JPH0623349B2 - Anisotropic conductive adhesive - Google Patents
Anisotropic conductive adhesiveInfo
- Publication number
- JPH0623349B2 JPH0623349B2 JP61019093A JP1909386A JPH0623349B2 JP H0623349 B2 JPH0623349 B2 JP H0623349B2 JP 61019093 A JP61019093 A JP 61019093A JP 1909386 A JP1909386 A JP 1909386A JP H0623349 B2 JPH0623349 B2 JP H0623349B2
- Authority
- JP
- Japan
- Prior art keywords
- anisotropic conductive
- particles
- conductive adhesive
- weight
- organic polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電気部品の組立て、特に電気部品と回路基板
との接続、あるいは、回路基板相互間の接続に関するも
のである。さらに詳しくは、液晶ディスプレーとＦＰ
Ｃ、ＰＣＢ、あるいは、フラットケーブルとの接続、液
晶ディスプレーを構成するガラス基板への裸のＩＣチッ
プの直接搭載をはじめとする表面装置型部品の回路基板
への搭載、フラットケーブル、ＦＰＣ、およびＰＣＢの
同種あるいは異種相互間接続などに適した異方導電性接
着剤に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to assembling of electric parts, particularly to connection between electric parts and a circuit board or connection between circuit boards. More specifically, liquid crystal display and FP
C, PCB or flat cable connection, mounting of surface device type parts on circuit board, including direct mounting of bare IC chip on glass substrate constituting liquid crystal display, flat cable, FPC, and PCB The present invention relates to an anisotropic conductive adhesive suitable for the same type or different type mutual connection.
この異方導電性接着剤は、カメラ、電卓、テレビ、コン
ピューター、通信機器、計測機、自動車の電装部品、そ
の他各種の産業用および民生用の電気機器の組立てに用
いられている。This anisotropic conductive adhesive is used for assembling cameras, calculators, televisions, computers, communication devices, measuring instruments, electric components for automobiles, and various other industrial and consumer electric devices.
二つの部品を相互に面接続する手法としては、ハンダが
一般的である。位置合せした状態であらかじめ少量の接
着剤で部品を相互に固定しておき融けたハンダと接触さ
せたり、一方の部品の接続端子上にペーストハンダを塗
布しておき他方の部品をその上に位置合せして載せたう
えハンダの融点以上に加熱するいわゆるリフローハンダ
法などがよく用いられる。Solder is generally used as a method for surface-connecting two components to each other. In a state of alignment, fix parts to each other with a small amount of adhesive in advance and make contact with molten solder, or apply paste solder on the connection terminals of one part and position the other part on it. A so-called reflow soldering method in which they are placed together and heated above the melting point of the solder is often used.
また、有機ポリマまたは有機モノマ、あるいはその混合
体をマトリックス成分とし、それに微粒子状の無機導電
体を配合する導電性ペーストや導電性接着剤や異方導電
性接着剤や感圧ゴムなど有機導電体は公知であり、電子
産業分野を中心に広く使用されている。Further, an organic conductor such as a conductive paste, a conductive adhesive, an anisotropic conductive adhesive or a pressure-sensitive rubber in which an organic polymer or an organic monomer or a mixture thereof is used as a matrix component and a fine-particle inorganic conductor is blended with the matrix component. Is well known and widely used mainly in the electronic industry field.
上記微粒子状の無機導電体として、従来から用いられて
きたものは、銀、金、パラジウムなどの貴金属を中心と
する金属の微粉末あるいは微フレーク体であった。ま
た、液状の有機ポリマ粒子に無電解メッキ法で銅、銀、
金などを被覆して導電化する方法も知られている（特願
昭５９−１８６４３４号）。さらに熱可塑性樹脂ポリマ
を用いてメッキ被覆した粒子を用いた接着剤（特開昭５
１−１３５９３８号公報）、カーボンブラック粉とシリ
カ微粒子を混合して用いた接着剤（特開昭６０−８３７
７号公報）も提案されている。What has been conventionally used as the above-mentioned fine-particle inorganic conductor is a fine powder or fine flake of a metal mainly composed of a noble metal such as silver, gold or palladium. In addition, copper, silver, and
A method of coating gold or the like to make it conductive is also known (Japanese Patent Application No. 59-186434). Further, an adhesive agent using particles coated with a thermoplastic resin polymer (Japanese Patent Laid-Open No. Sho 5 (1999) -58138)
No. 1-135938), an adhesive using a mixture of carbon black powder and silica fine particles (JP-A-60-837).
