JP2019204807A - Substrate material etching device - Google Patents

Abstract

To provide a substrate material etching device in which the etch factor and etch rate are improved, the etching uniformity is maintained, and the transport stability is ensured at the same time.SOLUTION: An etching apparatus 11 etches a substrate material A to be conveyed by spraying an etching liquid B from a spray nozzle 4 onto the substrate material A and includes dam rolls 10 and 12, a liquid stopper bar 13, and a transition jig 14. Due to the setting of the vertical distance E between the spray nozzle 4 and the substrate material A, the etch factor and the etch rate are improved. Regardless of this setting, etching uniformity is maintained by the setting of the left-right pitch interval F and the inclined spray angle α of the spray nozzle 4 and the arrangement of the upper and lower dam rolls 10 and 12 and the liquid stopper bar 13. Moreover, regardless of the arrangement of the dam rolls 10 and 12, the arrangement of the transition jig 14 ensures the conveyance stability of the substrate material A.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a substrate material etching apparatus. That is, the present invention relates to a substrate material etching apparatus used in a manufacturing process of an electronic circuit board.

《Technical background》
Printed wiring boards and other electronic circuit boards used in electronic devices have made significant progress in miniaturization, weight reduction, ultrathinning, and flexibility, and the density and miniaturization of formed electronic circuits are also remarkable.
The typical manufacturing process of such an electronic circuit board is as follows. First, a photosensitive resist (etching resist) is applied or affixed to a substrate material made of a copper-clad laminate.
Then, exposure is performed by applying a negative film of the circuit, and the resist other than the circuit forming portion is dissolved and removed by a development process. Then, after the copper foil other than the exposed circuit forming portion is dissolved and removed by an etching process, the resist of the circuit forming portion is dissolved and removed by a peeling process.
Therefore, an electronic circuit is formed with the copper foil of the circuit forming portion remaining on the outer surface of the substrate material, and the electronic circuit board is manufactured.

<< General Example Etching Apparatus 1 >>
FIG. 6B shows a general example of the etching apparatus 1 used in the manufacturing process of such an electronic circuit board.
In this etching apparatus 1, etching is performed by spraying an etching solution B from the spray nozzle 4 onto the upper and lower surfaces of the workpiece, that is, the substrate material A, which is conveyed by the wheel 3 of the conveyor 2.
In the figure, 5 is a chamber, 6 is a liquid tank, 7 is a spray pump, and 8 is a spray tube (shower tube). C indicates the conveyance direction (front-rear direction), and D indicates the vertical direction.

<< Conventional Etching Apparatus 9 >>
FIGS. 3, 4, and 5 (2) show a conventional example of the etching apparatus 9. In this etching apparatus 9 as well, as in the etching apparatus 1 of the general example described above, from the spray nozzles 4 arranged in large numbers on the top and bottom, left and right, front and back on both surfaces of the substrate material A that is horizontally conveyed by the wheel 3 of the conveyor 2. Etching is performed by spraying an etching solution B through the spray zone Z.
In accordance with the general example described above, the spray nozzle 4 has a vertical distance E between the substrate material A of 90 mm or more, a left-right pitch distance F of 70 mm or more, an injection pressure of 0.18 Mpa on the upper side, and 0.16 Mpa on the lower side. It is provided. The lower spray nozzle 4 was provided perpendicular to the substrate material A without being inclined.

By the way, in this etching apparatus 9, unlike the general example described above, the spray nozzles 4 are directed alternately in the left-right direction G at an injection angle α inclined obliquely from vertical ((2 in FIG. 5). ) See diagram).
Further, on the upper side, dam rolls 10 made of straight rollers are arranged in a front-rear pair via a spray zone Z of the spray nozzle 4 and are arranged so as to contact the upper surface of the substrate material A to be conveyed.

By the way, the following first, second, and third problems have been pointed out with respect to such a conventional etching apparatus 9.
<< First: Improvement of etch factor and etch rate >>
First, there was a strong demand for improvement in etch factor and etch rate.
That is, as described above, the electronic circuit board and its electronic circuit have been remarkably advanced in density and miniaturization, and further improvement of the etch factor and further improvement of the etch rate are strongly desired. It was.
These will be further described in detail. Regarding the pattern of the electronic circuit to be formed, FIG. 7B shows an ideal example having a rectangular cross section. (3) The figure shows a good example of a cross section close to this. On the other hand, FIG. (4) shows a bad example in which the cross section forms a trapezoid with a steep slope. In the figure, L is a circuit width (bottom width), T is a top surface width (top width), S is an inter-circuit space, and H is a circuit height (depth).
As for the etching apparatus 9, a highly accurate etching, that is, a circuit that is finished close to a rectangular cross section as shown in FIG. K pattern formation has been strongly desired. The need for further improvement in etch factor was growing.
Further, there has been a strong need for improving the etching speed and further improving the etch rate.

<< Second: Maintenance of etching uniformity >>
Second, maintenance of etching uniformity has been a problem.
The above-described improvement in etch factor and etch rate are achieved by the etching solution B having a stronger impact spray strength (strength when the etching solution B sprayed from the spray nozzle 4 collides with and sprays the substrate material A). ). A strong impact spray hitting force is realized by making the vertical distance E between the spray nozzle 4 and the substrate material A closer.
That is, in the etching apparatus 9 of the conventional example, the spray nozzle 4 is made closer to the substrate material A, that is, the vertical distance E, which is 90 mm or more in the conventional example and the general example, is set short. Improved spray hitting force, etch factor and etch rate.

