CN107479274A - The bonding method and display device of display panel and external circuitses - Google Patents
The bonding method and display device of display panel and external circuitses Download PDFInfo
- Publication number
- CN107479274A CN107479274A CN201710563161.5A CN201710563161A CN107479274A CN 107479274 A CN107479274 A CN 107479274A CN 201710563161 A CN201710563161 A CN 201710563161A CN 107479274 A CN107479274 A CN 107479274A
- Authority
- CN
- China
- Prior art keywords
- electrode
- substrate
- display panel
- external
- external circuitses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The present invention provides a kind of bonding method and display device of display panel and external circuitses.This method makes the conducting particles in the electrode of substrate and anisotropy conductiving glue of display panel by using the material including ferromagnetic material, and magnetization treatment is carried out to the electrode of substrate, so that electrode of substrate has magnetic, so that after the anisotropy conductiving glue is coated on the display panel, conducting particles is by magnetic absorption to electrode of substrate, and then the conducting particles in adjacent electrode of substrate gap is reduced, the utilization rate of conducting particles is lifted, avoids adjacent electrode short-circuit.
Description
Technical field
The present invention relates to the bonding method and display of display technology field, more particularly to a kind of display panel and external circuitses
Device.
Background technology
Flat display apparatus has many merits such as thin fuselage, power saving, radiationless, is widely used.It is existing
Flat panel display device mainly includes liquid crystal display device (Liquid Crystal Display, LCD) and Organic Light Emitting Diode
Display device (Organic Light Emitting Display, OLED).
Existing flat display apparatus generally comprises display panel (Panel) and external circuitses, and display panel is normally showing
When showing, it is necessary to using external circuitses, such as flexible PCB (Free Pascal Compiler, FPC) or chip on film
(Chip On Film, COF), the outer pin that panel is connected to by lead are bonded (Outer Lead Bonding, OLB) area
Domain, realize and drive signal is transmitted to each signal wire in display panel.And the OLB regions of external circuitses and display panel are electrically connected
Connecing is completed by bonding (Bonding) technique, bonding process mainly on press equipment by external circuitses by precompressed,
This pressure is connected on display panel, and the electrode wires on the external electrode and display panel on external circuitses are pressed to together, in
Between pass through anisotropic conducting resinl (Anisotropic Conductive Film, ACF) realize conducting.
Fig. 1 and Fig. 2 are referred to, anisotropy conductiving glue has the characteristic of vertical conducting and lateral isolation, and the ACF leads to
Often include：Insulating cement 120 and the conducting particles 110 being filled in insulating cement 120, the material of wherein conducting particles 110 are usual
For conductive metallic material, main function is the electrode of substrate 210 and external circuitses to electrically conduct on corresponding display panel 200
External electrode 310 on 300, the material of insulating cement 120 is usually resin, and main function is by external circuitses 300 and display surface
Plate 200 is bonded together, and during bonding, will first be aligned in external circuitses 300 and display panel 200, is then pressed described outer
Connect circuit 300 and display panel 200 so that external electrode 310 on external circuitses 300 by the conducting particles 110 in ACF with
Electrode of substrate 210 on display panel 200 electrically conducts, and preferable bonding result is as shown in figure 1, conducting particles 110 is abundant
Utilize, be filled only between corresponding electrode of substrate 210 and external electrode 310, adjacent electrode of substrate 210 and external electrode
Insulating cement 120 is only filled between 310, electrode of substrate 210 and external electrode 310 turn in vertical direction, in lateral isolation.
But for the filling capacity of reinforced insulation glue 120 during crimping, it will usually ACF is heated, as shown in Fig. 2 heat tracing
The flowing of insulating cement 120 can make conducting particles 110 be squeezed into adjacent substrate electrode 210 and/or adjacent external electrode caused by pressure
In space between 310, make adjacent electrode of substrate 210 and/or external electrode 310 that horizontal conducting occur, cause short circuit.
The content of the invention
It is an object of the invention to provide the bonding method of a kind of display panel and external circuitses, can lift conducting particles
Utilization rate, reduce the conducting particles in electrode gap, avoid horizontal conducting, prevent that adjacent electrode is short-circuit.
