JP7260337B2 - ELECTROPLATING CURRENT CONTROL METHOD AND ELECTROPLATING CURRENT CONTROL DEVICE - Google Patents

Description

The present invention relates to an electroplating current control method and an electroplating current control device.

In Patent Document 1, in an electroplating facility equipped with a plating line in which plating tanks containing plating electrodes are arranged along the traveling direction of the material to be plated, the required current is increased or decreased when the material to be plated accelerates or decelerates. describes an electroplating current control method that achieves a desired basis weight by increasing or decreasing the number of plating electrodes used and the electrode current flowing through the plating electrodes used, respectively, according to the number of plating electrodes used.

Japanese Unexamined Patent Application Publication No. 2010-202950

Here, in Patent Literature 1 described above, no current is applied to unused plating electrodes. However, if no current is applied to the unused plating electrode, the plating material may deposit on the plating electrode, and the deposited plating material may adhere to the material to be plated, resulting in defects. Therefore, in an actual electroplating equipment, a constant small current (hereinafter sometimes referred to as "BASE current" or "base current") is passed through plating electrodes that are not used. Although the current is small, passing the BASE current also changes the basis weight (more specifically, the basis weight increases).

In this regard, the technique described in Patent Document 1 described above does not take into consideration the change in the basis weight due to the BASE current, so there is a risk that the plating of the final product will be thicker than the target basis weight. . In recent years, the speed of the plating line has increased and the number of plating electrodes has increased, so the width of basis weight (difference between the thinnest basis weight and the thickest basis weight) has increased. In the case of thin coating, the majority of electrodes are not used, so if the BASE current is not considered as in Patent Document 1, the phenomenon that the plating of the final product becomes thicker than the target coating weight becomes more pronounced. will appear.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electroplating current control method and an electroplating current control apparatus capable of achieving a desired basis weight.

An electroplating current control method according to one aspect of the present invention supplies current to an electroplating facility having a plating line that is arranged along the traveling direction of a material to be plated and is divided into a plurality of paths of a predetermined length. An electroplating current control method for controlling the basis weight in one or more use passes, which are passes that the material to be plated has already passed and are supplied with a current for the basis weight of the material to be plated; Supply to the plating electrode in one or more non-passed passes, which are the passes before the material to be plated passes, considering the basis weight in one or more non-used passes that have already passed but are not used passes Including deriving the current value, the basis weight in the non-use pass is derived according to the current value of the base current predetermined as the supply current to the plating electrode in the non-use pass.

In such an electroplating current control method, not only the basis weight in the used path but also the basis weight in the unused path to which the base current is supplied (the basis weight corresponding to the base current) is considered, and the basis current supplied to the plating electrode A current value is derived. In this way, by deriving the supply current value in consideration of the basis weight caused by the base current, thick basis weight due to the base current can be suppressed, and a desired basis weight can be achieved.

In the above control method, each time the first region of the material to be plated passes through one pass, the remaining basis weight obtained by subtracting the completed basis weight for which the basis weight has already been completed for the first region from the target basis weight in the first region and a required total current to satisfy the remaining basis weight, and based on the required total current, from one or a plurality of non-passed paths, a current for the basis weight of the material to be plated is supplied. and a step of deriving a current value to be supplied to the plating electrode in each of the one or more non-passed paths based on the information of the identified one or more paths to be used. and setting the current to be supplied to the plating electrode in the next pass through which the material to be plated passes next based on the derived supply current value, and the step of deriving the supply current value includes one or more Based on the information on the paths scheduled to be used, for one or more paths scheduled to be used, the supply current value to be supplied to the plating electrode is derived according to the basis weight based on the total required current. For one or more scheduled unused paths that are not scheduled paths, the current value of the base current is derived as the supply current value supplied to the plating electrode, and in the step of identifying the scheduled used paths, The total basis weight and the total basis weight according to the supply of the base current in one or more non-use paths may be used as the completed basis weight to derive the remaining basis weight. Thus, when deriving the remaining basis weight from the target basis weight and the completed basis weight, the basis weight generated by the base current is added to the completed basis weight according to the supply of the base current in the non-use path. can be surely taken into account to derive the supply current value.

In the control method described above, in the step of identifying the paths to be used, one or a plurality of paths to be used may be identified in consideration of an assumed basis weight according to the base current of the paths not to be used. When deriving the supply current value considering the base current in the unused path, it is necessary to appropriately consider the basis weight according to the supply of the base current in the path that the material to be plated has already passed (passing path). Although it can be done, the basis weight according to the supply of the base current of the paths to be passed in the future (non-passed paths) cannot be taken into consideration because the passing speed is undetermined. For this reason, for example, in a mode in which the supply current value is not derived in a section in which there is no path to be used thereafter, the basis weight according to the supply of the base current in the paths scheduled to be unused after the last path to be used is not taken into consideration. Since the supply current value is derived, there is a risk that the base current of the non-use path after the last use path may cause thick coating. In this regard, the paths that are planned to be used are identified and the supply current value is derived by considering the assumed basis weight according to the base current of the paths that are not to be used on the premise that the current speed continues. The supply current value is derived in consideration of the basis weight of the planned pass, and it is possible to avoid the occurrence of thick basis weight due to the base current of the non-use paths after the last use pass.

In the above control method, in the step of specifying the path to be used, a value obtained by subtracting the assumed basis weight from the remaining basis weight is derived as the recalculated remaining basis weight, and the required total current that satisfies the recalculated remaining basis weight is derived. , may identify one or more paths to be used. In this way, the expected basis weight corresponding to the base current is subtracted to derive the recalculated remaining basis weight, and the planned use path is specified. It is possible to derive the supply current value by surely considering the corresponding basis weight.

In the above control method, in the step of specifying the path to be used, when the conveying speed of the material to be plated changes, the value of the base current is corrected according to the change in the conveying speed, and further estimated from the corrected BASE current value A basis weight may be derived. In this way, by changing the value of the base current in accordance with the change in the conveying speed, it is possible to keep the basis weight uniform according to the base current even when the conveying speed changes. It is possible to suppress the occurrence of excess and deficiency.

An electroplating current control device according to another aspect of the present invention is an electroplating equipment equipped with a plating line arranged along the traveling direction of a material to be plated and divided into a plurality of paths of a predetermined length. An electroplating current control device that controls the supply current to a device (rectifier), and manages the basis weight of the material to be plated in divided sections of the same length, and the path that the material to be plated has already passed for each divided section and the basis weight in one or more used passes, which are passes to which current is supplied for the basis weight of the material to be plated, and the basis weight in one or more non-used passes that have already passed and are not used passes. Considering this, a derivation unit is provided for deriving the current value supplied to the plating electrode in one or more non-passing passes that are the passes before the material to be plated passes, and the derivation unit is the basis weight in the non-use pass is derived according to the current value of the base current predetermined as the supply current to the plating electrode in the non-use path.

