CN215705004U - Double-silicon-wafer processing system - Google Patents
Double-silicon-wafer processing system Download PDFInfo
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- CN215705004U CN215705004U CN202121763587.3U CN202121763587U CN215705004U CN 215705004 U CN215705004 U CN 215705004U CN 202121763587 U CN202121763587 U CN 202121763587U CN 215705004 U CN215705004 U CN 215705004U
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- 238000012545 processing Methods 0.000 title claims abstract description 24
- 230000007246 mechanism Effects 0.000 claims abstract description 110
- 235000012431 wafers Nutrition 0.000 claims abstract description 84
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 59
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 58
- 239000010703 silicon Substances 0.000 claims abstract description 58
- 238000007599 discharging Methods 0.000 claims abstract description 29
- 230000005540 biological transmission Effects 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 4
- 230000007723 transport mechanism Effects 0.000 claims description 2
- 238000012423 maintenance Methods 0.000 abstract description 4
- 239000011521 glass Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 230000009977 dual effect Effects 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000003854 Surface Print Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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Abstract
The embodiment of the application provides a double silicon piece system of processing, wherein the system includes: the device comprises a sheet feeding mechanism, a rotary conveying mechanism, a positioning platform, a printing mechanism, a printing platform and a sheet discharging mechanism; the positioning platform is provided with a positioning mechanism, and the printing platform is provided with a printing mechanism; the two second ends of the conveying plate move between the conveyor belt and the positioning platform; the conveying plate is used for synchronously moving the double silicon wafers on the conveying belt of the wafer conveying mechanism to the positioning platform for positioning, the positioning platform is used for synchronously conveying the positioned double silicon wafers to the printing platform for printing and then conveying the double silicon wafers back to the positioning platform, and the conveying plate is also used for synchronously moving the double silicon wafers of the positioning platform to the conveying belt of the wafer discharging mechanism. The two rows of conveying structures are parallel, two silicon wafers are conveyed simultaneously, the wafer feeding speed is not influenced, the two sets of vision positioning systems and the two sets of printing structures are printed simultaneously, the productivity can be effectively improved, and the maintenance is convenient.
Description
Technical Field
The utility model relates to the technical field of processing, in particular to a double-silicon-wafer processing system.
Background
The existing solar printing mode is rotary table single-table-board printing or linear transmission table-board alternate interchange printing, but only single-sheet printing and two-sheet printing cannot be performed simultaneously, and along with the fact that the printing speed and the ink return speed reach the limit of the printing process requirement, the speed cannot be increased any more, the whole line productivity cannot be effectively increased any more, and the mode becomes the bottleneck of improving the productivity and restricts the development of the industry.
Most of conventional revolving tables of printing machines adopt four-station revolving tables, wherein one station is a sheet feeding station and a contraposition station, the second station is a printing station, the third station is a sheet discharging station, and the fourth station is an idle station. And most of the printing is single-sheet printing, and even if a rotary table is used for double-sheet printing, the rotary table structure and the corresponding sheet feeding structure are large, so that the maintenance is difficult.
Under the limitation of the time requirement of the printing process, the printing speed can not be increased any more, and only one sheet can be printed at a time under the same time, which becomes the bottleneck of improving the productivity.
SUMMERY OF THE UTILITY MODEL
In order to solve the above technical problem, an embodiment of the present invention provides a dual silicon wafer processing system.
The embodiment of the utility model provides a double-silicon-wafer processing system which comprises a wafer feeding mechanism, a rotary conveying mechanism, a positioning platform, a printing mechanism, a printing platform and a wafer discharging mechanism, wherein the wafer feeding mechanism is arranged on the rotary conveying mechanism; wherein,
the sheet feeding mechanism and the sheet discharging mechanism respectively comprise two conveyor belts, the positioning mechanism is arranged on the positioning platform, the printing mechanism is arranged on the printing platform, the positioning mechanism is in communication connection with the printing mechanism, and the positioning platform is in translational connection with the printing platform;
the rotary conveying mechanism comprises a rotating shaft and a conveying plate, wherein a first end of the conveying plate is in transmission connection with the rotating shaft, and two second ends of the conveying plate move between the conveying belt and the positioning platform;
the conveying plate is used for synchronously moving the double silicon wafers on the conveying belt of the wafer conveying mechanism to the positioning platform for positioning, the positioning platform is used for synchronously conveying the positioned double silicon wafers to the printing platform for printing and then conveying the double silicon wafers back to the positioning platform, and the conveying plate is also used for synchronously moving the double silicon wafers of the positioning platform to the conveying belt of the wafer discharging mechanism.
