JPH06293434A - Ic carrying method - Google Patents

Ic carrying method

Info

Publication number
JPH06293434A
JPH06293434A JP8219293A JP8219293A JPH06293434A JP H06293434 A JPH06293434 A JP H06293434A JP 8219293 A JP8219293 A JP 8219293A JP 8219293 A JP8219293 A JP 8219293A JP H06293434 A JPH06293434 A JP H06293434A
Authority
JP
Japan
Prior art keywords
package
pusher
socket
line
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8219293A
Other languages
Japanese (ja)
Inventor
Tamotsu Katayama
保 片山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP8219293A priority Critical patent/JPH06293434A/en
Publication of JPH06293434A publication Critical patent/JPH06293434A/en
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Sorting Of Articles (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

PURPOSE:To provide an IC package carrying method by a horizontal carrying handler capable of significantly shortening the replacing time of an IC package for a socket. CONSTITUTION:In an IC package carrying method, a mechanism for bringing an IC package into contact with 8 socket is provided with two or more hands having both sucking mechanism and pusher mechanism. For example, two pusher-and-suction hands 33, 34 of the same form are provided, and IC carrying lanes 31, 32 are provided in two lines on both sides of a socket 3. The A-line pusher-and-suction hand 33 supplies an IC package 1 from the A-line supplying and discharging table 31 to the socket 3 and brings the IC package 1 into contact with the socket 3. Also, the B-line pusher-and-suction hand 34 sucks the IC package 1 of the B-line supplying and discharging table 32 and waits. Thus, supplement, measurement, and discharge can be simultaneously performed by operating the pusher-and-suction hand 33 or 34 only by one pitch.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、水平搬送型ハンドラー
のICパッケージ搬送方式に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC package transfer system for a horizontal transfer type handler.

【0002】[0002]

【従来の技術】従来の水平搬送型ハンドラーは、ソケッ
ト1個に対して吸着機構とプッシャー機構を兼ね備えた
ハンド(以下、プッシャー兼吸着ハンドと略す)が1本
しかなかったため、測定部と供給テーブル間を1本のプ
ッシャー兼吸着ハンドが1往復する間に1回のコンタク
トしか得られなかった。
2. Description of the Related Art A conventional horizontal transfer type handler has only one hand (hereinafter, abbreviated as pusher / suction hand) having both a suction mechanism and a pusher mechanism for one socket. Only one contact was obtained during one reciprocation of one pusher / adsorption hand.

【0003】以下、従来技術を図4、図5により説明す
る。
The prior art will be described below with reference to FIGS. 4 and 5.

【0004】従来の技術は図4に示す通り、プッシャー
兼吸着ハンド5で吸着したICパッケージ1をそのまま
ICソケット3に押しつけコンタクトする。測定が終了
すると排出専用吸着ハンド6がソケット部3のICパッ
ケージ1を排出用IC搬送テーブル4に搬送する。と同
時に、プッシャー兼吸着ハンド5が供給用IC搬送テー
ブル2まで移動し、次のICパッケージ1を吸着し、再
びソケット部3まで移動してコンタクトするという工程
を踏む。つまり、1本のプッシャー兼吸着ハンド5が1
往復動作を行うに付き1回のコンタクトしか得られなか
った。図5はICパッケージがトレーから供給されテス
トを経て、分類用トレーに収納されるまでの工程を示
す。
In the prior art, as shown in FIG. 4, the IC package 1 adsorbed by the pusher / adsorption hand 5 is pressed against the IC socket 3 as it is to make a contact. When the measurement is completed, the ejection-use suction hand 6 conveys the IC package 1 in the socket 3 to the ejection IC conveyance table 4. At the same time, the pusher / suction hand 5 moves to the supply IC carrying table 2, picks up the next IC package 1, moves to the socket 3 again, and contacts. In other words, one pusher and suction hand 5
Only one contact was obtained for the reciprocating motion. FIG. 5 shows a process in which an IC package is supplied from a tray, tested, and then stored in a sorting tray.

【0005】[0005]

【発明が解決しようとする課題】本発明の目的は、ハン
ドラーにおけるソケットへのICパッケージ入れ替え時
間を大幅に短縮することにある。
SUMMARY OF THE INVENTION It is an object of the present invention to significantly reduce the time required to replace an IC package in a socket in a handler.

【0006】[0006]

【課題を解決するための手段】上記目的は、ICパッケ
ージをソケットにコンタクトさせる機構にプッシャー兼
吸着ハンドを2本あるいはそれ以上搭載する手段をと
る。
The above-described object is to provide a mechanism for contacting an IC package with a socket by mounting two or more pusher / suction hands.