ADVANTAGE OF THE INVENTION According to this invention, the electroplating current control method and electroplating current control apparatus which can implement|achieve desired basis weight can be provided.

1 is a schematic diagram showing a schematic configuration of an electroplating current control system according to a first embodiment of the present invention; FIG. 2 is a schematic diagram showing a schematic configuration of electroplating equipment included in the electroplating current control system of FIG. 1. FIG. It is a hardware block diagram of a control apparatus. 4 is a flow chart showing an execution procedure of electroplating current control processing according to the first embodiment of the present invention; FIG. 4 is a diagram for explaining an electroplating current control process according to the first embodiment of the present invention, where (a) is a table showing current value calculation results at calculation positions in the first pass, and (b) is a diagram showing the first pass. is. FIG. 4A is a diagram illustrating an electroplating current control process according to the first embodiment of the present invention, in which (a) is a table showing current value calculation results at calculation positions in the fourth pass, and (b) is a diagram showing the fourth pass; is. FIG. 4A is a diagram for explaining the electroplating current control process according to the first embodiment of the present invention, in which (a) is a table showing current value calculation results at calculation positions in the fifth pass, and (b) is a diagram showing the fifth pass; is. FIG. 4A is a diagram illustrating the electroplating current control process according to the first embodiment of the present invention, in which (a) is a table showing current value calculation results at calculation positions in the sixth pass, and (b) is a diagram showing the sixth pass; is. FIG. 4A is a diagram for explaining the electroplating current control process according to the first embodiment of the present invention, in which (a) is a table showing current value calculation results at calculation positions in the seventh pass, and (b) is a diagram showing the seventh pass; is. FIG. 10 is a flow chart showing an execution procedure of an electroplating current control process according to the second embodiment; FIG. FIG. 10A is a diagram for explaining the electroplating current control process according to the second embodiment, in which (a) is a table showing current value calculation results at calculation positions in the first pass, and (b) is a diagram showing the first pass. FIG. 8 is a diagram for explaining an electroplating current control process according to the second embodiment, in which (a) is a table showing current value calculation results at calculation positions in the second pass, and (b) is a diagram showing the second pass. FIG. 11 is a flow chart showing an execution procedure of an electroplating current control process according to the third embodiment; FIG. FIG. 11A is a diagram for explaining the electroplating current control process according to the third embodiment, in which (a) is a table showing current value calculation results at calculation positions in the third pass, and (b) is a diagram showing the third pass. FIG. 11A is a diagram for explaining an electroplating current control process according to the third embodiment, in which (a) is a table showing current value calculation results at calculation positions in the fourth pass, and (b) is a diagram showing the fourth pass.

Hereinafter, embodiments will be described in detail with reference to the drawings. In the explanation, the same reference numerals are given to the same elements or elements having the same function, and duplicate explanations are omitted.

[First embodiment]
<Electroplating current control system>
First, an electroplating current control system 1 according to a first embodiment will be described with reference to FIGS. 1 to 3. FIG. FIG. 1 is a schematic diagram showing a schematic configuration of an electroplating current control system 1 according to the first embodiment.

As shown in FIG. 1 , the electroplating current control system 1 includes an electroplating equipment 10 , a controller 50 , a basis weight setting device 70 and a speed setting device 80 . The basis weight setter 70 and the speed setter 80 are configured to enable control of the electroplating equipment 10 by the control device 50 by outputting predetermined information to the control device 50 . Specifically, the basis weight setting device 70 outputs (sets) a target basis weight (a target value of the plating adhesion amount) for the material to be plated to the control device 50 . In addition, the speed setter 80 outputs (sets) the target conveying speed (line speed) of the material to be plated to the control device 50 .

(Electroplating equipment)
FIG. 2 is a schematic diagram showing a schematic configuration of the electroplating equipment 10. As shown in FIG. The electroplating equipment 10 is arranged along the traveling direction of the material to be plated 11, which is a steel plate, and has a plurality of passes P (a first pass P1, a second pass P2, a third pass P3, a fourth pass P4, fifth pass P5, sixth pass P6, seventh pass P7, eighth pass P8, and ninth pass P9). In the electroplating equipment 10, while the material 11 to be plated passes through the plating line L, the material is weighted according to the current flowing through the pair of electrodes 13a, 13a of the plating cell 13 provided in each path P, and is sent to the next process. be done. In the plating cell 13, electrodes 13a and 13a are provided on the front and back surfaces of the material 11 to be plated so that both sides (front and back) of the material 11 to be plated can be plated. The material to be plated 11 is transported by a bridle (not shown) driven by an electric motor (not shown), and a plurality of conductor rolls 19a and sink rolls 19b provided at approximately equal intervals. The plating cell 13 is housed in a plating bath 14 . The plating bath 14 contains a plating electrolyte. When current flows through the electrodes 13a, 13a, the plating electrolyte, the material to be plated 11, and the conductor roll 19a, the material in each plating cell 13 or the plating material contained in the electrolyte is plated on the material to be plated 11. .

The plating lines L are arranged at approximately equal intervals, the first pass P1, the second pass P2, the third pass P3, the fourth pass P4, the fifth pass P5, the sixth pass P6, the seventh pass P7, the eighth pass P8, and a ninth pass P9. The control section of each path P is, for example, between the conductor roll 19a and the sink roll 19b that are continuous with each other (more specifically, between the calculated positions CR of the conductor roll 19a and the sink roll 19b). Further, as shown in FIG. 2, the divided sections of the material to be plated include, for example, a first region at tracking points Ta to Tb, a second region at tracking points Tb to Tc, a third region at tracking points Tc to Td, and a third region at tracking points Tc to Td. Tracking points Td to Te in the 4th region, tracking points Te to Tf in the 5th region, tracking points Tf to Tg in the 6th region, tracking points Tg to Th in the 7th region, tracking points Th to Ti in the 8th region, and tracking points Th to Ti in the 8th region. 9 regions are divided into tracking points Ti to Tj. The upstream side of each path P is a calculation position CR for calculating the current value. Further, the position of the upstream end of the electrode 13a of the plating cell 13 in each pass P is the output position OR where the current value calculated at the calculation position CR is set in the electroplating equipment 10. FIG.

