CN109065692A - A kind of packaging method of LED - Google Patents
A kind of packaging method of LED Download PDFInfo
- Publication number
- CN109065692A CN109065692A CN201810859640.6A CN201810859640A CN109065692A CN 109065692 A CN109065692 A CN 109065692A CN 201810859640 A CN201810859640 A CN 201810859640A CN 109065692 A CN109065692 A CN 109065692A
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- led chip
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- package substrate
- led
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
The present invention provides the packaging method of LED a kind of, and the opposite electroconductive magnetic layer of magnetic pole is respectively set in the P electrode and N electrode of LED chip, and the encapsulation unit of package substrate is correspondingly arranged positioning magnetic group；When packaged, LED chip is directly transferred on package substrate in batches, so that the P electrode of LED chip and N electrode is attracted positioning by the first magnetic suction needle of positioning magnetic group and the second magnetic suction needle respectively subsequently through the mode of vibration, and then be electrically connected on the different metal electrode of encapsulation unit, is formed and be accurately positioned, realize the flood tide transfer of miniLED, subsequent be fixed on again by conventional sealing mode completes to encapsulate on package substrate, easy to operate, high-efficient, and LED chip will not be damaged, improve yield.Using this method, can abandon completely in the prior art in such a way that the suction nozzle absorption LED chip of bonder carries out accurate die bond, thus the case where avoiding the leakage of LED chip from grabbing or damage LED chip.
Description
Technical field
The present invention relates to LED packaging technology fields, and in particular to can be suitable for the one of the flood tide transfer encapsulation of miniLED
The packaging method of kind LED improves encapsulation yield and efficiency to realize.
Background technique
MiniLED is the concept technology occurred recently, also known as " secondary millimeter light emitting diode ", it is intended that crystallite dimension is about
In 100-200 microns of LED.MiniLED be between traditional LED and MicroLED (LED miniatureization and matrixing technology),
In simple terms or the improvement version on the basis of traditional LED backlight.
MiniLED is exactly that LED (light emitting diode) backlight is carried out filming, microminiaturization, array in simple terms,
LED unit can be allowed at 100-200 microns, can be realized the independent addressing of each pixel as OLED, luminous (oneself is operated alone
It shines).Its advantage is the features such as both inheriting the high efficiency of inorganic LED, high brightness, fast high-reliability and reaction time,
The characteristic of backlight is not necessarily to self-luminous again, it is small in size, frivolous, moreover it is possible to realize energy-efficient effect easily.
The size of MiniLED is minimum, draws LED chip with suction nozzle in wafer region using conventional packaging method and is transferred to
Die bond is carried out on specified circuit, the operating time is longer, the bad control of absorption dynamics of suction nozzle, be easy to cause LED chip leakage grab or
Situations such as person damages.Therefore its maximum problem, which is just well-known flood tide and shifts, (needs nearly ten thousand on such as 10 cun of panel
LED chip), this is resulted in, and miniLED cost of manufacture is high, yield is low, low efficiency, and technical threshold high in this way allows multiple commercial vendors to hope
And step back.
Summary of the invention
For this purpose, the present invention be got rid of using a kind of packaging method for the LED that can be encapsulated suitable for the flood tide transfer of miniLED
It abandons conventionally employed suction nozzle and draws the mode that LED chip carries out die bond, the case where being grabbed to avoid leakage or damage LED chip, realize
Improve encapsulation yield and efficiency.
To achieve the above object, the technical solution used in the present invention is as follows:
A kind of packaging method of LED, includes the following steps:
A1 provides LED chip, the first electroconductive magnetic layer is arranged in the P electrode of LED chip, in the N electrode of LED chip
The upper setting second electroconductive magnetic layer opposite with the magnetic pole of the first electroconductive magnetic layer；
A2, provides package substrate and positioning magnetic group, the package substrate are equipped with the encapsulation unit of array, the positioning
Magnetic group can be removed the back side for being set to package substrate and correspond encapsulation unit, and the positioning magnetic group includes that magnetic pole is opposite
The first magnetic suction needle and the second magnetic suction needle, the first magnetic suction needle and the second magnetic suction needle respectively correspond the different metal electricity of encapsulation unit
Pole；
LED chip batch is transferred on package substrate by A3；
A4 provides a vibration device and acts on the LED chip on package substrate and package substrate, and LED chip is vibrating
In the process, P electrode and N electrode are attracted positioning by the first magnetic suction needle of positioning magnetic group and the second magnetic suction needle respectively, and then respectively
It is electrically connected on the different metal electrode of encapsulation unit；
The LED chip positioned is fixed on package substrate by A5；
A6 removes positioning magnetic group, completes encapsulation.