However, when the vertical distance E is made closer, there arises a problem that the etching uniformity is deteriorated and deteriorated.
This problem will be further described in detail. In a normal state, the sprayed etching solution B flows in the left-right direction G on the outer surface of the upper surface and the lower surface of the substrate material A. After etching the substrate material A, it flows down and is discharged from both the left and right sides. Updated to fresh liquid.
On the other hand, when the spray nozzle 4 is moved closer and the spray hitting force is further increased, the depth and width of the formed circuit K vary, and the etching uniformity is likely to be impaired.
That is, for the outer surfaces of the upper surface and the lower surface of the substrate material A, a. A difference occurs in the spray hitting force of the etching solution B depending on whether or not it is directly below the spray nozzle 4; b. The flow and update of the etching solution B are hindered. c. Etching solution B is scattered or flows in the front-rear direction C. d. Liquid accumulation or stagnation occurs. Etching causes excessive or insufficient etching and slow speed.

Even in the conventional etching apparatus 9, measures for restricting the flow of the etching solution B on the upper surface of the substrate material A, such as providing a dam roll 10 on the upper side and tilting the upper spray nozzle 4, that is, measures for maintaining etching uniformity are taken. However, it was insufficient as a countermeasure against strong spray hitting force.
For example, there is a possibility that the etching solution B will bounce off the substrate material A and scatter in the front-rear direction C due to a strong spray hitting force. In addition, since the jetted etching solution B naturally falls and falls under its own weight, there is a concern about the occurrence of problems in the case of a strong spray hitting force even on the lower surface of the substrate material A that has been considered to have no problem in etching uniformity. .
It has been pointed out that the etching uniformity is impaired as the etch factor and the etching rate are improved, which is a big problem.

<< Third: Ensuring transport stability >>
Thirdly, ensuring transport stability has been a problem.
Electronic circuit boards and board materials A have made significant progress in terms of weight reduction, ultrathinning, and flexibility. In the etching apparatus 9, the substrate material A is sandwiched between the upper and lower wheels 3 of the conveyor 2 and conveyed.
On the other hand, as described above, the dam roll 10 is provided as a measure for maintaining the etching uniformity of the upper surface of the substrate material A. However, the use of the upper wheel 3 is refrained from being omitted and deleted instead. Yes. Instead of the wheel 3, a dam roll 10 is provided.
In addition, as a measure for maintaining the etching uniformity on the lower surface of the substrate material A, it has been considered to provide a new dam roll instead of the wheel 3 for the main part. However, the use of the lower wheel 3 can be avoided instead. Lack or reduction.
In this case, there is a possibility that the substrate material A, which has been significantly reduced in weight and thickness, may not be stably transported, and it is pointed out that the substrate material A may be dropped during transportation.
Therefore, it has been required to ensure the conveyance stability of the substrate material A regardless of the improvement of the etching factor and the etching rate described above and the maintenance of the etching uniformity.

<< About the present invention >>
In view of such circumstances, the substrate material etching apparatus of the present invention has been made to solve the above-described problems of the prior art.
The first aspect of the present invention is an apparatus for etching a substrate material, in which an etching factor and an etching rate are improved, secondly, etching uniformity is maintained, and thirdly, transport stability is ensured at the same time. The purpose is to propose.

<About each claim>
The technical means of the present invention for solving such a problem is as follows, as described in the claims.
About Claim 1, it is as follows.
The substrate material etching apparatus according to the first aspect is used in the manufacturing process of the electronic circuit board, and etches the both sides of the substrate material conveyed by the conveyor by spraying an etching solution from the spray nozzle. And it has an upper and lower dam roll, an upper liquid stop bar, and a lower transition jig.
The conveyor conveys the substrate material between upper and lower wheel groups.
The spray nozzles are opposed to the substrate material to be conveyed in each spray zone, and are arranged in a large number in the upper, lower, left, and front, and are inclined obliquely toward the left or right direction. .
The dam roll is composed of a straight roller, and is arranged in a front-rear pair via the spray zone. The dam roll is arranged to come into contact with the substrate material to be transported, and the sprayed etching liquid is the substrate material. To flow back and forth on the upper and lower surfaces of the.
The liquid stop bar restricts the etchant from flowing back and forth beyond the dam roll.
A large number of the crossing jigs are arranged on the left, right, front and back, and the lower surface of the substrate material to be conveyed is in contact with and held.

About Claim 2, it is as follows.
In the substrate material etching apparatus according to claim 2, in claim 1, the spray nozzle is set such that the vertical distance between the spray nozzle and the substrate material is set to 30 mm or more and 80 mm or less. It is characterized by being sprayed onto the substrate material with a spray impact having a strong impact.
About Claim 3, it is as follows.
In the substrate material etching apparatus according to claim 3, in claim 2, the spray nozzle has an injection pressure of 0.1 MPa to 0.3 MPa, a left-right pitch interval of 30 mm to 60 mm, and an inclination. The injection angle is set to 10 degrees or more and 30 degrees or less.
About Claim 4, it is as follows.
In the substrate material etching apparatus according to claim 4, in claim 3, the bridging jig has a substantially vertical plate shape and is stretched between the dam roll and the shaft of the wheel before and after the dam roll. An upper end edge that is substantially linear in a direction is in contact with the lower surface of the substrate material conveyed near the dam roll from below.

About Claim 5, it is as follows.
According to a fifth aspect of the present invention, there is provided an apparatus for etching a substrate material according to the fourth aspect, wherein the etching factor and the etching rate are improved by setting the vertical distance between the spray nozzle and the substrate material.
Regardless of the setting of the vertical distance, the etching uniformity is maintained by setting the horizontal pitch interval and the inclined spray angle of the spray nozzle and disposing the dam roll and the liquid stop bar.
In addition, regardless of the arrangement of the upper and lower dam rolls, the conveyance stability of the substrate material is ensured by the arrangement of the transition jig.
About Claim 6, it is as follows.
The substrate material etching apparatus according to claim 6 is the substrate material etching device according to claim 5, wherein the dam roll is driven and is disposed opposite to the upper and lower sides, so that the substrate material is conveyed by sandwiching the substrate material. It is characterized by further ensuring stability.

