JP2748615B2 - Conductive adhesive - Google Patents
Conductive adhesiveInfo
- Publication number
- JP2748615B2 JP2748615B2 JP1305415A JP30541589A JP2748615B2 JP 2748615 B2 JP2748615 B2 JP 2748615B2 JP 1305415 A JP1305415 A JP 1305415A JP 30541589 A JP30541589 A JP 30541589A JP 2748615 B2 JP2748615 B2 JP 2748615B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive adhesive
- powder
- conductive
- silver
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Description
【発明の詳細な説明】 産業上の利用分野 本発明は各種電子機器において、チップ抵抗器，チッ
プコンデンサ等各種電子部品の電気的接続回着や金属端
子，フィルム状配線板等を回路配線板や各種電子部品に
電気的接続固着するための導電性接着剤に関する。The present invention relates to various kinds of electronic equipment, and to various kinds of electronic devices, such as electrical connection and connection of various electronic parts such as chip resistors and chip capacitors, metal terminals, film-like wiring boards, and the like. The present invention relates to a conductive adhesive for electrically connecting and fixing various electronic components.
従来の技術 従来電気回路の電気的接続固着方法としては半田付や
金属端子等の場合は鋏めによる方法、銀ペーストによる
固着またはフィルム状配線板については専用コネクター
による接続方法が一般に知られている。2. Description of the Related Art Conventionally, as a method of electrical connection and fixing of an electric circuit, a method using scissors for soldering or metal terminals, and a method using a special connector for fixing with silver paste or a film wiring board are generally known. .
発明が解決しようとする課題 半田付による接続方法は接続する両者がいずれも半田
付可能な金属の場合に限られ、かつ周辺材料も半田付に
よる熱に耐え得るものでなければならない制約条件があ
る。金属端子等の鋏めによる方法は、電極間の間隔が大
きくなるため高密度化した配線板に適用できず、ガラ
ス，セラミック等の基板にも割れが発生するため適用で
きない。さらにフィルム状配線板の場合、別途専用コネ
クターが必要でありコスト高になる。一方、前記各課題
を解決し得るものとして異方導電接着剤による熱圧着接
続方法が提案され、ガラス配線板等の電気的接続固着に
適用されている。しかし瞬間接着が可能なものは接着用
樹脂バインダとして熱可塑性樹脂を用いているため接続
信頼性にとぼしく接続部に常に機械的に荷重をかけて保
持しておくことが必要であった。Problems to be Solved by the Invention The connection method by soldering is limited only to the case where both of the two parts to be connected are metal that can be soldered, and there is a constraint that the peripheral material must be able to withstand the heat by soldering. . The method using scissors such as metal terminals cannot be applied to a high-density wiring board due to a large interval between electrodes, and is not applicable to a substrate made of glass, ceramic, or the like because cracks occur. Furthermore, in the case of a film-shaped wiring board, a special connector is separately required, which increases costs. On the other hand, a thermocompression bonding method using an anisotropic conductive adhesive has been proposed as a method that can solve the above-mentioned problems, and is applied to electrical connection and fixing of a glass wiring board or the like. However, those capable of instantaneous bonding use a thermoplastic resin as a bonding resin binder, and therefore have poor connection reliability, so that it is necessary to always apply a mechanical load to the connection portion and hold it.