According to a specific embodiment of the present disclosure, the two conveyor belts of the sheet feeding mechanism and the sheet discharging mechanism are parallel to each other, and the sheet feeding mechanism and the sheet discharging mechanism are located on the same straight line;
the positioning platform comprises two positioning sub-platforms which are parallel to each other;
the distance between the two conveyor belts is equal to the distance between the two positioning sub-platforms and equal to the distance between the two second ends of the conveying plate.
According to one embodiment of the present disclosure, both conveyor belts are parallel to the first direction, and both positioning tables are parallel to the second direction;
the first direction is perpendicular to the second direction.
According to a specific embodiment of the present disclosure, the printing platform includes two separated printing brush platforms, the two printing brush platforms are respectively located at two sides of the positioning platform, and the two printing sub-platforms and the positioning platform are located on a same straight line extending along the first direction.
According to a specific embodiment of the present disclosure, the second end includes a vacuum chuck and/or a holder for holding a silicon wafer.
According to a specific embodiment of this disclosure, the locating platform includes the loading board, set up the through-hole on the loading board, be provided with below the loading board can pass in and out the activity arch of loading board.
According to a specific embodiment of the present disclosure, the printing brush platform and the locator platform are the same platform;
the cylinder is arranged below the positioning sub-platform and is in transmission connection with the positioning sub-platform, and the cylinder pushes the positioning sub-platform to move between a positioning area below the positioning mechanism and a printing area below the printing mechanism.
According to a specific embodiment of the present disclosure, the rotary conveyance mechanism is a six-axis robot.
According to a specific embodiment of the present disclosure, the number of the conveying plates is at least two, and the first ends of at least two conveying plates are hinged to the rotating shaft.
The double-silicon-wafer processing system provided by the application comprises a wafer feeding mechanism, a rotary conveying mechanism, a positioning platform, a printing mechanism, a printing platform and a wafer discharging mechanism; the sheet feeding mechanism and the sheet discharging mechanism respectively comprise two conveyor belts, the positioning mechanism is arranged on the positioning platform, the printing mechanism is arranged on the printing platform, the positioning mechanism is in communication connection with the printing mechanism, and the positioning platform is in translational connection with the printing platform; the rotary conveying mechanism comprises a rotating shaft and a conveying plate, wherein a first end of the conveying plate is in transmission connection with the rotating shaft, and two second ends of the conveying plate move between the conveying belt and the positioning platform; the conveying plate is used for synchronously moving the double silicon wafers on the conveying belt of the wafer conveying mechanism to the positioning platform for positioning, the positioning platform is used for synchronously conveying the positioned double silicon wafers to the printing platform for printing and then conveying the double silicon wafers back to the positioning platform, and the conveying plate is also used for synchronously moving the double silicon wafers of the positioning platform to the conveying belt of the wafer discharging mechanism. The utility model adopts a rotary and alternate structure for use, two rows of transmission structures are parallel, two silicon wafers are transmitted simultaneously, the wafer feeding speed is not influenced, two sets of vision positioning systems and two sets of printing structures are printed simultaneously, the productivity can be effectively improved, and the maintenance is convenient.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings required to be used in the embodiments will be briefly described below, and it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope of the present invention. Like components are numbered similarly in the various figures.
FIG. 1 is a schematic diagram illustrating a dual silicon wafer processing system according to an embodiment of the present disclosure;
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
Hereinafter, the terms "including", "having", and their derivatives, which may be used in various embodiments of the present invention, are only intended to indicate specific features, numbers, steps, operations, elements, components, or combinations of the foregoing, and should not be construed as first excluding the existence of, or adding to, one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing.
Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which various embodiments of the present invention belong. The terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning that is consistent with their contextual meaning in the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein in various embodiments of the present invention.