<About the action>
Since the present invention comprises such means, the following is achieved.
(1) In the etching apparatus, etching is performed by spraying an etching solution from a spray nozzle onto both surfaces of a substrate material conveyed by a conveyor.
(2) In the present invention, the vertical distance between the spray nozzle and the substrate material is set to 30 mm to 80 mm.
(3) Since the two are close to each other as described above, the etching solution is sprayed onto the substrate material with a strong spray hitting force, and the etch factor and the etch rate are improved.
(4) The spray pressure of the spray nozzle is 0.1 Mpa to 0.3 Mpa, and such a strong spray hitting force is realized without increasing its capability.
(5) By the way, the present invention employs a combination of upper and lower dam rolls, liquid stop bars, dense left and right pitch intervals of spray nozzles of 30 mm to 60 mm, and inclined spray angles of 10 to 30 degrees of spray nozzles. It becomes.
(6) Therefore, even though the etching solution is sprayed with a strong spray hitting force, the occurrence of scattering to the front and rear, outflow, impact difference, liquid accumulation, retention and the like is prevented. The etchant flows and etches the substrate material from side to side as expected, then flows down from both sides, and is discharged and renewed.
Accordingly, excessive or insufficient etching and slow speed are avoided, circuits are formed without variation, and etching uniformity is maintained.
(7) By the way, in the present invention, many dam rolls are provided, and accordingly, the use of the wheels of the conveyor is constrained and reduced or reduced accordingly.
(8) Accordingly, in the present invention, the transition jig holds and supports the substrate material conveyed near the dam roll from the lower side.
Also, the upper and lower dam rolls support and sandwich the substrate material to be transported. Therefore, the conveyance stability is ensured despite the decrease in the number of wheels.
(9) As described above, the etching apparatus of the present invention maintains the etching uniformity despite the improvement in the etch factor and the etch rate. In addition, the conveyance stability is ensured in spite of maintaining the etching uniformity.
(10) Therefore, the substrate material etching apparatus according to the present invention exhibits the following effects.

<< First effect >>
First, the etch factor and etch rate are improved.
In the etching apparatus of the present invention, the vertical distance between the spray nozzle and the substrate material is set close, and the etching solution is sprayed onto the substrate material with a spray impact having a strong impact.
Therefore, the etch factor is improved and the etch rate is improved, so that it is possible to reliably and promptly cope with a circuit board in which density and miniaturization progress.

<< Second effect >>
Second, etching uniformity is maintained.
In the etching apparatus of the present invention, a dam roll is also disposed on the lower side, a liquid stop bar is disposed on the upper side, and the left and right pitch intervals are set densely and inclined with respect to the upper and lower spray nozzles. .
Therefore, excessive or insufficient etching and slow speed are avoided, and the circuit is formed without variation. As described above, in order to improve the etch factor and etch rate, the etching uniformity is maintained despite the fact that the spray nozzle is brought closer to the substrate material to increase the spray hitting force.

《Third effect》
Thirdly, conveyance stability is ensured simultaneously with these.
The etching apparatus of the present invention is provided with a crossing jig, and supports the conveyance by holding the substrate material from the lower side. The upper and lower dam rolls support and convey the substrate material.
Therefore, in order to maintain the etching uniformity, the dam rolls are arranged above and below as described above, and the conveyance stability is ensured without changing the use of the wheel.
As described above, the effects exerted by the present invention are remarkably large, such as all the problems existing in this type of prior art are solved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory side view of a main part of an apparatus for etching a substrate material according to the present invention. It uses for description of the form for implementing this invention, (1) A figure is a plane explanatory view of the principal part, (2) A figure is bottom face explanatory drawing of the principal part. It is a side explanatory view of the principal part for explanation of a conventional example. For the description of the conventional example, (1) is a plan explanatory view of the main part, and (2) is a bottom explanatory view of the main part. (1) A figure is a front explanatory drawing of the principal part for explanation of the form for carrying out the invention. (2) The figure is a front explanatory view of the main part for explaining the conventional example. (1) The figure is a side view of a transition jig for explaining the embodiment for carrying out the invention. (2) FIG. 2 is a side view of a general example of an etching apparatus. It is used for explanation of the electronic circuit board. And (1) figure is plane explanatory drawing. (2) Figures, (3) and (4) are enlarged cross-sectional explanatory views of the circuit. (2) Figure is an ideal example, (3) Figure is a good example, and (4) Figure is a bad example. Show. It is a cross-sectional photograph of a circuit for explanation of an electronic circuit board. And (1) figure is used for description of the form for implementing this invention, and (2) figure is used for description of a prior art example. It is for the description of the form for implementing this invention, and is a graph of an etch rate.

Hereinafter, the present invention will be described in detail with reference to the drawings.
<< Outline of the Invention >>
First, the outline of the present invention is as follows.
The substrate material A etching apparatus 11 according to the present invention is used in the manufacturing process of the electronic circuit board J, and etches by spraying the etching solution B from the spray nozzle 4 onto both surfaces of the substrate material A conveyed by the conveyor 2. To do. And it has the upper and lower dam rolls 10 and 12, the upper liquid stop bar 13, and the lower transition jig 14.
First, the etching factor and the etching rate are improved by setting the vertical distance E between the spray nozzle 4 and the substrate material A.
Regardless of the setting of the vertical distance E, the etching uniformity can be achieved by setting the horizontal pitch distance F and the inclined spray angle α of the spray nozzle 4 and the arrangement of the upper and lower dam rolls 10 and 12 and the liquid stop bar 13. Is maintained.
Moreover, regardless of the arrangement of the upper and lower dam rolls 10 and 12, the conveyance stability of the substrate material A is ensured by the arrangement of the transition jig 14.
As described above, in the present invention, the etching uniformity is maintained regardless of the improvement in the etching rate and the etching factor. In addition, the conveyance stability is ensured despite the etching uniformity being maintained.
The outline of the present invention is as described above. Hereinafter, the etching apparatus 11 for the substrate material A according to the present invention will be described in more detail.

