JP2948038B2 - Anisotropic conductive film - Google Patents

Anisotropic conductive film

Info

Publication number
JP2948038B2
JP2948038B2 JP4338985A JP33898592A JP2948038B2 JP 2948038 B2 JP2948038 B2 JP 2948038B2 JP 4338985 A JP4338985 A JP 4338985A JP 33898592 A JP33898592 A JP 33898592A JP 2948038 B2 JP2948038 B2 JP 2948038B2
Authority
JP
Japan
Prior art keywords
particles
metal
anisotropic conductive
conductive film
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP4338985A
Other languages
Japanese (ja)
Other versions
JPH06187834A (en
Inventor
政和 川田
壽郎 小宮谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP4338985A priority Critical patent/JP2948038B2/en
Publication of JPH06187834A publication Critical patent/JPH06187834A/en
Application granted granted Critical
Publication of JP2948038B2 publication Critical patent/JP2948038B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L2224/29199—Material of the matrix
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Landscapes

  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【産業上の利用分野】本発明は、微細な回路同志の電気
的接続、更に詳しくはＬＣＤ（液晶ディスプレイ）とフ
レキシブル回路基板の接続や、半導体ＩＣとＩＣ搭載用
基板のマイクロ接合等に用いることのできる異方導電フ
ィルムに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used for electrical connection between fine circuits, more specifically, for connection between an LCD (Liquid Crystal Display) and a flexible circuit board, and micro-joining between a semiconductor IC and an IC mounting board. The present invention relates to an anisotropic conductive film that can be used.

【０００２】[0002]

【従来の技術】最近の電子機器の小型化、薄型化に伴
い、微細な回路同志の接続、微小部分と微細な回路の接
続等の必要性が飛躍的に増大してきており、その接続方
法として、半田接合技術の進展と共に新しい材料として
異方性の導電接着剤やフィルムが使用されている（例え
ば、特開昭５９−１２０４３６、６０−１９１２２８、
６０−８４７１８、６１−２７４３９４、６１−５５８
０９、６１−２８７９７４、６２−２４４１４２、６３
−１５３５３４、６３−３０５５９１、６４−４７０８
４、６４−８１８７８、特開平１−４６５４９、１−２
５１７８７各号公報等）。2. Description of the Related Art With the recent miniaturization and thinning of electronic equipment, the necessity of connection between minute circuits, connection between minute parts and minute circuits, etc. has been dramatically increased. With the development of solder bonding technology, anisotropic conductive adhesives and films have been used as new materials (see, for example, JP-A-59-120436, 60-191228,
60-84718, 61-274394, 61-558
09, 61-287974, 62-244142, 63
-15534, 63-305591, 64-4708
4, 64-81878, JP-A-1-46549, 1-2
51787 publications, etc.).

【０００３】この方法は、接続しようとする回路間に所
定量の導電性粒子を含有する接着剤またはフィルムを挟
み、所定の温度・圧力・時間により熱圧着することによ
って、回路間の電気的接続を行なうと同時に、隣接する
回路間には絶縁性を確保させるものである。In this method, an adhesive or film containing a predetermined amount of conductive particles is sandwiched between circuits to be connected, and thermocompression-bonded at a predetermined temperature, pressure, and time, thereby providing electrical connection between the circuits. At the same time, insulation between adjacent circuits is ensured.