Referring to fig. 1, a schematic structural diagram of a dual silicon wafer processing system according to an embodiment of the present invention is shown. As shown in fig. 1, the double silicon wafer processing system 100 mainly includes a wafer feeding mechanism 110, a rotary conveying mechanism 120, a positioning mechanism 130, a positioning platform 140, a printing mechanism 150, a printing platform and a wafer discharging mechanism 160; wherein,
the sheet feeding mechanism 110 and the sheet discharging mechanism 160 both comprise two conveyor belts, the positioning mechanism 130 is arranged on the positioning platform 140, the printing mechanism 150 is arranged on the printing platform, the positioning mechanism 130 is in communication connection with the printing mechanism 150, and the positioning platform 140 is in translational connection with the printing platform;
the rotary conveying mechanism 120 comprises a rotating shaft 121 and a conveying plate 122, wherein a first end of the conveying plate 122 is in transmission connection with the rotating shaft 121, and two second ends of the conveying plate 122 move between the conveyor belt and the positioning platform 140;
the conveying plate 122 is configured to synchronously move the double silicon wafers on the conveyor belt of the wafer conveying mechanism 110 to the positioning platform 140 for positioning, the positioning platform 140 is configured to synchronously convey the positioned double silicon wafers to the printing platform for printing and then return the double silicon wafers to the positioning platform 140, and the conveying plate 122 is further configured to synchronously move the double silicon wafers of the positioning platform 140 to the conveyor belt of the wafer discharging mechanism 160.
The double-silicon-wafer processing system 100 provided by this embodiment is used for realizing synchronous processing of double silicon wafers, and this processing process mainly relates to the processing processes such as positioning and printing after the silicon wafers come out of the flower basket. The double-silicon-wafer processing system 100 comprises a wafer feeding mechanism 110, a wafer discharging mechanism 160, a positioning mechanism 130 and a printing mechanism 150, wherein the positioning mechanism 130 and the printing mechanism 150 are positioned between the wafer feeding mechanism 110 and the wafer discharging mechanism 160, the wafer feeding mechanism 110 is connected with a flower basket and synchronously receives double silicon wafers from the flower basket, and the wafer discharging mechanism 160 is used for discharging the printed double silicon wafers to the next process. Optionally, the rotary transport mechanism 120 is a six-axis robot.
Specifically, as shown in fig. 1, the sheet feeding mechanism 110 and the sheet discharging mechanism 160 each include two conveyor belts. According to a specific embodiment of the present disclosure, the two conveyor belts of the sheet feeding mechanism 110 and the sheet discharging mechanism 160 are parallel to each other, and the sheet feeding mechanism 110 and the sheet discharging mechanism 160 are located on the same straight line;
the positioning platform 140 comprises two positioning sub-platforms parallel to each other;
the spacing between the two conveyors is equal to the spacing between the two locator sub-platforms and equal to the spacing between the two second ends of the transport plate 122.
Alternatively, both conveyors are parallel to the first direction (F1 shown in fig. 1), and both positioning tables are parallel to the second direction (F2 shown in fig. 1);
the first direction is perpendicular to the second direction.
In this way, the rotation conveying mechanism 120 rotates back and forth by 90 degrees, so that the smooth transfer from the wafer feeding mechanism 110 to the positioning platform 140 and the smooth transfer from the positioning platform 140 to the wafer discharging mechanism 160 can be realized, and the double-silicon-wafer processing flow is further optimized.
According to a specific embodiment of the present disclosure, the printing platform includes two separated printing brush platforms, the two printing brush platforms are respectively located at two sides of the positioning platform 140, and the two printing sub-platforms and the positioning platform 140 are located on a same straight line extending along the first direction.
In this embodiment, the printing platform is divided into two printing sub-platforms, which are respectively disposed at two sides of the positioning platform 140, such as printing 1 and printing 2 shown in fig. 1. Thus, after the positioning platform 140 is positioned, the two silicon wafers can be respectively moved to the printing platforms at the two sides for synchronous printing, and then returned to the positioning platform 140, so that the positioning platform 140 can be returned to the wafer discharging mechanism 160.
In a specific implementation, the number of the conveying plates 122 is at least two, and the first ends of at least two conveying plates 122 are hinged to the rotating shaft 121.
The number of the conveying plates 122 is usually at least two, and the current conveying flow of the double silicon wafers and the next conveying flow of the double silicon wafers can be respectively performed, so that the front and the back processing flows of the double silicon wafers are sequentially performed, and the processing efficiency is improved.