<< Electronic circuit board J >>
The etching apparatus 11 of the present invention is used in the manufacturing process of the electronic circuit board J. First, the electronic circuit board J will be generally described with reference to FIG.
The electronic circuit board J such as a printed wiring board is remarkably progressed in size reduction, weight reduction, ultrathinning, and flexibility, and the formed electronic circuit K is also markedly increased in density and miniaturization.
And the board | substrate material A used by the manufacturing process consists of a copper clad laminated board by which copper foil was affixed on the insulating base material. A typical one having a size of 500 mm × 400 mm or 600 mm × 500 mm and a thickness of about 0.06 mm × 1.6 mm is typical.
Many of the electronic circuits K to be formed have a circuit width (bottom width) L of about 5 μm to 40 μm, an inter-circuit space S of about 5 μm to 40 μm, and a circuit height (depth) H of about 12 μm to 35 μm. It has become to.

The electronic circuit board J is composed of a double-sided board on which the electronic circuit K is formed on the front and back sides, and is divided into a rigid rigid type and a film-like flexible type. . The present invention is widely applied to various types of electronic circuits K in addition to conventional printed wiring boards.
As a method for manufacturing such an electronic circuit board J, a subtractive method (see the background art section described above), a semi-additive method, and other various manufacturing methods are known. Applied about the method. For example, half etching, soft etching, quick etching, etc. are used.
The electronic circuit board J is as described above.

<< Etching device 11 >>
Hereinafter, the etching apparatus 11 of the present invention will be described. First, the etching apparatus 11 will be generally described with reference to FIG. 1, FIG. 2, FIG.
The etching apparatus 11 is used in the above-described manufacturing process of the electronic circuit board J, and etches the etching liquid B from the upper and lower spray nozzles 4 onto both the upper and lower surfaces of the substrate material A that is horizontally conveyed by the conveyor 2. To process.
The etching solution B is made of cupric chloride, ferric chloride, or other corrosive solution, and dissolves and removes the exposed copper foil portion of the substrate material A. The etching solution B after the etching process flows down to the liquid tank 6 of the chamber 5 and is collected and stored as shown in FIG. 6 (2), and then the spray pump 7, the filter, the spray tube 8 and the like. Circulated to the spray nozzle 4 and reused.

The conveyor 2 conveys the substrate material A between the upper and lower wheels 3 in the conveying direction (front-rear direction) C. The wheel 3 is composed of, for example, a driven ring wheel having a diameter of 32 mm, and a large number are arranged on the front, rear, left, and right.
Many wheels 3 correspond to each other in the vertical direction, but are disposed only on the upper side on the lower spray zone Z, and are disposed only on the lower side below the upper spray zone Z. Each wheel 3 is attached to a wheel shaft 15.
The wheel shafts 15 are arranged at equal pitch intervals in the transport direction C. Of course, the arrangement of the dam rolls 10 and 12 is lacking. As for the dam rolls 10 and 12, the arrangement of the wheel shafts 15 and the arrangement of the wheels 3 are refrained. That is, instead of the wheel shaft 15 and the wheel 3, the dam rolls 10 and 12 are provided.
For example, 15 wheels 3 are arranged on each wheel shaft 15 in the left-right direction (width direction) G at equal pitch intervals, but those arranged near the lower spray zone Z are as follows. , Has become a smaller number.
That is, on the lower side, the wheel shaft 15 and the wheel 3 are disposed closer to the spray zone Z than the upper side in order to prevent the transported substrate material A from falling. In order to avoid this, the number of wheels 3 is thinned out, and the number is small.
Each wheel shaft 15 is installed between holder frames (not shown) provided on the left and right sides of the chamber 5. When observed in the conveyance direction (front-rear direction) C, the respective wheels 3 positioned in the front-rear direction are arranged in a partially overlapping positional relationship.
The general description of the etching apparatus 11 is as described above.

<About spray nozzle 4>
First, the spray nozzle 4 of the etching apparatus 11 of the present invention will be described with reference to FIG. 1, FIG. 2, FIG.
The spray nozzles 4 are arranged facing the substrate material A to be conveyed in each spray zone Z, and are arranged in a large number in the upper, lower, left and right directions, and are inclined obliquely toward the left or right direction. Yes.
The vertical distance E between the substrate material A is set to 30 mm or more and 80 mm or less, so that the etching solution B is sprayed onto the substrate material A with a strong impact spray hitting force. Yes.
Further, the injection pressure is set to 0.1 MPa to 0.3 MPa, the left and right pitch interval F is set to 30 mm to 60 mm, and the inclined injection angle α is set to 10 degrees to 30 degrees. Yes.

Such a spray nozzle 4 will be further described in detail. A number of spray nozzles 4 are arranged in the vertical direction D, the horizontal direction G, and the front-back direction C. The spray nozzle 4 in the illustrated example is a long nozzle.
First, when the conveyance direction (front-rear direction) C is observed, the horizontal direction (width direction) G is slightly set so that the spray nozzles 4 positioned in the front-rear direction do not form a row so as not to correspond to each other. The positional relationship is shifted. That is, the space between the front and rear spray nozzles 4 is shifted in the left-right direction G so as not to be arranged in one line in the transport direction (front-rear direction) C.
Therefore, with respect to the substrate material A, consideration is given so that the portions subjected to the spray hitting force by the jetted etching solution B do not overlap on the same locus.
The spray nozzle 4 has the following settings.

First, the vertical spray distances E in the vertical direction D of the upper and lower spray nozzles 4 and the substrate material A of the pass line are set to approach each other. Thus, the etching solution B is sprayed onto the substrate material A with a strong impact spray hitting force (see FIGS. 1 and 5 (1)).
The vertical distance E is set to 30 mm to 80 mm. If it is less than 30 mm, the spray nozzle 4 becomes too close to the substrate material A, and the spray hitting force difference, impact difference, and strength difference received by the substrate material A in the etching solution B become prominent, and the etching solution in the substrate material A B rebounds and scatters.
On the other hand, if it exceeds 80 mm, it is too far, resulting in insufficient impact, insufficient spray hitting force, and insufficient etching.