課題を解決するための手段 上記課題を解決するために本発明はビスフェノール型
エポキシ樹脂と、硬化促進剤としてイミダゾール・ビス
フェノールジグリシジルエーテル付加物と、導電性粉末
とを含む導電性接着剤とすることで達成される。本発明
による導電性接着剤において高度の導電性が必要な場合
は粒子径や粒子形状によっても最適値は異なるが銀粉末
または銀コートした銅粉末を80〜90重量％含有させるこ
とが望ましく、異方導電接着剤として用いる場合は銀コ
ートした銅粉末を10〜50重量％含有させることが望まし
い。本添加量や粒子径，粒子形状の選択については適用
用途によって任意に変えることができる。また導電性粉
末としては前記銀粉末や銀コートした銅粉末ばかりでな
くニッケル等他の金属粉，黒鉛粉末，酸化スズ等化合物
導電粉等種々の導電性粉末が適用できるが、本発明者ら
の検討では銀コートした銅粉末が最も接続安定性とその
信頼性が良好であった。またガラスやセラミックスに接
着接続する場合にはシラン系やチタネート系カップリン
グ剤を導電性接着剤中に添加することにより接着強度及
び接続信頼性を極めて安定化させることができる。Means for Solving the Problems In order to solve the above problems, the present invention provides a conductive adhesive containing a bisphenol type epoxy resin, imidazole / bisphenol diglycidyl ether adduct as a curing accelerator, and a conductive powder. Is achieved in. When a high degree of conductivity is required in the conductive adhesive according to the present invention, the optimum value varies depending on the particle diameter and particle shape, but it is desirable to contain 80 to 90% by weight of silver powder or silver-coated copper powder. When used as a conductive adhesive, it is desirable to contain 10 to 50% by weight of copper powder coated with silver. The addition amount, the particle diameter, and the selection of the particle shape can be arbitrarily changed depending on the application. As the conductive powder, not only the silver powder and the silver-coated copper powder but also various conductive powders such as other metal powders such as nickel, graphite powder, and compound conductive powder such as tin oxide can be used. In the examination, silver-coated copper powder had the best connection stability and reliability. In the case of adhesively connecting to glass or ceramics, the bonding strength and connection reliability can be extremely stabilized by adding a silane or titanate coupling agent to the conductive adhesive.
作 用 本発明によれば120℃〜180℃数秒間で圧接硬化でき従
来の熱可塑性樹脂を用いた導電性接着剤に比較して高度
の接着強度と電気的接続信頼性が確保できる。すなわち
半田付が不可能な回路配線材料でも接続が可能であり、
金属端子鋏め方法のような広い電極間隔は必要なくガラ
スやセラミックス基板でも割れることなく接続固着で
き、コネクターや熱可塑性樹脂を用いた従来の導電性接
着剤の場合のような接続部への機械的保持も必要ない。
加うるに指触圧程度の圧接と数秒間の極部加熱で接続で
きるため製造設備も簡素なものにできる。Effects According to the present invention, the adhesive can be hardened by pressing at 120 ° C. to 180 ° C. for several seconds, and a higher adhesive strength and electrical connection reliability can be secured as compared with a conductive adhesive using a conventional thermoplastic resin. In other words, connection is possible even with circuit wiring materials that cannot be soldered,
Wide electrode spacing is not required as in the metal terminal scissors method, and it can be connected and fixed without breaking even on glass or ceramic substrates, and it is a machine to connect parts like connectors or conventional conductive adhesives using thermoplastic resin There is no need to hold the target.
In addition, since the connection can be made by pressure contact of the order of finger pressure and heating of the pole part for several seconds, the manufacturing equipment can be simplified.
ZnO,Sb2S3,V2O3粉末を添加する理由は導電性粉末とし
て銀や銅粉末を適用した場合高湿度下でのマイグレーシ
ョンを防止する目的であり、単独ではZnOが最も防止硬
化が大であるが、Sb2S3やV2O3を複合させるとさらに相
乗効果が現われる。ZnOの効果はZn2+イオンの性により
銅や銀のイオン化と移動を抑止するためと考えられる
が、Sb2S3,V2O3の効果や相乗効果についての原理は不明
である。The reason for adding ZnO, Sb 2 S 3 , V 2 O 3 powder is to prevent migration under high humidity when silver or copper powder is applied as the conductive powder, and ZnO alone has the most preventive hardening. Although large, synergistic effects appear when Sb 2 S 3 and V 2 O 3 are combined. It is thought that the effect of ZnO is to suppress ionization and migration of copper and silver due to the nature of Zn 2+ ions, but the principle of the effects and synergistic effects of Sb 2 S 3 and V 2 O 3 is unknown.
実施例 以下、本発明の実施例について説明する。Examples Hereinafter, examples of the present invention will be described.
