JPH0638114Y2 - 縦形炉の排気ガス・液体処理装置 - Google Patents
縦形炉の排気ガス・液体処理装置Info
- Publication number
- JPH0638114Y2 JPH0638114Y2 JP11555088U JP11555088U JPH0638114Y2 JP H0638114 Y2 JPH0638114 Y2 JP H0638114Y2 JP 11555088 U JP11555088 U JP 11555088U JP 11555088 U JP11555088 U JP 11555088U JP H0638114 Y2 JPH0638114 Y2 JP H0638114Y2
- Authority
- JP
- Japan
- Prior art keywords
- exhaust
- pipe
- gas
- reaction tube
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007788 liquid Substances 0.000 title claims description 40
- 239000007789 gas Substances 0.000 claims description 31
- 238000006243 chemical reaction Methods 0.000 claims description 24
- 239000002699 waste material Substances 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 12
- 239000012495 reaction gas Substances 0.000 claims description 9
- 239000010453 quartz Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 235000012431 wafers Nutrition 0.000 description 12
- 230000005494 condensation Effects 0.000 description 5
- 238000009833 condensation Methods 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 239000006227 byproduct Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Chemical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11555088U JPH0638114Y2 (ja) | 1988-08-31 | 1988-08-31 | 縦形炉の排気ガス・液体処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11555088U JPH0638114Y2 (ja) | 1988-08-31 | 1988-08-31 | 縦形炉の排気ガス・液体処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0238468U JPH0238468U (enrdf_load_stackoverflow) | 1990-03-14 |
| JPH0638114Y2 true JPH0638114Y2 (ja) | 1994-10-05 |
Family
ID=31357311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11555088U Expired - Lifetime JPH0638114Y2 (ja) | 1988-08-31 | 1988-08-31 | 縦形炉の排気ガス・液体処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0638114Y2 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000074125A1 (fr) * | 1999-05-27 | 2000-12-07 | Applied Materials, Inc. | Appareil pour la fabrication d'un dispositif a semiconducteur |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2668023B2 (ja) * | 1990-02-05 | 1997-10-27 | 東京エレクトロン株式会社 | 熱処理装置 |
| JP2578517B2 (ja) * | 1990-05-10 | 1997-02-05 | 信越半導体株式会社 | 半導体ウエーハの処理装置 |
-
1988
- 1988-08-31 JP JP11555088U patent/JPH0638114Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000074125A1 (fr) * | 1999-05-27 | 2000-12-07 | Applied Materials, Inc. | Appareil pour la fabrication d'un dispositif a semiconducteur |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0238468U (enrdf_load_stackoverflow) | 1990-03-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8851886B2 (en) | Substrate processing apparatus and method of manufacturing semiconductor device | |
| JP5023646B2 (ja) | 排気系、捕集ユニット及びこれを用いた処理装置 | |
| US6482753B1 (en) | Substrate processing apparatus and method for manufacturing semiconductor device | |
| JP4099060B2 (ja) | ガス流により回転支持され回転駆動される基板保持器を備えたｃｖｄ反応炉 | |
| JPH0638114Y2 (ja) | 縦形炉の排気ガス・液体処理装置 | |
| WO2002045823A1 (fr) | Dispositif de traitement de gaz d'echappement | |
| JP2003504884A (ja) | 溶着反応装置におけるシール手段およびその適用 | |
| CN114835114B (zh) | 石墨部件净化炉 | |
| JP2581955B2 (ja) | 半導体デバイスの熱処理装置 | |
| JP3578258B2 (ja) | 熱処理装置 | |
| JP3936455B2 (ja) | 高温腐食性ガス体の除害装置及び除害方法 | |
| JP2668023B2 (ja) | 熱処理装置 | |
| JP4373723B2 (ja) | シリンダ型気相成長装置 | |
| SU1505976A1 (ru) | Установка парогазового термообезжиривани металлоизделий | |
| JP2602265B2 (ja) | 縦形炉 | |
| JP3690095B2 (ja) | 成膜方法 | |
| JPH11168066A (ja) | 熱処理装置のクリーニング方法 | |
| CN222286882U (zh) | 一种电加热水洗式尾气处理用排气腔总成 | |
| KR0155381B1 (ko) | 처리장치 | |
| JP3717768B2 (ja) | 半導体製造装置のガスクリーニング方法 | |
| JPS6316003B2 (enrdf_load_stackoverflow) | ||
| JPH0220213Y2 (enrdf_load_stackoverflow) | ||
| JPH03285884A (ja) | 炭化硅素治具 | |
| JPH0545435Y2 (enrdf_load_stackoverflow) | ||
| JPH03227514A (ja) | 半導体製造装置 |