CN106793477A - A kind of multilayer circuit board that can be reduced welding temperature and increase welding pad structure intensity - Google Patents
A kind of multilayer circuit board that can be reduced welding temperature and increase welding pad structure intensity Download PDFInfo
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- CN106793477A CN106793477A CN201710156562.9A CN201710156562A CN106793477A CN 106793477 A CN106793477 A CN 106793477A CN 201710156562 A CN201710156562 A CN 201710156562A CN 106793477 A CN106793477 A CN 106793477A
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- parts
- epoxy resin
- metal layer
- circuit board
- multilayer circuit
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention discloses a kind of multilayer circuit board that can be reduced welding temperature and increase welding pad structure intensity, including coating metal layer, bottom metal layer and intermediate metal layer.Coating metal layer is provided with several weld pads, and weld pad is connected by conducting resin material with flexible PCB, and at least one conducting resin material is embedded with temperature sensor.Be all provided with bottom metal layer and all intermediate metal layers it is jagged, filled with the silica thermal insulation layer with radiation shield performance in each breach.Anisotropy conductiving glue material, by weight, is mainly made up of following component：40 ~ 50 parts of EG100 epoxy resin；30 ~ 60 parts of 4 epoxy resin of ET；5 ~ 7 parts of bar-shaped zinc oxide；46 parts of silane coupler, 20 ~ 24 parts of curing agent；10 ~ 14 parts of silver-bearing copper epoxy resin composite conducting particles；47 parts of nitrile rubber；12 parts of dibutyl phthalate.After said structure, weld pad is difficult to disperse heat energy, convenient board heating, saving production cost and can increase structural strength.
Description
Technical field
Welding temperature can be reduced the present invention relates to a kind of electronic component field, particularly one kind and increase welding pad structure is strong
The multilayer circuit board of degree.
Background technology
Circuit board can be divided into single layer board, double-layer circuit board and multilayer circuit board according to the number of line layer.It is wherein many
Layer circuit board stacking up layers line layer, and these line layers are electrically connected with through hole or blind hole.Because multilayer circuit board can be by
Circuit layer stack simultaneously concentrates in the circuit board of a small area, therefore in the case where light, thin, short, the small trend of electronic product is pursued, it is many
The application of layer circuit board is more and more extensive.
During welding flexible circuit board with circuit board, conducting resin material must apply certain solidification temperature to be formed
The weld pad contact of solidification.If weld pad temperature deficiency will cause weld pad contact cracking (Crack), hole (hole) or stripping etc. existing
As.But in traditional circuit board, because the number of plies of circuit board is different, the temperature difference of its weld pad is very big.So that weld pad connects
The phenomenons such as point cracking, hole or stripping often occur, and cause following insoluble difficulty：Firstth, weld pad contact point structure is strong
Degree weakens：Once weld pad contact occurs the phenomenons such as cracking, hole or stripping, the structural strength of weld pad contact significantly weakens.Sternly
During weight, encapsulating structure or flexible circuit board will be unable to play its electrical functionality.Secondth, board operating difficulties is heated：In circuit board
Welding process in, can adjust manufacture craft parameter (as improve heat source temperature, quickening heat speed or the thermal source distance that furthers),
To improve the temperature of specific weld pad.So during the adjustment of heating board, and cannot accurately obtain required manufacture craft ginseng
Number, its effect on driving birds is not good.And when circuit board is changed, board is carrying out manufacture craft parameter modification process, will cause board
It is idle.3rd, manufacture craft elasticity is reduced：There are different manufacture craft parameters in response to various boards, can be directed to different
The different production line of manufacture craft parameter setting.But each production line can only arrange in pairs or groups in specific circuit board so that production line
Manufacture craft elasticity is suitable low, and the idle situation of production line will be caused to occur.4th, production hour is increased：In traditional electricity
After road plate and encapsulating structure or flexible circuit plate weld, being both needed to put into a large amount of manpowers carries out the heavy industry manufacture craft of artificial repair welding
(Reworking Process), with the structural strength of reinforcement weld pad contact.The man-hour of artificial repair welding is tediously long, through production is commonly formed
The bottleneck and many production hours of increase of line.5th, manufacturing cost is increased：As described above, traditional circuit board is in its welding system
In making technique, because of increased circuit board defective products, board standby time, production line standby time and heavy industry man-hour and heavy industry people
Power, and cause many manufacturing costs must to waste.