Further, in step A1, the first electroconductive magnetic layer and the second electroconductive magnetic layer are layer of iron-nickel alloy.
Further, in step A1, the first electroconductive magnetic layer and the second electroconductive magnetic layer it is micro- with a thickness of 0.6-0.8
Rice.
Further, in step A2, the first magnetic suction needle and the second magnetic suction needle of the positioning magnetic group include: pilot pin
And it is sheathed on the spiral winding in pilot pin, the spiral winding electric connection of power supply, by the electric current side for changing spiral winding
Always change the magnetic pole of pilot pin.
Further, the material of the pilot pin is silicon steel.
Further, between step A2 and step A3, further includes:
Step A21 is laid with a weldering adhesive film in the surface of metal electrode of encapsulation unit；
In step A4, the P electrode and N electrode of LED chip is electrically connected the different metal electrode in encapsulation unit
It welds on adhesive film, and then is electrically connected on the different metal electrode of encapsulation unit；
In step A5, the LED chip positioned is fixed on package substrate, specifically: it is heated to melting weldering glue film
Layer, which is formed, flows gelatinous weldering glue, then solidifies weldering glue, and the weldering glue after solidification is fixedly connected between metal electrode and P electrode or gold
Belong between electrode and N electrode.
Further, the weldering adhesive film is tin cream film layer or elargol film layer.
Further, further include step A7, demagnetization is carried out to LED chip.
The technical solution provided through the invention, has the following beneficial effects:
The opposite electroconductive magnetic layer of magnetic pole, the encapsulation of package substrate are respectively set in the P electrode and N electrode of LED chip
Unit is correspondingly arranged positioning magnetic group；When packaged, LED chip is directly transferred on package substrate in batches, subsequently through vibration
It is fixed that dynamic mode is attracted the P electrode of LED chip and N electrode by the first magnetic suction needle of positioning magnetic group and the second magnetic suction needle respectively
Position, and then be electrically connected on the different metal electrode of encapsulation unit, it is formed and is accurately positioned, realize that the flood tide of miniLED turns
It moves, subsequent be fixed on again by conventional sealing mode completes to encapsulate on package substrate, and it is easy to operate, it is high-efficient, and will not damage
LED chip improves yield.Using this method, can abandon completely in the prior art using bonder suction nozzle draw LED chip into
The mode of the accurate die bond of row, thus the case where avoiding the leakage of LED chip from grabbing or damage LED chip.
Meanwhile magnetic positioning is carried out using removable positioning magnetic group, it is enterprising without the metal electrode in encapsulation unit
Row magnetizes, reusable；Just assembled when needing to encapsulate, prevent the metal electrode of encapsulation unit have for a long time it is magnetic and
Pollutant is adsorbed, causes encapsulation abnormal.
Detailed description of the invention
Fig. 1 show the flow diagram of the packaging method of LED in embodiment；
Fig. 2 show the structural schematic diagram of LED chip in embodiment；
Fig. 3 show the package structure diagram of single package unit in embodiment.
Specific embodiment
To further illustrate that each embodiment, the present invention are provided with attached drawing.These attached drawings are that the invention discloses one of content
Point, mainly to illustrate embodiment, and the associated description of specification can be cooperated to explain the operation principles of embodiment.Cooperation ginseng
These contents are examined, those of ordinary skill in the art will be understood that other possible embodiments and advantages of the present invention.In figure
Component be not necessarily to scale, and similar component symbol is conventionally used to indicate similar component.
Now in conjunction with the drawings and specific embodiments, the present invention is further described.