【０００４】この異方導電接着剤やフィルムに含まれて
いる導電粒子には、一般的には金属粒子や高分子核材に
金属被覆を施したものが用いられている。金属粒子の場
合、半田粒子等の柔らかいものが用いられる場合が多
く、相対する回路端子間の間隙ばらつきを吸収して回路
端子間の接触面積を大きくとることができ、安定した導
通性が得られるという長所があった。しかしながら、反
面微細な回路同士の接続をするために導電粒子の粒度分
布を揃え隣接端子間の電気的短絡を防ぐことが困難であ
り、高温高湿度放置試験や高温放置試験等の処理を施し
た場合に、金属粒子の酸化等の変化が生じ接続が不安定
になる等の問題があった。また高分子核材に金属被覆を
施した粒子の場合、作製方法によっては高分子核材粒子
の粒度分布を極めてシャープにできるため、微細な回路
接続にも対応でき、更に金被覆が用いられる場合が多い
こともあり、前述のような長期環境処理による粒子表面
の酸化等の変化は少ないという長所がある。しかしなが
ら、反面相対する回路端子間の間隙ばらつきが５μｍ以
上もある場合には、導電粒子の端子への接触が不安定に
なり安定した接続性が得られないという問題があった。[0004] As the conductive particles contained in the anisotropic conductive adhesive or film, generally, metal particles or polymer nucleus materials coated with metal are used. In the case of metal particles, a soft material such as solder particles is often used, and the variation in the gap between the opposite circuit terminals can be absorbed, and the contact area between the circuit terminals can be increased, and stable conductivity can be obtained. There was an advantage. However, on the other hand, it is difficult to make the particle size distribution of the conductive particles uniform and prevent an electrical short circuit between adjacent terminals in order to connect the fine circuits to each other. In such a case, there is a problem that a change such as oxidation of the metal particles occurs and the connection becomes unstable. In the case of particles in which a polymer core material is coated with a metal, the particle size distribution of the polymer core material particles can be made extremely sharp depending on the manufacturing method, so that it is possible to cope with fine circuit connection, and when gold coating is used. There is an advantage that there is little change such as oxidation of the particle surface due to the long-term environmental treatment as described above. However, when the gap variation between opposing circuit terminals is 5 μm or more, there is a problem that the contact of the conductive particles to the terminals becomes unstable and stable connectivity cannot be obtained.

【０００５】[0005]

【発明が解決しようとする課題】本発明は、このような
従来の欠点に鑑み種々の検討の結果なされたものであ
り、その目的とするところは、微細な回路接続にも対応
でき、相対する回路端子間の間隙ばらつきも吸収するこ
とのできる接続信頼性の高い異方導電フィルムを提供す
るものである。SUMMARY OF THE INVENTION The present invention has been made in consideration of the above-mentioned drawbacks, and has been made as a result of various studies. The object of the present invention is to cope with fine circuit connections. It is an object of the present invention to provide an anisotropic conductive film having high connection reliability, which can absorb variations in gaps between circuit terminals.

【０００６】[0006]

【課題を解決するための手段】すなわち、本発明は絶縁
性接着剤樹脂中に導電性粒子を分散させた異方導電フィ
ルムにおいて、該導電性粒子が高分子核材の表面に金属
被覆を施したものと、これよりも硬度が低くかつ粒径が
大きい金属粒子とからなる異方導電性フィルムである。That is, the present invention relates to an anisotropic conductive film in which conductive particles are dispersed in an insulating adhesive resin, wherein the conductive particles are provided with a metal coating on the surface of a polymer core material. And an anisotropic conductive film comprising metal particles having a lower hardness and a larger particle size.

【０００７】以下、図面で本発明を詳細に説明する。図
１は、本発明による異方導電フィルムの断面模式図であ
り、図２は本発明による異方導電フィルムを用いた回路
の接続状態を示す断面図である。Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic cross-sectional view of an anisotropic conductive film according to the present invention, and FIG. 2 is a cross-sectional view showing a connection state of a circuit using the anisotropic conductive film according to the present invention.

【０００８】この異方導電フィルムは、高分子核材１の
表面に金属被覆２を施した金属被覆粒子３と、これより
も硬度が低くかつ粒径が大きい金属粒子４が絶縁性接着
剤５に分散さているのが特徴である。図２に示すように
回路基板７、７′をこの異方導電フィルムを用いて接続
した場合、端子８、８′の間の間隙が各端子でばらつき
があり、金属被覆粒子では接続できない端子には大きな
柔らかい金属粒子がその段差を吸収して接続を保つこと
ができ、また金属粒子の割合を減らすことにより、隣接
端子間の短絡を防ぎ微細な回路接続にも対応が可能とな
る。The anisotropic conductive film comprises a metal-coated particle 3 in which a metal coating 2 is provided on the surface of a polymer core material 1 and a metal particle 4 having a lower hardness and a larger particle size than the insulating adhesive 5. The feature is that it is dispersed. As shown in FIG. 2, when the circuit boards 7 and 7 'are connected using this anisotropic conductive film, the gap between the terminals 8 and 8' varies among the terminals, and the terminals cannot be connected with the metal-coated particles. Large soft metal particles can absorb the steps to maintain the connection, and by reducing the ratio of the metal particles, short-circuiting between adjacent terminals can be prevented and fine circuit connection can be handled.