The present invention also aims to provide a kind of display device, the utilization rate of conducting particles can be lifted, reduces electrode
Conducting particles in space, horizontal conducting is avoided, prevent that adjacent electrode is short-circuit.
To achieve the above object, the invention provides the bonding method of a kind of display panel and external circuitses, including it is as follows
Step：
Step S1, display panel is provided, the display panel has multiple electrode of substrate being sequentially arranged at intervals, the base
The material of plate electrode includes ferromagnetic material；
Step S2, the electrode of substrate is magnetized so that the electrode of substrate obtains magnetic；
Step S3, anisotropy conductiving glue is provided, the anisotropy conductiving glue includes：Insulating cement and it is scattered in institute
Multiple conducting particles in insulating cement are stated, the material of the conducting particles includes ferromagnetic material；
Step S4, anisotropy conductiving glue, the conduction are coated in the region that the display panel is provided with electrode of substrate
Particle absorption is on electrode of substrate；
Step S5, external circuitses are provided, the external circuitses have multiple external electrodes corresponding with electrode of substrate, by institute
State external circuitses to press with display panel contraposition so that the conducting particles on each electrode of substrate is corresponding with each electrode of substrate
External electrode contacts.
The material of the electrode of substrate and conducting particles includes one or more alloys in iron, cobalt and nickel.
The material of the insulating cement is insulating resin.
The external circuitses are flexible PCB or chip on film.
The external circuitses are being pressed with before display panel, also being preheated to the external circuitses in the step S5.
The step S1 is specifically included：
Step S11, one underlay substrate is provided, an electrode of substrate film, the substrate electricity are deposited on the underlay substrate
The material of very thin films is ferrimagnet；
Step S12, photoresistance is coated with electrode of substrate film, the photoresistance is exposed and developed, in the photoresistance
Upper formation electrode of substrate pattern；
Step S13, using the photoresistance to block, the electrode of substrate film is etched, obtains multiple being spaced successively
The electrode of substrate of arrangement；
Step S14, the photoresistance is peeled off, obtains display panel.
The present invention also provides a kind of display device, including：The display panel and external circuitses that are oppositely arranged and electrically connect
Connect the anisotropy conductiving glue of the display panel and external circuitses；
The anisotropy conductiving glue includes：Insulating cement and the multiple conducting particles being scattered in the insulating cement；
The display panel has multiple electrode of substrate being sequentially arranged at intervals, the external circuitses have it is multiple successively between
Every the external electrode of arrangement, the multiple electrode of substrate passes through the conduction in anisotropy conductiving glue with the multiple external electrode
Particle, which corresponds, to be electrically connected with；
The material of the conducting particles and the electrode of substrate includes ferromagnetic material and the electrode of substrate has magnetic
Property.
The material of the electrode of substrate and conducting particles includes one or more alloys in iron, cobalt and nickel.
The material of the insulating cement is insulating resin.
The external circuitses are flexible PCB or chip on film.
Beneficial effects of the present invention：The present invention provides a kind of bonding method of display panel and external circuitses, by using
Material including ferromagnetic material makes the conducting particles in the electrode of substrate and anisotropy conductiving glue of display panel, and to institute
State electrode of substrate and carry out magnetization treatment so that electrode of substrate has magnetic, so that the anisotropy conductiving glue is coated to
After on the display panel, conducting particles is reduced in adjacent electrode of substrate gap by magnetic absorption to electrode of substrate
Conducting particles, lift the utilization rate of conducting particles, avoid adjacent electrode short-circuit.The present invention also provides a kind of display device, energy
The utilization rate of conducting particles is enough lifted, avoids adjacent electrode short-circuit.
Brief description of the drawings
In order to be further understood that the feature of the present invention and technology contents, refer to below in connection with the detailed of the present invention
Illustrate and accompanying drawing, however accompanying drawing only provide with reference to and explanation use, be not used for being any limitation as the present invention.
