WO2021004023A1 - Surface mount and assembly method for small light-emitting diodes of display panel - Google Patents

Surface mount and assembly method for small light-emitting diodes of display panel Download PDF

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Publication number
WO2021004023A1
WO2021004023A1 PCT/CN2019/127820 CN2019127820W WO2021004023A1 WO 2021004023 A1 WO2021004023 A1 WO 2021004023A1 CN 2019127820 W CN2019127820 W CN 2019127820W WO 2021004023 A1 WO2021004023 A1 WO 2021004023A1
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WO
WIPO (PCT)
Prior art keywords
magnetic
emitting diode
assembly
circuit board
light
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Application number
PCT/CN2019/127820
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French (fr)
Chinese (zh)
Inventor
郑净远
尹太勇
Original Assignee
惠州市华星光电技术有限公司
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Publication of WO2021004023A1 publication Critical patent/WO2021004023A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present invention relates to a surface adhesion assembly technology, in particular to a surface adhesion assembly method of a small light emitting diode of a display panel.
  • small light emitting diodes Light Emitting Diode, LED
  • the above-mentioned small LEDs are used as the backlight of the display panel, and the backlight can be thinned, miniaturized, and arrayed.
  • the small LEDs can be smaller than 100 microns, and the organic light emitting LED (Organic LED, OLED) can also achieve individual addressing of each pixel unit and drive light emission separately.
  • OLED Organic LED
  • the biggest advantage of small LED is that it has the characteristics of high efficiency, high brightness, high reliability and fast response time of OLED. It also has the characteristics of self-illumination without backlight, small size, light and thin, and can easily achieve energy-saving effects.
  • mini-LED mini-LED
  • micro-LED micro-LED
  • the LED can only be sucked up by the suction nozzle and placed on the PCB.
  • the display panel has 2 million pixels.
  • the SMT technology cannot quickly fix a large number of small LEDs to the corresponding solder pads of the circuit board, which will cause the small LEDs to be fixed on the circuit board for a long time, and the efficiency is too low, which lengthens the SMT process time and leads to The display panel yield is reduced.
  • the present invention provides a surface-adhesive assembly method for small light-emitting diodes of display panels to solve the problem of the excessively long time and excessive efficiency of fixing the light-emitting diodes to the circuit board in the existing small-sized light-emitting diode surface adhesion technology Low and lead to the problem of low display panel yield.
  • the main purpose of the present invention is to provide a surface adhesion assembly method for small light-emitting diodes of a display panel, including:
  • the providing step includes providing a circuit board assembly, a thin film assembly, and a plurality of magnetic elements, wherein the circuit board assembly includes a printed circuit board, and a plurality of solder pad groups are provided on the top surface of the printed circuit board, each The soldering pad group includes a plurality of soldering pads, tin paste is coated on each of the soldering pads, the thin film component includes a thin film sheet, and a plurality of light emitting diode components are attached to the bottom surface of the thin film sheet, and the multiple Each light-emitting diode assembly corresponds to the plurality of bonding pad groups, each of the light-emitting diode assemblies includes a light-emitting diode, a plurality of welding feet are arranged at the bottom of the light-emitting diode, and the plurality of magnetic elements are arranged on the printed circuit board or On the thin film assembly, the plurality of magnetic elements correspond to the plurality of bonding pad groups, and the plurality of magnetic elements correspond to the plurality
  • the magnetic assembly step includes moving the thin film component against the circuit board component so that each of the magnetic elements magnetically connects the solder pads of the corresponding solder pad groups and the solder feet of the corresponding LED components to each other Adsorbing together, and causing the light-emitting diode assembly to be detached from the film sheet due to magnetic force and adsorbed onto the welding pad group;
  • the soldering step includes heating the circuit board assembly to bring the solder paste to a hot-melt state so that the solder feet of each light-emitting diode assembly adhere to the soldering pads of the corresponding soldering pad group Pad on;
  • the circuit board assembly is cooled to solidify the solder paste.
  • the plurality of magnetic elements are a plurality of magnetic dopants, and the plurality of magnetic dopants are arranged on the printed circuit board and are respectively doped and arranged on the corresponding solder In the solder paste of the pad group.
  • the magnetic assembly step further includes that the plurality of light-emitting diode components are simultaneously detached from the thin film sheet due to magnetic force and are attracted to the plurality of bonding pad groups.
  • the magnetic assembly step further includes that the plurality of light-emitting diode components are detached from the thin film sheet in a batch manner due to magnetic force and are adsorbed onto the plurality of bonding pad groups, wherein each The plurality of light emitting diode components in a batch are simultaneously detached from the thin film sheet due to magnetic force and are adsorbed on the plurality of bonding pad groups in the batch.
  • the magnetic assembly step further includes aligning each of the light-emitting diode components with the corresponding solder pad group, and then moving each of the light-emitting diode components to lean against the corresponding solder pad group , Making the solder paste on each of the solder pad groups attract the solder feet of the corresponding light-emitting diode assembly with the magnetic force of the magnetic dopant.
  • the magnetic dopant includes magnetic powder.
  • the plurality of magnetic elements are arranged on the bottom surface of the printed circuit board and correspond to the plurality of solder pad groups, each of the magnetic elements includes a plurality of magnetic blocks, and the plurality of The magnetic blocks respectively correspond to the multiple solder pads of the corresponding solder pad group.
  • the plurality of magnetic blocks are permanent magnets or non-permanent magnets.
  • the plurality of magnetic blocks are a plurality of soldering positions attached to the bottom surface of the printed circuit board.
  • the plurality of magnetic elements are a plurality of magnetic powders, and each of the magnetic powders is magnetically attached to the plurality of solder feet of the light emitting diode assembly of the thin film assembly. on.
  • the surface adhesion assembly method of the small light-emitting diode of the display panel of the present invention can quickly assemble the multiple bonding pad groups of the circuit board assembly and the multiple light-emitting diode assemblies on the thin-film assembly at the same time through the magnetic element. They are aligned with each other in a second or sequential manner and fixed by magnetic attraction, and the attraction of the magnetic element can make the alignment of the bonding pad group and the light-emitting diode assembly more efficient, reducing the accuracy required for alignment.
  • the present invention uses the simultaneous or batch method to magnetically fix the bonding pad group and the light-emitting diode assembly, a large number of light-emitting diode assemblies can be quickly fixed to the circuit board assembly at the same time, avoiding the existing
  • the technical surface adhesion technology cannot fix a large number of small light-emitting diodes to the circuit board at one time, which causes a technical problem of low efficiency.
  • FIG. 1 is a schematic diagram of the steps of a method for surface adhesion assembly of a small light emitting diode of a display panel of the present invention.
  • FIG. 2 is a schematic side sectional view of the first embodiment of the surface adhesion assembly method of the small light emitting diode of the display panel of the present invention before the magnetic attraction assembly step is implemented.