【０００９】本発明に用いられる金属粒子４は金属被覆
粒子３よりも硬度が低く粒径が大きいものであれば、特
にその硬度、粒径、含有量を制限するものではないが、
接続する回路端子ピッチ、端子厚さばらつき等により最
適値を選択する方が望ましい。例えば、異方導電フィル
ムの主要な用途である液晶ディスプレイパネルとフレキ
シブル回路基板（以下ＦＰＣという）との接続では、金
属粒子及び金属被覆粒子径は０．５〜５０μｍ程度で、
かつ絶縁性接着剤に対する配合量は、１〜４体積％が好
ましい。また、このときの金属粒子の割合は、金属粒子
及び金属被覆粒子の総量中に２０〜８０体積％であるほ
うが好ましい。これよりも粒子径が小さい場合や配合量
が少ない場合には接続面積が少なくなるため接続信頼性
が低下し、逆に粒子径が大きい場合や配合量が多い場合
には隣接端子間の絶縁性が低下し短絡の発生にもつなが
る。As long as the metal particles 4 used in the present invention have a lower hardness and a larger particle size than the metal-coated particles 3, the hardness, particle size and content thereof are not particularly limited.
It is desirable to select the optimum value according to the circuit terminal pitch to be connected, the terminal thickness variation, and the like. For example, in the connection between a liquid crystal display panel and a flexible circuit board (hereinafter referred to as FPC), which is a main use of an anisotropic conductive film, the metal particles and the metal-coated particle diameter are about 0.5 to 50 μm,
And the compounding quantity with respect to the insulating adhesive is preferably 1 to 4 % by volume. In addition, the ratio of the metal particles at this time is preferably 20 to 80% by volume based on the total amount of the metal particles and the metal-coated particles. If the particle size is smaller than this, or if the compounding amount is small, the connection area will be small and the connection reliability will be reduced. Conversely, if the particle size is large or the compounding amount is large, the insulation between adjacent terminals will be poor. And the short circuit may occur.

【００１０】本発明に用いられる金属被覆粒子３は、そ
の組成に特には制限されない。例えば、高分子核材１で
はエポキシ樹脂、ウレタン樹脂、メラミン樹脂、フェノ
ール樹脂、アクリル樹脂、ポリエステル樹脂、スチレン
樹脂、スチレンブタジエン共重合体等のポリマー中から
１種あるいは２種以上組合せて使用すればよい。また、
金属被覆２には金、ニッケル、銀、銅、亜鉛、錫、イン
ジウム、パラジウム、アルミニウム等が挙げられ、これ
らを組合せてもよい。勿論これらの高分子核材の選択に
は、両者の密着力等を考慮して組合せた方がよいことは
いうまでもない。The composition of the metal-coated particles 3 used in the present invention is not particularly limited. For example, in the polymer core material 1, if one or a combination of two or more of polymers such as epoxy resin, urethane resin, melamine resin, phenol resin, acrylic resin, polyester resin, styrene resin, and styrene butadiene copolymer is used. Good. Also,
The metal coating 2 includes gold, nickel, silver, copper, zinc, tin, indium, palladium, aluminum and the like, and these may be combined. Of course, it is needless to say that it is better to select these polymer core materials in combination in consideration of the adhesion between them.

【００１１】金属被覆厚さには特に制限はないが、薄す
ぎると導電性が不安定になり、厚すぎると粒子変形が困
難になったり凝集等が生じるため、０．０１〜１μｍ程
度が好ましい。無電解メッキ等により均一に被覆されて
いる方がより好ましい。The thickness of the metal coating is not particularly limited, but if it is too thin, the conductivity becomes unstable, and if it is too thick, particle deformation becomes difficult or aggregation occurs, so that about 0.01 to 1 μm is preferable. . It is more preferable that the coating is uniform by electroless plating or the like.

【００１２】本発明に用いられる金属粒子４は、特にそ
の組成に制限はないが、従来よりこの分野において使用
されている、例えば金、銀、銅、亜鉛、錫、半田、イン
ジウム、パラジウム等が挙げられ、これらを組合せても
よい。The composition of the metal particles 4 used in the present invention is not particularly limited, but gold, silver, copper, zinc, tin, solder, indium, palladium and the like conventionally used in this field are used. And these may be combined.