In accompanying drawing,
Fig. 1 and Fig. 2 is the bonding structural representation of existing display panel and external circuitses；
Fig. 3 be the present invention display panel and external circuitses bonding method step S11 schematic diagram；
Fig. 4 and Fig. 5 be the present invention display panel and external circuitses bonding method step S12 schematic diagram；
Fig. 6 be the present invention display panel and external circuitses bonding method step S13 schematic diagram；
Fig. 7 be the present invention display panel and external circuitses bonding method step S14 schematic diagram；
Fig. 8 be the present invention display panel and external circuitses bonding method step S2 schematic diagram；
Fig. 9 be the present invention display panel and external circuitses bonding method step S3 to step S5 schematic diagram；
Figure 10 be the present invention display panel and external circuitses bonding method flow chart.
Embodiment
Further to illustrate the technological means and its effect of the invention taken, below in conjunction with being preferable to carry out for the present invention
Example and its accompanying drawing are described in detail.
Referring to Fig. 10, the present invention provides a kind of bonding method of display panel and external circuitses, comprise the following steps：
Step S1, display panel 20 is provided, the display panel 20 has multiple electrode of substrate 21 being sequentially arranged at intervals,
The material of the electrode of substrate 21 includes ferromagnetic material.
Specifically, the step S1 is specifically included：Step S11, referring to Fig. 3, a underlay substrate 22 is provided, in the lining
An electrode of substrate film 21 ' is deposited on substrate 22, the material of the electrode of substrate film 21 ' is ferrimagnet；Step
S12, Fig. 4 and Fig. 5 are referred to, photoresistance 23 are coated with electrode of substrate film 21 ', the photoresistance 23 is exposed and developed,
Electrode of substrate pattern is formed on the photoresistance 23；Step S13, referring to Fig. 6, with the photoresistance 23 to block, to the base
Plate electrode film 21 ' is etched, and obtains multiple electrode of substrate 21 being sequentially arranged at intervals；Step S14, referring to Fig. 7, peeling off
The photoresistance 23, obtains display panel 20.
Further, the underlay substrate 22 includes：Viewing area and the outer pin conformable region for surrounding the viewing area,
The multiple electrode of substrate 21 is provided with drive circuit, the multiple base in the outer pin conformable region in the viewing area
Plate electrode 21 is electrically connected with the drive circuit.
Preferably, the material of electrode of substrate 21 is one or more conjunctions in iron (Fe), cobalt (Co) and nickel (Ni)
Gold.
Step S2, referring to Fig. 8, magnetizing the electrode of substrate 21 so that the electrode of substrate 21 obtains magnetic.
Specifically, the electrode of substrate 21 is magnetized using high-intensity magnetic field in the step S2.
Step S3, referring to Fig. 9, providing anisotropy conductiving glue 10, the anisotropy conductiving glue 10 includes：Insulating cement
11 and multiple conducting particles 12 for being scattered in the insulating cement 11, the material of the conducting particles 12 is ferrimagnet.
Preferably, the material of the insulating cement 11 is insulating resin, and the material of conducting particles 12 is in iron, cobalt and nickel
One or more alloys, and then the conducting particles 12 can be magnetized after electrode of substrate 21 attract.
Step S4, referring to Fig. 9, being provided with region namely the outer pin patch of electrode of substrate 21 in the display panel 20
Close and anisotropy conductiving glue 10 is coated in area, the conducting particles 12 is adsorbed onto on electrode of substrate 21.
Step S5, referring to Fig. 9, providing external circuitses 30, it is multiple right with electrode of substrate 21 that the external circuitses 30 have
The external electrode 31 answered, the external circuitses 30 and display panel 20 are aligned into pressing so that leading on each electrode of substrate 21
Charged particle 12 contacts with external electrode 31 corresponding to each electrode of substrate 21.
Specifically, in the step S5 before the external circuitses 30 and display panel 20 are pressed, also to the external electricity
Road 30 is preheated.
Further, insulating cement 11 described in ultraviolet light are passed through in the step S5 so that the insulating cement 11 solidifies
The external circuitses 30 are fixedly attached on the display panel 20.
Alternatively, the external circuitses 30 can be flexible PCB or chip on film.