  • FIG. 3 is a schematic side sectional view of the first embodiment of the surface adhesion assembly method of the small light emitting diode of the display panel of the present invention after the magnetic attraction assembly step is implemented.
  • FIG. 4 is a schematic side sectional view of the second embodiment of the surface adhesion assembly method of the small light emitting diode of the display panel of the present invention before the magnetic attraction assembly step is implemented.
  • FIG. 5 is a schematic side sectional view of the second embodiment of the surface adhesion assembly method of the small light emitting diode of the display panel of the present invention after the magnetic attraction assembly step is implemented.
  • FIG. 6 is a schematic side cross-sectional view of the third embodiment of the surface adhesion assembly method of the small light emitting diode of the display panel of the present invention before the magnetic attraction assembly step is implemented.
  • FIG. 7 is a schematic side sectional view of the third embodiment of the surface adhesion assembly method of the small light emitting diode of the display panel of the present invention after the magnetic attraction assembly step is implemented.
  • the small light-emitting diode 51 (Light
  • the first embodiment of the Emitting Diode (LED) surface mount assembly method is a Surface Mount Technology (SMT) process, and includes: providing step S01, magnetic attraction assembly step S02, welding step S03, and cooling step S04 .
  • SMT Surface Mount Technology
  • the providing step S01 includes providing a circuit board assembly 1, a thin film assembly 2, and a plurality of magnetic elements 60.
  • the circuit board assembly 1 includes a printed circuit board 10, a plurality of solder pad groups 20 are provided on the top surface of the printed circuit board 10, and each of the solder pad groups 20 includes a plurality of solder pads 21.
  • the solder pad 21 is coated with a solder paste 30.
  • the film assembly 2 includes a film sheet 40, and the film sheet 40 may be a blue film.
  • a plurality of light-emitting diode assemblies 50 are attached to the bottom surface of the film sheet 40, and the plurality of light-emitting diode assemblies 50 correspond to the plurality of bonding pad groups 20, and each of the light-emitting diode assemblies 50 includes a light-emitting diode 51, so A plurality of solder pins 52 are provided at the bottom of the light emitting diode 51.
  • the light-emitting diode 51 can be a mini-light-emitting diode (Mini-LED) or a mini-light-emitting diode (Micro-LED).
  • the plurality of magnetic elements 60 are arranged on the printed circuit board 10 or the thin film assembly 2, the plurality of magnetic elements 60 correspond to the plurality of bonding pad groups 20, and the plurality of magnetic elements 60 are paired The plurality of light emitting diode assemblies 50.
  • the magnetic assembly step S02 includes moving the thin film assembly 2 against the circuit board assembly 1, so that each of the magnetic elements 60 magnetically connect the pads of the corresponding pad group 20 21 and the corresponding solder pins 52 of the LED assembly 50 are mutually attracted to each other, and the LED assembly 50 is detached from the film sheet 40 due to magnetic force and is adsorbed onto the bonding pad group 20.
  • the soldering step S03 includes heating the circuit board assembly 1 to bring the solder paste 30 to a hot-melt state so that the solder feet 52 of each light-emitting diode assembly 50 adhere to the corresponding On the solder pad 21 of the solder pad group 20.
  • the soldering step S03 may be one of the soldering furnace steps in the surface adhesion technology process.
  • the circuit board assembly 1 is cooled to solidify the solder paste 30.
  • the plurality of magnetic elements 60 are a plurality of magnetic dopants 60a, and the plurality of magnetic dopants 60a are disposed on the printed circuit board 10 and are respectively doped and disposed on In the solder paste 30 of the corresponding solder pad group 20.
  • the magnetic assembly step S02 further includes that the plurality of light emitting diode assemblies 50 are simultaneously detached from the film sheet 40 due to magnetic force and are adsorbed onto the plurality of bonding pad assemblies 20.
  • the magnetic assembly step S02 further includes that the plurality of light-emitting diode assemblies 50 are detached from the film sheet 40 in batches due to magnetic force and are adsorbed to the plurality of bonding pad groups 20, wherein the plurality of light-emitting diode assemblies 50 in each batch are simultaneously detached from the film sheet 40 due to magnetic force and are adsorbed onto the plurality of bonding pad groups 20 in the batch.
  • the magnetic assembly step S02 further includes that the plurality of light-emitting diode assemblies 50 are sequentially separated from the film sheet 40 due to magnetic force and are attracted to the plurality of bonding pad groups 20 .
  • the magnetic assembly step S02 further includes aligning each of the light-emitting diode components 50 with the corresponding solder pad group 20, and then moving each of the light-emitting diode components 50 to the corresponding The solder pad groups 20 make the solder paste 30 on each of the solder pad groups 20 attract the corresponding solder pins 52 of the light-emitting diode assembly 50 with the magnetic force of the magnetic dopant 60a.
  • the magnetic dopant 60a includes magnetic powder 60c.
  • the second embodiment of the surface adhesion assembly method of the small light emitting diode 51 of the display panel of the present invention also includes the above-mentioned providing step S01, magnetic attraction assembly step S02, welding step S03, and cooling step S04.
  • the plurality of magnetic elements 60 are provided on the bottom surface of the printed circuit board 10 and correspond to the plurality of solder pad groups 20, each The magnetic element 60 includes a plurality of magnetic blocks 60 b, and the plurality of magnetic blocks 60 b respectively correspond to the plurality of bonding pads 21 of the corresponding bonding pad group 20.
  • the plurality of magnetic blocks 60b are permanent magnets or non-permanent magnets.
  • the plurality of magnetic blocks 60b are electromagnets, which have magnetism only when they are energized, and have no magnetic force when they are not energized.
  • electromagnets By energizing all the electromagnets at the same time, in batches, or sequentially, it is possible to realize that the plurality of light-emitting diode assemblies 50 are transferred from the film sheet 40 in a simultaneous manner, a batch manner, or a sequential manner due to the magnetic force.
  • the plurality of magnetic blocks 60b are arranged on the bottom surface of the printed circuit board 10 in batches or sequentially through a jig.
  • the plurality of magnetic blocks 60 b are soldered parts of a plurality of exposed copper (bare copper wires) attached to the bottom surface of the printed circuit board 10.
  • the third embodiment of the surface adhesion assembly method of the small light emitting diode 51 of the display panel of the present invention also includes the above-mentioned providing step S01, magnetic attraction assembly step S02, welding step S03, and cooling step S04.
  • the plurality of magnetic elements 60 are a plurality of magnetic powders 60c, and each of the magnetic powders 60c is magnetically attached to the film assembly 2 On the plurality of solder feet 52 of the aligned LED assembly 50.