The content of the invention
The technical problem to be solved in the present invention is directed to above-mentioned the deficiencies in the prior art, and providing one kind can reduce welding temperature
The multilayer circuit board of degree and increase welding pad structure intensity, the multilayer circuit that welding temperature can be reduced and increase welding pad structure intensity
The weld pad of plate kind is difficult to disperse heat energy, convenient board heating, saving production cost and can increase structural strength.
In order to solve the above technical problems, the technical solution adopted by the present invention is：
A kind of multilayer circuit board that can be reduced welding temperature and increase welding pad structure intensity, including at least three metal levels and some
Individual insulating barrier, insulating barrier is arranged between two neighboring metal level, and metal level and insulating barrier are superposed.
At least three metal levels are respectively coating metal layer, bottom metal layer and at least one intermediate metal layer.
Several weld pads are provided with coating metal layer, weld pad is connected by conducting resin material with flexible PCB, at least
One conducting resin material is embedded with temperature sensor.
The breach corresponding with bond pad locations is provided with bottom metal layer and all intermediate metal layers, in each breach
Filled with the silica thermal insulation layer with radiation shield performance.
The conducting resin material is anisotropy conductiving glue material, the anisotropy conductiving glue material, by weight, mainly by such as
The following group is grouped into：
40 ~ 50 parts of EG100 epoxy resin；
30 ~ 60 parts of ET-4 epoxy resin；
5 ~ 7 parts of bar-shaped zinc oxide；
Silane coupler 4-6 parts
20 ~ 24 parts of curing agent；
10 ~ 14 parts of silver-bearing copper epoxy resin composite conducting particles；
Nitrile rubber 4-7 parts；
Dibutyl phthalate 1-2 parts.
The preparation method of anisotropy conductiving glue material, comprises the following steps：
Step 1, the pretreatment of silver-bearing copper epoxy resin composite conducting particles：Silver-bearing copper epoxy resin composite conducting particles are used into silane idol
Connection agent is pre-processed；
It is prepared by step 2, the bar-shaped zinc oxide fluid dispersion that is modified：1-3 parts of silane coupler is added drop-wise in deionized water, pH value is adjusted
It is 4~6, then system is warming up to 65 DEG C~90 DEG C, add bar-shaped zinc oxide, be incubated and stir, the bar-shaped zinc oxide that is modified is obtained
Dispersion liquid；
Step 3, stirs and evenly mixs：By EG100 epoxy resin and ET-4 epoxy resin feeding agitator tank, mixer is started, by temperature
90-130 DEG C is increased to, it is slow while stirring to add the bar-shaped zinc oxide fluid dispersion that is modified, and stir；
Step 4, insulation continues to stir, while stirring slow nitrile rubber and dibutyl phthalate；
Step 5, agitator tank is added by curing agent and silver-bearing copper epoxy resin composite conducting particles simultaneously, is stirred, and is cooled down, packaging
Get product.
The lower surface of bottom metal layer is provided with heat dissipating layer.
Each insulating barrier and bond pad locations corresponding section, are also filled with the silica thermal insulation layer with radiation shield performance.
Coating metal layer upper surface positioned at weld pad periphery sets matcoveredn.
The area of each breach is all higher than the area of weld pad.
Using after said structure, weld pad is difficult to disperse that heat energy, board heating be convenient, section to the present invention in above-mentioned multilayer circuit board
Save production cost and structural strength can be increased.Above-mentioned anisotropy conductiving glue material welding temperature is low, and with superior reinforcing
Energy and mechanical property, low production cost, bar-shaped zinc oxide are cross-linked to form modified bar-shaped zinc oxide with silane coupler so that rod
Shape zinc oxide can preferably disperse in water, play dispersion and modified double effectses, while having to anisotropy conductiving glue material
There is more preferable compatibility performance.In addition, by the silver-bearing copper epoxy resin composite conducting particles being coupled, with stronger adhesion strength,
Electric conductivity is strong, and structural strength is high, with excellent ageing resistace and antioxygenic property.
Brief description of the drawings
Fig. 1 is a kind of structural representation that can be reduced welding temperature and increase the multilayer circuit board of welding pad structure intensity of the present invention
Figure.
Specific embodiment
The present invention is further detailed explanation with specific better embodiment below in conjunction with the accompanying drawings.
As shown in figure 1, a kind of multilayer circuit board that can be reduced welding temperature and increase welding pad structure intensity, wherein there is top layer
Metal level 1, protective layer 11, weld pad 12, bottom metal layer 2, heat dissipating layer 21, intermediate metal layer 3, insulating barrier 4, breach 5, silica
The technical characteristics such as thermal insulation layer 6, conducting resin material 7, temperature sensor 71 and flexible circuit board 8.