Referring to figs. 1 to shown in Fig. 3, a kind of packaging method of LED provided in this embodiment includes the following steps:
A1 provides LED chip 10, the first electroconductive magnetic layer 111 is arranged in the P electrode 11 of LED chip 10, in LED core
The second electroconductive magnetic layer 121 opposite with the magnetic pole of the first electroconductive magnetic layer 11 is set in the N electrode 12 of piece 10；Such as the first conduction
The magnetic pole of magnetosphere 111 is the pole N, and the magnetic pole of the second electroconductive magnetic layer 121 is the pole S.
A2, provides package substrate 20 and positioning magnetic group, the package substrate 20 are equipped with the encapsulation unit of array, Fig. 3
In by taking single package unit as an example；The positioning magnetic group can be removed the back side for being set to package substrate 20 and correspond encapsulation
Unit, the positioning magnetic group include opposite the first magnetic suction needle 31 and the second magnetic suction needle 32 of magnetic pole, the first magnetic suction needle 31 and the
Two magnetic suction needles 32 respectively correspond the different metal electrode of encapsulation unit；
If each encapsulation unit includes the positive electrode 211 for connecting positive pole and the negative electrode for connecting power cathode
212；The magnetic pole of first magnetic suction needle 31 of the positioning magnetic group is the positive electrode 211 of the pole S and corresponding encapsulation unit, the second magnetic
The magnetic pole of needle 32 is the negative electrode 212 of the pole N and corresponding encapsulation unit.
10 batch of LED chip is transferred on package substrate 20 by A3；
In this step, 10 batch of LED chip is transferred on package substrate 20, the biggish flexible suction nozzle of an area is such as set
(not shown), such as silica gel suction nozzle, the LED chip 10 on whole piece indigo plant film is sucked in flexible suction nozzle, is detached from LED chip 10, and one
Secondary property is transferred on package substrate 20；Transfer in the step does not need to accomplish accurately to position, so using flexible suction nozzle
It just can satisfy, and LED chip 10 will not be caused to damage using flexible suction nozzle.
A4 provides a vibration device (not shown) and acts on the LED chip 10 on package substrate 20 and package substrate 20,
LED chip 10 is in vibration processes, and P electrode 11 and N electrode 12 are respectively by the first magnetic suction needle 31 of positioning magnetic group and the second magnetic
Suction spindle 32 is attracted positioning, and then is electrically connected on the different metal electrode of encapsulation unit；
Specifically, LED chip will do it displacement in vibration processes, and during displacement, the P electricity with the pole N magnetic pole
Pole 11 is sucked by the first magnetic suction needle 31 of the pole S magnetic pole, and then makes the P electrode 11 of LED chip 10 and the positive electrode 211 of encapsulation unit
Form electrical connection；N electrode 12 with the pole S magnetic pole is sucked by the second magnetic suction needle 32 of the pole N magnetic pole, and then makes the N of LED chip 10
Electrode 12 is electrically connected with the formation of the negative electrode 212 of encapsulation unit.
Of course, in other embodiments, the magnetic pole for being also possible to the first electroconductive magnetic layer 111 is the pole S, the second conductive magnetism
Property layer 121 magnetic pole be the pole N；In this way, the first magnetic suction needle 31 and the magnetic pole of the second magnetic suction needle 32 also mutually exchange, ability at this time
What the technical staff in domain can select easily, no longer it is described in detail.
The LED chip 10 positioned is fixed on package substrate 20 by A5；
A6 removes positioning magnetic group, completes encapsulation.
Using the above method, conductive magnetism that in the P electrode 11 and N electrode 12 of LED chip 10 magnetic pole to be respectively set opposite
Property layer, the encapsulation unit of package substrate 20 be correspondingly arranged positioning magnetic group；When packaged, the directly batch of LED chip 10 is shifted
To package substrate 20, the P electrode 11 and N electrode 12 for making LED chip 10 subsequently through the mode of vibration are respectively by positioning magnetic
The first magnetic suction needle 31 and the second magnetic suction needle 32 of group are attracted positioning, and then are electrically connected the different metal electrode in encapsulation unit
On, it is formed and is accurately positioned, realize the flood tide transfer of miniLED, it is subsequent to be fixed on package substrate by conventional sealing mode again
Encapsulation is completed, it is easy to operate, it is high-efficient, and LED chip 10 will not be damaged, improve yield.Using this method, can abandon completely existing
By the way of thering is the suction nozzle absorption LED chip 10 in technology using bonder to carry out accurate die bond, so that leakage be avoided to grab or damage
The case where LED chip 10.