No. 7) is also proposed.
ハンダ接続体においては、隣接する端子が近接すると、
いわゆるハンダブリッジを生じるおそれが増大するの
で、１mmあたり３本以上の高密度接続は、非常に困難で
ある。また必然的にハンダの融点以上の高温にさらされ
るので耐熱性の低い部品例えば、ポリエステルフィルム
やガラスでできた基板と他の部品とのハンダ接続は、赤
外線ビームを用いるなど、特殊な方法でないと不可能で
ある。In the solder connection body, when adjacent terminals come close to each other,
It is very difficult to make a high density connection of three or more wires per mm because the risk of forming a so-called solder bridge increases. In addition, since it is inevitably exposed to a temperature higher than the melting point of solder, parts with low heat resistance, for example, solder connection between a substrate made of polyester film or glass and other parts must be done by a special method such as using an infrared beam. It is impossible.
導電体として金属の微粉末あるいは微フレーク体を用い
た異方導電性接着剤では、裸のＩＣチップのごとき繊細
な部品を接続したときに強い局所的応力により部品その
ものが損傷するという問題がある。さらに金属と接着剤
との熱膨脹係数が異なるので温度が上昇した際に電気接
続がとだえやすいという問題がある。また、特開昭５１
−１３５９３８号公報で提案されているような熱可塑性
樹脂からなる有機ポリマ粒子に金属を被覆し、導電化し
たものを用いた異方導電性接着剤では、上記と同様に、
温度が上昇した際に電気接続がとだえやすく、電子材料
の部品として使用するには、信頼性に欠けるという問題
があった。さらに、特開昭６０−８３７７号公報で提案
されているようなカーボンブラック粉とシリカ微粒子を
混合して用いた接着剤では、良導電性が得られないとい
う問題があった。Anisotropic conductive adhesives that use fine metal powder or fine flake bodies as conductors have a problem that when a delicate component such as a bare IC chip is connected, the component itself is damaged by strong local stress. . Furthermore, since the coefficients of thermal expansion of the metal and the adhesive are different, there is a problem that the electrical connection tends to be rough when the temperature rises. In addition, JP-A-51
In an anisotropic conductive adhesive using an organic polymer particle made of a thermoplastic resin as described in JP-A-135938, which is coated with a metal and made conductive, as in the above,
When the temperature rises, the electrical connection tends to be dull, and there is a problem in that it is unreliable when used as a component of electronic materials. Furthermore, the adhesive agent using a mixture of carbon black powder and silica fine particles as proposed in JP-A-60-8377 has a problem that good conductivity cannot be obtained.
本発明は、上記の問題のある従来の接続に代ってそれら
の問題がない新しい異方導電性接着剤を提供するもので
ある。この目的を達成するために本発明の異方導電性接
着剤は、マトリックス樹脂を接着成分として、該マトリ
ックス樹脂中に、表面が金属で被覆された熱硬化性樹脂
からなる有機ポリマの粒子が１重量％から３０重量％と
シリカ微粒子が１重量％から３０重量％含有することを
特徴とする。The present invention provides a new anisotropically conductive adhesive that does not replace the problematic conventional connections described above and does not have those problems. In order to achieve this object, the anisotropic conductive adhesive of the present invention comprises a matrix resin as an adhesive component, and an organic polymer particle made of a thermosetting resin whose surface is coated with a metal in the matrix resin. % To 30% by weight and 1% to 30% by weight of silica fine particles.
前記構成においては、有機ポリマの粒子が、エポキシポ
リマからなることが好ましい。In the above structure, the organic polymer particles are preferably made of epoxy polymer.