  • the surface-adhesive assembly method of the small light-emitting diode 51 of the display panel of the present invention can quickly connect the multiple bonding pad groups 20 of the circuit board assembly 1 and the multiple light-emitting diodes on the thin film assembly 2 through the magnetic element 60.
  • the components 50 are aligned with each other in a simultaneous, batch, or sequential manner and fixed by magnetic attraction, and the attraction of the magnetic element can make the alignment of the bonding pad group 20 and the LED assembly 50 more efficient, reducing the accuracy required for alignment .
  • the present invention uses the simultaneous or batch method to magnetically fix the bonding pad group 20 and the light-emitting diode assembly 50, a large number of light-emitting diode assemblies 50 can be quickly fixed to the circuit board assembly 1 at the same time. This avoids the technical problem of low efficiency caused by the inability of the prior art surface adhesion technology to fix a large number of small light emitting diodes 51 to the circuit board at one time.

Abstract

A surface mount and assembly method for small light-emitting diodes of a display panel, comprising a providing step (S01), a magnetic attraction assembling step (S02), a soldering step (S03), and a cooling step (S04). In the providing step (S01), a circuit board assembly (1), a thin film assembly (2), and a plurality of magnetic elements (60) are provided. In the magnetic attraction assembling step (S02), a plurality of soldering pad groups (20) of the circuit board assembly (1) are fixed on a plurality of light-emitting diodes (51) of the thin film assembly (2) in batches by means of the magnetic elements (60), so that the efficiency of a surface mount technical process is improved.

Description

显示面板的小型发光二极管表面粘着组装方法Surface adhesion assembly method of small light emitting diode of display panel 技术领域Technical field
本发明是有关于一种表面粘着组装技术，特别是有关于一种显示面板的小型发光二极管表面粘着组装方法。The present invention relates to a surface adhesion assembly technology, in particular to a surface adhesion assembly method of a small light emitting diode of a display panel.
背景技术Background technique
随着显示面板的光源技术持续发展，以小型发光二极管(Light Emitting Diode, LED)作为显示面板中的每一像素的发光器件的技术逐渐受到重视。上述小型LED作为显示面板的背光源，可将背光源薄膜化、微小化、阵列化，能够让小型LED小于100微米，与有机发光LED (Organic LED, OLED)一样能够实现每个像素单元单独定址，单独驱动发光。小型LED最大优势在于具有OLED的高效率、高亮度、高可靠度及反应时间快等特点，也具备了自发光无需背光源的特性，体积小、轻薄，能轻易实现节能的功效。With the continuous development of the light source technology of the display panel, the technology of using small light emitting diodes (Light Emitting Diode, LED) as the light emitting device of each pixel in the display panel has gradually attracted attention. The above-mentioned small LEDs are used as the backlight of the display panel, and the backlight can be thinned, miniaturized, and arrayed. The small LEDs can be smaller than 100 microns, and the organic light emitting LED (Organic LED, OLED) can also achieve individual addressing of each pixel unit and drive light emission separately. The biggest advantage of small LED is that it has the characteristics of high efficiency, high brightness, high reliability and fast response time of OLED. It also has the characteristics of self-illumination without backlight, small size, light and thin, and can easily achieve energy-saving effects.
现有采用小型发光二极体作为像素发光器件的技术包括了迷你LED(Mini-LED)以及微型LED(Micro-LED)。上述小型LED技术的LED布局极为缜密，且相邻LED之间的间距极小。Existing technologies that use small light-emitting diodes as pixel light-emitting devices include mini-LEDs (Mini-LED) and micro-LEDs (Micro-LED). The LED layout of the aforementioned small LED technology is extremely meticulous, and the spacing between adjacent LEDs is extremely small.
上述小间距的Mini-LED或 Micro-LED，在以表面粘着技术(Surface Mount Technology, SMT)固定到电路板上时，只能透过吸嘴将LED吸起后摆放至PCB上，然而随着数量愈多则愈耗时。以一个超高画质(Full HD)的显示面板为例，显示面板的像素达到两百万个，在透过现有技术的SMT技术将两百万个小型LED固定到电路板时，因所述SMT技术无法快速地将大量小型LED对位固定到电路板的对应焊垫上，将会导致小型LED固定到电路板上的耗时过久，效率过低，拉长了SMT制程时间，进而导致显示面板产率降低。When the above-mentioned small-pitch Mini-LED or Micro-LED is fixed to the circuit board by Surface Mount Technology (SMT), the LED can only be sucked up by the suction nozzle and placed on the PCB. The greater the number, the more time-consuming. Take a full HD display panel as an example. The display panel has 2 million pixels. When 2 million small LEDs are fixed to the circuit board through the existing SMT technology, the The SMT technology cannot quickly fix a large number of small LEDs to the corresponding solder pads of the circuit board, which will cause the small LEDs to be fixed on the circuit board for a long time, and the efficiency is too low, which lengthens the SMT process time and leads to The display panel yield is reduced.
故，有必要提供一种显示面板的小型发光二极管表面粘着组装方法，以解决现有技术所存在的问题。Therefore, it is necessary to provide a surface adhesion assembly method for small light emitting diodes of display panels to solve the problems existing in the prior art.
技术问题technical problem
有鉴于此，本发明提供一种显示面板的小型发光二极管表面粘着组装方法，以解决现有技术的小型发光二极管表面粘着技术所存在的发光二极管固定到电路板上的耗时过久，效率过低而导致显示面板产率低的问题。In view of this, the present invention provides a surface-adhesive assembly method for small light-emitting diodes of display panels to solve the problem of the excessively long time and excessive efficiency of fixing the light-emitting diodes to the circuit board in the existing small-sized light-emitting diode surface adhesion technology Low and lead to the problem of low display panel yield.