It is a kind of can reduce welding temperature and increase welding pad structure intensity multilayer circuit board, including at least three metal levels and
Several insulating barriers, insulating barrier is arranged between two neighboring metal level, and metal level and insulating barrier are superposed.
At least three metal levels are respectively coating metal layer, bottom metal layer and at least one intermediate metal layer.
Several weld pads are provided with coating metal layer, weld pad is connected by conducting resin material with flexible PCB, at least
One conducting resin material is embedded with temperature sensor.
Said temperature sensor is embedded in conducting resin material, and temperature sensor wirelessly or non-wirelessly connects with data acquisition device
Connect.The benefit for so setting is, on the one hand can to welding when temperature carry out monitor in real time, it is more accurate to weld, to solidifying
Temperature can also carry out real-time detection, be easy to analyze the monitoring of whole temperature in welding process, and welded condition is understood in time.The opposing party
Face, when multilayer circuit board is arranged in whole machine, the heat condition of energy on-line monitoring multilayer circuit board, is that experimental analysis is provided with
The reference data of effect.
The breach corresponding with bond pad locations is provided with bottom metal layer and all intermediate metal layers, in each breach
Filled with the silica thermal insulation layer with radiation shield performance.
The setting of above-mentioned breach and silica thermal insulation layer, when weld pad is welded, be avoided that temperature from coating metal layer to
Under extend vertically, and can the interference of anti-stop signal, accelerate welding temperature heating rate, high insulating effect, weld pad is difficult to disperse heat
Energy, board heat convenience, save production cost, and then welding structure intensity is high.
The lower surface of bottom metal layer is provided with heat dissipating layer.The setting of heat dissipating layer, in multilayer circuit board is arranged on whole machine
When, multilayer circuit board will can be lowered the temperature, heating is prevented, extend the service life of multilayer circuit board.
Each insulating barrier and bond pad locations corresponding section, are also filled with the silica thermal insulation layer with radiation shield performance.
Coating metal layer upper surface positioned at weld pad periphery sets matcoveredn.
The area of each breach is all higher than the area of weld pad.
Above-mentioned conducting resin material is anisotropy conductiving glue material, and it preferably has following several preferred embodiments.
Embodiment 1
A kind of anisotropy conductiving glue material, by weight, is mainly made up of following component：
40 parts of EG100 epoxy resin；
30 parts of ET-4 epoxy resin；
5 parts of bar-shaped zinc oxide；
4 parts of silane coupler
20 parts of curing agent；
10 parts of silver-bearing copper epoxy resin composite conducting particles；
4 parts of nitrile rubber；
1 part of dibutyl phthalate.
The preparation method of anisotropy conductiving glue material, comprises the following steps：
Step 1, the pretreatment of silver-bearing copper epoxy resin composite conducting particles：Silver-bearing copper epoxy resin composite conducting particles are used into silane idol
Connection agent is pre-processed；
It is prepared by step 2, the bar-shaped zinc oxide fluid dispersion that is modified：1-3 parts of silane coupler is added drop-wise in deionized water, pH value is adjusted
It is 4~6, then system is warming up to 65 DEG C~90 DEG C, add bar-shaped zinc oxide, be incubated and stir, the bar-shaped zinc oxide that is modified is obtained
Dispersion liquid；
Step 3, stirs and evenly mixs：By EG100 epoxy resin and ET-4 epoxy resin feeding agitator tank, mixer is started, by temperature
90-130 DEG C is increased to, it is slow while stirring to add the bar-shaped zinc oxide fluid dispersion that is modified, and stir；
Step 4, insulation continues to stir, while stirring slow nitrile rubber and dibutyl phthalate；
Step 5, agitator tank is added by curing agent and silver-bearing copper epoxy resin composite conducting particles simultaneously, is stirred, and is cooled down, packaging
Get product.
Embodiment 2
A kind of anisotropy conductiving glue material, by weight, is mainly made up of following component：
45 parts of EG100 epoxy resin；
45 parts of ET-4 epoxy resin；
6 parts of bar-shaped zinc oxide；
5 parts of silane coupler
22 parts of curing agent；
12 parts of silver-bearing copper epoxy resin composite conducting particles；
5 parts of nitrile rubber；
1.5 parts of dibutyl phthalate.