Next, the spray pressures of the upper and lower spray nozzles 4 are set to 0.1 MPa to 0.3 MPa, respectively.
If it is less than 0.1 MPa, it is too weak, resulting in insufficient impact of the etching solution B on the substrate material A, insufficient spraying force, and insufficient etching. On the other hand, if it exceeds 0.3 MPa, it is too strong, and the impact difference, the spray hitting force difference, and the strength difference become conspicuous, and the rebound and scattering of the etching solution B on the substrate material A increase.
Therefore, for example, the spray pressure of the upper spray nozzle 4 is set to 0.18 MPa, and the spray pressure of the lower spray nozzle 4 is set to 0.16 MPa.

For the upper and lower spray nozzles 4, the left-right pitch interval F in the left-right direction G is set to 30 mm to 60 mm for each row sequentially arranged in the transport direction C.
In the case of less than 30 mm, it becomes difficult to dispose the spray nozzle 4. On the other hand, when the distance exceeds 60 mm, the mutual distance is too wide, and the impact difference, the spray hitting force difference, and the strength difference of the etching solution B become conspicuous due to the perspective difference with the spray nozzle 4.

The upper and lower spray nozzles 4 are alternately inclined in the left-right direction G (see FIGS. 2 and 5 (1)).
That is, the spray nozzles 4 arranged in the transport direction C are alternately directed in the right or left direction of the left-right direction G sequentially for each row. The same number of columns are provided in the right direction and in the left direction.
By such an inclined arrangement of the spray nozzle 4, the flow of the etching solution B sprayed onto the substrate material A in the left-right direction G is promoted. As a result, the renewal of the etching solution B, the solution pool elimination, and the residence elimination are achieved.
Therefore, the inclined injection angle α is set to 10 degrees to 30 degrees. When the angle is less than 10 degrees, the flow of the etching solution B is not promoted. On the other hand, when the angle exceeds 30 degrees, the impact difference, the spray hitting force difference, and the strength difference of the etching solution B become remarkable.
The spray nozzle 4 is as described above.

<< Dam Roll 10, 12 >>
Next, the dam rolls 10 and 12 of the etching apparatus 11 of the present invention will be described with reference to FIGS.
The upper and lower dam rolls 10 and 12 are made of straight rollers, are arranged in a front-rear pair via the spray zone Z, and are disposed so as to contact the substrate material A to be conveyed. Accordingly, the jetted etching liquid B is restricted from flowing back and forth on the upper and lower surfaces of the substrate material A.
In addition, the dam rolls 10 and 12 are driven and arranged to face each other in the vertical direction, so that the substrate material A is sandwiched and conveyed.

The upper and lower dam rolls 10 and 12 will be described in detail. In this etching apparatus 11, dam rolls 10 and 12 are arranged in pairs before and after each spray zone Z formed around the front and rear wheels 3 of the conveyor 2, that is, each spray space of the etchant B. Has been.
A pair of front and rear dam rolls 10 is arranged corresponding to each row of the upper spray nozzles 4, and a pair of front and rear dam rolls 12 are arranged corresponding to the rows of the lower spray nozzles 4. Yes.
The upper and lower dam rolls 10 and 12 are made of, for example, a straight roller having a diameter of 16 mm. And it arrange | positions with an axis | shaft toward the left-right direction G, and it is with a drive, and rotates in contact with the board | substrate material A.
The numerous dam rolls 10 and 12 prevent the etchant B sprayed from the spray nozzle 4 from flowing in the front-rear direction C along the upper and lower surfaces of the substrate material A. That is, the etching liquid B is regulated so as to flow only in the left-right direction G, thereby promoting renewal of the etching liquid B, elimination of the liquid pool, and elimination of the residence.
Further, the upper and lower dam rolls 10 and 12 are respectively disposed at positions facing each other in the upper and lower directions, and thus transport the substrate material A transported by the conveyor 2 while sandwiching it. The substrate material A is supported by the dam rolls 10 and 12 in an auxiliary manner, so that the substrate 3 is conveyed more stably.
As for the dam rolls 10 and 12, as described above.

<About the liquid stop bar 13>
Next, the liquid stop bar 13 of the etching apparatus 11 of the present invention will be described with reference to FIGS. 1 and 2 (1). Many liquid stop bars 13 are arranged on the upper side in order to restrict the etching liquid B from flowing back and forth beyond the upper dam roll 10.
That is, the liquid stop bar 13 is fixedly installed in the left-right direction G between the left and right holder frames (not shown), and thus is positioned higher than the dam rolls 10 with a slight gap.
Then, each liquid stop bar 13 causes the etching liquid B to be sprayed onto the substrate material A with a strong impact spray force, bounces off, scatters, overflows, and thus flows over the dam rolls 10 and flows out in the front-rear direction D. To regulate. The etching solution B that overflows only by the dam roll 10 is regulated at a higher level.
The liquid stop bar 13 restricts the etching liquid B to flow in the left-right direction G. That is, the above-described renewal promotion, liquid pool elimination, and residence elimination by the dam roll 10 are complemented.
The liquid stop bar 13 is as described above.

<< About the transition jig 14 >>
Next, the transition jig 14 of the etching apparatus 11 according to the present invention will be described with reference to FIGS. 1, 2 (2), FIG. 6 (1), and the like.
A large number of crossing jigs 14 are arranged on the lower left, right, front and rear, and abut the lower surface of the substrate material A being conveyed.
That is, the crossing jig 14 has a substantially vertical plate shape, is spanned between the lower dam roll 12 and the front and rear wheel shafts 15, and has an upper end edge that is substantially linear in the front-rear direction C. It contacts the lower surface of the substrate material A conveyed near the dam roll 12 from below.

