JPH0631732Y2 - 面実装用混成集積回路 - Google Patents
面実装用混成集積回路Info
- Publication number
- JPH0631732Y2 JPH0631732Y2 JP1988019882U JP1988288U JPH0631732Y2 JP H0631732 Y2 JPH0631732 Y2 JP H0631732Y2 JP 1988019882 U JP1988019882 U JP 1988019882U JP 1988288 U JP1988288 U JP 1988288U JP H0631732 Y2 JPH0631732 Y2 JP H0631732Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- hybrid integrated
- integrated circuit
- printed circuit
- external printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988019882U JPH0631732Y2 (ja) | 1988-02-19 | 1988-02-19 | 面実装用混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988019882U JPH0631732Y2 (ja) | 1988-02-19 | 1988-02-19 | 面実装用混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01125571U JPH01125571U (US07122547-20061017-C00032.png) | 1989-08-28 |
| JPH0631732Y2 true JPH0631732Y2 (ja) | 1994-08-22 |
Family
ID=31235786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988019882U Expired - Lifetime JPH0631732Y2 (ja) | 1988-02-19 | 1988-02-19 | 面実装用混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0631732Y2 (US07122547-20061017-C00032.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0745978Y2 (ja) * | 1990-09-29 | 1995-10-18 | 太陽誘電株式会社 | 混成集積回路装置 |
| EP1196014B1 (en) * | 1999-07-09 | 2006-01-04 | Fujitsu Limited | Printed wiring board unit, hierarchical mounting auxiliary substrate and electronic apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59123348U (ja) * | 1983-02-07 | 1984-08-20 | 三菱電機株式会社 | 混成集積回路装置 |
| JPS59123347U (ja) * | 1983-02-07 | 1984-08-20 | 三菱電機株式会社 | 混成集積回路装置 |
| JPS60194550A (ja) * | 1984-03-16 | 1985-10-03 | Nec Corp | 混成集積回路 |
| JPS61106036U (US07122547-20061017-C00032.png) * | 1984-12-18 | 1986-07-05 |
-
1988
- 1988-02-19 JP JP1988019882U patent/JPH0631732Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01125571U (US07122547-20061017-C00032.png) | 1989-08-28 |
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