It should be noted that the present invention makes electrode of substrate 21 and conductive particle by using the material including ferromagnetic material
Son 12, and magnetization treatment is carried out to the electrode of substrate 21 so that electrode of substrate 21 has magnetic so that the anisotropy is led
After electric glue 10 is coated on the display panel 20, conducting particles 12 reduces phase by magnetic absorption to electrode of substrate 21
Conducting particles 12 in the adjacent gap of electrode of substrate 21, the utilization rate of conducting particles 12 is lifted, avoid adjacent electrode short-circuit.
Referring to Fig. 9, the present invention also provides a kind of display device, including：The display panel 20 and external electricity being oppositely arranged
Road 30 and the anisotropy conductiving glue 10 for being electrically connected with the display panel 20 and external circuitses 30；
The anisotropy conductiving glue 10 includes：Insulating cement 11 and the multiple conductions being scattered in the insulating cement 11
Particle 12；
The display panel 20 has multiple electrode of substrate 21 being sequentially arranged at intervals, and the external circuitses 30 have multiple
The external electrode 31 being sequentially arranged at intervals, the multiple electrode of substrate 21 are led with the multiple external electrode 31 by anisotropy
Conducting particles 12 in electric glue 10, which corresponds, to be electrically connected with；
The material of the conducting particles 12 and the electrode of substrate 21 includes ferromagnetic material and the electrode of substrate 21
With magnetic.
Preferably, the material of the electrode of substrate 21 and conducting particles 12 is one or more conjunctions in iron, cobalt and nickel
Gold.
Specifically, the electrode of substrate 21 obtains magnetic by magnetization treatment, is specially completed in electrode of substrate 21
Afterwards, the electrode of substrate 21 is magnetized using high-intensity magnetic field so that electrode of substrate 21 has magnetic.
Specifically, the material of the insulating cement 11 is insulating resin, by the display panel after the solidification of insulating cement 11
20 and the external circuitses 30 be fixedly attached together.
Alternatively, the external circuitses 30 can be flexible PCB or chip on film.
It should be noted that because electrode of substrate 21 has magnetic in above-mentioned display device, and the conducting particles 12
Material includes ferromagnetic material again, and the electrode of substrate 21 can attract the conducting particles 12, reduce adjacent electrode of substrate
Conducting particles 12 in 21 gaps, the utilization rate of conducting particles 12 is lifted, avoid adjacent electrode short-circuit.
In summary, the present invention provides a kind of bonding method of display panel and external circuitses, by using including ferromagnetic
Property material material make display panel electrode of substrate and anisotropy conductiving glue in conducting particles, and to the substrate electricity
Pole carries out magnetization treatment so that electrode of substrate has magnetic, so that the anisotropy conductiving glue is coated to the display
After on panel, conducting particles reduces the conductive particle in adjacent electrode of substrate gap by magnetic absorption to electrode of substrate
Son, the utilization rate of conducting particles is lifted, avoid adjacent electrode short-circuit.The present invention also provides a kind of display device, can be lifted and led
The utilization rate of charged particle, avoid adjacent electrode short-circuit.
It is described above, for the person of ordinary skill of the art, can be with technique according to the invention scheme and technology
Other various corresponding changes and deformation are made in design, and all these changes and deformation should all belong to the claims in the present invention
Protection domain.
Claims (10)
1. the bonding method of a kind of display panel and external circuitses, it is characterised in that comprise the following steps：
Step S1, display panel (20) is provided, the display panel (20) has multiple electrode of substrate being sequentially arranged at intervals
(21), the material of the electrode of substrate (21) includes ferromagnetic material；
Step S2, the electrode of substrate (21) is magnetized so that the electrode of substrate (21) obtains magnetic；
Step S3, anisotropy conductiving glue (10) is provided, the anisotropy conductiving glue (10) includes：Insulating cement (11) and
The multiple conducting particles (12) being scattered in the insulating cement (11), the material of the conducting particles (12) include ferromagnetism thing
Matter；
Step S4, anisotropy conductiving glue (10) is coated in the region that the display panel (20) is provided with electrode of substrate (21),
Conducting particles (12) magnetic absorption is on electrode of substrate (21)；
Step S5, external circuitses (30) are provided, the external circuitses (30) have multiple corresponding external with electrode of substrate (21)
Electrode (31), the external circuitses (30) and display panel (20) contraposition are pressed so that leading on each electrode of substrate (21)
Charged particle (12) contacts with external electrode (31) corresponding to each electrode of substrate (21).