Such a transition jig 14 will be further described in detail. The crossing jig 14 in the illustrated example has a vertical plate shape and includes three locking holes 16. The central locking hole 16 is fitted and locked in a groove formed on the outer periphery of the dam roll 12, and the front and rear locking holes 16 are externally fitted and locked to the wheel shafts 15 before and after the dam roll 12.
Accordingly, the crossing jig 14 is stretched between the lower dam rolls 12 and the wheel shafts 15 at the front and rear thereof. The upper end edge is substantially linear in the front-rear direction C, and the lower surface of the substrate material A that is transported and passed from the upper side is held in contact from the lower side.
Such crossing jigs 14 are arranged at equal pitches in the left-right direction G for each of the lower dam rolls 12. Therefore, the conveyance of the substrate material A is supported by the abutting and holding from the lower side.
In addition, the thing of various structures can be considered for the transfer jig 14 besides the example of illustration. For example, there is a configuration in which there are two locking holes 16, one locking hole 16 is fitted and locked in the groove of the dam roll 12, and the other locking hole 16 is fitted and locked to the wheel shaft 15. Is possible.

《Action etc.》
The substrate material A etching apparatus 11 of the present invention is configured as described above. Then, it becomes as follows.
(1) The etching apparatus 11 is used in the manufacturing process of the electronic circuit board J. Then, an etching solution B is sprayed from a plurality of spray nozzles 4 arranged on the top and bottom, left and right, and front and rear of the workpiece conveyed by the group of wheels 3 of the conveyor 2, that is, the upper and lower surfaces of the substrate material A. The upper and lower surfaces of the plate material A are etched (see FIG. 1 and the like).

(2) With regard to the electronic circuit board J and the electronic circuit K, the progress of high density and miniaturization is remarkable, and the demand for improving the etch factor and the etch rate is further increased.
In order to answer such needs, in this etching apparatus 11, a long nozzle is used as the spray nozzle 4, and the vertical distance E between the spray nozzle 4 and the substrate material A of the pass line is set to 30 mm to 80 mm. (See FIGS. 1 and 5 (1)). On the other hand, in the etching apparatus 9 of the conventional example, it was usually 90 mm or more (see FIGS. 3 and 5 (2)).

(3) Since the spray nozzle 4 and the substrate material A are close to each other as described above, the etching solution B is sprayed onto the substrate material A with a strong impact spray hitting force, so that the copper foil is dissolved and removed.
Therefore, etching with high accuracy is performed, and the circuit K having a cross section that is nearly rectangular is patterned (see FIG. 7 (3)), and the etch factor is improved. Further, the time required for etching is shortened, and the etching speed and the etching rate are improved.

  (4) Moreover, this can be realized without increasing the spraying pressure of the spray nozzle 4 or the capability of the spray pump 7 (see FIG. 6 (2)). The spray pressure (spray pressure) of the spray nozzle 4 is about 0.1 MPa to 0.3 MPa as before.

(5) Although the etching liquid B is sprayed onto the substrate material A with a strong spray hitting force based on such a close vertical distance E, the etching uniformity is maintained.
When these are described in detail, first, this etching apparatus 11 employs the following configurations.
-Dam rolls 10 and 12 are disposed not only on the upper side but also on the lower side (see FIGS. 1 and 2). On the other hand, the conventional etching apparatus 9 is arranged only on the upper side (see FIGS. 3 and 4).
A liquid stopper bar 13 is disposed on the upper side (see FIGS. 1 and 2 (1)).
The upper and lower spray nozzles 4 have a left-right pitch interval F set densely at 30 mm to 60 mm (see FIG. 2). On the other hand, in the etching apparatus 9 of the conventional example, it was 70 mm or more (see FIG. 4).
The upper and lower spray nozzles 4 are inclined and arranged at an inclination spray angle α set to 10 to 30 degrees (see FIG. 5 (1)). On the other hand, in the etching apparatus 9 of the conventional example, only the upper side is inclined (see FIG. 5B).

(6) The etching apparatus 11 employs a combination of the dam rolls 10 and 12, the liquid stopper bar 13, the left and right pitch interval F of the spray nozzle 4, and the spray angle α, so that the etching uniformity is improved. Maintained.
That is, although the etching solution B is sprayed with a strong spray hitting force, the upper surface and the lower surface of the substrate material A are scattered back and forth without flowing, flowing out, and the impact difference is eliminated, and the liquid pool and stay Does not occur. As expected, the etching solution B flows in the left-right direction G, etches the substrate material A, then flows down and is discharged from both the left and right sides, and is sequentially updated to a fresh solution.
Although the striking force is strengthened, excessive or insufficient etching and slow generation are prevented, and the circuit K is formed without variations in depth and width. In this way, the etching uniformity is maintained and maintained as before without decreasing.

(7) By the way, the board | substrate material A is pinched and conveyed by the wheel 3 group of the conveyor 2. FIG. On the other hand, in the present invention, many dam rolls 10 and 12 are provided in place of the wheel 3 in the upper and lower sides.
That is, with respect to the conveyor 2, the use of the wheel 3 is reduced to that extent, and many of the wheels 3 are partially missing at the locations where the dam rolls 10 and 12 are provided (FIGS. 1 and 2). FIG. 2 (2) and the conventional example of FIGS. 3 and 4 (2) are compared for comparison.
Therefore, as it is, anxiety arises in the stable conveyance of the substrate material A. Substrate material A is significantly reduced in weight, thickness, and flexibility. The lack of the lower wheel 3 and the increase in the reduction cause a risk of falling of the substrate material A during transportation. Retention is weak and insufficient.