また前記構成においては、シリカ微粒子の一次粒子平均
径が４ミリミクロンから２００ミリミクロンであること
が好ましい。Further, in the above-mentioned structure, it is preferable that the average particle diameter of the silica fine particles is 4 to 200 mm.
また前記構成においては、有機ポリマの粒子が、球状粒
子であることが好ましい。Further, in the above structure, the particles of the organic polymer are preferably spherical particles.
また前記構成においては、表面の金属被覆がメッキによ
り被覆されたものであることが好ましい。Further, in the above structure, it is preferable that the metal coating on the surface is coated by plating.
以下本発明の詳細について説明する。The details of the present invention will be described below.
本発明で用いられる有機ポリマの球状粒子としては、エ
ポキシ、フェノールなどの熱硬化性樹脂から選ぶことが
できる。熱硬化性樹脂からなる球状粒子は、高温におけ
る信頼性と耐熱性に優れ、さらに良好な表面メッキを与
えることができる。なかでもエポキシ樹脂からなる粒子
は、特に優れたメッキ粒子を与える。The spherical particles of the organic polymer used in the present invention can be selected from thermosetting resins such as epoxy and phenol. The spherical particles made of a thermosetting resin have excellent reliability and heat resistance at high temperatures, and can give good surface plating. Among them, particles made of an epoxy resin give particularly excellent plated particles.
被覆される金属は、金、白金、銀、錫、ニッケル、銅、
亜鉛、アルミ、パラジウム、コバルトなどが好適に用い
られる。単一組成の被覆のみでなく、ハンダのごとき合
金被覆も用いられる。最下層に銅、次にニッケル、最上
層に金というように複合被覆として用いられることは、
コストと性能のバランスからいってしばしば有利であ
る。複合被覆において最上層をハンダとしたものも用い
られる。被覆される金属量は、その体積が有機ポリマ粒
子の体積を越えないことが好ましく、３０重量％以下の
ものがより好適である。The metals to be coated are gold, platinum, silver, tin, nickel, copper,
Zinc, aluminum, palladium, cobalt and the like are preferably used. Not only single composition coatings, but also alloy coatings such as solder are used. Used as a composite coating with copper on the bottom layer, then nickel, and gold on the top layer,
It is often advantageous in terms of cost and performance balance. In the composite coating, a solder having the uppermost layer is also used. The amount of the metal coated is preferably such that the volume thereof does not exceed the volume of the organic polymer particles, more preferably 30% by weight or less.
表面に金属を被覆した有機ポリマ粒子の直径は、２〜１
００ミクロン、より好ましくは、５〜４０ミクロンの範
囲にあって、かつ、粒径の揃った球状に近いものが好ま
しい。The diameter of the organic polymer particles whose surface is coated with a metal is 2-1.
It is preferably in the range of 00 microns, and more preferably in the range of 5 to 40 microns, and has a spherical shape with a uniform particle size.
表面に金属を被覆した有機ポリマ粒子の量は、個々の粒
子がほぼ独立を保ち接着剤層全体が横方向に絶縁性を持
つことができる程度に制限する必要があり、１重量％か
ら３０重量％が適当である。より好ましくは、２重量％
から１０重量％の範囲が好適に用いられる。The amount of organic polymer particles coated with a metal on the surface must be limited to the extent that the individual particles can be kept substantially independent and the entire adhesive layer can have insulating properties in the lateral direction. % Is appropriate. More preferably 2% by weight
The range of 10 to 10% by weight is preferably used.
本発明に用いられるシリカ微粒子は、透明性に優れてい
ること、電気絶縁性が良いことが必要である。The silica fine particles used in the present invention are required to have excellent transparency and good electric insulation.
これらのシリカ微粒子としては、市販のオルガノゾル、
水性シリカゾル等のコロイド状シリカ微粒子や、コロイ
ド状シリカ微粒子が、凝集したアエロジルなど、あるい
は、これらの混合物等が用いられるが、勿論ここに挙げ
たものに限定されるものではない。As these silica fine particles, commercially available organosol,
Colloidal silica fine particles such as aqueous silica sol, aerosil obtained by aggregating colloidal silica fine particles, or a mixture thereof may be used, but of course, the present invention is not limited thereto.