Meanwhile magnetic positioning is carried out using removable positioning magnetic group, it is enterprising without the metal electrode in encapsulation unit
Row magnetizes, reusable；Just assembled when needing to encapsulate, prevent the metal electrode of encapsulation unit have for a long time it is magnetic and
Pollutant is adsorbed, causes encapsulation abnormal.
Of course, can be incited somebody to action in the method used by the present embodiment disposable operation cannot be accurately controlled in advance
In the case that all encapsulation units can position LED chip on package substrate, remaining LED chip can be filled by subsequent
10 carry out the step of repeating A3 to A4 again, until the step of LED chip 10 carries out A5 and A6 again is all located in all encapsulation units.
Further, in the present embodiment, in step A1, the first electroconductive magnetic layer 111 and the second electroconductive magnetic layer 121
With a thickness of 0.6-0.8 microns.Influence of the thickness to the P electrode 11 of LED chip 10 and the whole height of N electrode 12 is little,
It can guarantee that magnetism reaches suitable size again.Further, the first electroconductive magnetic layer and the second electroconductive magnetic layer are iron nickel
Alloy-layer, in other embodiments, the first electroconductive magnetic layer and the second electroconductive magnetic layer are also possible to that other have can be conductive
It is constituted with the material of magnetic conduction.
Further, in the present embodiment, in step A2, the first magnetic suction needle 31 and the second magnetic suction needle of the positioning magnetic group
32 include: pilot pin (i.e. the pilot pin 321 of the pilot pin 311 of the first magnetic suction needle 31 and the second magnetic suction needle 32 in Fig. 3) and
The spiral winding being sheathed in pilot pin (i.e. the spiral winding 312 that is sheathed in pilot pin 311 in Fig. 3 and is sheathed on positioning
Spiral winding 322 on needle 321), the spiral winding electric connection of power supply is changed by changing the current direction of spiral winding
The magnetic pole of pilot pin.So set, the magnetic pole and magnetism size of the first magnetic suction needle 31 of adjustment and the second magnetic suction needle 32 can be facilitated,
Applicability is wide.Further, the material of the pilot pin is silicon steel, can preferably form magnetic field and demagnetization.
Further, in the present embodiment, ultrasonic vibration apparatus conventional in the prior art, motor is can be used in vibration device
Vibration device etc. shifts on package substrate as long as being able to drive LED chip.
Further, in the present embodiment, between step A2 and step A3, further includes:
Step A21 is laid with a weldering adhesive film 22 in the surface of metal electrode of encapsulation unit；
In step A4, the P electrode 11 and N electrode 12 of LED chip 10 are electrically connected the different metal in encapsulation unit
On the weldering adhesive film 22 of electrode (i.e. positive electrode 211 and negative electrode 212), and then it is electrically connected the different metal in encapsulation unit
On electrode；
In step A5, the LED chip 10 positioned is fixed on package substrate 20, specifically: it is heated to melting weldering
Adhesive film 22, which is formed, flows gelatinous weldering glue, then solidifies weldering glue, and the weldering glue after solidification is fixedly connected on metal electrode and P electrode 11
Between or metal electrode and N electrode 12 between；And then the LED chip 10 positioned is fixed on package substrate, it is equivalent to often
The fixed structure of rule；Using this kind of fixed form, facilitate subsequent coating fluorescent powder.Further, the weldering adhesive film 22 is
Tin cream film layer or elargol film layer in existing packaging technology.In other embodiments, the side that can also be fixed using direct sealing
LED chip is fixed on package substrate by formula.