（実施例１） ビスフェノールＦ型エポキシ樹脂（油化シェル＃80
7）55重量部、下記式の２メチルイミダゾール・ビスフ
ェノールＡジグリシジルエーテル付加物14重量部，ジシ
アンジアミド１重量部，樹枝状銀コート銅粉末（銀コン
テント５％，平均粒度12μｍ）27重量部，酸化亜鉛粉末
（平均制度3.8μ）３重量部をそれぞれ精秤し混合して
三本ロールミルで混練して本発明による導電接着剤を得
た。(Example 1) Bisphenol F type epoxy resin (oiled shell # 80)
7) 55 parts by weight, 14 parts by weight of 2-methylimidazole / bisphenol A diglycidyl ether adduct of the following formula, 1 part by weight of dicyandiamide, 27 parts by weight of dendritic silver-coated copper powder (silver content 5%, average particle size 12 μm), oxidation Three parts by weight of zinc powder (3.8 μm on average) were precisely weighed, mixed, and kneaded with a three-roll mill to obtain a conductive adhesive according to the present invention.
電極間隔1.25mmの銅箔回路付積層板の電極部にスクリ
ーン印刷法にて本接着剤を塗布し、同一間隔および電極
形状を有するアルミ箔回路付ポリエチレンテレフタレー
トフィルム（フィルム厚50μｍ）を電極部分を位置合せ
して重ね160℃に加熱した圧接用銅板で1kg/cm2の圧力で
10秒間重ね合せた部分の導電接着剤を硬化させた。This adhesive is applied by screen printing to the electrodes of a laminated board with a copper foil circuit with an electrode spacing of 1.25 mm, and a polyethylene terephthalate film with an aluminum foil circuit (film thickness 50 μm) having the same spacing and electrode shape is used for the electrode part. Aligned and stacked with a pressure welding copper plate heated to 160 ° C at a pressure of 1 kg / cm 2
The portion of the conductive adhesive that was overlapped for 10 seconds was cured.
このものの接続部の接触抵抗値は全て50mΩ未満であ
った。さらに接着面に対してポリエチレンテレフタレー
トフィルムを直角方向に500g/cmの荷重で引っぱりつつ8
5℃槽中で1000時間,60℃90〜95％R.H湿度槽中で1000時
間，−25℃30分間〜85℃30分間のヒートショック試験を
100サイクル行なったがいずれも接着部が剥れることは
なかった。The contact resistance values of the connection portions were all less than 50 mΩ. While pulling the polyethylene terephthalate film in a direction perpendicular to the adhesive surface with a load of 500 g / cm,
Heat shock test for 1000 hours in a 5 ° C bath, 1000 hours in a 60 ° C 90-95% RH humidity bath, -25 ° C for 30 minutes to 85 ° C for 30 minutes
After 100 cycles, none of the bonded portions peeled off.
（実施例２） 実施例１の本発明による導電性接着剤にシランカッ
プリング剤（信越シリコーンKBM−403γ−グリシジオキ
シプロピルトリメトキシシラン）を１重量％添加分散さ
せ、カップリング剤入り導電性接着剤とした。 (Example 2) A silane coupling agent (Shin-Etsu Silicone KBM-403γ-glycidyloxypropyltrimethoxysilane) was added to the conductive adhesive of Example 1 according to the present invention in an amount of 1% by weight and dispersed therein, and the conductive agent containing the coupling agent was dispersed. An adhesive was used.
電極間隔0.4mmのインジュウム−アンチモン透明電極
を有するガラスベース回路板の電極部分にスクリーン印
刷法にて本接着剤を塗布し、同じ電極間隔および電極
形状を有するアルミ箔回路付きポリエチレンテレフタレ
ートフィルム（フィルム厚50μ）を電極部分を位置合わ
せして重ね160℃に加熱した圧接用銅板で1kg/cm2の圧力
で10秒間重ね合わせ、重ねた部分の導電性接着剤を硬化
させ接続した。This adhesive is applied by a screen printing method to the electrode portion of a glass-based circuit board having an indium-antimony transparent electrode with an electrode spacing of 0.4 mm, and a polyethylene terephthalate film with an aluminum foil circuit having the same electrode spacing and electrode shape (film thickness). 50μ) were overlapped with the electrode portions aligned, and overlaid with a pressure welding copper plate heated to 160 ° C. at a pressure of 1 kg / cm 2 for 10 seconds, and the electrically conductive adhesive in the overlapped portion was cured and connected.
