JPH0971895A - Plating current controller - Google Patents

Abstract

PROBLEM TO BE SOLVED: To control a plating current by conducting the optimum load balance control for the overall plating current of the plating current of each plating cell in accordance with the concn. of the plating soln. SOLUTION: The concns. of plating cells 3a to 3c are detected by plating soln. concn. detectors 4a to 4c, and the load balance of the plating current is determined by a central processing unit 14 based on the detected concns. The current references of the cells 3a to 3c are calculated by load balance control circuits 9a to 9c from the load balance references of the plating currents of the cells 3a to 3c from the central processing unit 14 and supplied to distributors 8a to 8c.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating current controller for controlling a plating current density within a predetermined range in consideration of a load balance of a plating current of each plating cell.

[0002]

2. Description of the Related Art Heretofore, this type of control device has exclusively controlled the total current of the plating cells without strictly controlling the plating current density while considering the current load balance of each plating cell. That is, conventionally, the plating current supplied to the plating cell is detected by the detector, and the controller supplies the plating current to the plating cell. The line speed of the strip detected by the detector is input to the calculation circuit, and the calculation circuit increases or decreases the total current reference set by the current reference circuit according to the increase or decrease of the line speed. For example, when line speed increases, the total current reference is increased.

[0003]

Since the conventional control device is constructed as described above, the load of the plating current of each plating cell cannot be balanced according to the concentration of the plating solution, so that the concentration of the plating solution, etc. There is a problem that it is difficult to control the plating current density within a predetermined range while taking into consideration the current load balance of each plating cell when the plating conditions of No. 2 change.

The present invention has been made to solve the above problems, and can determine the optimum load balance of the plating current of each plating cell with respect to the total plating current according to the concentration of the plating solution, and at the same time An object of the present invention is to obtain a plating current control device that controls the current density to fall within a predetermined range.

[0005]

SUMMARY OF THE INVENTION Claims 1 and 2 of the present invention
The plating current control device according to (1) controls the load balance of the total plating current by determining the load balance of the plating current of each plating cell according to the feedback of the plating solution concentration.

Further, a plating current control device according to a third aspect of the present invention is provided with a correction circuit for correcting the load balance control circuit according to whether or not each plating cell is used.

Further, the plating current control device according to the fourth and fifth aspects of the present invention is such that the plating current reference is corrected by the feedback signal of the plating adhesion amount.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1. Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram showing an automatic plating current controller according to the first embodiment.
Is a strip to be plated that advances in the direction of the arrow in the figure, 2
Is a detector for detecting the line speed of the strip 1, 3a-
3c is a plating cell for plating the strip 1 and 4a to 4a.
c is a detector for detecting the concentration of each plating solution, 5a-5c are detectors for the plating current supplied to the plating cells 3a-3c, 6a-6c are rectifiers for supplying the plating current, and 7a-
7c is the plating cells 3a to 3c via the rectifiers 6a to 6c.
A controller for controlling the current supplied to the controller to a predetermined value, 8a to 8c distributing the plating current, and a distributor supplying to the controllers 7a to 7c, 9a to 9c according to the load balance of the plating current of each plating cell. A control circuit for performing load balance control on the total current, 10 is an adder for obtaining the total sum of plating currents from the outputs of the detectors 5a to 5c, and 11 is a PI (comparison, integral) controller for outputting an output signal to the load balance control circuit 9a. Supply to ~ 9c. Reference numeral 12 denotes a calculation circuit, which calculates the difference between the line speed of the strip 1 obtained via the detector 2 and the current reference and supplies the information to the adder 12a. The adder 12a is the adder 10
Then, the difference between the sum of the plating current and the output of the calculation circuit 12 is obtained, and the output is supplied to the PI controller 11. 13 is a current reference circuit that calculates a total current reference from the basis weight, plate width, electrode efficiency, and line speed, and supplies this to the calculation circuit 12, and 14 is a center that determines the load balance of the plating current depending on the concentration of each plating solution. It is an arithmetic processing unit.

Next, the operation will be described. The plating currents supplied to the respective plating cells 3a to 3c are detected by the detectors 5a to 5c.
Is detected by and is added by the adder 10. The sum of the plating currents thus obtained is calculated by the adder 12a as a difference from the total current reference of the calculation circuit 12, and is supplied to the controller 11. On the other hand, the plating solution concentration detectors 4a to 4c detect the concentration of each plating solution and feed it back to the central processing unit 14. Central processing unit 14
Calculates the load balance of the plating current of each plating cell according to the feedback signal of each plating solution concentration and outputs it to the control circuits 9a to 9c. Load balance control circuit 9a-
9c receives the output from the PI controller 11, calculates the plating current reference of each plating cell according to the load balance reference of the plating current of each plating cell from the central processing unit 14, and supplies it to the distributors 8a to 8c. Distributor 8a
8c supplies the plating current to the plating cells 3a to 3c via the controllers 7a to 7c, the rectifiers 6a to 6c and the detectors 5a to 5c. The line speed of the strip 1 detected by the detector 2 is input to the calculation circuit 12,
The calculation circuit 12 increases or decreases the total current reference set by the current reference circuit 13 as the line speed increases or decreases. The current reference circuit 13 calculates a comprehensive current reference based on the plating conditions, that is, the basis weight, plate width, electrode efficiency, line speed, and the like.