2. the bonding method of display panel as claimed in claim 1 and external circuitses, it is characterised in that the electrode of substrate
(21) and conducting particles (12) material include iron, cobalt and nickel in one or more alloys.
3. the bonding method of display panel as claimed in claim 1 and external circuitses, it is characterised in that the insulating cement (11)
Material be insulating resin.
4. the bonding method of display panel as claimed in claim 1 and external circuitses, it is characterised in that the external circuitses
(30) it is flexible PCB or chip on film.
5. the bonding method of display panel as claimed in claim 1 and external circuitses, it is characterised in that in the step S5
Before carrying out contraposition pressing to the external circuitses (30) and display panel (20), also the external circuitses (30) are preheated.
6. the bonding method of display panel as claimed in claim 1 and external circuitses, it is characterised in that the step S1 is specific
Including：
One underlay substrate (22) step S11, is provided, an electrode of substrate film (21 '), institute are deposited on the underlay substrate (22)
Stating the material of electrode of substrate film (21 ') includes ferromagnetic material；
Step S12, photoresistance (23) is coated with electrode of substrate film (21 '), the photoresistance (23) is exposed and developed,
Electrode of substrate pattern is formed on the photoresistance (23)；
Step S13, the electrode of substrate film (21 ') is etched with the photoresistance (23) to block, obtain it is multiple successively
Spaced electrode of substrate (21)；
Step S14, the photoresistance (23) is peeled off, obtains display panel (20).
A kind of 7. display device, it is characterised in that including：Relative setting display panel (20) and external circuitses (30) and
Connect the anisotropy conductiving glue (10) of the display panel (20) and external circuitses (30)；
The anisotropy conductiving glue (10) includes：Insulating cement (11) and be scattered in the insulating cement (11) multiple lead
Charged particle (12)；
The display panel (20) has multiple electrode of substrate (21) being sequentially arranged at intervals, and the external circuitses (30) have more
The individual external electrode (31) being sequentially arranged at intervals, the multiple electrode of substrate (21) is with the multiple external electrode (31) by each
Conducting particles (12) in anisotropy conducting resinl (10), which corresponds, to be electrically connected with；
The material of the conducting particles (12) and the electrode of substrate (21) includes ferromagnetic material and the electrode of substrate
(21) there is magnetic.
8. display device as claimed in claim 7, it is characterised in that the material of the electrode of substrate (21) and conducting particles (12)
Material includes one or more alloys in iron, cobalt and nickel.
9. display device as claimed in claim 7, it is characterised in that the material of the insulating cement (11) is insulating resin.
10. display device as claimed in claim 7, it is characterised in that the external circuitses (30) are flexible PCB or covered
Brilliant film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710563161.5A CN107479274A (en) | 2017-07-11 | 2017-07-11 | The bonding method and display device of display panel and external circuitses |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710563161.5A CN107479274A (en) | 2017-07-11 | 2017-07-11 | The bonding method and display device of display panel and external circuitses |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107479274A true CN107479274A (en) | 2017-12-15 |
Family
ID=60596587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710563161.5A Pending CN107479274A (en) | 2017-07-11 | 2017-07-11 | The bonding method and display device of display panel and external circuitses |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107479274A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108878678A (en) * | 2018-06-14 | 2018-11-23 | 武汉华星光电半导体显示技术有限公司 | Conductive adhesive structure production method, conductive adhesive structure and display panel assembly |
