JP2008169404A - Electroplating method - Google Patents
Electroplating method Download PDFInfo
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- JP2008169404A JP2008169404A JP2007000792A JP2007000792A JP2008169404A JP 2008169404 A JP2008169404 A JP 2008169404A JP 2007000792 A JP2007000792 A JP 2007000792A JP 2007000792 A JP2007000792 A JP 2007000792A JP 2008169404 A JP2008169404 A JP 2008169404A
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本発明は、電気めっき方法に関し、特にライン速度の低下などめっき操業条件が変動した場合であっても、めっき不良の発生を防止しようとするものである。 The present invention relates to an electroplating method, and in particular, intends to prevent the occurrence of defective plating even when the plating operation conditions fluctuate, such as a decrease in line speed.
鋼板の表面には、耐食性などの表面特性を向上させるために表面処理が施されるが、かような表面処理の一つとして電気めっきが広く用いられている。
電気めっきの中でも、耐食性と装飾性を兼ね備えたものとしてニッケルめっきが知られており、従来から飲料缶等の用途に広く使用されている。
The surface of the steel sheet is subjected to surface treatment in order to improve surface characteristics such as corrosion resistance, and electroplating is widely used as one of such surface treatments.
Among electroplating, nickel plating is known as having both corrosion resistance and decorativeness, and has been widely used for beverage cans and the like.
ところで、電気めっきを行う場合、めっきセルの前段に十分なルーパー設備を有する場合はともかく、かようなルーパー設備を有しないめっきラインでは、コイルの切換え時などに、めっきセル部の通板速度が低速になる場合がある。 By the way, when performing electroplating, regardless of having sufficient looper equipment in the previous stage of the plating cell, in the plating line without such looper equipment, the plate passing speed of the plating cell section is changed when the coil is switched. May be slow.
電気めっきにおいて、鋼板に対するめっき付着量を一定にするためには、電気量密度(C/dm2)を一定にする必要がある。
従って、ライン速度が低下し、通板面積が減少した場合には、電流密度(A/dm2)を低減することにより、電気量密度の変動を抑制していた。
In electroplating, in order to make the amount of plating attached to a steel plate constant, it is necessary to make the electric quantity density (C / dm 2 ) constant.
Therefore, when the line speed is decreased and the sheet passing area is decreased, the current density (A / dm 2 ) is reduced to suppress the variation in the electric density.
しかしながら、電流密度の低減は、めっき効率を低下させるだけでなく、ステインと呼ばれるめっき付着むらの発生原因となる。 However, the reduction of the current density not only lowers the plating efficiency but also causes uneven plating adhesion called stain.
本発明は、上記の課題を解決するために開発されたもので、めっき操業中、ライン速度が低下した場合であっても、めっき効率を低下させず、かつめっき付着むらの発生を効果的に防止することができる電気めっき方法を提案することを目的とする。 The present invention has been developed to solve the above-described problems. Even when the line speed is reduced during the plating operation, the plating efficiency is not reduced and the occurrence of uneven plating adhesion is effectively prevented. The object is to propose an electroplating method that can be prevented.
さて、発明者らは、上記の課題を解決すべく、鋭意研究を重ねた。
その結果、ライン速度が低下した場合にはめっきセル数を切り替える、具体的には使用するめっきセル数を減少し、単位セル当たりの電流密度を上昇させることによって、所期した目的が有利に達成されることの知見を得た。
本発明は上記の知見に立脚するものである。
Now, the inventors have made extensive studies to solve the above problems.
As a result, when the line speed decreases, the intended purpose is advantageously achieved by switching the number of plating cells, specifically reducing the number of plating cells used and increasing the current density per unit cell. Gained the knowledge of being.
The present invention is based on the above findings.
すなわち、本発明は、鋼板表面に、複数のめっきセルを用いて電気めっきを施すに際し、予め電流密度とめっき効率との関係から電流密度の許容下限値を求めておき、ライン速度に応じてめっきセル数を切り替えることにより、電流密度が上記許容下限値を下回ることがないように、電流密度を制御することを特徴とする電気めっき方法である。 That is, in the present invention, when performing electroplating on a steel sheet surface using a plurality of plating cells, an allowable lower limit value of the current density is obtained in advance from the relationship between the current density and the plating efficiency, and plating is performed according to the line speed. The electroplating method is characterized in that the current density is controlled by switching the number of cells so that the current density does not fall below the allowable lower limit value.
本発明によれば、ライン速度が低下した場合であっても、単位セル当たりの電流密度が許容下限値未満には低下しないので、めっき効率の低下は勿論のこと、めっき付着むらの発生を効果的に防止することができる。 According to the present invention, even if the line speed decreases, the current density per unit cell does not decrease below the allowable lower limit value. Can be prevented.