(Control device)
Returning to FIG. 1, functions of the control device 50 will be described. The control device 50 is a device that controls the electroplating equipment 10 . The control device 50 includes an acquisition unit 51 , a storage unit 52 , a derivation unit 53 and a setting unit 54 .

The obtaining unit 51 obtains the target weight per unit area from the weight per unit area setter 70 and obtains the line speed, which is the transport speed of the material to be plated 11 , from the speed setter 80 . The acquisition unit 51 stores the acquired target basis weight and line speed in the storage unit 52 . The acquisition unit 51 may acquire the above information at predetermined time intervals, or may acquire the information only when the target basis weight or line speed changes.

The deriving section 53 derives the value of current supplied to the electrodes 13a, 13a (plating electrodes) of each plating cell 13. As shown in FIG. The derivation unit 53 acquires the target basis weight and the line speed from the storage unit 52, and each time the tracking points Ta to Tj of the material to be plated 11 pass through the calculated position CR of each pass P, the electrode 13a of each plating cell 13 , 13a (plating electrode). The lead-out unit 53 stores the derived current values supplied to the electrodes 13 a of the plating cells 13 in the storage unit 52 .

The derivation unit 53 first derives the remaining basis weight by subtracting the completed basis weight for which the basis weight has already been completed for the predetermined region from the target basis weight for the predetermined region of the material to be plated 11 . Subsequently, the derivation unit 53 derives the required total current that satisfies the remaining basis weight (allows the remaining basis weight to be applied). Subsequently, the derivation unit 53 identifies one or more planned use paths from one or more non-passed paths based on the required total current. The non-passed path is the path P before the material to be plated 11 passes (the material to be plated 11 is scheduled to pass from now on). The non-passed paths include the above-mentioned planned use paths and non-use planned paths. The path to be used is the path P to which the electric current for determining the weight of the material to be plated 11 is scheduled to be supplied. A non-used path is a path P that is not a planned-to-use path. A fixed small current (BASE (base) current) is also supplied to the paths not to be used, and the BASE current is a current for suppressing deposition of the plating material on the electrodes 13a, 13a. . Therefore, the "current for the basis weight of the material to be plated 11" does not include the BASE current, and the path not to be used is the path planned to be used (the path to which the current for the basis weight of the material to be plated 11 is scheduled to be supplied). P) is different. Then, the deriving unit 53 determines one or more non-passed paths (one or more paths P that may include both a planned-to-use path and a planned-to-be-unused path) based on information on the specified one or more planned-to-use paths. A current value supplied to each of the electrodes 13a, 13a is derived.

Derivation of the remaining basis weight described above will be described in detail. The lead-out portion 53 is a path P through which the material to be plated 11 has already passed and to which an electric current for determining the weight of the material to be plated 11 is supplied. The remaining basis weight is derived in consideration of the basis weight of one or a plurality of non-use paths, which are paths P that have already passed 11 and are not the above-described used paths. The basis weight for each used pass is set based on the target basis weight and the weight for each pass P (details will be described later). The basis weight in the non-use path is derived according to the current value of the BASE current predetermined as the supply current to the electrodes 13a, 13a in the non-use path. The deriving unit 53 derives a value obtained by adding the sum of the basis weights in each use path and the sum of the basis weights according to the supply of the BASE current in each non-use path as a complete basis weight, and calculates the total basis weight from the target basis weight. By subtracting the completed basis weight, the remaining basis weight (the amount of basis weight to be used on the planned use path and non-use planned path in the future) is derived.

Derivation of the supply current value to the electrodes 13a, 13a in each non-passage path described above will be described in detail. The deriving unit 53 supplies the one or more planned use paths to the electrodes 13a, 13a according to the basis weight based on the above-described required total current, based on the information of the specified one or more planned use paths. (details will be described later), and for one or a plurality of non-use paths, the current value of the BASE current is derived as the supply current value to be supplied to the electrodes 13a, 13a.

Based on the supply current value derived by the derivation unit 53, the setting unit 54 sets the current supplied to the electrodes 13a, 13a in the next pass, which is the pass P through which the material to be plated 11 passes next. The setting unit 54 acquires the value of the current supplied to the electrodes 13a, 13a of the plating cell 13 of the next pass from the storage unit 52, and sets the current supplied to the electrodes 13a, 13a.

FIG. 3 is a hardware configuration diagram of the control device 50. As shown in FIG. As shown in FIG. 3, the control device 50 is composed of a circuit 100 having one or more processors 103, memory 104, storage 105, and input/output ports . The input/output port 106 inputs and outputs control signals to and from the electroplating equipment 10 , the basis weight setter 70 and the speed setter 80 . The storage 105 records programs for causing the support effect calculator 3 to execute processing. The storage 105 can be anything computer readable. Specific examples include hard disks, nonvolatile semiconductor memories, magnetic disks, and optical disks. The memory 104 temporarily stores the programs loaded from the storage 105, the calculation results of the processor 103, and the like. The processor 103 cooperates with the memory 104 to execute a program, thereby configuring each functional module described above.

Note that the hardware configuration of the control device 50 is not necessarily limited to configuring each functional module by a program. For example, each functional module of the control device 50 may be composed of a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) integrated with this.

<Procedure for executing electroplating current control processing>
Next, the execution procedure of the electroplating current control process (control method) performed by the control device 50 will be described in detail with reference to FIG.

As shown in FIG. 4, the acquisition unit 51 of the control device 50 first acquires the target weight per unit area from the perimeter weight setting device 70 (step S1). The acquisition unit 51 also acquires the line speed from the speed setting device 80 . The acquisition unit 51 stores the acquired target basis weight and line speed in the storage unit 52 .

Subsequently, when the tracking points Ta to Tj pass the calculation position CR of each path P (step S2), the derivation unit 53 of the control device 50 calculates the remaining basis weight by subtracting the completed basis weight from the target basis weight ( step S3). Specifically, the deriving unit 53 acquires the target weight per unit area from the storage unit 52, and obtains the total weight per unit area for each use pass and the total weight per unit weight according to the supply of the BASE current for each non-use path. is derived as a completed basis weight, and the remaining basis weight is calculated by subtracting the completed basis weight from the target basis weight.