シリカ微粒子の一次微粒子平均径は、４ミリミクロンか
ら２００ミリミクロン、より好ましくは、４ミリミクロ
ンから７０ミリミクロンのものが好適である。The average primary particle diameter of the silica fine particles is preferably 4 millimicrons to 200 millimicrons, more preferably 4 millimicrons to 70 millimicrons.
シリカ粒子の量は、１重量％から３０重量％、より好ま
しくは、２重量％から１０重量％が好適である。使用量
が上記より以下では、接続体の温度上昇時に電気接続が
とだえやすい。また、上記より以上では、異方導電性接
着剤と接着する被着部品間の接着力が弱くなるという問
題がある。The amount of silica particles is preferably 1% by weight to 30% by weight, more preferably 2% by weight to 10% by weight. When the amount used is less than the above, the electrical connection tends to dull when the temperature of the connecting body rises. In addition, above the above, there is a problem that the adhesive force between the adhered components that adhere to the anisotropic conductive adhesive becomes weak.
接着層を構成するマトリックス樹脂は、それ自身が電気
絶縁性に優れていて、かつ、被着部品との接着性に優れ
たものであることが必要である。接着プロセスにおいて
接着される二つの部品の空隙を流れることができる程度
に流動性をもっている必要があり、熱、光、電子線等に
よって硬化するか、あるいは冷却によって固化して強固
な接着層を形成するものでなければならない。エポキ
シ、アクリル、ポリブタジエンをはじめとする硬化型樹
脂、共重合系のポリエステル、共重合系のポリアミド、
熱可塑性のポリウレタンをはじめとする各種熱可塑性樹
脂あるいは、これらの混合物等が用いられるが、勿論こ
こに挙げたものに限定されるものではない。The matrix resin forming the adhesive layer must be excellent in electric insulation itself and excellent in adhesiveness to the adhered component. It must have fluidity so that it can flow through the gap between the two parts to be bonded in the bonding process, and it can be hardened by heat, light, electron beams, etc., or solidified by cooling to form a strong adhesive layer. Must be something that Epoxy, acrylic, polybutadiene and other curable resins, copolymer polyesters, copolymer polyamides,
Various thermoplastic resins including thermoplastic polyurethane and mixtures thereof are used, but of course, the present invention is not limited to these.
本発明の異方導電性接着剤は、表面に金属被覆された有
機ポリマの粒子を分散含有するペーストとして、一方の
部品の少なくとも端子部、あるいは全面的に塗布してお
き、必要に応じて乾燥して溶剤を除去したのち他の部品
を向い合せてホットプレスして、電気接続体としたり、
さらに異方導電性接着剤を、接着フィルムとして、二つ
の部品間にはさんでホットプレスし、電気接続体とする
こともできる。The anisotropic conductive adhesive of the present invention is a paste containing dispersed particles of an organic polymer metal-coated on the surface thereof, and at least the terminal portion of one component or the entire surface of the paste is applied, and dried if necessary. After removing the solvent to face the other parts and hot press to make an electrical connection,
Further, an anisotropic conductive adhesive can be used as an adhesive film by sandwiching it between two parts and hot pressing to form an electrical connection.
ペーストは、通常希釈剤で希釈されており、希釈剤に
は、ケトン類、アルコール類、セルソルブ類、ジエキサ
ン、芳香族炭化水素類、酢酸エチルなどのエステル類な
どが挙げられる。接着フィルムは、上記ペーストを製膜
し、溶剤を乾燥してフィルムとしたり、希釈剤を用いな
いで、溶融製膜により直接フィルムとする方法が用いら
れるが、ここに挙げた方法に限定されるものではない。The paste is usually diluted with a diluent, and examples of the diluent include ketones, alcohols, cellosolves, diexane, aromatic hydrocarbons, esters such as ethyl acetate, and the like. As the adhesive film, a method of forming the above-mentioned paste into a film by drying the solvent or a method of forming a film directly by melt-forming without using a diluent is used, but the method is not limited to the method described here. Not a thing.