In this way, the load balance of the plating current is determined for each plating cell in accordance with the concentration of each plating solution, so that the plating current can be set in accordance with the concentration of each plating solution, and the optimum amount of deposited plating can be set. Is effective.

Embodiment 2. In the first embodiment, the case where the load balance of the plating current is determined by the detectors 4a to 4c that detect the concentration of each plating solution has been described. However, in the second embodiment, as shown in FIG. Since 15 is provided and the load balance control circuits 9a to 9c are corrected depending on the use or non-use of each plating cell, the optimum amount of plating adhesion can be secured even when the rectifier of each plating cell is turned on and off.

Embodiment 3. As shown in FIG. 3, a total current value required for correction is calculated from a detection device 16 for detecting the amount of plating adhered, a feedback value from the amount of plating adhesion detector 16 and a speed feedback value from the line speed detector 2. Since the central processing unit 17 and the adder 18 are provided and the total plating current reference is corrected by the feedback signal of the plating adhesion amount, the basis weight, the plate width,
It is possible to secure the optimum amount of plating adhered to changes in various plating conditions such as electrode efficiency and line speed.

[0013]

As described above, according to the first and second aspects of the present invention,
According to the plating current control device, the load balance circuit by feedback of the plating solution concentration is added, so by determining the load balance of the plating current of each plating cell according to the plating solution concentration, the load balance control for the total plating current can be performed. Then, the plating current value of each plating cell can be determined.

Further, according to the plating current control device of the third aspect of the present invention, since the load balance control circuit is provided with the correction circuit for correcting whether or not each plating cell is used, the rectifier of each plating cell is provided. Even when turning on and off, the optimum amount of plating can be secured.

Further, according to the plating current control device of the fourth and fifth aspects of the present invention, the plating current reference is corrected by the feedback signal of the plating adhesion amount.
It is possible to secure the optimum amount of deposited plating even with respect to changes in various plating conditions such as the basis weight, plate width, electrode efficiency and line speed.

[Brief description of drawings]

FIG. 1 is a block diagram showing a plating current control device according to a first embodiment of the present invention.

FIG. 2 is a block diagram showing a plating current control device according to a second embodiment of the present invention.

FIG. 3 is a block diagram showing a plating current control device according to a third embodiment of the present invention.

[Explanation of symbols]

1 strip, 2 speed detector, 3a to 3c plating cell, 4a to 4c plating solution concentration detector, 8a to 8c
Distributor, 9a to 9c Load balance control circuit, 10, 1
2a, 18 adder, 12 calculation circuit, 13 current reference circuit, 14, 17 central processing unit, 15 correction circuit, 16 plating amount detection device.

Claims (5)

[Claims] 1. A plating current controller that controls the plating current of each plating cell in accordance with the sum of the plating currents supplied to the plurality of plating cells and the line speed of the strip to be plated, detects the concentration of each plating solution. A plating current control device which calculates a plating current reference for each plating cell and supplies a plating current to each plating cell based on the calculated reference. 2. A first adder for obtaining a sum of plating currents supplied to a plurality of plating cells, a current reference circuit for setting a total current reference from plating conditions, and a detection for detecting a line speed of a strip to be plated. For increasing or decreasing the total current reference from the current reference circuit in response to the output from the controller
And a second adder that controls the plating current supplied to each plating cell according to the output of the first calculation circuit and the output of the first adder, and the second adder. In a plating current control device having a distributor that evenly distributes the controlled plating current to each of the plating cells, a central processing unit that determines the load balance of the plating current depending on the concentration of each plating solution, and the central processing unit And a load balance control circuit for calculating the current reference of each plating cell according to the load balance reference of the plating current of each plating cell and supplying it to the distributor. 3. The plating current control device according to claim 2, further comprising a correction circuit for correcting the load balance control circuit according to use or non-use of each plating cell. 4. The plating current control device according to claim 1, wherein the plating current reference is corrected by a feedback signal of the plating adhesion amount. 5. A plating adhesion amount detecting device, a central processing unit for calculating a total current value required for correction from a feedback value from the plating adhesion amount detecting device and a feedback value from a line speed detector, and the correction. The plating current control device according to claim 2, further comprising a third adder for adding values.