JPH06346295A - Plating current controller - Google Patents

Abstract

PURPOSE:To enable an optimum plating in accordance with plating conditions by distributing an optimum working load of plating current for the overall plating current to each plating cell. CONSTITUTION:The plating currents to be supplied to plating cells 3a to 3c are detected by current detectors 4a to 4c and added by an adder 8. The difference between the total of the added plating current and a total current refference of a calculating circuit 10 is obtained by an adder 10a, and the current refference distributed based on the difference given by the adder 10a is inputted to working load distribution control circuits 12a to 12c by a PI controller 9. The plating current refference for each plating cell is calculated by the control circuits 12a to 12c based on the set value of the plating current load factor of each plating cell and supplied to distributors 7a to 7c, and a plating current is supplied to the plating cells 3a to 3c through the controller 6a to 6c, rectifiers 5a to 5c and the current detectors 4a to 4c.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating current controller for controlling a plating current density within a predetermined range in consideration of a load balance of a plating current of each plating cell.

[0002]

2. Description of the Related Art Heretofore, this type of control device has exclusively controlled the total current of the plating cells without strictly controlling the plating current density while considering the current load balance of each plating cell. As a conventional example, Japanese Patent Publication 1-
There is a 48359 publication. FIG. 4 shows the main part of this publication, and is a block diagram of a conventional plating current automatic control device.

Reference numeral 1 is a strip as a countermeasure against plating which advances in the direction of the arrow in the figure, 2 is a speed detector for detecting the line speed of the strip 1, 3a to 3c are plating cells for plating the strip 1, and 4a to 4c are plating cells 3a to 3c. A current detector for detecting the supplied plating current, 5a to 5c are rectifiers for supplying the plating current, and 6a to 6c are rectifiers 5a to
A controller that controls the current supplied to the plating cells 3a to 3c via 5c to a predetermined value, 7a to 7c are distributors that distribute and supply the plating current to the controllers 6a to 6c, and 8 is a detector 4a to 4c. An adder 9 for obtaining the sum of the plating currents by the output, and a PI (proportional, integral) controller 9 supplies the output signals to the distributors 7a to 7c.

Reference numeral 10 is a calculation circuit, which finds the difference between the line speed of the strip 1 obtained through the speed detector 2 and the current reference and supplies it to the adder 10a. The adder 10 a obtains the difference between the sum of the plating currents of the adder 8 and the output of the calculation circuit 10 and supplies the difference to the PI controller 9. Reference numeral 11 is a current reference circuit that calculates a total current reference from the basis weight, plate width, electrode efficiency and line speed, and supplies this to the calculation circuit 10.

Next, the operation will be described. The plating current supplied to each of the plating cells 3a to 3c is the current detector 4a to
4c, and the adder 8 adds them. The sum of the plating currents thus obtained is calculated by the adder 10a as a difference from the total current reference of the calculation circuit 10, and is supplied to the PI controller 9. The PI controller 9 supplies the current reference distributed based on the difference given from the adder 10a to the distributors 7a to 7c. The distributors 7a to 7c distribute the plating current to the controllers 6a to 6c and the rectifiers 5a to 5c.
c and the current detectors 4a to 4c, the plating cells 3a to
Supply to 3c.

The line speed of the strip 1 detected by the speed detector 2 is input to the calculation circuit 10, and the calculation circuit 10 increases or decreases the line speed and the current reference circuit 11 increases.
The total current reference set by is increased or decreased. For example, when line speed increases, the total current reference is increased.

The relationship between the line speed and the current reference is expressed by equation 1. ΣI: Total current reference (A), F: Faraday constant (C /
F), C: basis weight (g / m ² ) g: plate width (mm), V:
Line speed (mpm), G: Deposit Rati
o (g / F), η: Plating efficiency (%)

[0008]

[Equation 1]

[0009]

Since the conventional control device is constructed as described above, when the plating conditions such as the basis weight, plate width, electrode efficiency and line speed are changed, for example, the concentration of each plating cell is changed. However, if you want to improve the plating condition by thinning the plating in the plating cell on the subsequent stage side and improving the plating condition, it is not possible to set the usage load factor of the plating current of each plating cell, so consider the current load balance of each plating cell. However, it is difficult to control the plating current density within a predetermined range.