異方導電性接着剤をフィルムとして用いる場合の、フィ
ルム膜厚は、５ミクロンから１５０ミクロン、好ましく
は、１０ミクロンから５０ミクロンが適当である。When the anisotropic conductive adhesive is used as a film, the film thickness is suitably 5 to 150 microns, preferably 10 to 50 microns.
実施例１ 市販エポキシ樹脂（エピコート８２８）１０ｇとＨＬＢ
１３のノニオン系界面活性剤０．４ｇの混合物を１０ｇ
の水で乳化し、８ｇの水に溶解した０．７当量のピペラ
ジン水溶液を加えて、常温でゆるやかに４日間攪拌して
球状粒子状に硬化した。湿式分級により直径２５から３
７ミクロンの粒子に揃えた。Example 1 10 g of commercially available epoxy resin (Epicoat 828) and HLB
10 g of a mixture of 0.4 g of 13 nonionic surfactants
This was emulsified with water, added with 0.7 equivalent of an aqueous solution of piperazine dissolved in 8 g of water, and gently stirred at room temperature for 4 days to cure into spherical particles. Diameter from 25 to 3 by wet classification
Aligned to 7 micron particles.
この粒子の表面に銅を１ミクロンの厚さに、次いで銀を
１ミクロンの厚さにいずれも無電解メッキして導電性粒
子を得た。Copper was applied to the surface of the particles to a thickness of 1 micron and then silver was applied to the thickness of 1 micron by electroless plating to obtain conductive particles.
この導電性粒子３重量％、アエロジル２００（日本アエ
ロジル（株）製）３重量％、バイロン３００（東洋紡績
（株）製）４４重量％、メチルエチルケトン５０重量％
を混合してペーストをつくった。3 wt% of the conductive particles, 3 wt% of Aerosil 200 (manufactured by Nippon Aerosil Co., Ltd.), 44 wt% of Byron 300 (manufactured by Toyobo Co., Ltd.), 50 wt% of methyl ethyl ketone
Were mixed to form a paste.
１８ミクロンの銅箔をクラッドしたポリエステルフィル
ムを原料として５本／mmのピッチの端子をもつ試験回路
を２枚つくり、その１枚の端子部に前記のペーストをス
クリーン印刷した。乾燥後の塗膜の厚さは、平均して３
０ミクロンであった。Two test circuits having terminals with a pitch of 5 / mm were made from a polyester film clad with 18-micron copper foil as a raw material, and the paste was screen-printed on one of the terminals. The thickness of the coating film after drying is 3 on average.
It was 0 micron.
端子部同士を向合せて１５０℃、１０kg／cm2で１０秒
間ホットプレスし、直ちに放冷した。こうして得た接続
体の接合端子間抵抗は、５０ミリオーム以下であった。
また、隣接端子間絶縁抵抗は１０１３オーム以上であっ
た。この接続体を１００℃まで昇温しても、上記の導電
性、絶縁性は保持された。なお下表に本発明品を１００
℃まで昇温した時の導通抵抗値を、シリカ微粒子を用い
ないものと比べて表示した。The terminals were faced to each other, hot pressed at 150 ° C. and 10 kg / cm 2 for 10 seconds, and then allowed to cool immediately. The resistance between the joining terminals of the thus obtained connecting body was 50 milliohms or less.
The insulation resistance between adjacent terminals was 10 13 ohms or more. Even when the temperature of this connector was raised to 100 ° C., the above-mentioned conductivity and insulation were maintained. The following table shows 100 products of the present invention.
The conduction resistance value when the temperature was raised to 0 ° C. was displayed in comparison with that without silica fine particles.