【００１３】本発明に用いられる接着剤５は、絶縁性を
示すものであれば、熱可塑性、熱硬化性、光硬化性等、
特に制限はない。例えばスチレンブタジエン樹脂、スチ
レン樹脂、エチレン酢酸ビニル樹脂、アクリルニトリル
ブタジエンゴム、シリコーン樹脂、アクリル樹脂、エポ
キシ樹脂、ウレタン樹脂、フェノール樹脂、アミド樹
脂、エポキシメタクリレート系をはじめとするアクリレ
ート系樹脂等が挙げられ、必要に応じて２種以上の樹脂
を組合せればよい。また、必要に応じて粘着付与剤、架
橋剤、老化防止剤、カップリング剤等を併用してもよ
い。As long as the adhesive 5 used in the present invention has an insulating property, it has thermoplasticity, thermosetting property, photocuring property and the like.
There is no particular limitation. Examples include styrene butadiene resin, styrene resin, ethylene vinyl acetate resin, acrylonitrile butadiene rubber, silicone resin, acrylic resin, epoxy resin, urethane resin, phenol resin, amide resin, and acrylate resins including epoxy methacrylate resins. If necessary, two or more resins may be combined. If necessary, a tackifier, a crosslinking agent, an antioxidant, a coupling agent and the like may be used in combination.

【００１４】[0014]

【実施例】以下、本発明による実施例及び従来方法によ
る比較例を示す。 実施例１ エポキシ樹脂（エピコート１００４、油化シエルエポキ
シ（株）製）８０重量部、フェノール樹脂（ＰＲ−１２
６８６、住友デュレズ（株）製）４０重量部、アクリル
ニトリルブタジエン共重合体（ＮＳ２２０ＳＨ、日本合
成ゴム（株））１５重量部、１−ベンジル２−メチルイ
ミダゾール（四国化成（株）製）５重量部を混合した熱
硬化性接着剤に、メラミン樹脂を核材とし厚さ０．３μ
ｍのニッケルと０．１μｍの金を無電解メッキした平均
粒径８μｍ、最大粒径１２μｍの分布を有する金属被覆
粒子を２体積％と、平均粒径１５μｍ、最大粒径３０μ
ｍの分布を有する半田粒子を２体積％を分散させ、異方
導電フィルムを作製した。EXAMPLES Examples according to the present invention and comparative examples according to the conventional method will be shown below. Example 1 80 parts by weight of an epoxy resin (Epicoat 1004, manufactured by Yuka Shell Epoxy Co., Ltd.) and a phenol resin (PR-12)
686, manufactured by Sumitomo Durez Co., Ltd.) 40 parts by weight, acrylonitrile butadiene copolymer (NS220SH, Nippon Synthetic Rubber Co., Ltd.) 15 parts by weight, 1-benzyl 2-methylimidazole (manufactured by Shikoku Chemicals) 5 parts by weight Part of the thermosetting adhesive, melamine resin as the core material, thickness 0.3μ
2% by volume of metal-coated particles having an average particle size of 8 μm and a maximum particle size of 12 μm obtained by electroless plating of nickel and 0.1 μm gold, an average particle size of 15 μm, and a maximum particle size of 30 μm
2% by volume of the solder particles having a distribution of m were dispersed to prepare an anisotropic conductive film.

【００１５】この異方導電フィルムを、回路幅０．１ｍ
ｍ、回路ピッチ０．２ｍｍ、１６０端子を有するＦＰＣ
と、表面にインジウムを蒸着したガラス基板との間に挟
み、１７５℃、３０Ｋｇ／ｃｍ2、２０ｓｅｃの条件で
熱圧着により接続した。ここで用いたＦＰＣは、７５μ
ｍのポリイミド基材と３５μｍの銅箔からできたもので
あり、回路加工後表面を半田メッキしたものである。The anisotropic conductive film is provided with a circuit width of 0.1 m.
m, circuit pitch 0.2 mm, FPC having 160 terminals
And a glass substrate having indium deposited on its surface, and connected by thermocompression at 175 ° C., 30 Kg / cm 2 and 20 sec. The FPC used here is 75μ
m, made of a polyimide substrate and a copper foil of 35 μm, and the surface is solder-plated after circuit processing.

【００１６】この接続体を高温高湿度試験（８５℃、８
５％ＲＨ）処理をし、隣接端子間の接続抵抗値を観察し
た結果、１０００時間処理後も初期からの接続抵抗上昇
も全端子で５Ω以下と良好な接続性が得られた。This connected body was subjected to a high temperature and high humidity test (85 ° C., 8
As a result of observing the connection resistance value between the adjacent terminals after performing the treatment at 5% RH), the connection resistance increased from the initial stage even after the treatment for 1000 hours.