Subsequently, the derivation unit 53 calculates the required total current I according to the remaining basis weight F from the following equation (1) (step S4). The derivation unit 53 acquires the line speed V from the storage unit 52 when deriving the required total current. Note that the coefficient K is a predetermined value, and the width W of the material to be plated 11 and the plating efficiency E are also predetermined values that do not change during the control process.
I=K*F*W*V/E (1)
I: Required total current (A), K: Factor, F: Remaining basis weight (g/m2), W: Width of plated material 11 (mm), V: Line speed (mpm), E: Plating efficiency (% )

Subsequently, the derivation unit 53 determines the number of used paths m so as to satisfy the following expression (2) (step S5). That is, the derivation unit 53 sets the number of used paths m to the minimum number that satisfies the required total current. The activation priority and burden ratio Bn of each path P are determined in advance.
Σn _=1～m−1 (iR*Bn)<I<Σn _=1～m (iR*Bn) (2)
m: number of paths used, iR: rated current (A) of each path, I: total required current (A), Bn: load ratio (LOAD RATIO) of path P with n-th startup priority

Subsequently, the derivation unit 53 determines whether or not the next pass, which is the pass P through which the tracking points Ta to Tj of the material to be plated 11 will pass, is the use pass (step S6). In step S6, if the next pass is the use pass, the derivation unit 53 calculates the basis weight f for the next electrodes 13a, 13a from the following equation (3) (step S7).
f=F*Bnx/Bna (3)
f: basis weight of next electrodes 13a, 13a (g/m2), F: remaining basis weight (g/m2), Bnx: burden ratio of next pass, Bna: sum of burden ratios of all passes used

Subsequently, the derivation unit 53 calculates the supply current value i to the next electrodes 13a, 13a from the following equation (4) (step S8).
i=K*f*W*V/E (4)
i: supply current value (A) to the next electrodes 13a, 13a, K: coefficient, F: basis weight of the next electrodes 13a, 13a (g/m2), W: width of the material to be plated 11 (mm), V: Line speed (mpm), E: Plating efficiency (%)

In step S6, if the next path is not the used path but the non-used path, the setting unit 54 of the control device 50 sets the current value so that the BASE current flows through the next electrodes 13a, 13a (step S9). . Note that the derivation unit 53 derives not only the current value of the next path but also the current values of the other non-passed paths in the same way, and stores the calculation result (for example, see FIG. 5A) in the storage unit 52. may As shown in FIG. 5(a), in the calculation result, for each path P, the activation priority, the burden ratio, whether it is a path scheduled to be used ("ON" in FIG. 5), or whether it is a path scheduled to be unused. (“BASE” in FIG. 5), the supply current value, and the basis weight ratio corresponding to the supply current value are associated with each other.

Subsequently, the lead-out part 53 determines whether or not the tracking points Ta to Tj of the material to be plated 11 have passed the output position OR of each pass P (step S10). When it is determined that the output position OR has been passed in step S10, the derivation unit 53 outputs the current value or the BASE current value calculated and set as described above to the current control device (rectifier) (step S11). . Then, it is determined whether or not there is a used path for which the supply current value has not yet been set (step S12). If it is determined in step S12 that there is no used path for which the supply current value is not set, the process ends. On the other hand, when it is determined in step S12 that there is a use path for which the supply current value is not set, the derivation unit 53 calculates the sum of the weight per unit area of each use path and the BASE current supply of each non-use path. A value obtained by summing the sum of the basis weights according to is derived as a completed basis weight (step S13), and the processes from step S2 onward are performed again. The above is the execution procedure of the electroplating current control process (control method) performed by the control device 50 .

<Example of electroplating current control processing>
Next, an example (specific example) of the electroplating current control process will be described with reference to FIGS. 5 to 9. FIG. 5 to 9 are diagrams for explaining the electroplating current control process. (b) shows the processing at the calculation position CR of which path P the tracking point Ta of the material to be plated is, and (a ) shows the current value calculation result for each path P at the tracking point Ta shown in (b). 5 shows information about the first pass P1, FIG. 6 the fourth pass P4, FIG. 7 the fifth pass P5, FIG. 8 the sixth pass P6, and FIG. 9 the seventh pass P7. Note that the numerical values in the calculation examples described below are examples of tin plating.

First, a specific example of processing when the tracking point Ta shown in FIG. 5B reaches the calculated position CR of the first path P1 will be described. For example, the derivation unit 53 refers to the storage unit 52 and acquires the target basis weight: 2.800 (g/m2). Since it is the first pass P1, the deriving unit 53 calculates the remaining basis weight=target basis weight=2.800 (g/m2). The derivation unit 53 calculates the required total current from the formula (1) described above. Coefficient K: 2.71, remaining basis weight F: 2.800 (g/m2), width W of plated material 11: 1000 (mm), line speed V: 200 (mpm), plating efficiency E: 90 (%) ), the derivation unit 53 calculates the required total current from the equation (1) as follows.
Required total current I=2.71*2.8*1000*200/90=16862.2(A)

Subsequently, the derivation unit 53 determines five paths P (first path P1, eighth path P8, second path P2, seventh path P1, eighth path P8, second path P2, seventh path P7, and the third path P3) are specified as the paths to be used, and the other paths P (the fourth path P4, the fifth path P5, the sixth path P6, and the ninth path P9) are specified as the paths not to be used. (See FIG. 5(a)).

Subsequently, the deriving unit 53 calculates the weight per unit area of the electrodes 13a, 13a of the first pass P1, which is the next pass and the pass to be used, from the above-described formula (3). As shown in FIG. 5A, when the burden ratio Bnx of the first pass P1, which is the next pass, is 80, and the total burden ratio Bna of all the paths to be used is 380 (80+70+80+70+80), the formula (3) gives , the derivation unit 53 calculates the basis weight of the electrodes 13a, 13a of the first pass P1 as follows.
First pass P1 basis weight f1=2.8*80/380=0.5895 (g/m2)

Subsequently, the derivation unit 53 calculates the supply current value i to the electrodes 13a, 13a of the first pass P1 from the above-described equation (4). It is assumed that the conditions such as the coefficient K are the same as those described above.
Supply current value i1 of first path P1=2.71*0.589*1000*200/90≈3549.9 (A)

The deriving unit 53 derives not only the first pass P1, which is the next pass, at the tracking point Ta of the material to be plated, but also the supply current value to the next pass at the calculated position CR of each of the other tracking points Tb to Tj. , to output the current value calculation result. The setting unit 54 sets the supply current value i1≈3549.9 (A) as the current value of the electrodes 13a, 13a of the first pass P1. The control device 50 performs the same processing for the tracking points Tb to Tj passing through the calculated positions CR of the second path P2 and the third path P3, respectively, and determines the supply current value to the electrodes 13a and 13a of the second path P2. and the value of current supplied to the electrodes 13a, 13a of the third path P3.

