JPS60128293A - Device for automatic compensation and control of plating current - Google Patents

Abstract

PURPOSE:To improve the gloss, electrode efficiency and corrosion resistance of a plated surface by compensating the excess or shortage of the coating weight of plating that arises with a change in the number of plating cells by the change rate of the number of cells so that current density can be controlled in a prescribed range. CONSTITUTION:A titled device is provided with a selection circuit 13 which selects the cells 3a-d to be conducted with electricity from the upperstream in the advancing direction of a strip 1 according to the line speed of the strip 1 passing through plural plating cells 3a-d and a control circuit which selects the excess or shortage of the coating weight of plating on the strip 1. The above-described control circuit controls the tracking of the strip 1 and the current density of the cells to be added by changing the number of the cells at a prescribed change rate in the stage of changing the number of the cells to be conducted with electricity. Said circuit controls the current according to the result obtd. by comparing the total sum of the plating current supplied to the cells 3a-d and the current reference compensated so as to obtain the prescribed plating current in accordance with the line speed of the strip 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an apparatus for controlling plating current density within a certain range, and particularly for compensating for excess or deficiency in the amount of plating that occurs when changing the number of metx cells.

[Prior art]

Conventionally, the control device for this scale mainly controls the total current of the Menki cell without strictly controlling the plating current density. The plating current density is calculated by calculating the current value of the electrolyte from its electrode length and plate width, and the comprehensive measure R is calculated from the basis weight, plate width, electrode efficiency, and line speed. As long as these plating conditions do not change, the total current is controlled to be constant, and the amount of plating deposited is controlled to be constant. However, with the latest plating processes.

It has become necessary to control the plating current density to within a certain range as well as to control the plating current density to within a certain range.

This is due to the increased demand for higher gloss on the plated surface, improved electrode efficiency, and improved corrosion resistance.

FIG. 1 is a block diagram of a conventional plating current automatic compensation control device. 1 is a strip to be plated that advances in the same direction as the arrow 1 shown in the figure; 2 is a detector that detects the line speed of the strip 1; 3a to 3d are Menki cells that plate the strip 1; and 4a to 4di are supplied to the Metki cells 3a to 3d. A plating current detector, 5a to 5d are rectifiers that supply plating current, and 6a to 6d &: are controllers that control the rectifiers 5a to 5d so that the current supplied to the Menki cells 38 to 3d is a predetermined value. a to 7d are distributors 8 that distribute the plating current and supply it to the controllers 6a to 6d;
9 is a PI (proportional/integral controller) that supplies output signals to distributors 7a to 7d. 10 is a calculation circuit. .

The line speed of the strip 1 obtained by blowing the detector 2,
The difference from the tL flow reference is calculated and supplied to the adder 10a. The adder 10a sums the plating current of the adder 8 and the calculation circuit 10.
The difference between the output and the output is determined and supplied to the PI controller 9. 1
1. Calculate the overall current standard including the basis weight, plate width, electrode efficiency, and line speed λ.

This is a current reference circuit that supplies the calculation circuit 10.

Let me briefly explain the operation. The magnetic currents supplied to the magnetic cells 3a to 3d are detected by the detectors 4a to 4d, and added to the adder 8. The sum of the calculated current f' is supplied to the adder 10a, and the difference between it and the total current reference of the calculation circuit 10 is supplied to the controller 9. The PI controller 9 distributes the iI flow based on the difference n given from the adder 10a.
d. The distributors 7a to 7d distribute the plating current to the controllers 6a to 6d, the rectifiers 5a to 5d, and the rectifier 4a.
~4d is valved and supplied to Metxels 3a~3d.

The line speed of the strip 1 detected by the detector 2 is input to the calculation circuit 10, and the calculation circuit 10 calculates the increase/decrease in the total current reference by adding CJJ to the current reference circuit 11 according to the increase/decrease in the line speed. let For example, when the line speed increases, the total current reference is increased.

Thus, the conventional control device adds the total plating current according to the moving speed of the strip.

Since the current density of the plating cell, also known as fLK process, is changed, there is a drawback that the plating current cannot be controlled within the required range.

[Summary of the invention]

The present invention has been made to eliminate the drawbacks of the conventional ones, and according to the line speed of the strip, the optimal number of meshes/l/& downstream force of the line)
The density of the plating current is controlled within a certain range by selecting from among them, and compensating for the excess or deficiency in the plating area that occurs due to the change in the number of plating cells by the rate of change (increase rate or decrease rate) of the number of plating cells. The purpose is to provide a plating current automatic compensation control device.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings. Second
In the figure, parts with the same reference numerals as those in FIG. circuit.

14 is a plating compensation circuit, 15 is a tracking circuit for the strip 1, and 16 is a transmitter that generates Taharusuke in synchronization with the movement of the strip 1 and inputs it to the tracking circuit 15.