The present invention has been made in order to solve the above problems, and determines the optimum load sharing of the plating current of each plating cell with respect to the total plating current, and also determines the current density of each plating cell within a predetermined range. It is an object of the present invention to obtain a plating current control device that controls so that Another object of the present invention is to obtain a plating current control device that corrects the usage load share depending on the use or non-use of each plating cell. It is another object of the present invention to obtain a plating current control device that secures an optimum plating adhesion amount by feeding back the plating adhesion amount.

[0011]

A plating current controller according to the present invention obtains a plating current density within a predetermined range corresponding to the sum of plating currents supplied to a plurality of plating cells and the feed speed of a material to be plated. According to the result of comparison with the total current standard set as described above, in the plating current control device that controls the plating current of each plating cell, the load distribution predetermined as the ratio of the plating current of each plating cell to the total plating current is used. Accordingly, a load sharing means is provided for calculating the plating current of each plating cell from the result of comparison between the sum of the plating currents and the total current reference, and controlling the plating current based on the result of the calculation.

Further, there is provided a use load share correction means for correcting the use load share according to use / non-use of each plating cell.

Further, a plating amount detecting means and a current value necessary for correction are calculated from the detected plating amount and the feed speed of the material to be plated, and the total amount of current is corrected based on the calculation result. It is equipped with means.

[0014]

The plating current control device of the present invention is set so as to obtain a plating current density within a predetermined range in accordance with the sum of the plating currents supplied to the plurality of plating cells and the feeding speed of the material to be plated. By comparing the result of comparison with the total current standard, which is determined as the ratio of the plating current of each plating cell to the total plating current,
The plating current of each plating cell is calculated, and the plating current is controlled by the calculation result.

Further, the usage load sharing is corrected according to the use / non-use of each plating cell.

Further, a current value required for correction is calculated from the detected plating adhesion amount and the feed speed of the material to be plated, and the total current reference is corrected by the calculation result.

[0017]

【Example】

Example 1. Hereinafter, Embodiment 1 of the present invention will be described with reference to FIG. In the figure, 1 to 11 are the same as the conventional ones and their explanations are omitted. Reference numerals 12a to 12c are control circuits that carry out the use load share of the total plating current according to the use load ratio of the plating current of each plating cell determined in advance.

Next, the operation will be described. The plating current supplied to each of the plating cells 3a to 3c is the current detector 4a to
4c, and the adder 8 adds them. The sum of the plating currents thus obtained is calculated by the adder 10a as a difference from the total current reference of the calculation circuit 10, and is supplied to the PI controller 9. The PI controller 9 inputs the current reference distributed based on the difference given from the adder 10a to the working load sharing control circuits 12a to 12c.

The use load sharing control circuits 12a-12c are
The plating current reference of each plating cell is calculated according to the set value of the usage load factor of the plating current of each plating cell, and the distributor 7
a to 7c. The distributors 7a to 7c supply the plating current to the plating cells 3a to 3c via the controllers 6a to 6c, the rectifiers 5a to 5c and the current detectors 4a to 4c.

Here, the load sharing control circuits 12a-12 are used.
c is calculated based on the following formula, that is, the formula represented by Formula 2, and the current reference (Ij) of each plating cell is determined. Current standard of each plating cell (Ij) = (Comprehensive current standard)-(Load sharing rate of each plating cell)

[0021]

[Equation 2]

Example 2. In the first embodiment, the case where the plating current reference of each plating cell is calculated by the usage load sharing control circuits 12a to 12c has been described. However, as shown in FIG. 2, the usage load sharing is performed depending on whether each plating cell is used or not. A use load sharing correction circuit 13 for correction is added, and the outputs of the use load sharing control circuits 12a to 12c are corrected by this correction output. Therefore, the rectifiers 5a, 5b of each plating cell,
Even if 5c is turned on and off, the optimum amount of deposited plating can be secured.