同様にして実施例１による接着剤を用いてガラス回
路板とポリエチレンテレフタレートフィルムを接続し
た。上記２例の接続部の接触抵抗は全て100mΩ未満であ
った。さらに接着面に対してポリエチレンテレフタレー
トフィルムを直角方向に500g/cmの荷重で引っ張りつつ8
5℃槽中で1000時間、60℃〜90〜95％R.H.湿度槽中で100
0時間、−25℃30分間〜85℃30分間のヒートショック試
験を100サイクル行った。結果、カップリング剤入り導
電性接着剤によるものはいずれの試験も接着部が剥が
れることはなかったが実施例−１による導電性接着剤
では湿度槽中に放置したものは75〜100時間で接着部が
全て剥がれた。Similarly, the glass circuit board and the polyethylene terephthalate film were connected using the adhesive according to Example 1. The contact resistances of the connection parts in the above two examples were all less than 100 mΩ. While pulling the polyethylene terephthalate film perpendicular to the adhesive surface with a load of 500 g / cm
1000 hours in 5 ℃ bath, 100 ℃ in 60 ℃ ~ 90 ~ 95% RH humidity bath
A heat shock test was performed for 100 cycles at -25 ° C for 30 minutes to 85 ° C for 30 minutes for 0 hour. As a result, in the case of the conductive adhesive containing the coupling agent, the bonded portion was not peeled off in any of the tests, but in the case of the conductive adhesive according to Example-1, the adhesive left in the humidity bath adhered in 75 to 100 hours. All parts were peeled off.
シランカップリング剤の代わりにチタネート系カップ
リング剤を用いても同様の結果であった。Similar results were obtained when a titanate coupling agent was used instead of the silane coupling agent.
（実施例３） 実施例１による導電性接着剤、実施例１による導電
性接着剤から酸化亜鉛粉末を抜いた導電性接着剤、実
施例１による導電性接着剤にさらにSb2O3粉末１重量部
を添加した導電性接着剤、同じくV2O3粉末を１重量部
添加した導電性接着剤についてそれぞれ下記試料を作
製し相隣り合う電極間に10Vの電圧を印加し60℃90〜95
％R.H.の湿度槽中で3000時間の銀マイグレーション試験
を行った。Example 3 The conductive adhesive according to Example 1, the conductive adhesive obtained by removing the zinc oxide powder from the conductive adhesive according to Example 1, the conductive adhesive according to Example 1, and the Sb 2 O 3 powder 1 The following samples were prepared for the conductive adhesive to which 1 part by weight of V 2 O 3 powder was added, and a voltage of 10 V was applied between adjacent electrodes at 60 ° C. 90-95.
The silver migration test was performed for 3000 hours in a% RH humidity bath.
フェノール積層板に銀レジン系ペーストで2mmピッチ
の電極印刷を行い上記各接着剤を電極部分にスクリーン
印刷した。同一間隔同一形状になるようポリエチレンテ
レフタレートフィルムにも銀レジン系ペーストで電極を
形成し、両電極部分を重ね合わせて160℃に加熱した圧
接用銅板で1kg/cm2の圧力で10秒間加圧し重ね合わせた
部分の導電性接着剤を硬化させた物を試験試料とした。
上記試験で銀マイグレーションが発生した時間は下記の
とおりであった。Electrodes were printed on the phenol laminate at a pitch of 2 mm with a silver resin-based paste, and the above-mentioned adhesives were screen-printed on the electrode portions. The same interval electrodes to form a silver resin system paste to a polyethylene terephthalate film so that the same shape, 10 seconds pressurized overlapped with insulation displacement copper plate was heated to 160 ° C. by superposing two electrode portions at a pressure of 1 kg / cm 2 The cured product of the conductive adhesive in the joined portion was used as a test sample.
The time when silver migration occurred in the above test was as follows.
