realized.

It should be further noted that, based on the above-mentioned patent application "electroless metal processing line and unit carrying transport structure (patent application No. 2021100347178)", further, wherein the horizontal and vertical carrying means is realized by the technical content of the patent application "a plating line horizontal and vertical carrying means (patent application No. 202023007264X)"; wherein, the horizontal plate rotating device is realized by adopting the technical content of 'a plating line horizontal plate rotating device (2020230013196)'; wherein the caterpillar adjusting device adopts the patent application 'a vertical continuous plating line caterpillar adjusting device (patent application number: 2020230014061)'; wherein, the partition following frame is realized by adopting the technical content of the patent application 'a plating line partition following frame (patent application number: 2020230014108)'; the steering device is realized by the technical content described in the patent application 'a plating line steering device (patent application No. 2020230015261)'; the transfer following frame is realized by adopting the technical content described in the patent application 'a plating line transfer following frame (patent application number: 2020230015558)'; the method is realized by adopting the technical content of the patent application 'a circuit board annular metallization processing line (patent application number: 2020230072442)'; this is achieved using the technical teaching of the patent application "a plating jig (patent application No. 2020230072669)".

It should be further noted that, the technical process of etching the circuit board to be etched in the etching device by using the vertical loading device of the vertical continuous carrying manner and the etching device of the etching processing manner can be realized by using the technical contents described in the patent application "a vertical continuous etching device and etching method (patent application No. 2021108820545)"; the vertical continuous etching needs to use a clamp to clamp a circuit board for processing, when the processing mode is single-row processing, the clamp can be realized by adopting the technical content described in the patent application 'an electroplating clamp (patent application No. 2020230072669)', and when the processing mode is multi-row processing, the clamp can be realized by adopting the technical content described in the patent application 'a multi-row chuck (patent application No. 2021217828151)'; when the processing needs to realize the rotation of the circuit board in the vertical direction, the technical content described in the patent application 'a vertical rotation device for processing the circuit board (patent application number: 2021217827958)' can be adopted; it should be noted that, as a processing method of the cylinder mode, a vertically continuous etching line cylinder structure described in the patent application "a vertically continuous etching line cylinder structure (patent application No. 2021217810764)" can be adopted.

In addition, in the techniques of the above patent applications, the metal parts of the mechanism, which are in contact with the processing chemical, are made of titanium, which can effectively prevent the etching chemical from corroding during the processing.

It should be further noted that the above patent applications for inventions: the electroless metal processing line and unit carrier transport structure (patent application No. 2021100347178) is but one of the alternative specific mechanical structural implementations of a vertical continuous etch line described in the present invention.

Further, the etching device is a spraying type etching device.

It should be further noted that the etching processing device adopting the spraying mode adopts the spraying mechanisms which are consistent with the vertical direction of the circuit board and are arranged on the two sides of the circuit board to spray the etching liquid medicine on the two sides of the circuit board to form the device for etching process, the spraying mode is that the spraying matrixes are correspondingly distributed on the first side of the circuit board, the spraying matrixes are correspondingly distributed on the second side of the circuit board, and the spraying matrixes spray the etching liquid medicine towards the surface of the circuit board to form the etching of the circuit board in the vertical and continuous transportation process of the circuit board.

It is further explained with reference to the patent applications for invention: the chemical deposition metal processing line and unit carrying transport structure (patent application No. 2021100347178) is divided into an upper transport and processing section and a lower processing and supporting section, and the spraying mode is generally distributed on the upper layer of the vertical continuous etching line.

Furthermore, the etching processing device comprises a soaking mode etching processing device and a spraying mode etching processing device, the circuit board to be etched is etched by the soaking mode etching processing device firstly, and then is etched by the spraying mode etching processing device, and the inside of the soaking mode etching processing device is distributed with an internal spraying device.

It should be further noted that, the immersion etching device and the spraying etching device are used to immerse the circuit board completely in the cylinder filled with the etching solution for immersion etching, and after the immersion etching is completed, the circuit board is further processed by spraying, and the spraying processing is optional, such as etching, trimming, cleaning, corrosion inhibition, film removal and the like.

