JPH0636586Y2 - 半導体チップ塔載用ヒートシンクテープ構造 - Google Patents
半導体チップ塔載用ヒートシンクテープ構造Info
- Publication number
- JPH0636586Y2 JPH0636586Y2 JP1990007715U JP771590U JPH0636586Y2 JP H0636586 Y2 JPH0636586 Y2 JP H0636586Y2 JP 1990007715 U JP1990007715 U JP 1990007715U JP 771590 U JP771590 U JP 771590U JP H0636586 Y2 JPH0636586 Y2 JP H0636586Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- semiconductor chip
- punching
- block
- fitting hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 43
- 238000004080 punching Methods 0.000 claims description 42
- 239000002184 metal Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000001771 impaired effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990007715U JPH0636586Y2 (ja) | 1990-01-30 | 1990-01-30 | 半導体チップ塔載用ヒートシンクテープ構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990007715U JPH0636586Y2 (ja) | 1990-01-30 | 1990-01-30 | 半導体チップ塔載用ヒートシンクテープ構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0399444U JPH0399444U (en, 2012) | 1991-10-17 |
| JPH0636586Y2 true JPH0636586Y2 (ja) | 1994-09-21 |
Family
ID=31511369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990007715U Expired - Lifetime JPH0636586Y2 (ja) | 1990-01-30 | 1990-01-30 | 半導体チップ塔載用ヒートシンクテープ構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0636586Y2 (en, 2012) |
-
1990
- 1990-01-30 JP JP1990007715U patent/JPH0636586Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0399444U (en, 2012) | 1991-10-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |