JPH0638426Y2 - 多電源素子用パッケージ - Google Patents

多電源素子用パッケージ

Info

Publication number
JPH0638426Y2
JPH0638426Y2 JP1988116284U JP11628488U JPH0638426Y2 JP H0638426 Y2 JPH0638426 Y2 JP H0638426Y2 JP 1988116284 U JP1988116284 U JP 1988116284U JP 11628488 U JP11628488 U JP 11628488U JP H0638426 Y2 JPH0638426 Y2 JP H0638426Y2
Authority
JP
Japan
Prior art keywords
power supply
package
substrate
loop
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988116284U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0238736U (enExample
Inventor
貴稔 瀧川
寛彦 井原
貴雄 前田
正晴 安原
正策 山中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP1988116284U priority Critical patent/JPH0638426Y2/ja
Publication of JPH0238736U publication Critical patent/JPH0238736U/ja
Application granted granted Critical
Publication of JPH0638426Y2 publication Critical patent/JPH0638426Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/07554—
    • H10W72/547—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1988116284U 1988-09-02 1988-09-02 多電源素子用パッケージ Expired - Lifetime JPH0638426Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988116284U JPH0638426Y2 (ja) 1988-09-02 1988-09-02 多電源素子用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988116284U JPH0638426Y2 (ja) 1988-09-02 1988-09-02 多電源素子用パッケージ

Publications (2)

Publication Number Publication Date
JPH0238736U JPH0238736U (enExample) 1990-03-15
JPH0638426Y2 true JPH0638426Y2 (ja) 1994-10-05

Family

ID=31358681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988116284U Expired - Lifetime JPH0638426Y2 (ja) 1988-09-02 1988-09-02 多電源素子用パッケージ

Country Status (1)

Country Link
JP (1) JPH0638426Y2 (enExample)

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
浅香寿一著「ボンディング技術」昭和４５年３月３１日日刊工業新聞社発行Ｐ．７１図５・１３（ａ）

Also Published As

Publication number Publication date
JPH0238736U (enExample) 1990-03-15

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