技术解决方案Technical solutions
本发明的主要目的在于提供一种显示面板的小型发光二极管表面粘着组装方法，包括：The main purpose of the present invention is to provide a surface adhesion assembly method for small light-emitting diodes of a display panel, including:
提供步骤，包括提供一电路板组件、一薄膜组件、以及多个磁性元件，其中所述电路板组件包括印刷电路板，在所述印刷电路板的顶面上设置有多个焊垫组，各所述焊垫组包括多个焊垫，在各所述焊垫上涂布有锡膏，所述薄膜组件包括薄膜片，在所述薄膜片的底面上附着有多个发光二极管组件，所述多个发光二极管组件对应所述多个焊垫组，各所述发光二极管组件包括有一发光二极管，所述发光二极管底部设置有多个焊脚，所述多个磁性元件设置在所述印刷电路板或是所述薄膜组件上，所述多个磁性元件对应所述多个焊垫组，且所述多个磁性元件对所述多个发光二极管组件；The providing step includes providing a circuit board assembly, a thin film assembly, and a plurality of magnetic elements, wherein the circuit board assembly includes a printed circuit board, and a plurality of solder pad groups are provided on the top surface of the printed circuit board, each The soldering pad group includes a plurality of soldering pads, tin paste is coated on each of the soldering pads, the thin film component includes a thin film sheet, and a plurality of light emitting diode components are attached to the bottom surface of the thin film sheet, and the multiple Each light-emitting diode assembly corresponds to the plurality of bonding pad groups, each of the light-emitting diode assemblies includes a light-emitting diode, a plurality of welding feet are arranged at the bottom of the light-emitting diode, and the plurality of magnetic elements are arranged on the printed circuit board or On the thin film assembly, the plurality of magnetic elements correspond to the plurality of bonding pad groups, and the plurality of magnetic elements correspond to the plurality of light emitting diode assemblies;
磁吸组装步骤，包括移动所述薄膜组件靠向所述电路板组件，使各所述磁性元件以磁力将对应的所述焊垫组的焊垫以及对应的所述发光二极管组件的焊脚相互吸附在一起，并使所述发光二极管组件因磁力自所述薄膜片脱离且被吸附到所述焊垫组上；The magnetic assembly step includes moving the thin film component against the circuit board component so that each of the magnetic elements magnetically connects the solder pads of the corresponding solder pad groups and the solder feet of the corresponding LED components to each other Adsorbing together, and causing the light-emitting diode assembly to be detached from the film sheet due to magnetic force and adsorbed onto the welding pad group;
焊接步骤，包括对所述电路板组件进行加温，使所述锡膏达致热熔状态以使各所述发光二极管组件的所述焊脚粘着到对应的所述焊垫组的所述焊垫上；以及The soldering step includes heating the circuit board assembly to bring the solder paste to a hot-melt state so that the solder feet of each light-emitting diode assembly adhere to the soldering pads of the corresponding soldering pad group Pad on; and
降温步骤，对所述电路板组件进行降温使锡膏固化。In the cooling step, the circuit board assembly is cooled to solidify the solder paste.
在本发明一实施例中，所述多个磁性元件为多份磁性掺杂物，所述多份磁性掺杂物设置在所述印刷电路板上，且分别掺杂设置在对应的所述焊垫组的所述锡膏内。In an embodiment of the present invention, the plurality of magnetic elements are a plurality of magnetic dopants, and the plurality of magnetic dopants are arranged on the printed circuit board and are respectively doped and arranged on the corresponding solder In the solder paste of the pad group.
在本发明一实施例中，所述磁吸组装步骤进一步包括所述多个发光二极管组件因磁力同时自所述薄膜片脱离且被吸附到所述多个焊垫组上。In an embodiment of the present invention, the magnetic assembly step further includes that the plurality of light-emitting diode components are simultaneously detached from the thin film sheet due to magnetic force and are attracted to the plurality of bonding pad groups.
在本发明一实施例中，所述磁吸组装步骤进一步包括所述多个发光二极管组件因磁力以批次方式自所述薄膜片脱离且被吸附到所述多个焊垫组上，其中每一批次中的所述多个发光二极管组件因磁力同时自所述薄膜片脱离且被吸附到在所述批次中的所述多个焊垫组上。In an embodiment of the present invention, the magnetic assembly step further includes that the plurality of light-emitting diode components are detached from the thin film sheet in a batch manner due to magnetic force and are adsorbed onto the plurality of bonding pad groups, wherein each The plurality of light emitting diode components in a batch are simultaneously detached from the thin film sheet due to magnetic force and are adsorbed on the plurality of bonding pad groups in the batch.
在本发明一实施例中，所述磁吸组装步骤进一步包括，使各所述发光二极管组件对齐对应的所述焊垫组，接着移动各所述发光二极管组件靠向对应的所述焊垫组，使各所述焊垫组上的所述锡膏以所述磁性掺杂物的磁力吸引对应的所述发光二极管组件的焊脚。In an embodiment of the present invention, the magnetic assembly step further includes aligning each of the light-emitting diode components with the corresponding solder pad group, and then moving each of the light-emitting diode components to lean against the corresponding solder pad group , Making the solder paste on each of the solder pad groups attract the solder feet of the corresponding light-emitting diode assembly with the magnetic force of the magnetic dopant.
在本发明一实施例中，所述磁性掺杂物包括磁粉。In an embodiment of the present invention, the magnetic dopant includes magnetic powder.
在本发明一实施例中，所述多个磁性元件设置在所述印刷电路板的底面上，并且对应所述多个焊垫组，各所述磁性元件包括多个磁性块，所述多个磁性块分别对应到对应焊垫组的所述多个焊垫。In an embodiment of the present invention, the plurality of magnetic elements are arranged on the bottom surface of the printed circuit board and correspond to the plurality of solder pad groups, each of the magnetic elements includes a plurality of magnetic blocks, and the plurality of The magnetic blocks respectively correspond to the multiple solder pads of the corresponding solder pad group.
在本发明一实施例中，所述多个磁性块为永久磁铁或是非永久磁铁。In an embodiment of the present invention, the plurality of magnetic blocks are permanent magnets or non-permanent magnets.
在本发明一实施例中，所述多个磁性块是以贴附到所述印刷电路板的底面的多个焊接部位。In an embodiment of the present invention, the plurality of magnetic blocks are a plurality of soldering positions attached to the bottom surface of the printed circuit board.
在本发明一实施例中，所述多个磁性元件为多份磁粉，各所述份磁粉以磁性附着方式设置在所述薄膜组件的对定的所述发光二极管组件的所述多个焊脚上。In an embodiment of the present invention, the plurality of magnetic elements are a plurality of magnetic powders, and each of the magnetic powders is magnetically attached to the plurality of solder feet of the light emitting diode assembly of the thin film assembly. on.
有益效果Beneficial effect
与现有技术相比较，本发明显示面板的小型发光二极管表面粘着组装方法透过磁性元件能够快速地将电路板组件的多个焊垫组以及薄膜组件上的多个发光二极管组件以同时、批次或是依序等方式相互对齐并磁吸固定，且磁吸元件的吸力能够使得焊垫组与发光二极管组件的对齐更有效率，降低了对齐所需的精度。因此，当本发明采用同时或是批次方式进行焊垫组与发光二极管组件的磁吸固定时，可在同时间内快速地将大量的发光二极管组件固定到电路板组件上，避免了现有技术的表面粘着技术无法一次性大量将小型发光二极管固定到电路板上而造成效率低落的技术问题。Compared with the prior art, the surface adhesion assembly method of the small light-emitting diode of the display panel of the present invention can quickly assemble the multiple bonding pad groups of the circuit board assembly and the multiple light-emitting diode assemblies on the thin-film assembly at the same time through the magnetic element. They are aligned with each other in a second or sequential manner and fixed by magnetic attraction, and the attraction of the magnetic element can make the alignment of the bonding pad group and the light-emitting diode assembly more efficient, reducing the accuracy required for alignment. Therefore, when the present invention uses the simultaneous or batch method to magnetically fix the bonding pad group and the light-emitting diode assembly, a large number of light-emitting diode assemblies can be quickly fixed to the circuit board assembly at the same time, avoiding the existing The technical surface adhesion technology cannot fix a large number of small light-emitting diodes to the circuit board at one time, which causes a technical problem of low efficiency.