In the following, specific configurations and matching procedures of the rotary conveyance mechanism 120, the positioning stage 140 and the printing stage will be specifically defined.
According to a specific embodiment of the present disclosure, the second end includes a vacuum chuck and/or a holder for holding a silicon wafer.
The second end is provided with a vacuum chuck or a clamping piece such as a tongue, a fork and the like, and the vacuum chuck or the clamping piece can be connected with the silicon wafer from the upper surface or the lower surface of the silicon wafer to move up and down or translate before printing.
According to a specific embodiment of the present disclosure, the positioning platform 140 includes a bearing plate, a through hole is formed on the bearing plate, and a movable protrusion capable of entering and exiting the bearing plate is disposed below the bearing plate.
Aiming at the printed silicon chip, because the upper surface printing can not be contacted, the tongue or the movable protrusion at the second end can jack up the lower surface of the silicon chip so as to protect the upper surface printed circuit of the silicon chip from being damaged.
According to a specific embodiment of the present disclosure, the printing brush platform and the locator platform are the same platform;
an air cylinder is arranged below the positioning sub-platform and is in transmission connection with the positioning sub-platform, and the air cylinder pushes the positioning sub-platform to move between a positioning area below the positioning mechanism 130 and a printing area below the printing mechanism 150.
In the embodiment, the movable printing scheme is realized by moving the same platform between the positioning area and the printing area, the hardware layout is saved, and the processing speed is increased.
The complete process flow of the dual silicon wafer processing system 100 provided in the present embodiment will be explained with reference to fig. 1.
The two conveyor belts of the conveying mechanism are simultaneously conveyed in parallel, and after coming out of an Automatic Guided Vehicle (AGV) basket, the two conveyor belts can be directly conveyed below a second end suction cup station of the rotary conveying mechanism 120, and silicon wafers on the conveyor belts are adsorbed onto the suction cups by the suction cups. Of course, the silicon wafer can also be lifted by the tongue or the fork at the second end. After the silicon wafers are sucked up, the conveying belt can continue to convey the next pair of double silicon wafers.
When the sucking disc sucks the piece work, the glass table surface of the positioning receipt strip below the vision is provided with a jacking mechanism, such as a movable bulge, which can penetrate through the through hole of the glass table surface to jack up the silicon chip. Considering that the printed silicon wafer is provided with silver paste or aluminum paste, the upper surface cannot be adsorbed, and the lower part can only be carried. At the moment, the silicon wafer can be inserted between the silicon wafer and the glass platform through the tongue or the fork, the jacking mechanism below the visual glass platform descends, and the silicon wafer falls on the tongue or the fork and is adsorbed by vacuum.
And then, rotating the sucker or the fork fixing structure by 90 degrees, then placing the silicon wafer on a vacuum glass table below the vision, simultaneously descending the tongue or the fork structure, releasing vacuum, placing the silicon wafer on a wafer discharging conveying belt, and then retracting the sucker, the tongue or the fork. The vision is then positioned for taking a photograph and rotated 90 back to the home position.
In the above process, the specific process of positioning and printing includes: after the visual alignment is completed, the Z-axis below the glass stage is lowered and the glass stage is transported to below the printing mechanism 150. According to the data given by the visual positioning, the glass table is translated to the printing mechanisms 150 at the two sides and moved to the position below the glass table under the two printing mechanisms 150 which are printing, and meanwhile, the printing mechanisms 150 are used for printing the other two positioned silicon chips. After printing, the two glass table tops which are just printed move to the position below the vision, then the glass table Z shaft below the vision descends, and the glass table which is positioned and moved to the position below the printing head is lifted along the Z shaft and is printed. The visual positioning sheet can also carry out the next sheet feeding operation again. Thus, the continuous alternate double-silicon-chip positioning and printing can be realized.