Further, further include step A7 in the present embodiment, demagnetization is carried out to LED chip 10.Because of the P electricity of LED chip 10
Also there is magnetism on pole 11 and N electrode 12, a magnetic field can be generated therebetween, the presence in the magnetic field is logical in subsequent LED chip 10
When electricity work, certain influence is generated to the flow direction of electric current, prevents electric current from uniformly spreading, causes out light uneven, always go out
Light quantity reduces.Demagnetization is carried out to LED chip 10, high temperature can be used in the present embodiment to eliminate influence of the magnetic field to electric current
Demagnetization, since the curie point of common magnet is spent more than 100, weldering adhesive film 22, which is heated to 200 °, just can all melt, so in reality
The magnetism of chip can be demagnetized by now welding in 22 heating process of adhesive film.Or be demagnetization by other means, it is specific
Demagnetization method be that those skilled in the art grasps already, this will not be detailed here.
Although specifically showing and describing the present invention in conjunction with preferred embodiment, those skilled in the art should be bright
It is white, it is not departing from the spirit and scope of the present invention defined by the appended claims, it in the form and details can be right
The present invention makes a variety of changes, and is protection scope of the present invention.
Claims (8)
1. a kind of packaging method of LED, which comprises the steps of:
A1 provides LED chip, and the first electroconductive magnetic layer is arranged in the P electrode of LED chip, sets in the N electrode of LED chip
Set the second electroconductive magnetic layer opposite with the magnetic pole of the first electroconductive magnetic layer；
A2, provides package substrate and positioning magnetic group, the package substrate are equipped with the encapsulation unit of array, the positioning magnetic
Group, which can be removed, to be set to the back side of package substrate and simultaneously corresponds encapsulation unit, and the positioning magnetic group includes opposite the of magnetic pole
One magnetic suction needle and the second magnetic suction needle, the first magnetic suction needle and the second magnetic suction needle respectively correspond the different metal electrode of encapsulation unit；
LED chip batch is transferred on package substrate by A3；
A4 provides a vibration device and acts on the LED chip on package substrate and package substrate, and LED chip is in vibration processes
In, P electrode and N electrode are attracted positioning by the first magnetic suction needle of positioning magnetic group and the second magnetic suction needle respectively, and then are electrically connected respectively
It is connected on the different metal electrode of encapsulation unit；
The LED chip positioned is fixed on package substrate by A5；
A6 removes positioning magnetic group, completes encapsulation.
2. the packaging method of LED according to claim 1, it is characterised in that: in step A1, the first electroconductive magnetic layer
It is layer of iron-nickel alloy with the second electroconductive magnetic layer.
3. the packaging method of LED according to claim 1 or 2, it is characterised in that: in step A1, first conductive magnetism
Property layer and the second electroconductive magnetic layer with a thickness of 0.6-0.8 microns.
4. the packaging method of LED according to claim 1, it is characterised in that: in step A2, the of the positioning magnetic group
One magnetic suction needle and the second magnetic suction needle include: pilot pin and the spiral winding that is sheathed in pilot pin, the spiral winding electricity
Power supply is connected, changes the magnetic pole of pilot pin by changing the current direction of spiral winding.
5. the packaging method of LED according to claim 4, it is characterised in that: the material of the pilot pin is silicon steel.
6. the packaging method of LED according to claim 1, it is characterised in that: between step A2 and step A3, also wrap
It includes:
Step A21 is laid with a weldering adhesive film in the surface of metal electrode of encapsulation unit；
In step A4, the P electrode and N electrode of LED chip are electrically connected in the weldering glue of the different metal electrode of encapsulation unit
In film layer, and then it is electrically connected on the different metal electrode of encapsulation unit；
In step A5, the LED chip positioned is fixed on package substrate, specifically: it is heated to melting weldering adhesive film shape
At the gelatinous weldering glue of flowing, then weldering glue is solidified, the weldering glue after solidification is fixedly connected between metal electrode and P electrode or metal electricity
Between pole and N electrode.
7. the packaging method of LED according to claim 6, it is characterised in that: the weldering adhesive film is tin cream film layer or silver
Adhesive film.
8. the packaging method of LED according to claim 1, it is characterised in that: further include step A7, carried out to LED chip
Demagnetization.
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| CN201810859640.6A CN109065692A (en) | 2018-08-01 | 2018-08-01 | A kind of packaging method of LED |
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| CN201810859640.6A CN109065692A (en) | 2018-08-01 | 2018-08-01 | A kind of packaging method of LED |
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Application publication date: 20181221 |