【００１７】比較例１ 実施例１と同じ接着剤に、同じ金属粒子のみ４体積％分
散させたものを作製し、同様の高温高湿度試験による評
価を行った結果、１０００時間処理後の接続抵抗値が初
期に比較して、全端子で１０Ω以上上昇した。Comparative Example 1 An adhesive in which only the same metal particles were dispersed by 4% by volume in the same adhesive as in Example 1 was prepared and evaluated by the same high-temperature and high-humidity test. The value increased by 10Ω or more at all terminals compared to the initial stage.

【００１８】比較例２ 実施例１と同じ接着剤に、同じ金属被覆粒子のみ４体積
％分散させたものを作製し、同様の高温高湿度試験によ
る評価を行った結果、１０００時間処理後の接続抵抗値
が初期に比較して、約２／３の端子は５Ω以下であった
が、約１／３の端子は１０Ω以上上昇し、各端子間で接
続信頼性に差が見られた。Comparative Example 2 The same adhesive as in Example 1 was prepared by dispersing only the same metal-coated particles by 4% by volume and evaluated by the same high-temperature and high-humidity test. Compared to the initial stage, the resistance value of about 2/3 of the terminals was 5Ω or less, but the value of about 1/3 of the terminals increased by 10Ω or more, indicating a difference in connection reliability between the terminals.

【００１９】[0019]

【発明の効果】本発明によると、従来問題であった回路
端子の厚さにばらつきがある場合にも全端子にわたって
高い接続信頼性を得ることが可能である。また、ガラス
基板とＦＰＣの接続だけでなく、プリント回路基板とＦ
ＰＣやＩＣと基板の接続においても容易に高い接続信頼
性を得ることができる。According to the present invention, it is possible to obtain high connection reliability over all terminals even when the thickness of the circuit terminals, which has been a problem in the past, varies. In addition to the connection between the glass substrate and the FPC, the printed circuit board and the FPC
High connection reliability can be easily obtained even when connecting a PC or IC to a substrate.

【図面の簡単な説明】[Brief description of the drawings]

【図１】図１は、本発明による異方導電フィルムの断面
模式図。FIG. 1 is a schematic cross-sectional view of an anisotropic conductive film according to the present invention.

【図２】図２は、本発明による異方導電フィルムを用い
た回路の接続状態を示す断面図。FIG. 2 is a sectional view showing a connection state of a circuit using an anisotropic conductive film according to the present invention.

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H01B 5/16 C09J 7/00 C09J 7/02 H01R 11/01 H05K 3/36 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 6 , DB name) H01B 5/16 C09J 7/00 C09J 7/02 H01R 11/01 H05K 3/36

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 絶縁性接着剤樹脂中に導電性粒子を分散
させた異方導電フィルムにおいて、該導電性粒子が高分
子核材の表面に金属被覆を施したものと、これよりも硬
度が低くかつ粒径が大きい金属粒子とからなり、金属粒
子及び金属被覆粒子の絶縁性接着剤に対する合計配合量
は１〜４体積％であることを特徴とする異方導電性フィ
ルム。1. An anisotropic conductive film in which conductive particles are dispersed in an insulating adhesive resin, wherein the conductive particles are provided with a metal coating on the surface of a polymer nucleus material. low and Ri Do and a particle size larger metal particles, metal particles
Amount of particles and metal-coated particles in insulating adhesive
The anisotropic conductive film according to claim 1 to 4 vol% der Rukoto is.
JP4338985A 1992-12-18 1992-12-18 Anisotropic conductive film Expired - Fee Related JP2948038B2 (en)

Priority Applications (1)

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JP4338985A JP2948038B2 (en) 1992-12-18 1992-12-18 Anisotropic conductive film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4338985A JP2948038B2 (en) 1992-12-18 1992-12-18 Anisotropic conductive film

Publications (2)

Publication Number Publication Date
JPH06187834A JPH06187834A (en) 1994-07-08
JP2948038B2 true JP2948038B2 (en) 1999-09-13

Family

ID=18323189

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WO2000024005A1 (en) * 1998-10-19 2000-04-27 Dynal Particles As Particles
US6787233B1 (en) 1998-10-19 2004-09-07 Dynal Biotech Asa Particles

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