为让本发明的上述内容能更明显易懂，下文特举优选实施例，且配合所附图式，作详细说明如下：In order to make the above-mentioned content of the present invention more obvious and understandable, the following is a detailed description of preferred embodiments, and in conjunction with the accompanying drawings:
附图说明Description of the drawings
图1是本发明显示面板的小型发光二极管表面粘着组装方法的步骤流程示意图。FIG. 1 is a schematic diagram of the steps of a method for surface adhesion assembly of a small light emitting diode of a display panel of the present invention.
图2是本发明显示面板的小型发光二极管表面粘着组装方法的第1实施例在磁吸组装步骤实施前的侧面剖视示意图。2 is a schematic side sectional view of the first embodiment of the surface adhesion assembly method of the small light emitting diode of the display panel of the present invention before the magnetic attraction assembly step is implemented.
图3是本发明显示面板的小型发光二极管表面粘着组装方法的第1实施例在磁吸组装步骤实施后的侧面剖视示意图。3 is a schematic side sectional view of the first embodiment of the surface adhesion assembly method of the small light emitting diode of the display panel of the present invention after the magnetic attraction assembly step is implemented.
图4是本发明显示面板的小型发光二极管表面粘着组装方法的第2实施例在磁吸组装步骤实施前的侧面剖视示意图。4 is a schematic side sectional view of the second embodiment of the surface adhesion assembly method of the small light emitting diode of the display panel of the present invention before the magnetic attraction assembly step is implemented.
图5是本发明显示面板的小型发光二极管表面粘着组装方法的第2实施例在磁吸组装步骤实施后的侧面剖视示意图。5 is a schematic side sectional view of the second embodiment of the surface adhesion assembly method of the small light emitting diode of the display panel of the present invention after the magnetic attraction assembly step is implemented.
图6是本发明显示面板的小型发光二极管表面粘着组装方法的第3实施例在磁吸组装步骤实施前的侧面剖视示意图。6 is a schematic side cross-sectional view of the third embodiment of the surface adhesion assembly method of the small light emitting diode of the display panel of the present invention before the magnetic attraction assembly step is implemented.
图7是本发明显示面板的小型发光二极管表面粘着组装方法的第3实施例在磁吸组装步骤实施后的侧面剖视示意图。7 is a schematic side sectional view of the third embodiment of the surface adhesion assembly method of the small light emitting diode of the display panel of the present invention after the magnetic attraction assembly step is implemented.
本发明的实施方式Embodiments of the invention
请参照图1，本发明显示面板的小型发光二极管51(Light Emitting Diode, LED)表面粘着组装方法的第1实施例为一种表面粘着技术(Surface Mount Technology, SMT)制程，且包括：提供步骤S01、磁吸组装步骤S02、焊接步骤S03、以及降温步骤S04。Please refer to FIG. 1, the small light-emitting diode 51 (Light The first embodiment of the Emitting Diode (LED) surface mount assembly method is a Surface Mount Technology (SMT) process, and includes: providing step S01, magnetic attraction assembly step S02, welding step S03, and cooling step S04 .
请参照图2，所述提供步骤S01，包括提供一电路板组件1、一薄膜组件2、以及多个磁性元件60。Please refer to FIG. 2, the providing step S01 includes providing a circuit board assembly 1, a thin film assembly 2, and a plurality of magnetic elements 60.
所述电路板组件1包括印刷电路板10，在所述印刷电路板10的顶面上设置有多个焊垫组20，各所述焊垫组20包括多个焊垫21，在各所述焊垫21上涂布有锡膏30。The circuit board assembly 1 includes a printed circuit board 10, a plurality of solder pad groups 20 are provided on the top surface of the printed circuit board 10, and each of the solder pad groups 20 includes a plurality of solder pads 21. The solder pad 21 is coated with a solder paste 30.
所述薄膜组件2包括薄膜片40，所述薄膜片40可为蓝膜。在所述薄膜片40的底面上附着有多个发光二极管组件50，所述多个发光二极管组件50对应所述多个焊垫组20，各所述发光二极管组件50包括有一发光二极管51，所述发光二极管51底部设置有多个焊脚52。所述发光二极管51可为一迷你发光二极管 (Mini-LED)或是微型发光二极管 (Micro-LED)。The film assembly 2 includes a film sheet 40, and the film sheet 40 may be a blue film. A plurality of light-emitting diode assemblies 50 are attached to the bottom surface of the film sheet 40, and the plurality of light-emitting diode assemblies 50 correspond to the plurality of bonding pad groups 20, and each of the light-emitting diode assemblies 50 includes a light-emitting diode 51, so A plurality of solder pins 52 are provided at the bottom of the light emitting diode 51. The light-emitting diode 51 can be a mini-light-emitting diode (Mini-LED) or a mini-light-emitting diode (Micro-LED).
所述多个磁性元件60设置在所述印刷电路板10或是所述薄膜组件2上，所述多个磁性元件60对应所述多个焊垫组20，且所述多个磁性元件60对所述多个发光二极管组件50。The plurality of magnetic elements 60 are arranged on the printed circuit board 10 or the thin film assembly 2, the plurality of magnetic elements 60 correspond to the plurality of bonding pad groups 20, and the plurality of magnetic elements 60 are paired The plurality of light emitting diode assemblies 50.
请参照图3，所述磁吸组装步骤S02，包括移动所述薄膜组件2靠向所述电路板组件1，使各所述磁性元件60以磁力将对应的所述焊垫组20的焊垫21以及对应的所述发光二极管组件50的焊脚52相互吸附在一起，并使所述发光二极管组件50因磁力自所述薄膜片40脱离且被吸附到所述焊垫组20上。3, the magnetic assembly step S02 includes moving the thin film assembly 2 against the circuit board assembly 1, so that each of the magnetic elements 60 magnetically connect the pads of the corresponding pad group 20 21 and the corresponding solder pins 52 of the LED assembly 50 are mutually attracted to each other, and the LED assembly 50 is detached from the film sheet 40 due to magnetic force and is adsorbed onto the bonding pad group 20.