Next, at the calculation position CR of the fourth pass P4 shown in FIG. 6B, the derivation unit 53 first calculates The total basis weight is derived as a completed basis weight: 1.768 (g / m2), and the target basis weight: 2.800 (g / m2) is subtracted from the completed basis weight: 1.768 (g / m2), Remaining basis weight: 1.032 (g/m2) is calculated. Then, the derivation unit 53 calculates the required total current I=2.71*1.032*1000*200/90=6212.4 (A) from the above equation (1), and from the equation (2), 2 One path P (seventh path P7 and eighth path P8) is specified as a path to be used, and the other paths P (fourth path P4, fifth path P5, sixth path P6, and ninth path P9) are specified as non-used paths. It is specified as a path to be used (see FIG. 6(a)). As shown in FIG. 6(a), the fourth path P4 is an unused path, so the setting unit 54 sets the current value of the BASE current to set as

Subsequently, at the calculation position CR of the fifth pass P5 shown in FIG. do. The basis weight of the non-use path is calculated by modifying the above formula (1). Now, the BASE current is 200 (A), so the basis weight fb of the non-use path is 200*90/(2 .71*1000*200)=0.033 (g/m2). The deriving unit 53 subtracts the remaining basis weight fb of the non-use pass from the remaining basis weight of 1.032 (g/m2) of the fourth pass P4 to obtain a remaining basis weight of 0.033 (g/m2). 998 (g/m2) is calculated. Then, the derivation unit 53 calculates the required total current I=2.71*0.998*1000*200/90=6012.4 (A) from the above equation (1), and from the equation (2), 2 Identifies one path P (the seventh path P7 and the eighth path P8) as the paths to be used, and identifies the other paths P (the fifth path P5, the sixth path P6, and the ninth path P9) as the paths not to be used. (see FIG. 7(a)). As shown in FIG. 7(a), the fifth path P5 is an unused path, so the setting unit 54 sets the current value of the BASE current: 200 (A) to the electrodes 13a, 13a of the fifth path P5. Set as the supply current value to

Subsequently, at the calculation position CR of the sixth pass P6 shown in FIG. do. The basis weight of the non-use path is calculated by modifying the above formula (1). Now, the BASE current is 200 (A), so the basis weight fb of the non-use path is 200*90/(2 .71*1000*200)=0.033 (g/m2). The derivation unit 53 subtracts the remaining basis weight fb: 0.033 (g/m2) in the non-use pass from the remaining basis weight: 0.998 (g/m2) in the fifth pass P5, and the remaining basis weight: 0.998 (g/m2). 965 (g/m2) is calculated. Then, the derivation unit 53 calculates the required total current I=2.71*0.965*1000*200/90=5812.4 (A) from the above equation (1), and from the equation (2), 2 One path P (the seventh path P7 and the eighth path P8) is specified as the path to be used, and the other paths P (the sixth path P6 and the ninth path P9) are specified as the paths not to be used (Fig. 8(a)). )reference). As shown in FIG. 8(a), the sixth path P6 is an unused path, so the setting unit 54 sets the current value of the BASE current: 200 (A) to the electrodes 13a, 13a of the sixth path P6. Set as the supply current value to

Subsequently, at the calculation position CR of the seventh pass P7 shown in FIG. 9(b), the derivation unit 53 first calculates one Subtract the weight per unit area fb of 0.033 (g/m2) in the previous non-use pass, and calculate the remaining weight per unit area: 0.932 (g/m2). Then, the derivation unit 53 calculates the required total current I=2.71*0.932*1000*200/90=5612.4 (A) from the above equation (1), and from the equation (2), 2 One path P (seventh path P7 and eighth path P8) is specified as a path to be used, and the other path P (a ninth path P9) is specified as a path not to be used (see FIG. 9A). The deriving unit 53 calculates the weight per unit area of the electrodes 13a, 13a of the seventh pass P7, which is the next pass and the pass to be used, from the above-described formula (3). As shown in FIG. 9(a), when the burden ratio Bnx of the seventh pass P7, which is the next pass, is 70, and the total burden ratio Bna of all the paths to be used is 140 (70+70), from equation (3) , the deriving unit 53 calculates the basis weight f=0.932*70/140=0.466 (g/m2) for the seventh pass P7. Then, the deriving unit 53 calculates the supply current value i=2.71*0.466*1000*200/90≈2806.2 (A) of the seventh path P7 from the above-described equation (4). The setting unit 54 sets the supply current value i≈2806.2 (A) as the current value of the electrodes 13a, 13a of the seventh path P7. The control device 50 performs similar processing when the tracking point Ta reaches the calculated position CR on the eighth path P8. As shown in FIG. 9A, since the eighth path P8 is the last path to be used, the current value calculation process is not performed thereafter, and the current value is set (the ninth path, which is a path not to be used). P9 supply current value: setting of 200 (A)) is performed. Note that when the line speed changes while passing through each of the paths described above, the current of the used path changes according to the change in the line speed V according to the equation (4). As a result, even if the line speed changes, the planned basis weight is ensured during passing.

<Effect>
Next, the effects of the electroplating current control method according to the first embodiment will be described.

In electroplating equipment, a constant small current (BASE current) is passed through electrodes that are not used (the current for basis weight is not actively applied) from the viewpoint of suppressing adhesion of the plating material. Although such a BASE current also increases the basis weight of the material to be plated, conventionally, the value of the current supplied to the electrode is determined without considering the change in the basis weight due to the BASE current. As a result, the plating of the final product may become thicker than the target basis weight. In recent years, the speed of plating lines has increased, the number of plating electrodes has increased, and the width of basis weight (difference between the thinnest basis weight and the thickest basis weight) has increased. In the case of thin coating, the majority of electrodes are not used, so if the BASE current is not considered as in Patent Document 1, the phenomenon that the plating of the final product becomes thicker than the target coating weight becomes more pronounced. Thus, the weight per unit area due to the BASE current cannot be ignored.

In order to solve such a problem, the electroplating current control method according to the present embodiment provides a plating line L that is arranged along the traveling direction of the material to be plated 11 and is divided into a plurality of paths P having a predetermined length. An electroplating current control method for controlling the supply current to the electroplating equipment 10 provided, which is a path P through which the material to be plated 11 has already passed and to which the current for the basis weight of the material to be plated 11 is supplied. Considering the basis weight of one or more used passes that are P and the basis weight of one or more non-used passes that are already passed P and are not used passes, This includes deriving the supply current value to the electrodes 13a and 13a in one or a plurality of non-passed paths, which is the path P, and the basis weight in the non-use path is preliminarily set as the supply current to the electrodes 13a and 13a in the non-use path. It is derived according to the current value of the determined BASE current. In such an electroplating current control method, not only the basis weight in the used path, but also the basis weight in the unused path to which the BASE current is supplied (the basis weight according to the BASE current) is taken into consideration, and the electrode 13a, 13a is derived. In this way, by deriving the supply current value in consideration of the basis weight caused by the BASE current, thick basis weight due to the BASE current can be suppressed, and a desired basis weight can be achieved.