導電性接着剤の種類 発生時間（時間） 1150 270 1900 1675 発明の効果 以上述べたように、本発明の導電性接着剤の採用によ
り、電気回路における電気的接続固着についてガラス基
板やセラミックス基板のような破壊し易い基板上でも高
密度実装を高い接着強度と高度の電気的接続信頼性を確
保できる。また、ハンダ付が不可能な回路配線材料でも
接続が可能である。Type of conductive adhesive Generation time (hours) 1150 270 1900 1675 Effect of the present invention As described above, by adopting the conductive adhesive of the present invention, electric connection and fixation in an electric circuit can be performed like a glass substrate or a ceramic substrate. Even on a substrate that is easily broken, high-density mounting can ensure high adhesive strength and high electrical connection reliability. Also, connection can be made using a circuit wiring material that cannot be soldered.
Claims (4)
剤として下記構造式に示すイミダゾール・ビスフェノー
ルジグリシジルエーテル付加物と、導電性粉末を含むこ
とを特徴とする導電性接着剤。 1. A conductive adhesive comprising a bisphenol-type epoxy resin, an imidazole / bisphenol diglycidyl ether adduct represented by the following structural formula as a curing accelerator, and a conductive powder.
あることを特徴とする請求項１記載の導電性接着剤。2. The conductive adhesive according to claim 1, wherein the conductive powder is a copper powder whose surface is coated with silver.
剤を含むことを特徴とする請求項１または２記載の導電
性接着剤。3. The conductive adhesive according to claim 1, further comprising a silane-based or titanate-based coupling agent.
は複数種類の粉末を含むことを特徴とする請求項1,2ま
たは３記載の導電性接着剤。4. The conductive adhesive according to claim 1, comprising one or more kinds of powders selected from ZnO, Sb 2 S 3 , and V 2 O 3 powders.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1305415A JP2748615B2 (en) | 1989-11-24 | 1989-11-24 | Conductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1305415A JP2748615B2 (en) | 1989-11-24 | 1989-11-24 | Conductive adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03166284A JPH03166284A (en) | 1991-07-18 |
| JP2748615B2 true JP2748615B2 (en) | 1998-05-13 |
Family
ID=17944860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1305415A Expired - Lifetime JP2748615B2 (en) | 1989-11-24 | 1989-11-24 | Conductive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2748615B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140065420A (en) * | 2011-09-20 | 2014-05-29 | 헨켈 아게 운트 코. 카게아아 | Electrically conductive adhesives comprising silver-coated particles |
| CN109207106A (en) * | 2018-09-11 | 2019-01-15 | 合肥绿普包装材料有限公司 | A kind of preparation method of the short curing time adhesive of ultralow temperature |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3391074B2 (en) * | 1994-01-07 | 2003-03-31 | 味の素株式会社 | Epoxy resin composition |
| AU7722300A (en) * | 1999-09-27 | 2001-04-30 | Georgia Tech Research Corporation | Electrically conductive adhesive containing epoxide-modified polyurethane |
| EP3093319A1 (en) * | 2015-05-13 | 2016-11-16 | Heraeus Deutschland GmbH & Co. KG | Electrically conductive composition |
| CN107236485B (en) * | 2017-07-25 | 2019-02-15 | 深圳科诺桥科技股份有限公司 | A kind of dendritic heat curing type pastes conducting resinl and preparation method thereof |
| CN113539549B (en) * | 2021-07-15 | 2023-08-01 | 江西古川胶带有限公司 | Thermosetting conductive adhesive film and preparation method and application thereof |
-
1989
- 1989-11-24 JP JP1305415A patent/JP2748615B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140065420A (en) * | 2011-09-20 | 2014-05-29 | 헨켈 아게 운트 코. 카게아아 | Electrically conductive adhesives comprising silver-coated particles |
| KR102009534B1 (en) * | 2011-09-20 | 2019-08-09 | 헨켈 아게 운트 코. 카게아아 | Electrically conductive adhesives comprising silver-coated particles |
| CN109207106A (en) * | 2018-09-11 | 2019-01-15 | 合肥绿普包装材料有限公司 | A kind of preparation method of the short curing time adhesive of ultralow temperature |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03166284A (en) | 1991-07-18 |
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