所述焊接步骤S03，包括对所述电路板组件1进行加温，使所述锡膏30达致热熔状态以使各所述发光二极管组件50的所述焊脚52粘着到对应的所述焊垫组20的所述焊垫21上。所述焊接步骤S03可为表面粘着技术制程中的过锡炉步骤的一种。The soldering step S03 includes heating the circuit board assembly 1 to bring the solder paste 30 to a hot-melt state so that the solder feet 52 of each light-emitting diode assembly 50 adhere to the corresponding On the solder pad 21 of the solder pad group 20. The soldering step S03 may be one of the soldering furnace steps in the surface adhesion technology process.
所述降温步骤S04，对所述电路板组件1进行降温使锡膏30固化。In the cooling step S04, the circuit board assembly 1 is cooled to solidify the solder paste 30.
在本发明第1实施例中，所述多个磁性元件60为多份磁性掺杂物60a，所述多份磁性掺杂物60a设置在所述印刷电路板10上，且分别掺杂设置在对应的所述焊垫组20的所述锡膏30内。In the first embodiment of the present invention, the plurality of magnetic elements 60 are a plurality of magnetic dopants 60a, and the plurality of magnetic dopants 60a are disposed on the printed circuit board 10 and are respectively doped and disposed on In the solder paste 30 of the corresponding solder pad group 20.
在本发明第1实施例中，所述磁吸组装步骤S02进一步包括所述多个发光二极管组件50因磁力同时自所述薄膜片40脱离且被吸附到所述多个焊垫组20上。In the first embodiment of the present invention, the magnetic assembly step S02 further includes that the plurality of light emitting diode assemblies 50 are simultaneously detached from the film sheet 40 due to magnetic force and are adsorbed onto the plurality of bonding pad assemblies 20.
在本发明第1实施例中，所述磁吸组装步骤S02进一步包括所述多个发光二极管组件50因磁力以批次方式自所述薄膜片40脱离且被吸附到所述多个焊垫组20上，其中每一批次中的所述多个发光二极管组件50因磁力同时自所述薄膜片40脱离且被吸附到在所述批次中的所述多个焊垫组20上。In the first embodiment of the present invention, the magnetic assembly step S02 further includes that the plurality of light-emitting diode assemblies 50 are detached from the film sheet 40 in batches due to magnetic force and are adsorbed to the plurality of bonding pad groups 20, wherein the plurality of light-emitting diode assemblies 50 in each batch are simultaneously detached from the film sheet 40 due to magnetic force and are adsorbed onto the plurality of bonding pad groups 20 in the batch.
在本发明第1实施例中，所述磁吸组装步骤S02进一步包括所述多个发光二极管组件50因磁力依序自所述薄膜片40脱离且被吸附到所述多个焊垫组20上。In the first embodiment of the present invention, the magnetic assembly step S02 further includes that the plurality of light-emitting diode assemblies 50 are sequentially separated from the film sheet 40 due to magnetic force and are attracted to the plurality of bonding pad groups 20 .
在本发明第1实施例中，所述磁吸组装步骤S02进一步包括，使各所述发光二极管组件50对齐对应的所述焊垫组20，接着移动各所述发光二极管组件50靠向对应的所述焊垫组20，使各所述焊垫组20上的所述锡膏30以所述磁性掺杂物60a的磁力吸引对应的所述发光二极管组件50的焊脚52。In the first embodiment of the present invention, the magnetic assembly step S02 further includes aligning each of the light-emitting diode components 50 with the corresponding solder pad group 20, and then moving each of the light-emitting diode components 50 to the corresponding The solder pad groups 20 make the solder paste 30 on each of the solder pad groups 20 attract the corresponding solder pins 52 of the light-emitting diode assembly 50 with the magnetic force of the magnetic dopant 60a.
在本发明第1实施例中，所述磁性掺杂物60a包括磁粉60c。In the first embodiment of the present invention, the magnetic dopant 60a includes magnetic powder 60c.
请参照图4及图5，本发明显示面板的小型发光二极管51表面粘着组装方法的第2实施例同样包括上述的提供步骤S01、磁吸组装步骤S02、焊接步骤S03、以及降温步骤S04。4 and 5, the second embodiment of the surface adhesion assembly method of the small light emitting diode 51 of the display panel of the present invention also includes the above-mentioned providing step S01, magnetic attraction assembly step S02, welding step S03, and cooling step S04.
与第1实施例不同之处在于，在本发明第2实施例中，所述多个磁性元件60设置在所述印刷电路板10的底面上，并且对应所述多个焊垫组20，各所述磁性元件60包括多个磁性块60b，所述多个磁性块60b分别对应到对应焊垫组20的所述多个焊垫21。The difference from the first embodiment is that, in the second embodiment of the present invention, the plurality of magnetic elements 60 are provided on the bottom surface of the printed circuit board 10 and correspond to the plurality of solder pad groups 20, each The magnetic element 60 includes a plurality of magnetic blocks 60 b, and the plurality of magnetic blocks 60 b respectively correspond to the plurality of bonding pads 21 of the corresponding bonding pad group 20.
在本发明第2实施例中，所述多个磁性块60b为永久磁铁或是非永久磁铁。In the second embodiment of the present invention, the plurality of magnetic blocks 60b are permanent magnets or non-permanent magnets.
在本发明第2实施例中，所述多个磁性块60b为电磁铁，透过通电才具有磁性，在不通电状况下则不具磁力。透过同时对所有电磁铁通电、批次通电，或是依序通电，则可实现上述多个发光二极管组件50因磁力以同时方式、批次方式、或是依序方式自所述薄膜片40脱离且被吸附到所述多个焊垫组20上的技术。In the second embodiment of the present invention, the plurality of magnetic blocks 60b are electromagnets, which have magnetism only when they are energized, and have no magnetic force when they are not energized. By energizing all the electromagnets at the same time, in batches, or sequentially, it is possible to realize that the plurality of light-emitting diode assemblies 50 are transferred from the film sheet 40 in a simultaneous manner, a batch manner, or a sequential manner due to the magnetic force. The technology of detaching and being adsorbed to the plurality of bonding pad groups 20.
在本发明第2实施例中，所述多个磁性块60b是透过一治具以批次方式或是依序设置到所述印刷电路板10的底面上。In the second embodiment of the present invention, the plurality of magnetic blocks 60b are arranged on the bottom surface of the printed circuit board 10 in batches or sequentially through a jig.
在本发明第2实施例中，所述多个磁性块60b是以贴附到所述印刷电路板10的底面的多个露铜（裸露出铜线）的焊接部位。In the second embodiment of the present invention, the plurality of magnetic blocks 60 b are soldered parts of a plurality of exposed copper (bare copper wires) attached to the bottom surface of the printed circuit board 10.
请参照图6及图7，本发明显示面板的小型发光二极管51表面粘着组装方法的第3实施例同样包括上述的提供步骤S01、磁吸组装步骤S02、焊接步骤S03、以及降温步骤S04。6 and 7, the third embodiment of the surface adhesion assembly method of the small light emitting diode 51 of the display panel of the present invention also includes the above-mentioned providing step S01, magnetic attraction assembly step S02, welding step S03, and cooling step S04.