(8) Now, in this etching apparatus 11, a large number of crossing jigs 14 are arranged on the lower left and right, front and rear, and the substrate material A transported around the dam rolls 10 and 12 by the conveyor 2, Abutting and holding from the lower side (see FIGS. 1 and 2 (2), FIG. 6 (1), etc.).
The transition jig 14 functions to support the conveyance of the substrate material A by the wheel 3 of the conveyor 2.
In addition to this, the upper and lower dam rolls 10 and 12 are also conveyed while sandwiching the substrate material A, although they are auxiliary. The dam rolls 10 and 12 exhibit the function of supporting the etching uniformity as described above, and also the function of supporting the conveyance of the substrate material A by the conveyor 2 as described above.
In this etching apparatus 11, the holding jig 14 and the dam rolls 10 and 12 reinforce the holding and clamping of the substrate material A despite the reduction of the wheel 3, and there is no risk of the substrate material A falling. As a result, the conveyance stability remains unchanged.

(9) As described above, in the etching apparatus 11 of the present invention, the etching factor and the etching rate are improved by setting the vertical distance E.
In spite of such setting, the etching uniformity is maintained by setting the left and right pitch interval F, the inclined spray angle α, the arrangement of the upper and lower dam rolls 10 and 12, the liquid stop bar 13, and the like.
In spite of the decrease in the number of wheels 3, the transfer jig 14 and the upper and lower dam rolls 10 and 12 ensure the conveyance stability without lowering as usual.
The operation of the present invention is as described above.

Examples of the present invention will be described below.
Example 1
First, Example 1 (etch factor) will be described.
FIG. 8 is a longitudinal cross-sectional photograph of the electronic circuit K at the center of the electronic circuit board J. (1) FIG. 8 relates to the embodiment of the present invention, and (2) relates to the conventional example.
That is, in the manufacturing process (subtractive method) of the electronic circuit board J, FIG. 8 (1) shows the result of the etching test using the etching apparatus 11 of the embodiment of the present invention. The electronic circuit K is shown.
On the other hand, FIG. 8B shows an electronic circuit K of an electronic circuit board J manufactured as a result of an etching test using the conventional etching apparatus 9.

The specifications of the electronic circuit board J and the electronic circuit K to be tested are as follows (see also FIG. 7).
・ Board: Double-sided copper-clad laminate ・ Board size: W510mm × L410mm
Copper foil thickness H: Upper surface side 18 μm, lower surface side 18 μm
DF thickness (photosensitive resist thickness): 15 μm
・ Base material thickness (thickness of insulating base material): 150 μm
L / S (bottom width (circuit width) / inter-circuit space): 30 μm / 30 μm
・ Pitch (L / S pitch): 60 μm
In addition, L / S observes correction value 40/20. That is, a photosensitive resist having a width of 40 μm and a space of 20 μm is used.
Etching conditions are as follows.
・ Spray pressure: 0.18MPa
・ Etching solution: Cupric chloride (47 ℃)
-Conveying speed: 1.99 m / min (Example)
1.54 m / min (conventional example)

As a result of the test, when the embodiment of the present invention is compared with the conventional example, the circuit K shown in FIG. 8 (1) formed by patterning the embodiment is changed to the circuit K of the conventional example shown in FIG. 8 (2). Compared to the etch factor, the cross-section became an ideal shape closer to a rectangle (see FIG. 7 (3)).
That is, for both of the manufactured electronic circuit boards J, a cross section of the electronic circuit K was observed at measurement points on the substrate surface 150 at equal intervals in the XY direction. Then, the embodiment of the present invention improved the etch factor by about 1.1 times compared to the conventional example. That is, the average value data of the etch factor was about 6.1 in the example and about 5.5 in the conventional example.
Thus, the improvement of the etching factor, which is the effect of the present invention, was supported by the test data of the etching apparatus 11 of the example. It has been proved that by adopting a setting in which the spray nozzle 4 is made closer to the substrate material A with the vertical distance E, the copper foil can be dissolved and removed with higher accuracy, that is, the etching factor is improved.
About Example 1, it is as above.

Example 2
Next, Example 2 (etch rate) will be described.
FIG. 9 is a graph of the etch rate. In this Example 2, in the manufacturing process (subtractive method) of the electronic circuit board J, the etching test was performed for the etching rate using the etching apparatus 11 of the example of the present invention and the etching apparatus 9 of the conventional example. .
Then, the bottom width (circuit width) L (see FIG. 7) of the formed electronic circuit K was measured at intervals of 5 seconds. That is, for the etching time from 45 seconds to 75 seconds, the bottom width L of the formed circuit K was measured at intervals of 5 seconds.
The specifications of the electronic circuit board J and the electronic circuit K to be tested and the etching process conditions are the same as those described in the first embodiment, but only the following points are different.
・ DF thickness (photosensitive resist thickness): 20 μm
L / S (bottom width (circuit width) / inter-circuit space): 25 μm / 25 μm (no correction)
・ Pitch (L / S pitch): 50 μm

As a result of the test, it was about 53.5 seconds in the embodiment of the present invention to obtain the desired bottom width of 25 μm, whereas it was about 62.5 seconds in the conventional example. In the embodiment, it took about 53.5 seconds, whereas in the conventional example, about 62.5 seconds were required (in FIG. 9, the bottom width of 40 μm is the initial state of etching, and the bottom width of 15 μm is the state of excessive etching). .
Thus, the improvement of the etching rate, which is the effect of the present invention, such as the improvement of the etching rate by about 1.2 times on the data, was supported by the test data of the etching apparatus 11 of the example.
It is supported that the time required to dissolve and remove the copper foil is shortened and the etching speed and the etching rate are improved by adopting the setting in which the spray nozzle 4 is set close to the substrate material A with the vertical distance E between them. It was.
About Example 2, it is as above.

