JPH06236991A - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法Info
- Publication number
- JPH06236991A JPH06236991A JP6001177A JP117794A JPH06236991A JP H06236991 A JPH06236991 A JP H06236991A JP 6001177 A JP6001177 A JP 6001177A JP 117794 A JP117794 A JP 117794A JP H06236991 A JPH06236991 A JP H06236991A
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- impurity
- impurity region
- insulating layer
- gate insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 66
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 239000012535 impurity Substances 0.000 claims abstract description 91
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 56
- 229920005591 polysilicon Polymers 0.000 claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 125000006850 spacer group Chemical group 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000005468 ion implantation Methods 0.000 claims abstract description 7
- 238000005229 chemical vapour deposition Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 3
- 239000012298 atmosphere Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 abstract description 12
- 239000000969 carrier Substances 0.000 abstract description 8
- 238000009413 insulation Methods 0.000 abstract description 5
- 238000001259 photo etching Methods 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 description 9
- 230000005684 electric field Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/32055—Deposition of semiconductive layers, e.g. poly - or amorphous silicon layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823468—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate sidewall spacers, e.g. double spacers, particular spacer material or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/6656—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using multiple spacer layers, e.g. multiple sidewall spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
- H01L29/6659—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930000420A KR960002101B1 (ko) | 1993-01-14 | 1993-01-14 | 반도체장치 및 그 제조방법 |
KR1993P420 | 1993-01-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06236991A true JPH06236991A (ja) | 1994-08-23 |
Family
ID=19349637
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6001177A Pending JPH06236991A (ja) | 1993-01-14 | 1994-01-11 | 半導体装置及びその製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH06236991A (ko) |
KR (1) | KR960002101B1 (ko) |
-
1993
- 1993-01-14 KR KR1019930000420A patent/KR960002101B1/ko not_active IP Right Cessation
-
1994
- 1994-01-11 JP JP6001177A patent/JPH06236991A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
KR960002101B1 (ko) | 1996-02-10 |
KR940019012A (ko) | 1994-08-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2897004B2 (ja) | Cmosfet製造方法 | |
JPH11121739A (ja) | 半導体装置及びその製造方法 | |
JPH0212836A (ja) | 半導体装置の製造方法 | |
JPS6344770A (ja) | 電界効果型トランジスタの製造方法 | |
JPH0697190A (ja) | Mosトランジスタの製造方法 | |
KR100419744B1 (ko) | 트랜지스터 및 그의 제조 방법 | |
JP3518059B2 (ja) | Mis型トランジスタの製造方法 | |
JPH0147016B2 (ko) | ||
JP2633104B2 (ja) | 半導体装置の製造方法 | |
JPH0234936A (ja) | 半導体装置およびその製造方法 | |
JPH11186544A (ja) | 浅い接合のソース/ドレーンを有するmosトランジスター及びその製造方法 | |
JPH06236991A (ja) | 半導体装置及びその製造方法 | |
JP2623902B2 (ja) | 半導体装置とその製造方法 | |
JPH0637106A (ja) | 半導体製造装置の製造方法 | |
JP3394562B2 (ja) | Mosfet製造方法 | |
JPS6126264A (ja) | 半導体装置の製造方法 | |
JPH0575045A (ja) | 半導体装置の製造方法 | |
JPH0778979A (ja) | 半導体装置の製造方法 | |
JPH1126766A (ja) | Mos型電界効果トランジスタおよびその製造方法 | |
JP2896960B2 (ja) | 半導体素子及びその製造方法 | |
JPH08186252A (ja) | 半導体装置 | |
JPH06314782A (ja) | 半導体装置の製造方法 | |
JPH10261795A (ja) | 絶縁ゲート型電界効果トランジスタ及びその製造方法 | |
JPS62130563A (ja) | 半導体装置 | |
KR100546812B1 (ko) | 반도체 소자 제조방법 |