与第1实施例不同之处在于，在本发明第3实施例中，所述多个磁性元件60为多份磁粉60c，各所述份磁粉60c以磁性附着方式设置在所述薄膜组件2的对定的所述发光二极管组件50的所述多个焊脚52上。The difference from the first embodiment is that, in the third embodiment of the present invention, the plurality of magnetic elements 60 are a plurality of magnetic powders 60c, and each of the magnetic powders 60c is magnetically attached to the film assembly 2 On the plurality of solder feet 52 of the aligned LED assembly 50.
在本发明第3实施例中，所述磁吸组装步骤S02中，在各所述发光二极管组件50因磁力自所述薄膜片40脱离且被吸附到对应的所述焊垫组20上时，各所述份磁粉60c结合到对应的所述焊垫组20的所述多个焊垫21的锡膏30上。In the third embodiment of the present invention, in the magnetic attraction assembly step S02, when each of the light-emitting diode assemblies 50 is detached from the film sheet 40 due to magnetic force and is adsorbed to the corresponding bonding pad group 20, Each of the magnetic powder 60c is bonded to the solder paste 30 of the plurality of solder pads 21 of the corresponding solder pad group 20.
与现有技术相比较，本发明显示面板的小型发光二极管51表面粘着组装方法透过磁性元件60能够快速地将电路板组件1的多个焊垫组20以及薄膜组件2上的多个发光二极管组件50以同时、批次或是依序等方式相互对齐并磁吸固定，且磁吸元件的吸力能够使得焊垫组20与发光二极管组件50的对齐更有效率，降低了对齐所需的精度。因此，当本发明采用同时或是批次方式进行焊垫组20与发光二极管组件50的磁吸固定时，可在同时间内快速地将大量的发光二极管组件50固定到电路板组件1上，避免了现有技术的表面粘着技术无法一次性大量将小型发光二极管51固定到电路板上而造成效率低落的技术问题。Compared with the prior art, the surface-adhesive assembly method of the small light-emitting diode 51 of the display panel of the present invention can quickly connect the multiple bonding pad groups 20 of the circuit board assembly 1 and the multiple light-emitting diodes on the thin film assembly 2 through the magnetic element 60. The components 50 are aligned with each other in a simultaneous, batch, or sequential manner and fixed by magnetic attraction, and the attraction of the magnetic element can make the alignment of the bonding pad group 20 and the LED assembly 50 more efficient, reducing the accuracy required for alignment . Therefore, when the present invention uses the simultaneous or batch method to magnetically fix the bonding pad group 20 and the light-emitting diode assembly 50, a large number of light-emitting diode assemblies 50 can be quickly fixed to the circuit board assembly 1 at the same time. This avoids the technical problem of low efficiency caused by the inability of the prior art surface adhesion technology to fix a large number of small light emitting diodes 51 to the circuit board at one time.

Claims (10)

  1. 一种显示面板的小型发光二极管表面粘着组装方法，包括：A surface adhesion assembly method for small light-emitting diodes of a display panel includes:
    提供步骤，包括提供一电路板组件、一薄膜组件、以及多个磁性元件，其中所述电路板组件包括印刷电路板，在所述印刷电路板的顶面上设置有多个焊垫组，各所述焊垫组包括多个焊垫，在各所述焊垫上涂布有锡膏，所述薄膜组件包括薄膜片，在所述薄膜片的底面上附着有多个发光二极管组件，所述多个发光二极管组件对应所述多个焊垫组，各所述发光二极管组件包括有一发光二极管，所述发光二极管底部设置有多个焊脚，所述多个磁性元件设置在所述印刷电路板或是所述薄膜组件上，所述多个磁性元件对应所述多个焊垫组，且所述多个磁性元件对所述多个发光二极管组件；The providing step includes providing a circuit board assembly, a thin film assembly, and a plurality of magnetic elements, wherein the circuit board assembly includes a printed circuit board, and a plurality of solder pad groups are provided on the top surface of the printed circuit board, each The soldering pad group includes a plurality of soldering pads, tin paste is coated on each of the soldering pads, the thin film component includes a thin film sheet, and a plurality of light emitting diode components are attached to the bottom surface of the thin film sheet, and the multiple Each light-emitting diode assembly corresponds to the plurality of bonding pad groups, each of the light-emitting diode assemblies includes a light-emitting diode, a plurality of welding feet are arranged at the bottom of the light-emitting diode, and the plurality of magnetic elements are arranged on the printed circuit board or On the thin film assembly, the plurality of magnetic elements correspond to the plurality of bonding pad groups, and the plurality of magnetic elements correspond to the plurality of light emitting diode assemblies;
    磁吸组装步骤，包括移动所述薄膜组件靠向所述电路板组件，使各所述磁性元件以磁力将对应的所述焊垫组的焊垫以及对应的所述发光二极管组件的焊脚相互吸附在一起，并使所述发光二极管组件因磁力自所述薄膜片脱离且被吸附到所述焊垫组上；The magnetic assembly step includes moving the thin film component against the circuit board component so that each of the magnetic elements magnetically connects the solder pads of the corresponding solder pad groups and the solder feet of the corresponding LED components to each other Adsorbing together, and causing the light-emitting diode assembly to be detached from the film sheet due to magnetic force and adsorbed onto the welding pad group;
    焊接步骤，包括对所述电路板组件进行加温，使所述锡膏达致热熔状态以使各所述发光二极管组件的所述焊脚粘着到对应的所述焊垫组的所述焊垫上；以及The soldering step includes heating the circuit board assembly to bring the solder paste to a hot-melt state so that the solder feet of each light-emitting diode assembly adhere to the soldering pads of the corresponding soldering pad group Pad on; and
    降温步骤，对所述电路板组件进行降温使锡膏固化。In the cooling step, the circuit board assembly is cooled to solidify the solder paste.
  2. 如权利要求1所述的显示面板的小型发光二极管表面粘着组装方法，其中，所述多个磁性元件为多份磁性掺杂物，所述多份磁性掺杂物设置在所述印刷电路板上，且分别掺杂设置在对应的所述焊垫组的所述锡膏内。2. The surface adhesion assembly method of a small light emitting diode for a display panel according to claim 1, wherein the plurality of magnetic elements are multiple magnetic dopants, and the multiple magnetic dopants are arranged on the printed circuit board , And are respectively doped and arranged in the solder paste of the corresponding solder pad group.
  3. 如权利要求1所述的显示面板的小型发光二极管表面粘着组装方法，其中，所述磁吸组装步骤进一步包括所述多个发光二极管组件因磁力同时自所述薄膜片脱离且被吸附到所述多个焊垫组上。The method for surface adhesion assembly of small light-emitting diodes for display panels according to claim 1, wherein the magnetic assembly step further comprises the step of magnetically detaching the plurality of light-emitting diode components from the film sheet and being attracted to the Multiple pad groups.