It needs to be further explained that, inside of the etching processing device with the soaking mode is also distributed with internal spraying devices for enhancing the circulation speed and force of the etching liquid medicine during etching, so that the etching liquid medicine can fully act on the surface of the circuit board.

It is further explained with reference to the patent applications for invention: the chemical deposition metal processing line and the unit carrying and transporting structure (patent application No. 2021100347178) are divided into an upper transporting and processing section and a lower processing and supporting section, the etching processing device in the soaking mode is generally distributed on the lower layer of the vertical continuous etching line, and the etching processing device in the spraying mode is generally distributed on the upper layer of the vertical continuous etching line.

Furthermore, the etching processing device comprises a spraying etching processing device and a soaking etching processing device, the circuit board to be etched is etched by the spraying etching processing device firstly, and then is etched by the soaking etching processing device, and the soaking etching processing device is internally provided with an internal spraying device.

It should be further noted that the spraying etching device and the soaking etching device are used for spraying the circuit board, the spraying processing is optionally etching, finishing, cleaning, corrosion inhibition, film removal, pretreatment and the like, and after the spraying processing is finished, the circuit board is further processed in a soaking mode.

It needs to be further explained that, inside of the etching processing device with the soaking mode is also distributed with internal spraying devices for enhancing the circulation speed and force of the etching liquid medicine during etching, so that the etching liquid medicine can fully act on the surface of the circuit board.

It is further explained with reference to the patent applications for invention: the chemical deposition metal processing line and the unit carrying and transporting structure (patent application No. 2021100347178) are divided into an upper transporting and processing section and a lower processing and supporting section, the spraying type etching processing device is generally distributed on the upper layer of the vertical continuous etching line, and the soaking type etching processing device is generally distributed on the lower layer of the vertical continuous etching line.

It should be further noted that the different etching processing devices can be selectively applied to different processing devices according to the conditions of line width/line gap, pattern structure, material, softness, thickness, etc. of the circuit board to be processed; generally, the etching processing device of the spraying mode is used for processing circuit boards with simpler and simpler circuit patterns, lower precision and lower etching effect requirement, the etching processing device of the soaking mode and the etching processing device of the spraying mode are generally used for processing circuit boards with simpler and simpler circuit patterns, lower precision and higher etching effect requirement, and the etching processing device of the spraying mode and the etching processing device of the soaking mode are generally used for processing circuit boards with simpler and simpler circuit patterns, lower precision and certain requirement on etching effect, but do not require very strict circuit board processing.

Further, the method steps of the etching process include:

carrying out high-concentration etching treatment on the circuit board to be etched to obtain an etched circuit board;

washing the etched circuit board with water;

and drying the etched circuit board.

It should be further noted that, for each of the different etching apparatuses, different etching methods may be correspondingly adopted, and optionally, the etching method adopts the most basic etching manner, that is, the processing steps of high-concentration etching → water washing → drying are adopted for etching, the high-concentration etching is adopted for pattern etching on both sides of the circuit board to be etched, and after the pattern etching is completed, the circuit board is washed with water in the water washing manner and then dried, so as to realize the whole processing process of circuit board etching.

Further, the method steps of the etching process include:

carrying out high-concentration etching treatment on the circuit board to be etched to obtain a first etched circuit board;

carrying out rapid water washing on the first etched circuit board;

carrying out secondary treatment on the first etched circuit board to obtain a second processed circuit board;

washing the second etched circuit board with water;

and drying the second processing circuit board.

It is further noted that, alternatively, the etching is performed by using the processing steps of high concentration etching → rapid water washing → secondary treatment → water washing → drying.

Further, the method steps of the etching process include:

carrying out high-concentration etching treatment on the circuit board to be etched to obtain a first etched circuit board;

performing air knife processing on the first etched circuit board;

carrying out rapid water washing on the first etched circuit board;

carrying out secondary treatment on the first etched circuit board to obtain a second processed circuit board;

washing the first etched circuit board with water;

and drying the second processing circuit board.