| CN109817098A (en) * | 2019-02-11 | 2019-05-28 | 京东方科技集团股份有限公司 | Display panel, the preparation method of display panel, display device |
| CN110277025A (en) * | 2019-06-28 | 2019-09-24 | 云谷（固安）科技有限公司 | A kind of display device and preparation method thereof |
| CN110544434A (en) * | 2019-09-04 | 2019-12-06 | 云谷（固安）科技有限公司 | display panel, manufacturing method thereof and display device |
| CN110967878A (en) * | 2019-10-22 | 2020-04-07 | 武汉华星光电技术有限公司 | Narrow-frame liquid crystal display panel and manufacturing method thereof |
| CN111312761A (en) * | 2020-02-17 | 2020-06-19 | 京东方科技集团股份有限公司 | Manufacturing method of OLED panel and substrate for manufacturing OLED panel |
| CN112698523A (en) * | 2019-10-07 | 2021-04-23 | 三星显示有限公司 | Method of manufacturing display module |
| CN113534511A (en) * | 2021-07-30 | 2021-10-22 | Tcl华星光电技术有限公司 | Binding structure, manufacturing method thereof and display device |
| CN114585251A (en) * | 2022-02-16 | 2022-06-03 | 深圳市华星光电半导体显示技术有限公司 | Binding device and binding method |
| CN114882790A (en) * | 2022-04-24 | 2022-08-09 | 绵阳惠科光电科技有限公司 | Anisotropic conductive adhesive and display device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0669643A (en) * | 1992-08-19 | 1994-03-11 | Sony Corp | Connecting method and connector of conductor and anisotropic conductive film for use therein |
| CN1496597A (en) * | 2001-02-09 | 2004-05-12 | Jsr��ʽ���� | Anisotropic conductive connector, its mfg. method and probe member |
| JP2004281933A (en) * | 2003-03-18 | 2004-10-07 | Chi Mei Electronics Corp | Method for mounting driver using hysteresis loss, substrate, and anisotropic conductive film |
| CN1989664A (en) * | 2004-07-23 | 2007-06-27 | Jsr株式会社 | Anisotropic conductive connector and production method therefor, adaptor device and electric inspection device for circuit device |
| JP2011160012A (en) * | 2011-05-27 | 2011-08-18 | Sony Chemical & Information Device Corp | Connection method, connection structure, and method of manufacturing the same |
| US20120106111A1 (en) * | 2010-10-31 | 2012-05-03 | Joseph Mazzochette | Anisotropic electrically and thermally conductive adhesive with magnetic nano-particles |
| CN103426499A (en) * | 2012-05-16 | 2013-12-04 | 日立化成株式会社 | Conductive particle, anisotropic conductive adhesive film and connecting structure |
| CN105493204A (en) * | 2015-10-29 | 2016-04-13 | 京东方科技集团股份有限公司 | Anisotropic conductive film, bonding structure, and display panel and preparation method thereof |
| CN105845204A (en) * | 2016-04-12 | 2016-08-10 | 京东方科技集团股份有限公司 | Method using anisotropic conductive adhesives to bond display, substrate and external circuit |
-
2017
- 2017-07-11 CN CN201710563161.5A patent/CN107479274A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0669643A (en) * | 1992-08-19 | 1994-03-11 | Sony Corp | Connecting method and connector of conductor and anisotropic conductive film for use therein |
| CN1496597A (en) * | 2001-02-09 | 2004-05-12 | Jsr��ʽ���� | Anisotropic conductive connector, its mfg. method and probe member |
| CN1246932C (en) * | 2001-02-09 | 2006-03-22 | Jsr株式会社 | Anisotropic conductive connector, its mfg. method and probe member |
| JP2004281933A (en) * | 2003-03-18 | 2004-10-07 | Chi Mei Electronics Corp | Method for mounting driver using hysteresis loss, substrate, and anisotropic conductive film |
| CN1989664A (en) * | 2004-07-23 | 2007-06-27 | Jsr株式会社 | Anisotropic conductive connector and production method therefor, adaptor device and electric inspection device for circuit device |
| US20120106111A1 (en) * | 2010-10-31 | 2012-05-03 | Joseph Mazzochette | Anisotropic electrically and thermally conductive adhesive with magnetic nano-particles |
| JP2011160012A (en) * | 2011-05-27 | 2011-08-18 | Sony Chemical & Information Device Corp | Connection method, connection structure, and method of manufacturing the same |
| CN103426499A (en) * | 2012-05-16 | 2013-12-04 | 日立化成株式会社 | Conductive particle, anisotropic conductive adhesive film and connecting structure |