More specifically, in the electroplating current control method according to the present embodiment, each time a predetermined region of the material to be plated 11 passes through one pass P, from the target basis weight in the predetermined region, already Deriving a remaining basis weight obtained by subtracting the completed basis weight from which the basis weight has been completed, deriving a required total current that satisfies the remaining basis weight, and based on the required total current, from one or more non-passed paths, a step of identifying one or more planned-to-use paths that are paths P to which current is supplied for determining the basis weight of the material to be plated 11; a step of deriving the value of the current supplied to the electrodes 13a, 13a in each of the non-passing paths; and, in the step of deriving the supply current value, based on the information of the one or more paths to be used, for the one or more paths to be used, according to the basis weight based on the total required current , to derive the supply current value to be supplied to the electrodes 13a, 13a, and for one or a plurality of paths not to be used among the non-passed paths, the current value of the BASE current is supplied to the electrodes 13a, 13a. In the step of deriving the supply current value as the supply current value to be used and specifying the path to be used, the sum of the basis weights in one or more use paths and the basis weight according to the supply of the BASE current in one or more non-use paths The remaining basis weight is derived using the value obtained by summing the combined value as the completed basis weight. In this way, when deriving the remaining basis weight from the target basis weight and the completed basis weight, by adding the basis weight according to the supply of the BASE current in the non-use path to the completed basis weight, the basis weight generated by the BASE current can be surely taken into account to derive the supply current value.

[Second embodiment]
Next, an electroplating current control method according to a second embodiment will be described with reference to FIGS. 10 to 12. FIG. In the following description, points different from the first embodiment are mainly described.

The electroplating current control method according to the second embodiment performs processing that is partly different from the electroplating current control method according to the first embodiment with respect to specifying the number of passes to be used. Specifically, in the electroplating current control method according to the second embodiment, after tentatively determining the number of passes to be used, before passing the next pass, the estimated basis weight (i.e., BASE The number of passes to be used is reconsidered in consideration of the weight per unit area based on current).

FIG. 10 is a flow chart showing the execution procedure of the electroplating current control process according to the second embodiment. In the electroplating current control method according to the second embodiment, the processes of steps S51 to S55 shown in FIG. 10 are performed as the process (use pass number determination process) corresponding to step S5 shown in FIG.

As shown in FIG. 10, in the used path number determination process, the deriving unit 53 of the control device 50 first tentatively determines the used path number (step S51). The number of used paths is tentatively determined, for example, from the above equation (2). Subsequently, the deriving unit 53 calculates the basis weight in the planned non-use path (remaining BASE current path) on the premise of the current speed (step S52). The basis weight of the path that is not planned to be used is derived by modifying the formula (1) described above, and is set to a value corresponding to the BASE current.

Subsequently, the derivation unit 53 recalculates the remaining basis weight in consideration of the basis weight in the planned non-use path (BASE current path) (step S53). Specifically, the remaining basis weight is recalculated by subtracting the basis weight of the path not to be used from the remaining basis weight. Subsequently, the derivation unit 53 recalculates the required total current based on the recalculated remaining basis weight using the above equation (1) (step S54). Finally, the deriving unit 53 determines (finally determines) the number of paths to be used from the above equation (2) based on the recalculated required total current (step S55).

An example (specific example) of the electroplating current control process according to the second embodiment will be described with reference to FIGS. 11 and 12. FIG. 11 and 12 are diagrams for explaining the electroplating current control process. (b) shows the process at the calculation position CR of which path P the tracking point Ta of the plated material is, and (a ) shows the current value calculation result for each path P at the tracking point Ta shown in (b). FIG. 11 shows information on the first pass P1, and FIG. 12 shows information on the second pass P2.

First, a specific example of processing when the tracking point Ta shown in FIG. 11(b) reaches the calculated position CR of the first path P1 will be described. For example, the derivation unit 53 refers to the storage unit 52 and acquires the target basis weight: 2.800 (g/m2). Since it is the first pass P1, the deriving unit 53 calculates the remaining basis weight=target basis weight=2.800 (g/m2). The derivation unit 53 derives the required total current: 16862.2 (A) from the formula (1) described above.

Subsequently, the derivation unit 53 determines five paths P (first path P1, eighth path P8, second path P2, seventh path P1, eighth path P8, second path P2, seventh path P7 and the third path P3) are tentatively determined as the paths to be used, and the other paths P (the fourth path P4, the fifth path P5, the sixth path P6, and the ninth path P9) are tentatively determined to be unused paths. decide. That is, the deriving unit 53 provisionally determines the number of paths to be used to be "five".

Next, the deriving unit 53 calculates the basis weight for the planned non-use path (remaining BASE current path) on the premise of the current speed. Now, the BASE current is 200 (A), and there are four paths not to be used, so the total basis weight for each path not to be used fbase=[200*(9−5)]*90/(2 .71*1000*200)=0.133 (g/m2).

Subsequently, the derivation unit 53 recalculates the remaining basis weight by subtracting the total basis weight of the paths not to be used: 0.133 (g/m2) from the remaining basis weight: 2.800 (g/m2). : 2.667 (g/m2). Then, the derivation unit 53 recalculates the required total current based on the recalculated remaining basis weight, and the required total current: 16062.2 (A) is recalculated. The total required current recalculated in this way is reconsidered in consideration of the basis weight of the BASE current of the paths that are not to be used. Based on the recalculated required total current, the derivation unit 53 determines whether the tentatively determined number of paths to be used is correct. In this case, even with the recalculated required total current of 16062.2 (A), the planned number of paths to be used is "5". ” is decided. Then, the deriving unit 53 calculates the weight per unit area of the electrodes 13a, 13a in the first pass P1, which is the next pass and the pass to be used, from the above-described formula (3), and the weight per unit area f1= 2.667*80/380=0.562 (g/m2) is derived. Then, the derivation unit 53 calculates the current value i=2.71*0.562*1000*200/90≈3381.5 (A ). In this way, by recalculating the required total current in consideration of the basis weight of the path not to be used, the supply current value is different from the case where the basis weight is not taken into consideration (first embodiment).