The operation will be briefly explained. FIG. 3 is a graph showing the relationship between line speed and plating current density. As shown in the figure, the upper limit value DU and lower limit value DL of the current density are slightly increased depending on the number N of Menki cells. When the number of Menki cells is N, when the line speed increases to V', the line speed reaches the upper limit value Dtrv' (FIG. 3(a)). 1, when the number of mesh cells is N+1, when the line speed decreases to V', D is close to the lower limit value DL.
It reaches L V' (Fig. 3(b)). Therefore, at the line speed V', the number of cells N is N+1, or the number N+1 of cells is N1Cf1, and in the former case, the progress of strip 1 is the same.

That is, the Menki cell 3a on the upstream side is injected f'L (Fig. 3 (
e)) In the latter case, the upstream Menki cell 3a is stopped and removed (Fig. 3(d)). Koniniji, Figure 3 Ce)
.

As shown in FIG. 4(f), as the number of plating cells increases or decreases, over- or under-plating occurs on the strip 1, so this is compensated for by the process ttcx#) shown in the flowchart of FIG.

Note that some explanations overlap with those of conventional devices.

The case where the Menkisel number is changed to N by N+1 at a certain speed during the speed up/down shown in FIG. 3(a) will be described with reference to the flowcharts shown in FIGS. 2 and 4. When the line speed 1iV reaches V', which is the Menki cell H change speed, the line 11V increases 'r' and pauses (halts (Pl). The lock contact 12 is opened and the control is performed as the PI controller 9 for comprehensive current control. Start (
P3).

At the same time, the tracking circuit 15 of the transmitter 16 operates, and the IJ lamp is awe-inspiring.

When the tracking of the preliminary foot length is completed (P4).

Metsukise/I/3'aff: Disconnect circuit engineer 9 and change the number from i to 1- (P5). Line speed N+
The sequence of changing the number of Menki cells is completed by releasing the hold of 1 (P6) and releasing the lock of the PI controller/I/9 (P6). Furthermore, when increasing the line speed, 1
The above explanation will be repeated.

- As shown in FIG. 3(b), when the line speed V decreases, the operation is controlled in the same way as the operation when the line speed V increases as described above, but the following points are different. That is.

Metxel 3a increases n, distributor 7 of Menxel 3a
The sign of the compensation value of a is reversed, and the cell 3a is separated at the end of tracking.

〔Effect of the invention〕

In addition, the time required for accelerating and decelerating the plating line can be reduced by changing and controlling the compensating strip length and compensation current depending on the cell number change rate.

[Brief explanation of drawings]

FIG. 1 is a block diagram of a conventional plating current automatic compensation control device, FIG. 2 is a block diagram of a plating current automatic compensation control device according to an embodiment of the present invention, and FIG. 3 shows the operation of the device shown in FIG. 2. Graph to explain. FIG. 4 is a flow chart of the operation of the apparatus shown in FIG. 1... Strip, i, 4a-4d... Detector, 3
a to 3d... Menki cell, 5a to 5d... rectifier,
6a to 6d...Controller, 7a to 7d...Distributor, 8°10a...Adder, 9...PI controller, 10...Calculation circuit, 11...'a vf, reference circuit , 12... Lock contact, 13... Selection circuit, 1
4... Compensation circuit, 15... Tracking circuit, 16
...Transmitter. In addition, in FIG. 1, the same reference numerals indicate the same parts. Agent Person Iwa Masu Publication No. 3 (C) N 口=I=ko↓ N+1 decoy■koN+1 田=]=ko↓ Procedural amendment (spontaneous) 1゜stomach'1 Director-General Difference 1 Indication of case Patent application No. 68-17709 2, Title of the invention: Plating current automatic compensation control device: 3 Sode jF, Representative Hitoshi Katayama Part 5, Amendment pair i Detailed description of the invention in the specification column 6, Amendment The statement of contents shall be amended as follows.

Claims (1)

[Claims] Each of the above plating currents is calculated according to the result of comparing the sum of the plating currents supplied to the plurality of cells with a current reference compensated to obtain a plating current density in a predetermined range corresponding to the line speed of the strip. In the plating current automatic compensation control device to be controlled, there is a selection circuit for selecting the above-mentioned mesh cells to be energized from upstream in the direction in which the strip travels according to the line speed, and a selection circuit for selecting the above-mentioned mesh cells to be energized from the upstream side of the strip traveling direction, and a selection circuit for selecting the above-mentioned mesh cells to be energized from the upstream direction in accordance with the above-mentioned line speed. Plating 1 characterized in that it is equipped with a control circuit that controls the tracking of the strip and the current density of the metal cells to be added or separated according to the change rate, and controls excess or deficiency of the amount of plating on the strip. ! Automatic flow compensation control device.