| CN105493204A (en) * | 2015-10-29 | 2016-04-13 | 京东方科技集团股份有限公司 | Anisotropic conductive film, bonding structure, and display panel and preparation method thereof |
| CN105845204A (en) * | 2016-04-12 | 2016-08-10 | 京东方科技集团股份有限公司 | Method using anisotropic conductive adhesives to bond display, substrate and external circuit |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108878678A (en) * | 2018-06-14 | 2018-11-23 | 武汉华星光电半导体显示技术有限公司 | Conductive adhesive structure production method, conductive adhesive structure and display panel assembly |
| CN109817098A (en) * | 2019-02-11 | 2019-05-28 | 京东方科技集团股份有限公司 | Display panel, the preparation method of display panel, display device |
| CN110277025A (en) * | 2019-06-28 | 2019-09-24 | 云谷（固安）科技有限公司 | A kind of display device and preparation method thereof |
| CN110277025B (en) * | 2019-06-28 | 2021-07-23 | 云谷（固安）科技有限公司 | Display device and preparation method thereof |
| CN110544434A (en) * | 2019-09-04 | 2019-12-06 | 云谷（固安）科技有限公司 | display panel, manufacturing method thereof and display device |
| CN112698523A (en) * | 2019-10-07 | 2021-04-23 | 三星显示有限公司 | Method of manufacturing display module |
| CN110967878A (en) * | 2019-10-22 | 2020-04-07 | 武汉华星光电技术有限公司 | Narrow-frame liquid crystal display panel and manufacturing method thereof |
| CN111312761A (en) * | 2020-02-17 | 2020-06-19 | 京东方科技集团股份有限公司 | Manufacturing method of OLED panel and substrate for manufacturing OLED panel |
| CN113534511A (en) * | 2021-07-30 | 2021-10-22 | Tcl华星光电技术有限公司 | Binding structure, manufacturing method thereof and display device |
| CN113534511B (en) * | 2021-07-30 | 2024-02-06 | Tcl华星光电技术有限公司 | Binding structure, manufacturing method thereof and display device |
| CN114585251A (en) * | 2022-02-16 | 2022-06-03 | 深圳市华星光电半导体显示技术有限公司 | Binding device and binding method |
| CN114882790A (en) * | 2022-04-24 | 2022-08-09 | 绵阳惠科光电科技有限公司 | Anisotropic conductive adhesive and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107479274A (en) | The bonding method and display device of display panel and external circuitses | |
| CN106405892B (en) | The crimping structure and compression bonding method of panel display apparatus | |
| CN107093606B (en) | A kind of production method of display panel, display device and display panel | |
| CN107482041A (en) | Flexible display panels and flexible display apparatus | |
| CN108666286B (en) | A kind of production method of display panel, display device and display panel | |
| CN106973520A (en) | A kind of preparation method of display panel, display device and display panel | |
| CN108493154A (en) | The production method and Micro LED display panels of Micro LED display panels | |
| KR20120101627A (en) | Connecting solar cell tabs to a solar cell busbar and a solar cell so produced | |
| JP2009010204A (en) | Light emitting device | |
| CN110416264A (en) | The binding method and display device of display device | |
| CN103413775A (en) | Manufacturing method and device of flexible display device | |
| TWI323901B (en) | Anisotropic conductive material | |
| CN105161630B (en) | A kind of organic electroluminescence device and preparation method thereof | |
| CN109065692A (en) | A kind of packaging method of LED | |
| CN107664886A (en) | Antistatic display device | |
| CN105870159A (en) | Organic light-emitting diode display panel, display device and manufacturing method | |
| CN203433761U (en) | Light-emitting diode (LED) light-emitting display board | |
| CN103904096A (en) | Double-face OLED display panel and manufacturing method | |
| CN106318244A (en) | Nuclear layer technology anisotropic conductive film | |
| CN103680317A (en) | Array substrate, manufacturing method thereof and displaying device | |
| CN107615153A (en) | Liquid crystal display panel | |
| CN209328538U (en) | Anisotropic conductive film structure | |
| US20130242244A1 (en) | Methods and apparatus for electrically connecting a substrate and electrically conductive glass | |
| CN203433760U (en) | Flexible LED (light-emitting diode) display panel | |
| CN1719571A (en) | Method for mfg. plasma display |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171215 |