JPH0638441Y2 - 面実装用ハイブリッドｉｃの実装構造 - Google Patents

面実装用ハイブリッドｉｃの実装構造

Info

Publication number
JPH0638441Y2
JPH0638441Y2 JP1987198506U JP19850687U JPH0638441Y2 JP H0638441 Y2 JPH0638441 Y2 JP H0638441Y2 JP 1987198506 U JP1987198506 U JP 1987198506U JP 19850687 U JP19850687 U JP 19850687U JP H0638441 Y2 JPH0638441 Y2 JP H0638441Y2
Authority
JP
Japan
Prior art keywords
insulating substrate
hybrid
back surface
conductor pattern
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987198506U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01104069U (sk
Inventor
和明 北賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP1987198506U priority Critical patent/JPH0638441Y2/ja
Publication of JPH01104069U publication Critical patent/JPH01104069U/ja
Application granted granted Critical
Publication of JPH0638441Y2 publication Critical patent/JPH0638441Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
JP1987198506U 1987-12-25 1987-12-25 面実装用ハイブリッドｉｃの実装構造 Expired - Lifetime JPH0638441Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987198506U JPH0638441Y2 (ja) 1987-12-25 1987-12-25 面実装用ハイブリッドｉｃの実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987198506U JPH0638441Y2 (ja) 1987-12-25 1987-12-25 面実装用ハイブリッドｉｃの実装構造

Publications (2)

Publication Number Publication Date
JPH01104069U JPH01104069U (sk) 1989-07-13
JPH0638441Y2 true JPH0638441Y2 (ja) 1994-10-05

Family

ID=31489011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987198506U Expired - Lifetime JPH0638441Y2 (ja) 1987-12-25 1987-12-25 面実装用ハイブリッドｉｃの実装構造

Country Status (1)

Country Link
JP (1) JPH0638441Y2 (sk)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5741837A (en) * 1980-08-27 1982-03-09 Sumitomo Heavy Ind Ltd Pipe end drawing apparatus in steel pipe manufacturing mill

Also Published As

Publication number Publication date
JPH01104069U (sk) 1989-07-13

Similar Documents

Publication Publication Date Title
JPH0638441Y2 (ja) 面実装用ハイブリッドｉｃの実装構造
JPS5999794A (ja) 厚膜回路装置
JPH05335438A (ja) リードレスチップキャリア
JPH0697634A (ja) フリップチップ用のプリント配線板
JP2705154B2 (ja) プリント配線板の製造方法
JPS63283051A (ja) 混成集積回路装置用基板
JPH0611531Y2 (ja) 回路基板装置
JPH0514541Y2 (sk)
JPH0543488Y2 (sk)
JPH0613741A (ja) 表面実装部品用回路基板
JPH0423322Y2 (sk)
JPH0389589A (ja) プリント配線板
JP2522585Y2 (ja) ドーナツ型ジヤンパ線ユニツト
JP2562259Y2 (ja) ベアチップを取付けたハイブリッドｉｃ
JPS63158896A (ja) 内部配線と表面配線の接続方法
JPS58158443U (ja) 混成集積回路基板
JPS58191661U (ja) プリント板
JPS62216292A (ja) メツキ厚測定パツド付きプリント配線板
JPS58168170U (ja) プリント基板
JPS6134728U (ja) シ−ト状コンデンサ
JPS60106363U (ja) プリント配線基板
JPS60172361U (ja) プリント基板
JPS6260288A (ja) スル−ホ−ルを有する配線基板
JPS62128667U (sk)
JPS58182455U (ja) プリント板