以下、本発明を具体的に説明する。
図1に、めっきセルの前段にルーパー設備を有しない電気ニッケルめっき設備の全体概略図を示す。図中、番号1がニッケルめっき装置、2は洗浄機、3は焼鈍炉である。
図2には、このニッケルめっき装置1の詳細図を示す。この例は、2基のめっきセルをそなえる場合である。図中、番号4は前段セル、5は後段セルであり、被処理材であるストリップ(鋼板)6は、これら前段セル4および後段セル5を通過する間に、その表裏面に所定厚さのニッケルめっきが施される。また、番号7は前段おもて面整流器、8は前段うら面整流器、9は後段おもて面整流器、10は後段うら面整流器、11は前段通電ロール、12は後段通電ロール、そして13がめっき用電極である。
The present invention will be specifically described below.
FIG. 1 shows an overall schematic diagram of an electro-nickel plating facility that does not have a looper facility upstream of the plating cell. In the figure, number 1 is a nickel plating apparatus, 2 is a washing machine, and 3 is an annealing furnace.
FIG. 2 shows a detailed view of the nickel plating apparatus 1. This example is a case where two plating cells are provided. In the figure, reference numeral 4 is a front cell, 5 is a rear cell, and a strip (steel plate) 6 which is a material to be treated has a predetermined thickness on the front and back surfaces while passing through the front cell 4 and the rear cell 5. Nickel plating is applied. Number 7 is a front surface rectifier, 8 is a back surface rectifier, 9 is a back surface rectifier, 10 is a back surface rectifier, 11 is a front current roll, 12 is a rear current roll, and 13 is It is an electrode for plating.
さて、本発明では、予め電流密度とめっき効率との関係を求めておく。
その一例を図3に示す。
同図に示したとおり、電流密度を低下させていくと、ある値Iに達するとめっき効率は低下しはじめる。
そして、電流密度値がIを下回って来ると、めっき付着むらが発生し出す。従って、Iを、適正なめっき効率が得られめっきむらが発生しない許容下限値とする。
In the present invention, the relationship between the current density and the plating efficiency is obtained in advance.
An example is shown in FIG.
As shown in the figure, when the current density is decreased, the plating efficiency starts to decrease when a certain value I is reached.
When the current density value falls below I, uneven plating adhesion starts to occur. Therefore, I is set to an allowable lower limit value at which proper plating efficiency is obtained and plating unevenness does not occur.
そこで、本発明では、ライン速度の低下に伴い電流密度が低減しはじめた場合、該電流密度値がI値すなわち許容下限値を下回らないように、例えば図4に示すように、許容下限値Iよりも若干高いIO値に到った時点で、セル数を切り替え、セル数を減少して単位セル当たりの電流密度を上昇させるのである。
ここに、IO値は、I値よりも10〜30%程度高い値に設定しておくことが好ましい。
Therefore, in the present invention, when the current density starts to decrease as the line speed decreases, the allowable lower limit value I is set so that the current density value does not fall below the I value, that is, the allowable lower limit value, for example, as shown in FIG. When a slightly higher IO value is reached, the number of cells is switched and the number of cells is decreased to increase the current density per unit cell.
Here, the I O value is preferably set to a value that is about 10 to 30% higher than the I value.
なお、セル数の切り替えは、図2に示した各整流器7〜10を用いて行い、必要に応じて使用するセル数を調整する。 The number of cells is switched using the rectifiers 7 to 10 shown in FIG. 2, and the number of cells to be used is adjusted as necessary.
図1に示した電気ニッケルめっき設備を用いて、ニッケルめっきを行った。セル数の切り替えは、図4に示した要領で行うものとし、ここに電流密度の許容下限値Iは0.5A/dm2、また切り替え設定値IOは0.6A/dm2に設定した。
そして、ライン速度に応じて電流密度が切り替え設定値IOまで低下した際には、図2に示した各整流器7〜10を調整して使用セル数を切り替えた。
Nickel plating was performed using the electric nickel plating facility shown in FIG. The number of cells is switched in the manner shown in FIG. 4, where the allowable lower limit I of the current density is set to 0.5 A / dm 2 and the switching set value I O is set to 0.6 A / dm 2 .
When the current density decreased to the switching set value I O according to the line speed, the number of cells used was switched by adjusting the rectifiers 7 to 10 shown in FIG.