【0007】[0007]

【実施例】以下、本発明の実施例1を図1と図2により
説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A first embodiment of the present invention will be described below with reference to FIGS.

【0008】本発明のIC搬送方式は前述の問題を解決
するため、図1のように同形状のプッシャー兼吸着ハン
ド33、34を2本設け、ソケット3の両側にIC搬送
レーン31、32を2列設ける。Aライン用プッシャー
兼吸着ハンド33がAライン用供給兼排出テーブル31
からソケット3にICパッケージ1を供給し、コンタク
トさせる。と同時にBライン用プッシャー兼吸着ハンド
34がBライン用供給兼排出テーブル32のICパッケ
ージ1を吸着し待機する。Aラインから供給したICパ
ッケージ1の測定が終了後、Aライン用プッシャー兼吸
着ハンド33がそのICパッケージ1を元の位置、つま
りAライン用供給兼排出テーブル31に排出する。と同
時にBライン用プッシャー兼吸着ハンド5が保持してい
るICパッケージ1をソケット3へ搬送しコンタクトさ
せる。つまり、プッシャー兼吸着ハンド33または34
が1ピッチ動作するだけで供給及び測定と排出を同時に
行うことができる。従来技術では、1本のプッシャー兼
吸着ハンドが1往復する間に1回のコンタクトが得られ
なかったことと比較すると、本発明では、1本のプッシ
ャー兼吸着ハンドが1往復する間に2回のコンタクトが
得られることになりICパッケージの入れ替え時間が大
幅に短縮されることは明かである。図2は、実施例1の
場合の、ICパッケージがトレーから供給されテストを
経て、分類用トレーに収納されるまでの工程を示す。
In order to solve the above-mentioned problems, the IC transfer system of the present invention is provided with two pusher / suction hands 33 and 34 of the same shape as shown in FIG. 1, and IC transfer lanes 31 and 32 are provided on both sides of the socket 3. Provide two rows. The A line pusher / suction hand 33 is used for the A line supply / discharge table 31.
From the above, the IC package 1 is supplied to the socket 3 for contact. At the same time, the B line pusher / suction hand 34 sucks the IC package 1 on the B line supply / discharge table 32 and waits. After the measurement of the IC package 1 supplied from the A line is completed, the A line pusher / suction hand 33 discharges the IC package 1 to the original position, that is, the A line supply / discharge table 31. At the same time, the IC package 1 held by the B-line pusher / suction hand 5 is conveyed to the socket 3 for contact. That is, the pusher and suction hand 33 or 34
It is possible to perform supply, measurement, and discharge at the same time by operating only one pitch. In the prior art, one contact was not obtained during one reciprocation of one pusher / suction hand, but in the present invention, two contacts were obtained during one reciprocation of one pusher / suction hand. It is clear that the contact time will be obtained and the IC package replacement time will be greatly shortened. FIG. 2 shows a process in which the IC package is supplied from the tray, tested, and stored in the sorting tray in the case of the first embodiment.

【0009】以下、本発明の実施例2を図3により説明
する。
The second embodiment of the present invention will be described below with reference to FIG.

【0010】図3は実施例2のICパッケージの流動工
程を示す。図3のように同形状のプッシャー兼吸着ハン
ド5を4本搭載した回転ロボット51を用いる。4本の
プッシャー兼吸着ハンド5はそれぞれが供給位置52、
待機位置53、ソケット部3、排出位置54に常時位置
することになる。このプッシャー兼吸着ハンド5を1ピ
ッチ(時計回りに90゜)動かす間に供給及び測定と排
出を同時に行うことができる。これも、実施例1と同
様、ICパッケージの入れ替え時間を大幅に短縮するこ
とができる。
FIG. 3 shows a flow process of the IC package of the second embodiment. As shown in FIG. 3, a rotary robot 51 equipped with four pusher / suction hands 5 of the same shape is used. Each of the four pusher / suction hands 5 has a supply position 52,
It is always located at the standby position 53, the socket portion 3, and the discharge position 54. Supply, measurement, and discharge can be performed at the same time while the pusher / suction hand 5 is moved one pitch (90 ° clockwise). Also in this case, as in the case of the first embodiment, the time for replacing the IC packages can be significantly reduced.

【0011】また、これ以外にも多数のプッシャー兼吸
着ハンドを1つの移動体に設置することにより、前述と
同様の効果が得られる。
Besides, by installing a large number of pusher / suction hands on one moving body, the same effect as described above can be obtained.