実施例２ 実施例１に記載した導電性粒子を５重量％、アエロジル
３００（日本アエロジル（株）製）５重量％、ポリエス
タＫＥ７１０（日本合成化学（株）製）９０重量％を、
ブラベンダ装置に仕込み、溶融混合後、平板ホットプレ
スを用いて膜厚約２５ミクロンのフィルムを得た。この
フィルムを実施例１で用いた５本／mmのピッチの端子を
もつ試験回路の端子間に挟み、１５０℃、１０kg／cm2
で１５秒ホットプレスし、直ちに放冷した。こうして得
られた接続体の性能は、実施例１と同様に良好な結果が
得られた。 Example 2 5% by weight of the conductive particles described in Example 1, 5% by weight of Aerosil 300 (manufactured by Nippon Aerosil Co., Ltd.), and 90% by weight of Polyester KE710 (manufactured by Nippon Synthetic Chemical Co., Ltd.)
After being charged in a brabender device, melted and mixed, a flat plate hot press was used to obtain a film having a thickness of about 25 microns. This film was sandwiched between the terminals of the test circuit having the terminals of the pitch of 5 / mm used in Example 1, 150 ° C., 10 kg / cm 2
It was hot-pressed for 15 seconds and immediately left to cool. As for the performance of the thus-obtained connector, good results were obtained as in Example 1.
本発明によれば、ハンダ接続体で得られない高い密度な
電気接続体が得られる。また耐熱性が低くてハンダで
は、接続できない部品についても安定した電気接続体が
得られる。なお金属微粒子で接続したものに比べ、温度
上昇時の電気接続に優れたものが得られる。さらにＩＣ
チップのごとき繊細な部品を回路基板上に直接に搭載す
ることができる。According to the present invention, it is possible to obtain a high-density electrical connector that cannot be obtained with a solder connector. In addition, since the heat resistance is low, stable electrical connection can be obtained even for parts that cannot be connected by soldering. It should be noted that it is possible to obtain the one excellent in electrical connection when the temperature rises, as compared with the one connected by the metal fine particles. Further IC
Delicate parts such as chips can be mounted directly on the circuit board.
Claims (5)
トリックス樹脂中に、表面が金属で被覆された熱硬化性
樹脂からなる有機ポリマの粒子が１重量％から３０重量
％とシリカ微粒子が１重量％から３０重量％含有するこ
とを特徴とする異方導電性接着剤。1. A matrix resin as an adhesive component, wherein 1 to 30% by weight of organic polymer particles comprising a thermosetting resin whose surface is coated with a metal and 1% by weight of silica fine particles are contained in the matrix resin. To 30% by weight of the anisotropic conductive adhesive.
なることを特徴とする特許請求の範囲第(1)項記載の異
方導電性接着剤。2. The anisotropic conductive adhesive according to claim 1, wherein the organic polymer particles are made of epoxy polymer.
クロンから２００ミリミクロンであることを特徴とする
特許請求の範囲第(1)項記載の異方導電性接3. The anisotropic conductive contact according to claim 1, wherein the average particle diameter of the silica fine particles is from 4 mm to 200 mm.
を特徴とする特許請求の範囲第(1)項記載の異方導電性
接着剤。4. The anisotropic conductive adhesive according to claim 1, wherein the organic polymer particles are spherical particles.