Subsequently, when the tracking point Ta shown in FIG. 12(b) reaches the calculation position CR of the second pass P2, the derivation unit 53 calculates the required total current: 13480.7 (A) from the remaining basis weight. Then, the number of paths to be used is incremented by one from the above equation (2) to provisionally set to "five". In this case, similarly to the processing described above, the derivation unit 53 first calculates the basis weight in the scheduled non-use path (remaining BASE current path). Now, the BASE current is 200 (A), and there are three paths not to be used, so the total basis weight for each path not to be used given the current speed fbase=[200*(8-5) ]*90/(2.71*1000*200)=0.100 (g/m2).

The derivation unit 53 subtracts the total basis weight of the paths that are not to be used: 0.100 (g/m2) from the remaining basis weight: 2.238 (g/m2), thereby recalculating the remaining basis weight: 2.00 (g/m2). 139 (g/m2) is derived. Then, the derivation unit 53 recalculates the required total current based on the recalculated remaining basis weight, and the required total current: 12880.7 (A) is recalculated. The total required current recalculated in this way is reconsidered in consideration of the basis weight of the BASE current of the paths that are not to be used. Based on the recalculated required total current, the derivation unit 53 determines whether the tentatively determined number of paths to be used is correct. In this case, since the recalculated required total current is 12680.7 (A), the number of paths to be used is "4". Since the tentatively determined number of planned paths to be used has been changed, calculation is performed again with the changed number of planned paths to be used. That is, the derivation unit 53 assumes that there are four paths that will not be used, and the sum of basis weights of the paths that will not be used based on the current speed, fbase=[200*(8−4)]*90/(2. 71*1000*200) = 0.133 (g/m2). The deriving unit 53 subtracts the sum of the weights of the non-use paths: 0.133 (g/m2) from the weight of the remaining weight: 2.238 (g/m2), thereby obtaining the weight of the weight: 2.106 (g/m2). /m2) is recalculated. Then, the derivation unit 53 recalculates the required total current based on the recalculated remaining basis weight, and the required total current: 12680.7 (A) is recalculated. The derivation unit 53 determines that the number of planned unused paths is "4" and determines that addition of planned used paths is unnecessary. Then, the derivation unit 53 calculates the weight per unit area of the electrodes 13a, 13a in the second pass P2, which is the next pass and the pass to be used, and the weight per unit area f=2.667*80/300= for the second pass P2. 0.562 (g/m2) is derived. Then, the derivation unit 53 calculates the current value i=2.71*0.562*1000*200/90≈3381.5 (A ). In this case, the planned current value to be supplied to the second path P2 and the current value to be supplied to the second path P2 at the time of the first path P1, which are paths in use having the same burden ratio, must be the same, and the calculation results must be consistent. can be confirmed (see FIG. 12(a)).

As described above, in the electroplating current control method according to the second embodiment, in the step of identifying the path to be used, the assumed basis weight based on the current speed corresponding to the BASE current in the path not to be used is considered. , one or more paths to be used are identified. In the case of deriving the supply current value in consideration of the BASE current in the unused path according to the first embodiment, the basis weight according to the supply of the BASE current in the path (passing path) that the material to be plated 11 has already passed is Although it can be appropriately considered, it is not possible to consider the basis weight according to the supply of the BASE current of the path that will pass in the future (the path that has not yet passed). For this reason, for example, in a mode in which a supply current value is not derived in a section in which there are no paths to be used thereafter, the basis weight according to the supply of the BASE current in the paths scheduled to be unused after the last path to be used is not taken into consideration. Since the supply current value is derived, there is a possibility that the BASE current of the unused path after the last used path may cause thick coating. In this regard, the path to be used is identified and the supply current value is derived by taking into consideration the assumed basis weight based on the current speed corresponding to the BASE current on the path not to be used. The supply current value is derived in consideration of the basis weight for the planned pass, and it is possible to avoid the occurrence of the thick basis weight due to the BASE current of the non-use passes after the last use pass.

More specifically, in the electroplating current control method according to the second embodiment, in the step of specifying the path to be used, the value obtained by subtracting the assumed basis weight by the BASE current from the remaining basis weight is derived as the recalculated remaining basis weight. , derives the required total current that satisfies the recalculated remaining basis weight, and specifies one or a plurality of paths to be used. In this way, the estimated basis weight corresponding to the BASE current is subtracted, the recalculated remaining basis weight is derived, and the planned use path is specified. It is possible to derive the supply current value by surely considering the corresponding basis weight. Note that when the line speed changes while passing through each of the paths described above, the current of the used path changes according to the change in the line speed V according to the equation (4). As a result, even if the line speed changes, the planned basis weight is ensured during passing.

[Third Embodiment]
Next, an electroplating current control method according to the third embodiment will be described with reference to FIGS. 13 to 15. FIG. In the following description, differences from the first and second embodiments are mainly described.

In the electroplating current control method according to the third embodiment, when the line speed of the material to be plated 11 changes, the value of the BASE current is corrected according to the change in the line speed, and the basis weight by the planned BASE current The amount is secured, and the basis weight in the subsequent non-use planned path is derived from the corrected BASE current.

13(a) and 13(b) are flowcharts showing the execution procedure of the electroplating current control process according to the third embodiment. In the electroplating current control method according to the third embodiment, the processing of steps S401 and S402 shown in FIG. 13A is performed in parallel with the processing of steps S2 and S3 shown in FIG. (line speed storage) is performed. Further, in the electroplating current control method according to the third embodiment, the process of step S410 shown in FIG. 13B is performed as the process (BASE current value setting) corresponding to step S9 shown in FIG.

As shown in FIG. 13(a), when the tracking points Ta to Tj pass the calculated position CR of the first pass (step S401), processing step S402 of storing the initial line velocity V0 is performed. At this time, in parallel, the remaining basis weight is calculated by subtracting the completed basis weight from the target basis weight (step S3).

Furthermore, when it is determined in step S6 in FIG. 4 that the next electrode is not used, the BASE current value is calculated according to the line speed as shown in FIG. 13(b). Specifically, the BASE current is corrected by the ratio of the current line speed to the initial line speed, as shown in the following formula.
ibase=ib0*V/V0 (5)
ibase: output (BASE) current value (A), ib0: set BASE current value (A), V: current line speed (mpm), V0: initial line speed (mpm)

An example (specific example) of the electroplating current control process according to the third embodiment will be described with reference to FIGS. 14 and 15. FIG. 14 and 15 are diagrams for explaining the electroplating current control process. (b) shows the process at the calculation position CR of which path P the tracking point Ta of the plated material is, and (a ) shows the current value calculation result for each path P at the tracking point Ta shown in (b). FIG. 14 shows information on the third pass P3, and FIG. 15 shows information on the fourth pass P4.