The preparation method of anisotropy conductiving glue material, comprises the following steps：
Step 1, the pretreatment of silver-bearing copper epoxy resin composite conducting particles：Silver-bearing copper epoxy resin composite conducting particles are used into silane idol
Connection agent is pre-processed；
It is prepared by step 2, the bar-shaped zinc oxide fluid dispersion that is modified：1-3 parts of silane coupler is added drop-wise in deionized water, pH value is adjusted
It is 4~6, then system is warming up to 65 DEG C~90 DEG C, add bar-shaped zinc oxide, be incubated and stir, the bar-shaped zinc oxide that is modified is obtained
Dispersion liquid；
Step 3, stirs and evenly mixs：By EG100 epoxy resin and ET-4 epoxy resin feeding agitator tank, mixer is started, by temperature
90-130 DEG C is increased to, it is slow while stirring to add the bar-shaped zinc oxide fluid dispersion that is modified, and stir；
Step 4, insulation continues to stir, while stirring slow nitrile rubber and dibutyl phthalate；
Step 5, agitator tank is added by curing agent and silver-bearing copper epoxy resin composite conducting particles simultaneously, is stirred, and is cooled down, packaging
Get product.
Embodiment 3
A kind of anisotropy conductiving glue material, by weight, is mainly made up of following component：
50 parts of EG100 epoxy resin；
60 parts of ET-4 epoxy resin；
7 parts of bar-shaped zinc oxide；
6 parts of silane coupler
24 parts of curing agent；
14 parts of silver-bearing copper epoxy resin composite conducting particles；
7 parts of nitrile rubber；
2 parts of dibutyl phthalate.
The preparation method of anisotropy conductiving glue material, comprises the following steps：
Step 1, the pretreatment of silver-bearing copper epoxy resin composite conducting particles：Silver-bearing copper epoxy resin composite conducting particles are used into silane idol
Connection agent is pre-processed；
It is prepared by step 2, the bar-shaped zinc oxide fluid dispersion that is modified：1-3 parts of silane coupler is added drop-wise in deionized water, pH value is adjusted
It is 4~6, then system is warming up to 65 DEG C~90 DEG C, add bar-shaped zinc oxide, be incubated and stir, the bar-shaped zinc oxide that is modified is obtained
Dispersion liquid；
Step 3, stirs and evenly mixs：By EG100 epoxy resin and ET-4 epoxy resin feeding agitator tank, mixer is started, by temperature
90-130 DEG C is increased to, it is slow while stirring to add the bar-shaped zinc oxide fluid dispersion that is modified, and stir；
Step 4, insulation continues to stir, while stirring slow nitrile rubber and dibutyl phthalate；
Step 5, agitator tank is added by curing agent and silver-bearing copper epoxy resin composite conducting particles simultaneously, is stirred, and is cooled down, packaging
Get product.
Verification experimental verification
Anisotropy conductiving glue material in the application circuit arrangement is used into identical heating parameters to it using same heater
Heating, and monitor the temperature change of thermal anisotropy's conducting resin material.
In addition, using same puller system, pulling force examination is carried out to the flexible PCB after solidification using the pulling force of 150KN
Test, observe the stripping situation of weld pad.
Meanwhile, using the anisotropy conductiving glue material of prior art, as reference examples.
Result of the test is as follows：
Tested more than, it is seen that of the invention with the obvious advantage, be easy to wide popularization and application.
The preferred embodiment of the present invention described in detail above, but, the present invention is not limited in above-mentioned implementation method
Detail, in range of the technology design of the invention, various equivalents can be carried out to technical scheme, this
A little equivalents belong to protection scope of the present invention.
Claims (5)
1. it is a kind of can reduce welding temperature and increase welding pad structure intensity multilayer circuit board, it is characterised in that：Including at least three
Individual metal level and several insulating barriers, insulating barrier are arranged between two neighboring metal level, and metal level and insulating barrier are superposed；
At least three metal levels are respectively coating metal layer, bottom metal layer and at least one intermediate metal layer；
Several weld pads are provided with coating metal layer, weld pad is connected by conducting resin material with flexible PCB, at least one
Conducting resin material is embedded with temperature sensor；
The breach corresponding with bond pad locations is provided with bottom metal layer and all intermediate metal layers, is filled out in each breach
Filled with the silica thermal insulation layer with radiation shield performance；
The conducting resin material is anisotropy conductiving glue material, the anisotropy conductiving glue material, by weight, mainly by such as the following group
It is grouped into：
40 ~ 50 parts of EG100 epoxy resin；
30 ~ 60 parts of ET-4 epoxy resin；
5 ~ 7 parts of bar-shaped zinc oxide；
Silane coupler 4-6 parts
20 ~ 24 parts of curing agent；
10 ~ 14 parts of silver-bearing copper epoxy resin composite conducting particles；
Nitrile rubber 4-7 parts；
Dibutyl phthalate 1-2 parts；
The preparation method of anisotropy conductiving glue material, comprises the following steps：
Step 1, the pretreatment of silver-bearing copper epoxy resin composite conducting particles：Silver-bearing copper epoxy resin composite conducting particles are used into silane idol
Connection agent is pre-processed；
It is prepared by step 2, the bar-shaped zinc oxide fluid dispersion that is modified：1-3 parts of silane coupler is added drop-wise in deionized water, pH value is adjusted
It is 4~6, then system is warming up to 65 DEG C~90 DEG C, add bar-shaped zinc oxide, be incubated and stir, the bar-shaped zinc oxide that is modified is obtained
Dispersion liquid；
Step 3, stirs and evenly mixs：By EG100 epoxy resin and ET-4 epoxy resin feeding agitator tank, mixer is started, by temperature
90-130 DEG C is increased to, it is slow while stirring to add the bar-shaped zinc oxide fluid dispersion that is modified, and stir；
Step 4, insulation continues to stir, while stirring slow nitrile rubber and dibutyl phthalate；
Step 5, agitator tank is added by curing agent and silver-bearing copper epoxy resin composite conducting particles simultaneously, is stirred, and is cooled down, packaging
Get product.