【0012】[0012]

【発明の効果】本発明によれば、前記のIC搬送方式を
採用することにより、ハンドラーにおけるソケットへの
ICパッケージ入れ替え時間を大幅に短縮することがで
きる効果がある。
According to the present invention, by adopting the above IC transfer method, there is an effect that the time for replacing the IC package in the socket in the handler can be greatly shortened.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例1を示す図である。FIG. 1 is a diagram showing a first embodiment of the present invention.

【図2】本発明の実施例1を示す平面図である。FIG. 2 is a plan view showing a first embodiment of the present invention.

【図3】本発明の実施例2を示す平面図である。FIG. 3 is a plan view showing a second embodiment of the present invention.

【図4】従来技術を示す図である。FIG. 4 is a diagram showing a conventional technique.

【図5】従来技術を示す平面図である。FIG. 5 is a plan view showing a conventional technique.

【符号の説明】[Explanation of symbols]

1・・・・・・・ICパッケージ 2・・・・・・・供給用IC搬送テーブル 3・・・・・・・ICソケット、またはソケット部 4・・・・・・・排出用IC搬送テーブル 5・・・・・・・プッシャー兼吸着ハンド 6・・・・・・・排出専用吸着ハンド 7・・・・・・・プッシャー兼吸着ハンド移動用ロボッ
ト 21・・・・・・供給トレー 22・・・・・・良品トレー 23・・・・・・不良品トレー 31・・・・・・Aライン用供給兼排出テーブル、また
はIC搬送レーン 32・・・・・・Bライン用供給兼排出テーブル、また
はIC搬送レーン 33・・・・・・Aライン用プッシャー兼吸着ハンド 34・・・・・・Bライン用プッシャー兼吸着ハンド 41・・・・・・Aライン用良品トレー 42・・・・・・Aライン用不良品トレー 43・・・・・・Bライン用良品トレー 44・・・・・・Bライン用不良品トレー 45・・・・・・Aライン用供給トレー 46・・・・・・Bライン用供給トレー 51・・・・・・回転ロボット 52・・・・・・供給位置 53・・・・・・待機位置 54・・・・・・排出位置
IC package 2 Supply IC carrier table 3 ... IC socket or socket part 4 IC discharge table 5 ・ ・ ・ ・ Pusher and suction hand 6 ・ ・ ・ ・ ・ ・ Suction discharge dedicated hand 7 ・ ・ ・ ・ Pusher and suction hand moving robot 21 ・ ・ ・ ・ ・ ・ Supply tray 22 ・・ ・ ・ ・ ・ Good product tray 23 ・ ・ ・ Defective product tray 31 ・ ・ ・ ・ ・ A line supply and discharge table or IC transfer lane 32 ・ ・ ・ ・ ・ B line supply and discharge table , Or IC transport lane 33 ... A line pusher / suction hand 34 ... B line pusher / suction hand 41 .. A line non-defective tray 42 .. ..Tray of defective products for A line 43 ・ ・ ・ ・ ・ ・ Good tray for B line 44 ・ ・ ・ ・ ・ ・ Defective tray for B line 45 ・ ・ ・ ・ ・ ・ Supply tray for A line 46 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Supply tray for B line 51・ ・ ・ ・ ・ ・ Rotating robot 52 ・ ・ ・ ・ ・ ・ Supply position 53 ・ ・ ・ ・ ・ ・ Standby position 54 ・ ・ ・ ・ ・ ・ Discharge position

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 H01L 21/68 B 8418−4M H05K 13/02 Z 8509−4E ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI Technical display location H01L 21/68 B 8418-4M H05K 13/02 Z 8509-4E

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】水平搬送型ハンドラーのICパッケージ搬
送方式において、ICパッケージをソケットにコンタク
トさせる機構に、吸着機構とプッシャー機構を兼ね備え
たハンドを2本あるいはそれ以上搭載することを特徴と
するIC搬送方式。
1. An IC package transfer method for a horizontal transfer type handler, characterized in that two or more hands having both a suction mechanism and a pusher mechanism are mounted on a mechanism for contacting the IC package with a socket. method.
JP8219293A 1993-04-08 1993-04-08 Ic carrying method Pending JPH06293434A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8219293A JPH06293434A (en) 1993-04-08 1993-04-08 Ic carrying method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8219293A JPH06293434A (en) 1993-04-08 1993-04-08 Ic carrying method

Publications (1)

Publication Number Publication Date
JPH06293434A true JPH06293434A (en) 1994-10-21