上記の条件で電気ニッケルめっきを実施した際のめっき付着むら発生率について調べた結果を、図5に示す。
なお、めっき付着むら発生率は、従来法に従って、めっき速度の低下に伴い電流密度を低下させた場合におけるめっき付着むら発生率を1として、その相対比で示す。
FIG. 5 shows the result of examining the occurrence rate of uneven plating adhesion when electrolytic nickel plating is performed under the above conditions.
In addition, the plating adhesion unevenness occurrence rate is shown as a relative ratio, assuming that the plating adhesion unevenness occurrence rate is 1 when the current density is lowered with a decrease in the plating speed in accordance with the conventional method.
図5に示したように、本発明に従い、めっき速度の低下に伴い電流密度が低下した場合に、使用セル数を切り替えることによって、電流密度が許容下限値を下回ることがないように制御した場合には、従来に比べてめっき付着むら発生率を格段に低減させることができた。 As shown in FIG. 5, according to the present invention, when the current density is lowered as the plating speed is lowered, the current density is controlled not to fall below the allowable lower limit value by switching the number of cells used. As a result, it was possible to significantly reduce the occurrence rate of plating adhesion unevenness compared to the conventional case.
以上、実施例では、電気ニッケルめっきに本発明を適用した場合について主に説明したが、本発明は、これだけに限るものではなく、電気亜鉛めっきや電気銅めっきなどいわゆる電気めっきであればいずれにも適合する。 As mentioned above, although the Example mainly demonstrated the case where this invention was applied to electro nickel plating, this invention is not restricted only to this, If it is what is called electroplating, such as electrogalvanization and electrocopper plating, any Is also suitable.
1 ニッケルめっき装置
2 洗浄機
3 焼鈍炉
4 前段セル
5 後段セル
6 ストリップ(鋼板)
7 前段おもて面整流器
8 前段うら面整流器
9 後段おもて面整流器
10 後段うら面整流器
11 前段通電ロール
12 後段通電ロール
13 めっき用電極
DESCRIPTION OF SYMBOLS 1 Nickel plating apparatus 2
7 Front surface rectifier 8 Front surface back rectifier 9 Rear surface rectifier
10 Back side rectifier
11 Pre-stage energizing roll
12 Back-stage energizing roll
13 Electrode for plating
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JP2007000792A JP2008169404A (en) | 2007-01-05 | 2007-01-05 | Electroplating method |
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JP2007000792A JP2008169404A (en) | 2007-01-05 | 2007-01-05 | Electroplating method |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60128293A (en) * | 1983-12-16 | 1985-07-09 | Nippon Steel Corp | Device for automatic compensation and control of plating current |
JPS6167797A (en) * | 1984-09-07 | 1986-04-07 | Mitsubishi Electric Corp | Automatic selection controlling device of plating cell |
JPS61127891A (en) * | 1984-11-28 | 1986-06-16 | Nippon Steel Corp | Manufacture of galvanized steel sheet |
JPS61266600A (en) * | 1985-05-20 | 1986-11-26 | Kawasaki Steel Corp | Production of steel sheet electrogalvanized on one side |
JPH04247898A (en) * | 1991-01-22 | 1992-09-03 | Mitsubishi Electric Corp | Plating current controller |
JPH08120483A (en) * | 1994-10-21 | 1996-05-14 | Nippon Steel Corp | Production of electrogalvanized steel sheet excellent in surface appearance |
JP2005272980A (en) * | 2004-03-26 | 2005-10-06 | Jfe Steel Kk | Method for producing electrogalvanized steel sheet having excellent plating appearance |
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2007
- 2007-01-05 JP JP2007000792A patent/JP2008169404A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60128293A (en) * | 1983-12-16 | 1985-07-09 | Nippon Steel Corp | Device for automatic compensation and control of plating current |
JPS6167797A (en) * | 1984-09-07 | 1986-04-07 | Mitsubishi Electric Corp | Automatic selection controlling device of plating cell |
JPS61127891A (en) * | 1984-11-28 | 1986-06-16 | Nippon Steel Corp | Manufacture of galvanized steel sheet |
JPS61266600A (en) * | 1985-05-20 | 1986-11-26 | Kawasaki Steel Corp | Production of steel sheet electrogalvanized on one side |
JPH04247898A (en) * | 1991-01-22 | 1992-09-03 | Mitsubishi Electric Corp | Plating current controller |
JPH08120483A (en) * | 1994-10-21 | 1996-05-14 | Nippon Steel Corp | Production of electrogalvanized steel sheet excellent in surface appearance |
JP2005272980A (en) * | 2004-03-26 | 2005-10-06 | Jfe Steel Kk | Method for producing electrogalvanized steel sheet having excellent plating appearance |
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