It is further noted that high concentration etching → air knife → rapid water washing → secondary treatment → water washing → drying is optionally employed.

Further, the method steps of the etching process include:

carrying out high-concentration etching treatment on the circuit board to be etched to obtain a first etched circuit board;

performing air knife processing on the first etched circuit board;

carrying out rapid water washing on the first etched circuit board;

rotating the first etching circuit board by 180 degrees up and down;

carrying out secondary treatment on the first etched circuit board to obtain a second processed circuit board;

washing the first etched circuit board with water;

and drying the second processing circuit board.

It is further noted that high-concentration etching → air knife → rapid water washing → up-and-down rotation by 180 ° → secondary treatment → water washing → drying is optionally employed.

Further, the secondary treatment is one of high-concentration etching treatment, low-concentration etching treatment, corrosion inhibition chemical treatment, cleaning chemical treatment and film removing chemical treatment.

It should be further noted that the above-mentioned secondary treatment is to perform secondary processing on the circuit board after the first etching, and the secondary treatment needs to be specifically selected according to different types of circuit boards and different processing requirements and processing effects.

Further, the up-down rotation 180 ° processing includes rotation position processing and rotation mode processing; wherein the content of the first and second substances,

the rotation position processing is rotation on the upper layer of the vertical continuous etching line or rotation on the lower layer of the vertical continuous etching line;

the rotation mode processing comprises one of double-sided prop type rotation, sucker type rotation, double-sided chuck type rotation and mechanical arm clamping type rotation.

It needs to be further explained that the processing of rotating up and down 180 degrees can better improve the etching uniformity during the vertical continuous etching, because the vertical continuous etching, the liquid medicine can be influenced by gravity and flows downwards on the plate surface, for a horizontal line with the same direction as the line body transportation direction, the liquid medicine flows downwards, which easily causes the problem that the etching on the upper side of the line is more and the etching on the lower side is less, namely the problem that the line etching is unbalanced, and the processing of rotating up and down 180 degrees is adopted, so that the circuit board is vertically downward to be etched, when half of the etching is reached, the upper end and the lower end of the circuit board are exchanged, and then the etching is continued, thus, the problem of unbalanced etching can be effectively solved.

It should be further noted that, when the Flexible Printed Circuit (FPC) is etched by using the vertical continuous etching line of the present invention, the FPC needs to be fixed by using a reinforcing jig to form a pseudo hard circuit board structure, and then etching is performed.

The method has the advantages that the vertical continuous etching effect can be realized by adopting different etching devices and combining different etching methods through a vertical continuous etching mode, the 'pool effect' in the etching process is effectively reduced, and different line body processing can be adopted for different circuit board types and circuit layout types through the combined processing design of different flows, so that a diversified and personalized processing mode is formed.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic diagram of a logic process for operating a vertical continuous etching line according to the present invention.

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture, and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if the meaning of "and/or" and/or "appears throughout, the meaning includes three parallel schemes, for example," A and/or B "includes scheme A, or scheme B, or a scheme satisfying both schemes A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

In order to better understand the technical scheme, the technical scheme is described in detail below with reference to the accompanying drawings.

Referring to fig. 1, fig. 1 is a schematic diagram illustrating a logic process of a vertical continuous etching line operation, in which first, a vertical loading device adopting a vertical continuous carrying manner and an etching device adopting an etching manner are adopted for an entire line body.

The vertical clamping device can be one of a spraying etching device, a soaking etching device, a spraying etching device and a soaking etching device.

Based on the vertical loading device, the adopted method steps of etching processing can be selected from one of the steps of high-concentration etching → water washing → drying, high-concentration etching → rapid water washing → secondary processing → water washing → drying, high-concentration etching → air knife → rapid water washing → up-down rotation by 180 degrees → secondary processing → water washing → drying.

Wherein, for the second treatment, one of high-concentration etching, low-concentration etching, corrosion inhibition chemical treatment, cleaning chemical treatment and film removing chemical treatment can be selected.

