JPH0635473Y2 - 半導体用保護シート - Google Patents

半導体用保護シート

Info

Publication number
JPH0635473Y2
JPH0635473Y2 JP1989127268U JP12726889U JPH0635473Y2 JP H0635473 Y2 JPH0635473 Y2 JP H0635473Y2 JP 1989127268 U JP1989127268 U JP 1989127268U JP 12726889 U JP12726889 U JP 12726889U JP H0635473 Y2 JPH0635473 Y2 JP H0635473Y2
Authority
JP
Japan
Prior art keywords
protective sheet
chip
sheet
adhesive
dicing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989127268U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0365249U (enrdf_load_stackoverflow
Inventor
浩 竹川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1989127268U priority Critical patent/JPH0635473Y2/ja
Publication of JPH0365249U publication Critical patent/JPH0365249U/ja
Application granted granted Critical
Publication of JPH0635473Y2 publication Critical patent/JPH0635473Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Landscapes

  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
JP1989127268U 1989-10-30 1989-10-30 半導体用保護シート Expired - Lifetime JPH0635473Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989127268U JPH0635473Y2 (ja) 1989-10-30 1989-10-30 半導体用保護シート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989127268U JPH0635473Y2 (ja) 1989-10-30 1989-10-30 半導体用保護シート

Publications (2)

Publication Number Publication Date
JPH0365249U JPH0365249U (enrdf_load_stackoverflow) 1991-06-25
JPH0635473Y2 true JPH0635473Y2 (ja) 1994-09-14

Family

ID=31675032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989127268U Expired - Lifetime JPH0635473Y2 (ja) 1989-10-30 1989-10-30 半導体用保護シート

Country Status (1)

Country Link
JP (1) JPH0635473Y2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010129607A (ja) * 2008-11-25 2010-06-10 Nitto Denko Corp ダイシング用表面保護テープ及びダイシング用表面保護テープの剥離除去方法
JP5451107B2 (ja) * 2009-02-24 2014-03-26 日東電工株式会社 自発巻回性積層シート及び自発巻回性粘着シート
JP2011054641A (ja) * 2009-08-31 2011-03-17 Nitto Denko Corp 被切断体からのダイシング表面保護テープの剥離除去方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS604579A (ja) * 1983-06-22 1985-01-11 Nitto Electric Ind Co Ltd マスキング用感圧性接着テ−プまたはシ−ト
JPS6461208A (en) * 1987-09-01 1989-03-08 Fsk Kk Cutting method of wafer

Also Published As

Publication number Publication date
JPH0365249U (enrdf_load_stackoverflow) 1991-06-25

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