  4. 如权利要求1所述的显示面板的小型发光二极管表面粘着组装方法，其中，所述磁吸组装步骤进一步包括所述多个发光二极管组件因磁力以批次方式自所述薄膜片脱离且被吸附到所述多个焊垫组上，其中每一批次中的所述多个发光二极管组件因磁力同时自所述薄膜片脱离且被吸附到在所述批次中的所述多个焊垫组上。2. The surface adhesion assembly method of a small light emitting diode for a display panel according to claim 1, wherein the magnetic assembly step further comprises the step of detaching the plurality of light emitting diode components from the thin film sheet due to magnetic force and being adsorbed To the plurality of bonding pad groups, wherein the plurality of light emitting diode components in each batch are simultaneously detached from the film sheet due to magnetic force and are adsorbed to the plurality of bonding pads in the batch Group on.
  5. 如权利要求1所述的显示面板的小型发光二极管表面粘着组装方法，其中，所述磁吸组装步骤进一步包括，使各所述发光二极管组件对齐对应的所述焊垫组，接着移动各所述发光二极管组件靠向对应的所述焊垫组，使各所述焊垫组上的所述锡膏以所述磁性掺杂物的磁力吸引对应的所述发光二极管组件的焊脚。8. The method for assembling the surface of the small light emitting diode of the display panel according to claim 1, wherein the magnetic attraction assembly step further comprises aligning each of the light emitting diode components with the corresponding solder pad group, and then moving each of the The light-emitting diode components lean against the corresponding solder pad groups, so that the solder paste on each of the solder pad groups attracts the solder feet of the corresponding light-emitting diode components with the magnetic force of the magnetic dopant.
  6. 如权利要求5所述的显示面板的小型发光二极管表面粘着组装方法，其中，所述磁性掺杂物包括磁粉。8. The surface adhesion assembly method of a small light emitting diode for a display panel according to claim 5, wherein the magnetic dopant comprises magnetic powder.
  7. 如权利要求1所述的显示面板的小型发光二极管表面粘着组装方法，其中，所述多个磁性元件设置在所述印刷电路板的底面上，并且对应所述多个焊垫组，各所述磁性元件包括多个磁性块，所述多个磁性块分别对应到对应焊垫组的所述多个焊垫。2. The surface adhesion assembly method of a small light emitting diode for a display panel according to claim 1, wherein the plurality of magnetic elements are arranged on the bottom surface of the printed circuit board and correspond to the plurality of solder pad groups, each of the The magnetic element includes a plurality of magnetic blocks, and the plurality of magnetic blocks respectively correspond to the plurality of bonding pads of the corresponding bonding pad group.
  8. 如权利要求7所述的显示面板的小型发光二极管表面粘着组装方法，其中，所述多个磁性块为永久磁铁或是非永久磁铁。8. The method for surface adhesion assembly of small light emitting diodes for display panels as claimed in claim 7, wherein the plurality of magnetic blocks are permanent magnets or non-permanent magnets.
  9. 如权利要求7所述的显示面板的小型发光二极管表面粘着组装方法，其中，所述多个磁性块是以贴附到所述印刷电路板的底面的多个焊接部位。7. The method for surface adhesion assembly of small light emitting diodes for display panels according to claim 7, wherein the plurality of magnetic blocks are a plurality of soldering positions attached to the bottom surface of the printed circuit board.
  10. 如权利要求1所述的显示面板的小型发光二极管表面粘着组装方法，其中，所述多个磁性元件为多份磁粉，各所述份磁粉以磁性附着方式设置在所述薄膜组件的对定的所述发光二极管组件的所述多个焊脚上。The surface adhesion assembly method of a small light emitting diode for a display panel according to claim 1, wherein the plurality of magnetic elements are multiple magnetic powders, and each of the magnetic powders is magnetically attached to the opposite side of the thin film assembly. On the plurality of solder feet of the light emitting diode assembly.
PCT/CN2019/127820 2019-07-09 2019-12-24 Surface mount and assembly method for small light-emitting diodes of display panel WO2021004023A1 (en)

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110418517B (en) * 2019-07-09 2020-10-16 惠州市华星光电技术有限公司 Surface adhering and assembling method for small LED of display panel
CN111246724B (en) * 2020-03-04 2021-06-01 环维电子(上海)有限公司 Side clamp jig of electronic module and use method thereof
CN111613709A (en) * 2020-05-27 2020-09-01 深圳市华星光电半导体显示技术有限公司 Mini light-emitting diode backlight module, manufacturing method thereof and display device
CN112201736B (en) * 2020-09-21 2022-02-11 深圳市弘亮光电股份有限公司 MiniLED matrix backlight board, manufacturing method thereof and notebook computer

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107425101A (en) * 2017-07-11 2017-12-01 华灿光电（浙江）有限公司 A kind of method of micro-led chip flood tide transfer
US20180212120A1 (en) * 2017-01-26 2018-07-26 International Business Machines Corporation Magnetically guided chiplet displacement
CN109065692A (en) * 2018-08-01 2018-12-21 厦门多彩光电子科技有限公司 A kind of packaging method of LED
CN109273565A (en) * 2018-10-15 2019-01-25 华映科技（集团）股份有限公司 A kind of transfer method of micro- light-emitting diode chip for backlight unit
CN110418517A (en) * 2019-07-09 2019-11-05 惠州市华星光电技术有限公司 The small light-emitting diode adhesive surface assemble method of display panel

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61156745A (en) * 1984-12-28 1986-07-16 Fujitsu Ltd Chip mounting method
CN101599476A (en) * 2008-06-04 2009-12-09 台湾应解股份有限公司 Thin double-sided packaging substrate and manufacture method thereof
CN103945681B (en) * 2014-04-08 2016-10-19 中国科学院重庆绿色智能技术研究院 LED inserter feeding device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180212120A1 (en) * 2017-01-26 2018-07-26 International Business Machines Corporation Magnetically guided chiplet displacement
CN107425101A (en) * 2017-07-11 2017-12-01 华灿光电（浙江）有限公司 A kind of method of micro-led chip flood tide transfer
CN109065692A (en) * 2018-08-01 2018-12-21 厦门多彩光电子科技有限公司 A kind of packaging method of LED
CN109273565A (en) * 2018-10-15 2019-01-25 华映科技（集团）股份有限公司 A kind of transfer method of micro- light-emitting diode chip for backlight unit
CN110418517A (en) * 2019-07-09 2019-11-05 惠州市华星光电技术有限公司 The small light-emitting diode adhesive surface assemble method of display panel

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