JPH0636601Y2 - 回路基板 - Google Patents

回路基板

Info

Publication number
JPH0636601Y2
JPH0636601Y2 JP1987022389U JP2238987U JPH0636601Y2 JP H0636601 Y2 JPH0636601 Y2 JP H0636601Y2 JP 1987022389 U JP1987022389 U JP 1987022389U JP 2238987 U JP2238987 U JP 2238987U JP H0636601 Y2 JPH0636601 Y2 JP H0636601Y2
Authority
JP
Japan
Prior art keywords
layer
conductive layer
bonding
insulating substrate
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987022389U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63131170U (US08118993-20120221-C00002.png
Inventor
貞公 大山
範明 関根
康身 牛窪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsumi Electric Co Ltd
Original Assignee
Mitsumi Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsumi Electric Co Ltd filed Critical Mitsumi Electric Co Ltd
Priority to JP1987022389U priority Critical patent/JPH0636601Y2/ja
Publication of JPS63131170U publication Critical patent/JPS63131170U/ja
Priority to US07/285,373 priority patent/US5119272A/en
Application granted granted Critical
Publication of JPH0636601Y2 publication Critical patent/JPH0636601Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP1987022389U 1986-07-21 1987-02-18 回路基板 Expired - Lifetime JPH0636601Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1987022389U JPH0636601Y2 (ja) 1987-02-18 1987-02-18 回路基板
US07/285,373 US5119272A (en) 1986-07-21 1988-12-16 Circuit board and method of producing circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987022389U JPH0636601Y2 (ja) 1987-02-18 1987-02-18 回路基板

Publications (2)

Publication Number Publication Date
JPS63131170U JPS63131170U (US08118993-20120221-C00002.png) 1988-08-26
JPH0636601Y2 true JPH0636601Y2 (ja) 1994-09-21

Family

ID=30819725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987022389U Expired - Lifetime JPH0636601Y2 (ja) 1986-07-21 1987-02-18 回路基板

Country Status (1)

Country Link
JP (1) JPH0636601Y2 (US08118993-20120221-C00002.png)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5117573A (ja) * 1974-08-02 1976-02-12 Kyoto Ceramic Denshikairoyoseramitsukusukibanno seizoho
JPS51151781A (en) * 1975-06-20 1976-12-27 Matsushita Electric Works Ltd Process for manufacturing laminated boards for chemical plating
JPS5826191B2 (ja) * 1980-03-07 1983-06-01 株式会社東芝 プリント配線板の製造方法
JPS5769269U (US08118993-20120221-C00002.png) * 1980-10-13 1982-04-26
JPS60214594A (ja) * 1984-04-11 1985-10-26 松下電器産業株式会社 印刷配線板の製造方法
JPS61121389A (ja) * 1984-11-16 1986-06-09 松下電器産業株式会社 セラミツク配線板

Also Published As

Publication number Publication date
JPS63131170U (US08118993-20120221-C00002.png) 1988-08-26

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