Example 3. Further, as shown in FIG. 3, a detection device 14 for detecting the plating adhesion amount, a feedback value of the detected plating adhesion amount and a speed feedback value from the line speed detector 2 are used to calculate a total current value necessary for correction. A plating adhesion amount correction circuit 15 for calculating and an adder 16 are provided, and the plating total current reference is corrected by a feedback signal of the plating adhesion amount. With this correction, it is possible to secure the optimum amount of deposited plating even with changes in various plating conditions such as the basis weight, plate width, electrode efficiency and line speed.

Example 4. Correction by use or non-use of the plating cell by the use load sharing correction circuit 13 of the second embodiment,
It is also possible to use both the correction and the correction by the feedback of the plating adhesion amount of the third embodiment.

[0025]

As described above, according to the present invention, since the use load factor of the plating current can be set for each plating cell, the plating current can be set according to various plating conditions such as the concentration of the plating solution. There is an effect that the optimum amount of plating adhesion can be secured.

Further, since the sharing of the usage load is corrected depending on the use / non-use of each plating cell, there is an effect that a better plating can be obtained.

Further, a current value required for correction is calculated from the detected amount of adhered plating and the feed speed of the material to be plated, and the total current reference is corrected based on this calculation result, so that better plating can be obtained. effective.

[Brief description of drawings]

FIG. 1 is a block diagram showing a plating current control device according to a first embodiment of the present invention.

FIG. 2 is a block diagram showing a plating current control device according to a second embodiment of the present invention.

FIG. 3 is a block diagram showing a plating current control device according to a third embodiment of the present invention.

FIG. 4 is a block diagram showing a conventional plating current control device.

[Explanation of symbols]

 1 strip 2 speed detector 3a, 3b, 3c plating cell 4a, 4b, 4c current detector 5a, 5b, 5c rectifier 6a, 6b, 6c controller 7a, 7b, 7c distributor 8 adder 9 PI controller 10 calculation circuit 10a addition Device 11 Current reference circuit 12a, 12b, 12c Working load sharing control circuit 13 Working load sharing correction circuit 14 Plating adhesion amount detection device 15 Plating adhesion amount correction circuit 16 Adder

Claims (3)

[Claims] 1. According to a result of comparing a total sum of plating currents supplied to a plurality of plating cells and a comprehensive current reference set so as to obtain a plating current density in a predetermined range corresponding to a feed speed of a material to be plated. In the plating current control device for controlling the plating current of each plating cell, the total of the above plating current and the total current reference are calculated according to the load distribution predetermined as the ratio between the plating current of each plating cell and the total plating current. A plating current control device comprising a load sharing means for calculating a plating current of each plating cell from the comparison result and controlling the plating current according to the calculation result. 2. According to a result of comparing a total sum of plating currents supplied to a plurality of plating cells and a total current reference set so as to obtain a plating current density within a predetermined range corresponding to a feed speed of a material to be plated. In the plating current control device for controlling the plating current of each plating cell, the total of the above plating current and the total current reference are calculated according to the load distribution predetermined as the ratio between the plating current of each plating cell and the total plating current. The load current sharing means for calculating the plating current of each plating cell from the comparison result, and controlling the plating current according to the result of the calculation, and the load sharing correction means for correcting the load sharing means according to the use / non-use of each plating cell A plating current control device comprising: 3. A plating adhesion amount detecting means, a current value necessary for correction is calculated from the plating adhesion amount detected by the plating adhesion amount detecting means and a feed speed of a material to be plated, and a total current reference is obtained by the calculation result. 3. The plating current control device according to claim 1, further comprising a plating adhesion amount correction means for correcting.