ものであることを特徴とする特許請求の範囲第(1)項記
載の異方導電性接着剤。5. The anisotropic conductive adhesive according to claim 1, wherein the metal coating on the surface is coated by plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61019093A JPH0623349B2 (en) | 1986-01-30 | 1986-01-30 | Anisotropic conductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61019093A JPH0623349B2 (en) | 1986-01-30 | 1986-01-30 | Anisotropic conductive adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62177082A JPS62177082A (en) | 1987-08-03 |
| JPH0623349B2 true JPH0623349B2 (en) | 1994-03-30 |
Family
ID=11989854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61019093A Expired - Lifetime JPH0623349B2 (en) | 1986-01-30 | 1986-01-30 | Anisotropic conductive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0623349B2 (en) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5136365A (en) * | 1990-09-27 | 1992-08-04 | Motorola, Inc. | Anisotropic conductive adhesive and encapsulant material |
| JPH07123179B2 (en) * | 1990-10-05 | 1995-12-25 | 信越ポリマー株式会社 | Circuit board connection structure with anisotropic conductive adhesive |
| US5686703A (en) * | 1994-12-16 | 1997-11-11 | Minnesota Mining And Manufacturing Company | Anisotropic, electrically conductive adhesive film |
| JP5378261B2 (en) * | 1997-02-14 | 2013-12-25 | 日立化成株式会社 | Adhesive for connecting circuit members |
| DE69830623T2 (en) | 1998-08-13 | 2006-05-04 | Hitachi Chemical Co., Ltd. | ADHESIVE FOR CONNECTING SWITCH ELEMENTS, PCB AND METHOD FOR MANUFACTURING THE SAME |
| US6356414B1 (en) | 1998-10-22 | 2002-03-12 | World Properties, Inc. | Liquid crystal polymer disk drive suspension assembly |
| US6574075B2 (en) | 1998-10-22 | 2003-06-03 | World Properties, Inc. | Liquid crystal polymer disk drive suspension assembly and method of manufacture thereof |
| WO2003000816A1 (en) * | 2001-06-25 | 2003-01-03 | Telephus, Inc. | Anisotropic conductive adhesives having enhanced viscosity and bonding methods and integrated circuit packages using the same |
| US6884833B2 (en) | 2001-06-29 | 2005-04-26 | 3M Innovative Properties Company | Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
| KR100621463B1 (en) * | 2003-11-06 | 2006-09-13 | 제일모직주식회사 | Insulated Conductive Particles and an Anisotropic Conductive film Containing the Particles |
| KR100667374B1 (en) | 2004-12-16 | 2007-01-10 | 제일모직주식회사 | Polymer Particles for Anisotropic Conductive Packaging Materials, Conductive Particles and an Anisotropic Conductive Packaging Materials Containing the Same |
| KR100650284B1 (en) | 2005-02-22 | 2006-11-27 | 제일모직주식회사 | Polymer Particles and Conductive Particles Having Enhanced Conducting Properties and an Anisotropic Conductive Packaging Materials Containing the Same |
| KR100720895B1 (en) | 2005-07-05 | 2007-05-22 | 제일모직주식회사 | Conductive particle having a density-gradient in the complex plating layer and Preparation of the same and Conductive adhesives using the same |
| JP2007113012A (en) * | 2006-11-13 | 2007-05-10 | Hitachi Chem Co Ltd | Adhesive for connecting circuit part |
| JP2007107008A (en) * | 2006-11-13 | 2007-04-26 | Hitachi Chem Co Ltd | Film-shaped adhesive and method for producing laminate |
| JP4928378B2 (en) * | 2007-08-06 | 2012-05-09 | 日立化成工業株式会社 | Adhesive for connecting circuit members |
| TWI540590B (en) * | 2011-05-31 | 2016-07-01 | 住友電木股份有限公司 | Semiconductor device |
| KR101535600B1 (en) * | 2012-11-06 | 2015-07-09 | 제일모직주식회사 | Anisotropic conductive film and semiconductor device |
| TWI795388B (en) * | 2017-02-17 | 2023-03-11 | 日商昭和電工材料股份有限公司 | adhesive film |
| CN106793477A (en) * | 2017-03-16 | 2017-05-31 | 苏州经贸职业技术学院 | A kind of multilayer circuit board that can be reduced welding temperature and increase welding pad structure intensity |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5187548A (en) * | 1975-01-30 | 1976-07-31 | Matsushita Electric Works Ltd | JUSHI SEIBUTSU |
| JPS51135938A (en) * | 1975-05-21 | 1976-11-25 | Seiko Epson Corp | Anisotropic electroconductive adhesive |
| JPS5749632A (en) * | 1980-09-08 | 1982-03-23 | Nippon Shokubai Kagaku Kogyo Co Ltd | Electrically conductive filler |
| JPS608377A (en) * | 1983-06-28 | 1985-01-17 | Matsushita Electric Ind Co Ltd | Anisotropically electrically-conductive adhesive |
-
1986
- 1986-01-30 JP JP61019093A patent/JPH0623349B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62177082A (en) | 1987-08-03 |
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