In conclusion, the utility model adopts a rotary and alternative structure, two rows of transmission structures are parallel, two silicon wafers are transmitted simultaneously, the wafer feeding speed is not influenced, two sets of vision positioning systems and two sets of printing structures are printed simultaneously, the productivity can be effectively improved, and the maintenance is convenient. Current AGV material loading just in time also adopts double material loading, and the silicon chip conveying just in time can effectively dock with the AGV width. Therefore, two silicon wafers can be printed simultaneously, and the productivity is greatly improved on the original basis. In addition, this application make full use of product line's advantage, with conveyer belt and print head near people's operation side as far as possible, when realizing that current productivity is close doubling, make the equipment be convenient for maintain, the superior sense of operation is stronger. Even when a single printing mechanism has a problem, another printing mechanism can still print, so that continuous printing and processing under the fault of the single printing mechanism are ensured, and the capacity of double-silicon-chip processing is greatly improved.
In the several embodiments provided in the present application, it should be understood that the disclosed apparatus may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, of the structures in which a block diagram may be implemented illustrating an architecture in which an apparatus according to various embodiments of the utility model may be implemented.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention.
Claims (9)
1. A double-silicon-wafer processing system is characterized by comprising a wafer feeding mechanism, a rotary conveying mechanism, a positioning platform, a printing mechanism, a printing platform and a wafer discharging mechanism; wherein,
the sheet feeding mechanism and the sheet discharging mechanism respectively comprise two conveyor belts, the positioning mechanism is arranged on the positioning platform, the printing mechanism is arranged on the printing platform, the positioning mechanism is in communication connection with the printing mechanism, and the positioning platform is in translational connection with the printing platform;
the rotary conveying mechanism comprises a rotating shaft and a conveying plate, wherein a first end of the conveying plate is in transmission connection with the rotating shaft, and two second ends of the conveying plate move between the conveying belt and the positioning platform;
the conveying plate is used for synchronously moving the double silicon wafers on the conveying belt of the wafer conveying mechanism to the positioning platform for positioning, the positioning platform is used for synchronously conveying the positioned double silicon wafers to the printing platform for printing and then conveying the double silicon wafers back to the positioning platform, and the conveying plate is also used for synchronously moving the double silicon wafers of the positioning platform to the conveying belt of the wafer discharging mechanism.
2. The system of claim 1, wherein the two conveyor belts of the sheet feeding mechanism and the sheet discharging mechanism are parallel to each other, and the sheet feeding mechanism and the sheet discharging mechanism are located on the same straight line;
the positioning platform comprises two positioning sub-platforms which are parallel to each other;
the distance between the two conveyor belts is equal to the distance between the two positioning sub-platforms and equal to the distance between the two second ends of the conveying plate.
3. The system of claim 2, wherein both conveyors are parallel to the first direction and both positioning tables are parallel to the second direction;
the first direction is perpendicular to the second direction.
4. The system of claim 3, wherein the printing platform comprises two separate printing brush platforms, the two printing brush platforms are respectively located at two sides of the positioning platform, and the two printing sub-platforms and the positioning platform are located on a same straight line extending along the first direction.
5. The system of claim 4, wherein the second end comprises a vacuum chuck and/or a clamp for holding a silicon wafer.
6. The system of claim 5, wherein the positioning platform comprises a bearing plate, the bearing plate is provided with a through hole, and a movable protrusion capable of moving in and out of the bearing plate is arranged below the bearing plate.
7. The system of claim 6, wherein the print brush platform and the locator platform are the same platform;
the cylinder is arranged below the positioning sub-platform and is in transmission connection with the positioning sub-platform, and the cylinder pushes the positioning sub-platform to move between a positioning area below the positioning mechanism and a printing area below the printing mechanism.
8. The system of claim 7, wherein the rotary transport mechanism is a six-axis robot.
9. The system of any one of claims 1 to 8, wherein the number of the transport plates is at least two, and the first ends of at least two transport plates are each hinged to the rotating shaft.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202121763587.3U CN215705004U (en) | 2021-07-30 | 2021-07-30 | Double-silicon-wafer processing system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202121763587.3U CN215705004U (en) | 2021-07-30 | 2021-07-30 | Double-silicon-wafer processing system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113524897A (en) * | 2021-07-30 | 2021-10-22 | 苏州迈为科技股份有限公司 | Double-silicon-wafer processing system and method |
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- 2021-07-30 CN CN202121763587.3U patent/CN215705004U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113524897A (en) * | 2021-07-30 | 2021-10-22 | 苏州迈为科技股份有限公司 | Double-silicon-wafer processing system and method |
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