Wherein, for the rotation mode of rotating up and down 180 degrees, the selectable mode is one of double-sided top column type rotation, sucker type rotation, double-sided chuck type rotation and mechanical arm clamping type rotation.

Wherein for a rotational position rotated up and down by 180 °, optionally the upper layer of vertically successive etch lines is rotated and the lower layer of vertically successive etch lines is rotated.

The processes form an integral structure, can be flexibly combined, and can make correspondingly selected vertical continuous etching lines according to the characteristics and the characteristics of the circuit board to be processed.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the embodiments of the present invention, and all modifications and equivalents that can be made by using the contents of the description and drawings of the embodiments of the present invention or directly/indirectly applied to other related technical fields are included in the scope of the embodiments of the present invention.

Claims (10)

1. The vertical continuous etching line is characterized by comprising a vertical loading device adopting a vertical continuous carrying mode and an etching processing device adopting an etching processing mode, wherein a circuit board to be etched is etched and processed on the etching processing device through the vertical loading device.

2. The vertically continuous etch line of claim 1, wherein the etch process device is a spray-type etch process device.

3. The vertical continuous etching line according to claim 1, wherein the etching processing device comprises a soaking type etching processing device and a spraying type etching processing device, the circuit board to be etched is etched by the soaking type etching processing device, and then is etched by the spraying type etching processing device, and an internal spraying device is distributed inside the soaking type etching processing device.

4. The vertical continuous etching line according to claim 1, wherein the etching processing device comprises a spraying etching processing device and a soaking etching processing device, the circuit board to be etched is etched by the spraying etching processing device and then etched by the soaking etching processing device, and an internal spraying device is distributed inside the soaking etching processing device.

5. The vertically continuous etch line of any of claims 2-4, the method steps of the etching process comprising:

carrying out high-concentration etching treatment on the circuit board to be etched to obtain an etched circuit board;

washing the etched circuit board with water;

and drying the etched circuit board.

6. The vertically continuous etch line of any of claims 2-4, the method steps of the etching process comprising:

carrying out high-concentration etching treatment on the circuit board to be etched to obtain a first etched circuit board;

carrying out rapid water washing on the first etched circuit board;

carrying out secondary treatment on the first etched circuit board to obtain a second processed circuit board;

washing the second etched circuit board with water;

and drying the second processing circuit board.

7. The vertically continuous etch line of any of claims 2-4, the method steps of the etching process comprising:

carrying out high-concentration etching treatment on the circuit board to be etched to obtain a first etched circuit board;

performing air knife processing on the first etched circuit board;

carrying out rapid water washing on the first etched circuit board;

carrying out secondary treatment on the first etched circuit board to obtain a second processed circuit board;

washing the first etched circuit board with water;

and drying the second processing circuit board.

8. The vertically continuous etch line of any of claims 2-4, the method steps of the etching process comprising:

carrying out high-concentration etching treatment on the circuit board to be etched to obtain a first etched circuit board;

performing air knife processing on the first etched circuit board;

carrying out rapid water washing on the first etched circuit board;

rotating the first etching circuit board by 180 degrees up and down;

carrying out secondary treatment on the first etched circuit board to obtain a second processed circuit board;

washing the first etched circuit board with water;

and drying the second processing circuit board.

9. The vertical continuous etching line according to any one of claims 6 to 8, wherein the secondary treatment is one of a high concentration etching treatment, a low concentration etching treatment, a corrosion inhibition chemical treatment, a cleaning chemical treatment, and a film removal chemical treatment.

10. The vertically continuous etch line of claim 8, the up-down rotation by 180 ° process comprising a rotational position process and a rotational mode process; wherein the content of the first and second substances,

the rotation position processing is rotation on the upper layer of the vertical continuous etching line or rotation on the lower layer of the vertical continuous etching line;

the rotation mode processing comprises one of double-sided prop type rotation, sucker type rotation, double-sided chuck type rotation and mechanical arm clamping type rotation.

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