Family

ID=13767574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8219293A Pending JPH06293434A (en) 1993-04-08 1993-04-08 Ic carrying method

Country Status (1)

Country Link
JP (1) JPH06293434A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020079653A (en) * 2002-09-02 2002-10-19 주식회사 한미 Singulation system of semiconductor package
KR20020079652A (en) * 2002-09-02 2002-10-19 주식회사 한미 Moving apparatus of semiconductor package
USRE38622E1 (en) 1996-07-15 2004-10-12 Seiko Epson Corporation Parts handling method
WO2006080809A1 (en) * 2005-01-31 2006-08-03 Hanmi Semiconductor Co., Ltd. Apparatus for processing semiconductor package
WO2008146687A1 (en) * 2007-05-23 2008-12-04 Tokuyama Corporation Lens coating device
JP4535408B1 (en) * 2010-05-10 2010-09-01 智雄 松下 Substrate transport mechanism and substrate transport method
US8008939B2 (en) 2008-03-11 2011-08-30 Seiko Epson Corporation Component test apparatus and component transport method
CN104528381A (en) * 2014-12-11 2015-04-22 杭州德创电子有限公司 Load transferring integrated device of single phase watt hour meter and turnover carton
CN105057234A (en) * 2015-08-03 2015-11-18 杭州长川科技股份有限公司 Piece dividing mechanism of integrated circuit sorting machine
CN106362966A (en) * 2016-08-31 2017-02-01 北京富桦明电子有限公司 Detection equipment for ballasts
CN106395362A (en) * 2016-10-26 2017-02-15 华南智能机器人创新研究院 Multi-workpiece synchronous taking and placing mechanism
CN107138434A (en) * 2017-07-30 2017-09-08 华天恒芯半导体(厦门)有限公司 A kind of chip manufacture screening plant
CN110314864A (en) * 2018-03-28 2019-10-11 北京君正集成电路股份有限公司 Chip detecting method and device based on manipulator
CN111085464A (en) * 2019-12-30 2020-05-01 中科慧远视觉技术(洛阳)有限公司 Device for online detection of appearance of glass cover plate

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE38622E1 (en) 1996-07-15 2004-10-12 Seiko Epson Corporation Parts handling method
KR20020079653A (en) * 2002-09-02 2002-10-19 주식회사 한미 Singulation system of semiconductor package
KR20020079652A (en) * 2002-09-02 2002-10-19 주식회사 한미 Moving apparatus of semiconductor package
WO2006080809A1 (en) * 2005-01-31 2006-08-03 Hanmi Semiconductor Co., Ltd. Apparatus for processing semiconductor package
US8087378B2 (en) 2007-05-23 2012-01-03 Tokuyama Corporation Apparatus for coating lenses
WO2008146687A1 (en) * 2007-05-23 2008-12-04 Tokuyama Corporation Lens coating device
JP5279704B2 (en) * 2007-05-23 2013-09-04 株式会社トクヤマ Lens coating equipment
US8008939B2 (en) 2008-03-11 2011-08-30 Seiko Epson Corporation Component test apparatus and component transport method
US8558570B2 (en) 2008-03-11 2013-10-15 Seiko Epson Corporation Component test apparatus and component transport method
JP4535408B1 (en) * 2010-05-10 2010-09-01 智雄 松下 Substrate transport mechanism and substrate transport method
JP2010258460A (en) * 2010-05-10 2010-11-11 Tomoo Matsushita Substrate transfer mechanism and substrate transfer method
CN104528381A (en) * 2014-12-11 2015-04-22 杭州德创电子有限公司 Load transferring integrated device of single phase watt hour meter and turnover carton
CN105057234A (en) * 2015-08-03 2015-11-18 杭州长川科技股份有限公司 Piece dividing mechanism of integrated circuit sorting machine
CN106362966A (en) * 2016-08-31 2017-02-01 北京富桦明电子有限公司 Detection equipment for ballasts
CN106395362A (en) * 2016-10-26 2017-02-15 华南智能机器人创新研究院 Multi-workpiece synchronous taking and placing mechanism
CN107138434A (en) * 2017-07-30 2017-09-08 华天恒芯半导体(厦门)有限公司 A kind of chip manufacture screening plant
CN110314864A (en) * 2018-03-28 2019-10-11 北京君正集成电路股份有限公司 Chip detecting method and device based on manipulator
CN111085464A (en) * 2019-12-30 2020-05-01 中科慧远视觉技术(洛阳)有限公司 Device for online detection of appearance of glass cover plate

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