Example 3
Next, Example 3 (etching uniformity) will be described.
In Example 3, half etching was performed by using the etching apparatus 11 of the example of the present invention and the etching apparatus 9 of the conventional example, and thus a test for etching uniformity was performed.
That is, with respect to the CCL substrate in which the circuit K does not exist, an etching test is performed by half-etching a copper foil having a thickness of 70 μm with a target value of 35 μm, thereby measuring the substrate surface 100 at equal intervals in the X and Y directions. The remaining copper thickness was measured at points.
The specifications to be tested are as follows.
・ Board: Double-sided copper-clad laminate, CCL board ・ Board size: W510mm × L410mm
・ Copper foil thickness: 70μm
In addition, the etching time and spray pressure of processing conditions are described in the table, and cupric chloride (47 ° C) is used as the etching solution.

As a result of such a test, the following data in Table 1 and Table 2 were obtained. In the data, the etching uniformity (uniformity) of 90% or more was ensured without change.
That is, as shown in Tables 1 and 2, according to the etching apparatus 11 of the present invention, data of etching uniformity equivalent to or higher than that of the conventional etching apparatus 9 was obtained on both the upper and lower surfaces.

The calculation of etching uniformity (uniformity) in the table is as follows. First, on the basis of the measured remaining copper thickness (μm), the average remaining copper thickness (μm) is obtained. → Then, by subtracting the average remaining copper thickness (μm) from 70 (μm), the average etching amount (μm) (described in the table) is calculated.
→ Then, the value of 3 × standard deviation (μm) (described in the table) / average etching amount (μm) is subtracted from 1. → Etching uniformity (%) is calculated.
Then, as shown in Table 1 and Table 2, the etching uniformity of the present invention is 95.0% on the upper surface and 93.7% on the lower surface, and 91.2% on the upper surface and 94.0% on the lower surface of the conventional example. It became the data of the same level.
Incidentally, as shown in Tables 1 and 2, the values of standard deviation (μm) and R, that is, Range (Max of remaining copper thickness−Min of remaining copper thickness) are also shown in the examples of the present invention. The value was slightly lower than that of the conventional example, which was excellent. Also from this aspect, it was confirmed that the etching uniformity was maintained. In addition, the etching rate of the present invention was shorter than that of the conventional example, and excellent data was obtained.

Thus, the maintenance of the etching uniformity, which is an effect of the present invention, was supported by the test data of the etching apparatus 11 of the example.
Etching uniformity despite the proximity of the vertical interval distance E between the spray nozzles 4 by adopting a combination of the dam rolls 10 and 12, the liquid stop bar 13, the left and right pitch interval F of the spray nozzle 4 and the spray angle α. Was confirmed.
About Example 3, it is as above.

A Substrate material B Etching solution C Transport direction (front-rear direction)
D Vertical direction E Vertical spacing distance F Left / right pitch spacing G Left / right direction (width direction)
H Circuit height (depth)
J Electronic circuit board K (electronic) circuit L Circuit width (bottom width)
S Inter-circuit space T Top width (top width)
Z Spray zone α Inclined spray angle 1 Etching device (general example)
2 Conveyor 3 Wheel 4 Spray nozzle 5 Chamber 6 Liquid tank 7 Spray pump 8 Spray tube 9 Etching device (conventional example)
10 Dam roll 11 Etching device (present invention)
12 Dam roll 13 Liquid stop bar 14 Transition jig 15 Wheel shaft 16 Locking hole

Claims (6)

An etching apparatus that sprays an etching solution from a spray nozzle onto both sides of a substrate material that is used in the manufacturing process of an electronic circuit board and is conveyed by a conveyor. The etching apparatus includes an upper and lower dam roll, an upper liquid stop bar, a lower Has a crossing jig on the side,
The conveyor conveys the substrate material between upper and lower wheel groups, and the spray nozzles are arranged facing the substrate material to be conveyed in each spray zone, and are arranged in large numbers in the up, down, left, and right directions. , It is inclined obliquely toward the left or right direction,
The dam roll is composed of a straight roller, and is arranged in a front-rear pair via the spray zone. The dam roll is arranged to come into contact with the substrate material to be transported, and the sprayed etching liquid is the substrate material. Restricts the back and forth flow of the top and bottom surfaces of the
The liquid stop bar regulates the etching solution from flowing back and forth beyond the dam roll,
An apparatus for etching a substrate material, characterized in that a number of the transition jigs are arranged on the left, right, front and back, and abut the lower surface of the substrate material conveyed.   2. The spray nozzle according to claim 1, wherein a vertical distance between the spray nozzle and the substrate material is set to 30 mm to 80 mm, and the etching solution is applied to the substrate material with a strong impact spray hitting force. An etching apparatus for a substrate material, characterized by being sprayed.   The spray nozzle according to claim 2, wherein the spray pressure is 0.1 MPa to 0.3 MPa, the left-right pitch interval is 30 mm to 60 mm, and the inclined spray angle is 10 degrees to 30 degrees. An etching apparatus for a substrate material, characterized by being set.   The crossing jig according to claim 3, wherein the crossing jig has a substantially vertical plate shape, is spanned between the dam roll and the shaft of the wheel before and after the dam roll, and an upper end edge that is substantially linear in the front-rear direction. An etching apparatus for a substrate material, wherein the substrate material is in contact with the lower surface of the substrate material conveyed near the dam roll from below. In claim 4, the etching factor and the etching rate are improved by setting the vertical distance between the spray nozzle and the substrate material,
Regardless of the setting of the vertical distance as described above, the setting of the horizontal pitch interval and the inclined spray angle of the spray nozzle and the arrangement of the dam roll and the liquid stop bar maintain the etching uniformity,
Regardless of the arrangement of the upper and lower dam rolls, the conveyance stability of the substrate material is ensured by the arrangement of the transition jig.   6. The dam roll according to claim 5, wherein the dam roll is driven and is disposed opposite to the upper and lower sides, and the conveyance stability of the substrate material is further ensured by conveying the substrate material with the substrate material sandwiched therebetween. A substrate material etching apparatus.