First, a specific example of processing when the tracking point Ta shown in FIG. 14B reaches the calculated position CR on the third path P3 will be described. Suppose now that the line speed, which was 200 at the calculated position CR of the first pass P1 (the unit of the line speed is omitted; the same shall apply hereinafter), accelerates to 230 at the calculated position CR of the third pass P3. . The deriving unit 53 calculates the remaining basis weight: 1.677 (g/m2), calculates the required total current: 11614.1 (A) from the remaining basis weight, adds one to the number of paths to be used, and obtains "4 Suppose that it is tentatively determined to be one.

The deriving unit 53 performs speed correction according to changes in the line speed, and then calculates the weight per unit area in the scheduled non-use paths (remaining BASE current paths). Now, the set BASE current is 200 (A), there are four unused paths, and the line speed is accelerating from 200 to 230, so the BASE current value to the unused paths is given by equation (5). Therefore, ibase=200*230/200=230(A), and furthermore, the total basis weight of each unused path fbase=[230*(7-4)]*90/(2.71*1000* 230) = 0.100 (g/m2). The derivation unit 53 recalculates the remaining basis weight of 1.577 in consideration of the total basis weight of the paths not to be used, and recalculates the required total current of 10924.1 (A) from the remaining basis weight. The total required current thus recalculated has been reconsidered to take into account changes in line speed. Based on the recalculated required total current, the derivation unit 53 determines whether the tentatively determined number of paths to be used is correct. In this case, even with the recalculated required total current of 10924.1 (A), the planned number of paths to be used is "4". ” is decided. Then, the deriving unit 53 calculates the weight per unit area of the electrodes 13a, 13a in the third pass P3, which is the next pass and the pass to be used, from the above-described formula (3), and the weight per unit area of the third pass P3 f= 1.577*80/290=0.435 (g/m2) is derived. Then, the derivation unit 53 calculates the supply current value i=2.71*0.435*1000*230/90≈3013.5 (A) to the electrodes 13a, 13a of the third path P3 from the above equation (4). ).

Next, it is assumed that the line speed further accelerates to 260 at the calculated position CR of the fourth pass P4 shown in FIG. 15(b). The derivation unit 53 calculates the remaining basis weight: 1.677−0.435=1.242 (g/m2), calculates the required total current: 9722.33 (A) from the remaining basis weight, and determines the path to be used. The number is tentatively determined as "three".

The deriving unit 53 performs speed correction according to changes in the line speed, and then calculates the weight per unit area in the scheduled non-use paths (remaining BASE current paths). Now, the set BASE current is 200 (A), there are four unused paths, and the line speed is accelerating from 200 to 260, so the BASE current to the unused paths is given by equation (5). ibase = 200 * 260/200 = 260 (A), and the total basis weight of each unused path fbase = [260 * (7-4)] * 90 / (2.71 * 1000 * 260 )=0.100 (g/m2). The derivation unit 53 recalculates the remaining basis weight of 1.142 in consideration of the total basis weight of the paths not to be used, and recalculates the required total current of 8942.33 (A) from the remaining basis weight. The total required current thus recalculated has been reconsidered to take into account changes in line speed. Based on the recalculated required total current, the derivation unit 53 determines whether the tentatively determined number of paths to be used is correct. In this case, even with the recalculated required total current of 8942.33 (A), the planned number of paths to be used is "3". ” is decided. Since the fourth path P4 is an unused path as shown in FIG. 15A, the supply current value is not calculated and the BASE current is set.

As described above, in the electroplating current control method according to the third embodiment, in the step of setting the BASE current value, when the line speed of the material to be plated 11 changes, the value of the BASE current is is corrected according to , and an assumed basis weight is derived from the corrected BASE current value. In this way, by changing the value of the BASE current according to changes in the line speed, it is possible to keep the basis weight uniform according to the BASE current even when the line speed changes. It is possible to suppress the occurrence of excess and deficiency.

Reference numerals 11: material to be plated, 13: plating line, 13a, 13a: electrode (plating electrode), 50: control device (electroplating current control device), P: path.

Claims (3)

An electroplating current control method for controlling a supply current to an electroplating equipment having a plating line arranged along the traveling direction of a material to be plated and divided into a plurality of paths of a predetermined length,
A basis weight in one or a plurality of used passes, which are the paths through which the material to be plated has already passed and to which a current for the basis weight of the material to be plated is supplied, and the passes that have already passed, Considering the basis weight in one or more non-used passes that are not the used passes, the value of current supplied to the plating electrode in one or more non-passed passes that are the passes before the material to be plated passes is determined. including deriving
The basis weight in the non-use pass is derived according to the current value of a base current predetermined as the supply current to the plating electrode in the non-use pass,
Each time the first region of the material to be plated passes through one pass, the remaining basis weight obtained by subtracting the completed basis weight for which the basis weight has already been completed for the first region from the target basis weight in the first region. is derived, and a required total current that satisfies the remaining basis weight is derived, and based on the required total current, a current for the basis weight of the material to be plated is supplied from one or more of the non-passing paths. identifying one or a plurality of paths to be used, which are the paths;
a step of deriving a current value to be supplied to the plating electrode in each of the one or more non-passed paths based on the information of the specified one or more paths to be used;
setting the current to be supplied to the plating electrode in the next pass through which the material to be plated passes next, based on the derived supply current value;
In the step of deriving the supply current value,
Based on the information of one or more of the paths to be used,
for one or more of the paths to be used, deriving the supply current value to be supplied to the plating electrode according to the basis weight based on the total required current;
of the non-passed paths, for one or a plurality of paths not scheduled to be used, the current value of the base current is derived as the supply current value to be supplied to the plating electrode;
In the step of identifying the path to be used,
The total basis weight in one or more of the used paths and the total basis weight corresponding to the supply of the base current in one or more non-use paths are added together as the completed basis weight, Deriving the remaining basis weight,
In the step of identifying the path to be used,
An electroplating current control method, wherein one or a plurality of the paths to be used are specified in consideration of an assumed basis weight according to the base current in the paths to be not used. In the step of identifying the path to be used,
A value obtained by subtracting the assumed basis weight from the remaining basis weight is derived as a recalculated remaining basis weight, the required total current that satisfies the recalculated remaining basis weight is derived, and one or more of the paths to be used are specified. The electroplating current control method according to claim 1 , wherein In the step of identifying the path to be used,
2. When the conveying speed of the material to be plated changes, the value of the base current is corrected in accordance with the change in the conveying speed, and the assumed basis weight is derived from the corrected value of the base current . Or the electroplating current control method according to 2 .

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