JPH0625971Y2 - 半導体端面処理用治具 - Google Patents
半導体端面処理用治具Info
- Publication number
- JPH0625971Y2 JPH0625971Y2 JP6396887U JP6396887U JPH0625971Y2 JP H0625971 Y2 JPH0625971 Y2 JP H0625971Y2 JP 6396887 U JP6396887 U JP 6396887U JP 6396887 U JP6396887 U JP 6396887U JP H0625971 Y2 JPH0625971 Y2 JP H0625971Y2
- Authority
- JP
- Japan
- Prior art keywords
- laser wafer
- spacer
- pressing
- face
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 37
- 125000006850 spacer group Chemical group 0.000 claims description 58
- 238000003825 pressing Methods 0.000 claims description 47
- 235000012431 wafers Nutrition 0.000 description 85
- 238000007740 vapor deposition Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6396887U JPH0625971Y2 (ja) | 1987-04-30 | 1987-04-30 | 半導体端面処理用治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6396887U JPH0625971Y2 (ja) | 1987-04-30 | 1987-04-30 | 半導体端面処理用治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63172162U JPS63172162U (enrdf_load_stackoverflow) | 1988-11-09 |
| JPH0625971Y2 true JPH0625971Y2 (ja) | 1994-07-06 |
Family
ID=30899693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6396887U Expired - Lifetime JPH0625971Y2 (ja) | 1987-04-30 | 1987-04-30 | 半導体端面処理用治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625971Y2 (enrdf_load_stackoverflow) |
-
1987
- 1987-04-30 JP JP6396887U patent/JPH0625971Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63172162U (enrdf_load_stackoverflow) | 1988-11-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0625971Y2 (ja) | 半導体端面処理用治具 | |
| JP2003326381A (ja) | レーザ加工における極薄金属板の保持装置 | |
| JPS60140780A (ja) | 半導体表面処理用治具 | |
| JP2002344070A (ja) | レーザバー保持装置 | |
| JPH08115871A (ja) | 試料ホルダの固定装置 | |
| JP2000196180A (ja) | 半導体装置の製造方法及びそれに用いる被膜形成用治具 | |
| JPH067619B2 (ja) | 半導体表面処理用治具 | |
| JPS63153876A (ja) | 半導体レ−ザの端面処理方法及びそれに使用する治具 | |
| JP3833814B2 (ja) | 半導体レーザ半製品の保護膜形成用スペーサおよびその製造方法 | |
| JPH04294589A (ja) | 半導体レーザ型デバイスのへき開面コーティング方法 | |
| JP2001094194A (ja) | 半導体レーザ素子の端面処理方法及びそれに用いる治具 | |
| JPH08167553A (ja) | 被処理材の固定装置 | |
| JPH04187767A (ja) | 薄膜被着用治具 | |
| JPH0249710Y2 (enrdf_load_stackoverflow) | ||
| JPH11163460A (ja) | スペーサおよび該スペーサを用いた半導体レーザ素子の端面保護膜形成方法 | |
| JP2003197717A (ja) | 棒状素子の整列治具 | |
| JPH03196004A (ja) | 導波路型光デバイス | |
| JPH0543470Y2 (enrdf_load_stackoverflow) | ||
| JP2641574B2 (ja) | 半導体チップの位置規正方法 | |
| JPH06103771B2 (ja) | 半導体レーザの端面処理方法及びそれに使用する治具 | |
| JPH0749854Y2 (ja) | 圧電片の整列装置 | |
| JPH0416016B2 (enrdf_load_stackoverflow) | ||
| JPH10231501A (ja) | リニアモータ搬送装置 | |
| JP2782273B2 (ja) | パターン化薄膜の形成に用いる基板保持治具 | |
| JP2707831B2 (ja) | 半導体装置の製造方法 |