2. it is according to claim 1 can reduce welding temperature and increase welding pad structure intensity multilayer circuit board, its feature
It is：The lower surface of bottom metal layer is provided with heat dissipating layer.
3. it is according to claim 1 can reduce welding temperature and increase welding pad structure intensity multilayer circuit board, its feature
It is：Each insulating barrier and bond pad locations corresponding section, are also filled with the silica thermal insulation layer with radiation shield performance.
4. it is according to claim 1 can reduce welding temperature and increase welding pad structure intensity multilayer circuit board, its feature
It is：Coating metal layer upper surface positioned at weld pad periphery sets matcoveredn.
5. it is according to claim 1 can reduce welding temperature and increase welding pad structure intensity multilayer circuit board, its feature
It is：The area of each breach is all higher than the area of weld pad.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710156562.9A CN106793477A (en) | 2017-03-16 | 2017-03-16 | A kind of multilayer circuit board that can be reduced welding temperature and increase welding pad structure intensity |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710156562.9A CN106793477A (en) | 2017-03-16 | 2017-03-16 | A kind of multilayer circuit board that can be reduced welding temperature and increase welding pad structure intensity |
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| CN106793477A true CN106793477A (en) | 2017-05-31 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108899351A (en) * | 2018-07-13 | 2018-11-27 | 京东方科技集团股份有限公司 | A kind of display panel and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62177082A (en) * | 1986-01-30 | 1987-08-03 | Toray Ind Inc | Anisotropic electrically conductive adhesive |
| CN101781540A (en) * | 2010-03-19 | 2010-07-21 | 东华大学 | High-performance conducting resin and preparation method thereof |
| CN102676096A (en) * | 2012-05-23 | 2012-09-19 | 江苏省东泰精细化工有限责任公司 | Preparation method of organosilicon conductive adhesive containing nanorod-shaped zinc oxide |
| CN103013408A (en) * | 2011-09-26 | 2013-04-03 | 陈银凤 | Preparation method of conductive adhesive cured at room temperature |
| CN105828535A (en) * | 2016-05-20 | 2016-08-03 | 苏州经贸职业技术学院 | Circuit board welding heating machine with temperature control circuit |
-
2017
- 2017-03-16 CN CN201710156562.9A patent/CN106793477A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62177082A (en) * | 1986-01-30 | 1987-08-03 | Toray Ind Inc | Anisotropic electrically conductive adhesive |
| CN101781540A (en) * | 2010-03-19 | 2010-07-21 | 东华大学 | High-performance conducting resin and preparation method thereof |
| CN103013408A (en) * | 2011-09-26 | 2013-04-03 | 陈银凤 | Preparation method of conductive adhesive cured at room temperature |
| CN102676096A (en) * | 2012-05-23 | 2012-09-19 | 江苏省东泰精细化工有限责任公司 | Preparation method of organosilicon conductive adhesive containing nanorod-shaped zinc oxide |
| CN105828535A (en) * | 2016-05-20 | 2016-08-03 | 苏州经贸职业技术学院 | Circuit board welding heating machine with temperature control circuit |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108899351A (en) * | 2018-07-13 | 2018-11-27 | 京东方科技集团股份有限公司 | A kind of display panel and display device |
| CN108899351B (en) * | 2018-07-13 | 2021-03-26 | 京东方科技集团股份有限公司 | Display panel and display device |
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